AD5641ACPZ-REEL7 [ADI]

SPI Interface in LFCSP and SC70; SPI接口的LFCSP和SC70
AD5641ACPZ-REEL7
型号: AD5641ACPZ-REEL7
厂家: ADI    ADI
描述:

SPI Interface in LFCSP and SC70
SPI接口的LFCSP和SC70

文件: 总20页 (文件大小:504K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
2.7 V to 5.5 V, <100 µA, 14-Bit nanoDAC,  
SPI Interface in LFCSP and SC70  
Data Sheet  
AD5641  
FEATURES  
FUNCTIONAL BLOCK DIAGRAM  
V
DD  
GND  
6-lead LFCSP and SC70 packages  
Micropower operation: 100 µA maximum at 5 V  
Power-down to typically 0.2 µA at 3 V  
Single 14-bit DAC  
POWER-ON  
RESET  
AD5641  
B version: 4 LSB INL  
A version: 16 LSB INL  
REF(+)  
14-BIT  
DAC  
DAC  
REGISTER  
OUTPUT  
BUFFER  
V
OUT  
2.7 V to 5.5 V power supply  
Guaranteed monotonic by design  
Power-on reset to 0 V with brownout detection  
3 power-down functions  
INPUT  
CONTROL  
LOGIC  
POWER-DOWN  
CONTROL LOGIC  
RESISTOR  
NETWORK  
Low power serial interface with Schmitt-triggered inputs  
On-chip output buffer amplifier, rail-to-rail operation  
interrupt facility  
SYNC  
SYNC SCLK SDIN  
APPLICATIONS  
Figure 1.  
Voltage level setting  
Portable battery-powered instruments  
Digital gain and offset adjustment  
Programmable voltage and current sources  
Programmable attenuators  
Table 1. Related Devices  
Part Number  
Description  
AD5601  
2.7 V to 5.5 V, <100 µA, 8-bit nanoDAC,  
SPI interface in LFCSP and SC70 packages  
2.7 V to 5.5 V, <100 µA, 10-bit nanoDAC,  
SPI interface in LFCSP and SC70 packages  
2.7 V to 5.5 V, <100 µA, 12-bit nanoDAC,  
GENERAL DESCRIPTION  
AD5611  
AD5621  
The AD5641, a member of the nanoDAC® family, is a single,  
14-bit, buffered, voltage-out DAC that operates from a single  
2.7 V to 5.5 V supply, typically consuming 75 µA at 5 V. The  
part comes in tiny LFCSP and SC70 packages. Its on-chip  
precision output amplifier allows rail-to-rail output swing to be  
achieved. The AD5641 uses a versatile 3-wire serial interface  
that operates at clock rates up to 30 MHz and is compatible with  
SPI®, QSPI™, MICROWIRE™, and DSP interface standards. The  
reference for AD5641 is derived from the power supply inputs  
and, therefore, gives the widest dynamic output range. The part  
incorporates a power-on reset circuit, which ensures that the  
DAC output powers up to 0 V and remains there until a valid  
write to the device takes place.  
SPI interface in LFCSP and SC70 packages  
PRODUCT HIGHLIGHTS  
1. Available in space-saving 6-lead LFCSP and SC70  
packages.  
2. Low power, single-supply operation. The AD5641 operates  
from a single 2.7 V to 5.5 V supply and with a maximum  
current consumption of 100 µA, making it ideal for  
battery-powered applications.  
3. The on-chip output buffer amplifier allows the output of  
the DAC to swing rail-to-rail with a typical slew rate of  
0.5 V/µs.  
4. Reference derived from the power supply.  
5. High speed serial interface with clock speeds up to  
30 MHz. Designed for very low power consumption. The  
interface powers up only during a write cycle.  
6. Power-down capability. When powered down, the DAC  
typically consumes 0.2 µA at 3 V.  
The AD5641 contains a power-down feature that reduces  
current consumption typically to 0.2 µA at 3 V, and provides  
software-selectable output loads while in power-down mode.  
The part is put into power-down mode over the serial interface.  
The low power consumption of the part in normal operation  
makes it ideally suited to portable battery-operated equipment.  
The combination of small package and low power makes this  
nanoDAC device ideal for level-setting requirements such as  
generating bias or control voltages in space-constrained and  
power-sensitive applications.  
7. Power-on reset with brownout detection.  
Rev. D  
Information furnished by Analog Devices is believed to be accurate and reliable. However, no  
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other  
rightsof third parties that may result fromits use. Specifications subject to change without notice. No  
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.  
Trademarks andregisteredtrademarks are the property of their respective owners.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.  
Tel: 781.329.4700  
www.analog.com  
Fax: 781.461.3113 ©2005–2012 Analog Devices, Inc. All rights reserved.  
 
 
 
 
 
AD5641  
Data Sheet  
TABLE OF CONTENTS  
Features .............................................................................................. 1  
Resistor String............................................................................. 13  
Output Amplifier........................................................................ 13  
Serial Interface ............................................................................ 13  
Input Shift Register .................................................................... 13  
Applications....................................................................................... 1  
General Description ......................................................................... 1  
Functional Block Diagram .............................................................. 1  
Product Highlights ........................................................................... 1  
Revision History ............................................................................... 2  
Specifications..................................................................................... 3  
Timing Characteristics ................................................................ 4  
Absolute Maximum Ratings............................................................ 5  
ESD Caution.................................................................................. 5  
Pin Configuration and Function Descriptions............................. 6  
Typical Performance Characteristics ............................................. 7  
Terminology .................................................................................... 12  
Theory of Operation ...................................................................... 13  
Digital-to-Analog Section ......................................................... 13  
SYNC  
Interrupt .......................................................................... 13  
Power-On Reset.......................................................................... 14  
Power-Down Modes .................................................................. 14  
Microprocessor Interfacing....................................................... 15  
Applications..................................................................................... 16  
Choosing a Reference as Power Supply for the AD5641....... 16  
Bipolar Operation Using the AD5641..................................... 16  
Using the AD5641 with a Galvanically Isolated Interface .... 17  
Power Supply Bypassing and Grounding................................ 17  
Outline Dimensions....................................................................... 18  
Ordering Guide .......................................................................... 19  
REVISION HISTORY  
2/12—Rev. C to Rev. D  
3/05—Rev. 0 to Rev. A  
Added 6-Lead LFCSP.........................................................Universal  
Changes to Title, Features Section, General Description Section,  
Table 1, and Product Highlights Section, ...................................... 1  
Changes to Table 4............................................................................ 5  
Added Figure 4; Renumbered Sequentially .................................. 6  
Changes to Table 5............................................................................ 6  
Change to Choosing a Reference as Power Supply for the  
AD5641 Section .............................................................................. 16  
Updated Outline Dimensions....................................................... 18  
Changes to Ordering Guide .......................................................... 19  
Changes to Timing Characteristics.................................................4  
Changes to Absolute Maximum Ratings........................................5  
Changes to Full-Scale Error Section ...............................................7  
Changes to Figures 28 and 30 ....................................................... 12  
Change to Resistor String Section................................................ 13  
Changes to Power-Down Mode Section ..................................... 14  
1/05—Revision 0: Initial Version  
10/07—Rev. B to Rev. C  
Added B Grade....................................................................Universal  
Changes to Offset Error and Gain Error Specifications.............. 3  
Changes to Table 4............................................................................ 5  
Changes to Typical Performance Characteristics......................... 7  
Changes to Ordering Guide .......................................................... 18  
7/05—Rev. A to Rev. B  
Change to Galvanically Isolated Interface Section..................... 18  
Changes to Figure 44...................................................................... 18  
Rev. D | Page 2 of 20  
 
Data Sheet  
AD5641  
SPECIFICATIONS  
VDD = 2.7 V to 5.5 V; RL = 2 kΩ to GND; CL = 200 pF to GND; −40°C < TA < +125°C; typical at +25°C; all specifications TMIN to TMAX  
,
unless otherwise noted.  
Table 2.  
A Grade  
Min Typ  
B Grade  
Min Typ  
Parameter  
Max  
Max  
Unit  
Test Conditions/Comments  
STATIC PERFORMANCE  
Resolution  
Relative Accuracy1  
Differential Nonlinearity1  
Zero-Code Error  
Offset Error  
14  
14  
Bits  
LSB  
LSB  
mV  
mV  
mV  
16  
1
10  
10  
4
1
10  
10  
Guaranteed monotonic by design  
All 0s loaded to DAC register  
0.5  
0.63  
0.5  
0.5  
0.63  
0.5  
Full-Scale Error  
All 1s loaded to DAC register  
Gain Error  
Zero-Code Error Drift  
Gain Temperature Coefficient  
0.004  
5.0  
2.0  
0.037  
0.004  
5.0  
2.0  
0.037 % of FSR  
µV/°C  
ppm of  
FSR/°C  
OUTPUT CHARACTERISTICS2  
Output Voltage Range  
Output Voltage Settling Time  
Slew Rate  
0
VDD  
10  
0
VDD  
10  
V
µs  
V/µs  
pF  
pF  
6
6
Code ¼ scale to ¾ scale, to 1 LSB  
0.5  
470  
1000  
120  
2
0.5  
470  
1000  
120  
2
Capacitive Load Stability  
RL = ∞  
RL = 2 kΩ  
DAC code = midscale, 1 kHz  
Output Noise Spectral Density  
Noise  
nV/Hz  
µV  
DAC code = midscale, 0.1 Hz to  
10 Hz bandwidth  
Digital-to-Analog Glitch  
Impulse  
5
5
nV-s  
1 LSB change around major carry  
Digital Feedthrough  
DC Output Impedance  
Short-Circuit Current  
LOGIC INPUTS  
0.2  
0.5  
15  
0.2  
0.5  
15  
nV-s  
mA  
VDD = 3 V/5 V  
Input Current3  
2
0.8  
0.6  
2
0.8  
0.6  
µA  
V
V
V
V
VINL, Input Low Voltage  
VDD = 4.5 V to 5.5 V  
VDD = 2.7 V to 3.6 V  
VDD = 4.5 V to 5.5 V  
VDD = 2.7 V to 3.6 V  
VINH, Input High Voltage  
1.8  
1.4  
1.8  
1.4  
Pin Capacitance  
POWER REQUIREMENTS  
VDD  
3
3
pF  
2.7  
5.5  
2.7  
5.5  
V
All digital inputs at 0 V or VDD  
DAC active and excluding load current  
VIH = VDD and VIL = GND  
IDD (Normal Mode)  
VDD = 4.5 V to 5.5 V  
VDD = 2.7 V to 3.6 V  
IDD (All Power-Down Modes)  
VDD = 4.5 V to 5.5 V  
VDD = 2.7 V to 3.6 V  
POWER EFFICIENCY  
IOUT/IDD  
75  
60  
100  
90  
75  
60  
100  
90  
µA  
µA  
VIH = VDD and VIL = GND  
0.5  
0.2  
0.5  
0.2  
µA  
µA  
VIH = VDD and VIL = GND  
VIH = VDD and VIL = GND  
96  
96  
%
ILOAD = 2 mA and VDD  
loaded  
= 5 V, full-scale  
1 Linearity calculated using a reduced code range (Code 256 to Code 16,128).  
2 Guaranteed by design and characterization, not production tested.  
3 Total current flowing into all pins.  
Rev. D | Page 3 of 20  
 
AD5641  
Data Sheet  
TIMING CHARACTERISTICS  
VDD = 2.7 V to 5.5 V; all specifications TMIN to TMAX, unless otherwise noted. See Figure 2.  
Table 3.  
Parameter  
Limit1  
33  
5
5
10  
5
Unit  
Test Conditions/Comments  
SCLK cycle time  
SCLK high time  
SCLK low time  
SYNC to SCLK falling edge setup time  
Data setup time  
2
t1  
ns min  
ns min  
ns min  
ns min  
ns min  
ns min  
ns min  
ns min  
ns min  
t2  
t3  
t4  
t5  
t6  
t7  
t8  
t9  
4.5  
0
Data hold time  
SCLK falling edge to SYNC rising edge  
Minimum SYNC high time  
SYNC rising edge to next SCLK falling edge ignored  
20  
13  
1 All input signals are specified with tR = tF = 1 ns/V (10% to 90% of VDD) and timed from a voltage level of (VIL + VIH)/2.  
2 Maximum SCLK frequency is 30 MHz.  
t4  
t2  
t1  
t9  
SCLK  
SYNC  
t8  
t3  
t7  
t6  
t5  
SDIN  
D15  
D14  
D2  
D1  
D0  
D15  
D14  
Figure 2. Timing Diagram  
Rev. D | Page 4 of 20  
 
 
 
 
 
Data Sheet  
AD5641  
ABSOLUTE MAXIMUM RATINGS  
TA = 25°C, unless otherwise noted.  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress  
rating only; functional operation of the device at these or any  
other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect  
device reliability.  
Table 4.  
Parameter  
Rating  
VDD to GND  
Digital Input Voltage to GND  
VOUT to GND  
−0.3 V to +7.0 V  
–0.3 V to VDD + 0.3 V  
–0.3 V to VDD + 0.3 V  
Operating Temperature Range  
Industrial  
Storage Temperature Range  
Maximum Junction Temperature  
SC70 Package  
–40°C to +125°C  
–65°C to +160°C  
150°C  
ESD CAUTION  
θJA Thermal Impedance  
θJC Thermal Impedance  
LFCSP Package  
433.34°C/W  
149.47°C/W  
θJA Thermal Impedance  
Reflow Soldering  
95°C/W  
Peak Temperature  
Time at Peak Temperature  
ESD  
260°C  
20 sec to 40 sec  
2.0 kV  
Rev. D | Page 5 of 20  
 
 
AD5641  
Data Sheet  
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS  
V
1
2
3
6
5
4
V
OUT  
DD  
V
1
2
3
6
5
4
AD5641  
SYNC  
SCLK  
SDIN  
OUT  
SCLK  
SDIN  
GND  
TOP VIEW  
AD5641  
(Not to Scale)  
TOP VIEW  
SYNC  
GND  
(Not to Scale)  
V
DD  
NOTES:  
1. CONNECT THE EXPOSED PAD TO GND.  
Figure 4. 6-Lead LFCSP Pin Configuration  
Figure 3. 6-Lead SC70 Pin Configuration  
Table 5. Pin Function Descriptions  
SC70 LFCSP  
Pin No. Pin No.  
Mnemonic  
Description  
1
4
SYNC  
Level-Triggered Control Input (Active Low). This is the frame synchronization signal for the input  
data. When SYNC goes low, it enables the input shift register and data is transferred in on the falling  
edges of the clocks that follow. The DAC is updated following the 16th clock cycle unless SYNC is  
taken high before this edge, in which case the rising edge of SYNC acts as an interrupt and the write  
sequence is ignored by the DAC.  
2
3
4
2
3
1
SCLK  
SDIN  
VDD  
Serial Clock Input. Data is clocked into the input shift register on the falling edge of the serial clock  
input. Data can be transferred at rates up to 30 MHz.  
Serial Data Input. This device has a 16-bit shift register. Data is clocked into the register on the falling  
edge of the serial clock input.  
Power Supply Input. The AD5641 can be operated from 2.7 V to 5.5 V. VDD should be decoupled to  
GND.  
5
6
5
6
GND  
VOUT  
EP  
Ground Reference Point for All Circuitry on the AD5641.  
Analog Output Voltage from the DAC. The output amplifier has rail-to-rail operation.  
Exposed Pad. Connect to GND.  
Rev. D | Page 6 of 20  
 
 
 
Data Sheet  
AD5641  
TYPICAL PERFORMANCE CHARACTERISTICS  
8
6
4
V
T
= V  
REF  
= 5V  
V
T
= V  
= 5V  
DD  
= 25°C  
DD  
REF  
= 25°C  
A
A
3
2
4
1
2
0
0
–1  
–2  
–3  
–4  
–2  
–4  
–6  
–8  
256  
2256  
4256  
6256  
8256 10256 12256 14256  
256  
2256  
4256  
6256  
8256 10256 12256 14256  
DAC CODE  
DAC CODE  
Figure 5. Typical INL  
Figure 8. Typical Total Unadjusted Error (TUE)  
2.0  
1.5  
0
–2  
MAX INL @ V = V  
= 5V  
= 3V  
DD  
REF  
MAX TUE ERROR @ V = V  
DD REF  
= 5V  
1.0  
MAX INL @ V = V  
DD  
–4  
REF  
0.5  
MAX TUE ERROR @ V = V  
DD REF  
= 3V  
–6  
0
–8  
MIN TUE ERROR @ V = V  
DD  
= 5V  
REF  
–0.5  
–1.0  
–1.5  
–2.0  
–10  
–12  
–14  
MIN INL @ V = V  
= 5V  
DD  
REF  
MIN TUE ERROR @ V = V  
DD  
= 3V  
80  
REF  
MIN INL @ V = V  
DD  
= 3V  
120  
REF  
–40  
–20  
0
20  
40  
60  
80  
100  
140  
–40  
–20  
0
20  
40  
60  
100  
120  
140  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
Figure 6. INL Error vs. Temperature (3 V/5 V Supply)  
Figure 9. Total Unadjusted Error (TUE) vs. Temperature (3 V/5 V Supply)  
5
4
10  
T
= 25°C  
T
= 25°C  
A
A
3
5
0
2
MAX INL ERROR  
MIN INL ERROR  
1
MAX TUE ERROR  
MIN TUE ERROR  
0
–1  
–2  
–3  
–4  
–5  
–5  
–10  
–15  
5.2  
2.7  
3.2  
3.7  
4.2  
4.7  
5.2  
2.7  
3.2  
3.7  
4.2  
4.7  
SUPPLY (V)  
SUPPLY (V)  
Figure 7. INL Error vs. Supply at 25°C  
Figure 10. Total Unadjusted Error (TUE) vs. Supply at 25°C  
Rev. D | Page 7 of 20  
 
 
 
AD5641  
Data Sheet  
0.0025  
0.0020  
0.0015  
0.0010  
0.0005  
0
0.6  
0.5  
0.4  
ZERO-CODE ERROR @ V = 5V  
DD  
MAX DNL @ V = 3V  
DD  
0.3  
ZERO-CODE ERROR @ V = 3V  
0.2  
DD  
MAX DNL @ V = 5V  
DD  
FULL-SCALE ERROR @ V = 5V  
DD  
0.1  
–0.0005  
–0.0010  
–0.0015  
–0.0020  
0
–0.1  
–0.2  
–0.3  
–0.4  
FULL-SCALE ERROR @ V = 3V  
DD  
MIN DNL @ V = 3V  
DD  
MIN DNL @ V = 5V  
DD  
–0.0025  
–40  
–40  
–20  
0
20  
40  
60  
80  
100  
120  
140  
–20  
0
20  
40  
60  
80  
100  
120  
140  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
Figure 11. Zero-Code/Full-Scale Error vs. Temperature (3 V/5 V)  
Figure 14. DNL Error vs. Temperature (3 V/5 V)  
0.0020  
1.0  
0.8  
T
= 25°C  
A
T
= 25°C  
A
0.0015  
0.0010  
0.0005  
0
0.6  
ZERO-CODE ERROR  
0.4  
MAX DNL ERROR  
MIN DNL ERROR  
0.2  
0
FULL-SCALE ERROR  
–0.2  
–0.4  
–0.6  
–0.8  
–1.0  
–0.0005  
–0.0010  
–0.0015  
–0.0020  
2.7  
3.2  
3.7  
4.2  
4.7  
5.2  
2.7  
3.2  
3.7  
4.2  
4.7  
5.2  
SUPPLY (V)  
SUPPLY (V)  
Figure 12. Zero-Code/Full-Scale Error vs. Supply at 25°C  
Figure 15. DNL Error vs. Supply at 25°C  
0.5  
12  
10  
8
V
= 3V  
= DV  
= GND  
= 25°C  
V
V
V
= 5V  
= DV  
= GND  
V
= 5V  
DD  
IH  
DD  
DD  
= 25°C  
V
V
T
DD  
IH  
DD  
A
0.4  
0.3  
IL  
A
IL  
A
T
T
= 25°C  
0.2  
0.1  
6
0
–0.1  
–0.2  
–0.3  
–0.4  
–0.5  
4
2
0
256 2256 4256 6256 8256 10256 12256 14256  
DAC CODE  
I
(mA)  
DD  
Figure 16. IDD Histogram (3 V/5 V)  
Figure 13. Typical DNL  
Rev. D | Page 8 of 20  
 
 
Data Sheet  
AD5641  
0
–0.1  
–0.2  
–0.3  
–0.4  
–0.5  
–0.6  
–0.7  
–0.8  
–0.9  
–1.0  
–1.1  
–1.2  
–1.3  
–1.4  
–1.5  
–1.6  
0.10  
0.09  
0.08  
0.07  
0.06  
0.05  
0.04  
0.03  
0.02  
0.01  
0
T
A = 25°C  
V
V
= V  
= 5V  
= 3V  
DD  
REF  
= V  
60  
DD  
REF  
–40  
–20  
0
20  
40  
80  
100  
120  
140  
2.7  
3.2  
3.7  
4.2  
4.7  
5.2  
TEMPERATURE (°C)  
SUPPLY VOLTAGE (V)  
Figure 17. Offset Error vs. Temperature (3 V/5 V Supply)  
Figure 20. Supply Current vs. Supply Voltage at 25°C  
0.8  
0.6  
0
–0.002  
–0.004  
–0.006  
–0.008  
–0.010  
–0.012  
–0.014  
–0.016  
V
= 5V  
= 25°C  
DD  
T
A
DAC LOADED WITH ZERO-SCALE CODE  
0.4  
V
= 5V  
DD  
0.2  
0
V
= 3V  
DD  
–0.2  
–0.4  
–0.6  
DAC LOADED WITH FULL-SCALE CODE  
–40  
–20  
0
20  
40  
60  
80  
100  
120  
140  
–15  
–10  
–5  
0
5
10  
15  
TEMPERATURE (°C)  
I (mA)  
Figure 18. Gain Error vs. Temperature (3 V/5 V)  
Figure 21. Sink and Source Capability  
70  
60  
50  
40  
30  
20  
10  
0
0.10  
0.09  
0.08  
0.07  
0.06  
0.05  
0.04  
0.03  
0.02  
0.01  
0
V
= 5V  
= 3V  
DD  
V
V
= 5V  
DD  
DD  
V
= 3V  
DD  
0
2000 4000 6000 8000 10000 12000 14000 16000  
DIGITAL INPUT CODE  
–40  
–20  
0
20  
40  
60  
80  
100  
120  
140  
TEMPERATURE (°C)  
Figure 19. Supply Current vs. Temperature (3 V/5 V Supply)  
Figure 22. Supply Current vs. Digital Input Code  
Rev. D | Page 9 of 20  
 
AD5641  
Data Sheet  
CH1  
T
V
= 25°C  
= 5V  
A
V
DD  
V
= 5V  
DD  
DD  
T
= 25°C  
A
CH1 = SCLK  
CH2  
V
OUT  
CH2 = V  
OUT  
CH1 = 5V/DIV CH2 = 1V/DIV TIME BASE = 2µs/DIV  
CH1 1V, CH2 5V, TIME BASE = 50µs/DIV  
Figure 23. Full-Scale Settling Time  
Figure 26. VDD vs. VOUT  
2.458  
T
= 25°C  
A
V
= 5V  
DD  
2.456  
2.454  
2.452  
2.450  
2.448  
2.446  
2.444  
2.442  
2.440  
2.438  
2.436  
CH1 = SCLK  
CH2 = V  
OUT  
T
= 25°C  
A
V
= 5V  
DD  
LOAD = 2kAND 220pF  
CODE 0x2000 TO 0x1FFF  
10ns/SAMPLE NUMBER  
CH1 = 5V/DIV CH2 = 1V/DIV TIME BASE = 2µs/DIV  
0
100  
200  
300  
400  
500  
SAMPLE NUMBER  
Figure 24. Midscale Settling Time  
Figure 27. Digital-to-Analog Glitch Energy  
V
= 5V  
DD  
= 25°C  
V
DD  
V
= 5V  
DD  
= 25°C  
T
A
T
A
MIDSCALE LOADED  
CH1  
CH1  
V
= 70mV  
OUT  
CH2  
CH1 5µV/DIV  
CH1 1V, CH2 20mV, TIME BASE = 20µs/DIV  
Figure 25. Power-On Reset to 0 V  
Figure 28. 1/f Noise, 0.1 Hz to 10 Hz Bandwidth  
Rev. D | Page 10 of 20  
 
Data Sheet  
AD5641  
700  
V
T
= 5V  
= 25°C  
V
T
= 5V  
DD  
DD  
= 25°C  
CH1  
A
A
600 UNLOADED OUTPUT  
500  
V
OUT  
400  
ZERO SCALE  
300  
MIDSCALE  
200  
100  
0
FULL SCALE  
CH2  
CH1 5V, CH2 1V, TIME BASE = 2µs/DIV  
100  
1000  
10000  
100000  
FREQUENCY (Hz)  
Figure 29. Exiting Power-Down Mode  
Figure 31. Noise Spectral Density  
140  
120  
100  
80  
450  
3/4 SCALE  
T
= 25°C  
A
SCLK/SDIN  
INCREASING  
FULL SCALE  
400  
350  
300  
250  
200  
150  
100  
50  
SCLK/SDIN  
DECREASING  
= 5V  
V
= 5V  
DD  
V
DD  
MIDSCALE  
1/4 SCALE  
SCLK/SDIN  
INCREASING  
V
= 3V  
DD  
60  
ZERO SCALE  
40  
20  
SCLK/SDIN DECREASING V = 3V  
DD  
0
0
0
1
2
3
4
5
6
0
5
10  
15  
20  
25  
V
(V)  
LOGIC  
FREQUENCY (MHz)  
Figure 32. SCLK/SDIN vs. Logic Voltage  
Figure 30. IDD vs. SCLK vs. Code  
Rev. D | Page 11 of 20  
 
AD5641  
Data Sheet  
TERMINOLOGY  
Relative Accuracy  
Gain Error  
For the DAC, relative accuracy or integral nonlinearity (INL) is  
a measure of the maximum deviation, in LSBs, from a straight  
line passing through the endpoints of the DAC transfer  
function. See Figure 5 for a plot of typical INL vs. code.  
Gain error is a measure of the span error of the DAC. It is the  
deviation in slope of the DAC transfer characteristic from ideal,  
expressed as a percent of the full-scale range.  
Total Unadjusted Error (TUE)  
Differential Nonlinearity (DNL)  
Total unadjusted error is a measure of the output error taking  
the various errors into account. See Figure 8 for a plot of typical  
TUE vs. code.  
Differential nonlinearity is the difference between the measured  
change and the ideal 1 LSB change between any two adjacent  
codes. A specified differential nonlinearity of 1 LSB maximum  
ensures monotonicity. This DAC is guaranteed monotonic by  
design. See Figure 13 for a plot of typical DNL vs. code.  
Zero-Code Error Drift  
Zero-code error drift is a measure of the change in zero-code  
error with a change in temperature. It is expressed in μV/°C.  
Zero-Code Error  
Gain Error Drift  
Zero-code error is a measure of the output error when zero  
code (0x0000) is loaded to the DAC register. Ideally, the output  
should be 0 V. The zero-code error is always positive in the  
AD5641 because the output of the DAC cannot go below 0 V.  
Zero-code error is due to a combination of the offset errors in  
the DAC and output amplifier. Zero-code error is expressed in  
mV. See Figure 11 for a plot of zero-code error vs. temperature.  
Gain error drift is a measure of the change in gain error with  
changes in temperature. It is expressed in (ppm of full-scale  
range)/°C.  
Digital-to-Analog Glitch Impulse  
Digital-to-analog glitch impulse is the impulse injected into the  
analog output when the input code in the DAC register changes  
state. It is normally specified as the area of the glitch in nV-s  
and is measured when the digital input code is changed by  
1 LSB at the major carry transition (0x2000 to 0x1FFF). See  
Figure 27.  
Full-Scale Error  
Full-scale error is a measure of the output error when full-scale  
code (0xFFFF) is loaded to the DAC register. Ideally, the output  
should be VDD − 1 LSB. Full-scale error is expressed in mV. See  
Figure 11 for a plot of full-scale error vs. temperature.  
Digital Feedthrough  
Digital feedthrough is a measure of the impulse injected into  
the analog output of the DAC from the digital inputs of the  
DAC, but is measured when the DAC output is not updated.  
It is specified in nV-s and is measured with a full-scale code  
change on the data bus, that is, from all 0s to all 1s and vice versa.  
Rev. D | Page 12 of 20  
 
Data Sheet  
AD5641  
THEORY OF OPERATION  
DIGITAL-TO-ANALOG SECTION  
OUTPUT AMPLIFIER  
The AD5641 DAC is fabricated on a CMOS process. The  
architecture consists of a string DAC followed by an output  
buffer amplifier. Figure 33 is a block diagram of the DAC  
architecture.  
The output buffer amplifier is capable of generating rail-to-rail  
voltages on its output, giving an output range of 0 V to VDD. It is  
capable of driving a load of 2 kΩ in parallel with 1000 pF to  
GND. The source and sink capabilities of the output amplifier  
can be seen in Figure 21. The slew rate is 0.5 V/μs, with a  
midscale settling time of 8 μs with the output loaded.  
V
DD  
REF (+)  
SERIAL INTERFACE  
RESISTOR  
NETWORK  
V
DAC REGISTER  
OUT  
SYNC  
The AD5641 has a 3-wire serial interface (  
, SCLK, and  
REF ()  
OUTPUT  
SDIN) that is compatible with SPI, QSPI, and MICROWIRE  
interface standards, as well as most DSPs. See Figure 2 for a  
timing diagram of a typical write sequence.  
AMPLIFIER  
GND  
Figure 33. DAC Architecture  
SYNC  
The write sequence begins by bringing the  
line low. Data  
Because the input coding to the DAC is straight binary, the ideal  
output voltage is given by  
from the SDIN line is clocked into the 16-bit shift register on  
the falling edge of SCLK. The serial clock frequency can be as  
high as 30 MHz, making the AD5641 compatible with high  
speed DSPs. On the 16th falling clock edge, the last data bit is  
clocked in and the programmed function is executed (a change  
in DAC register contents and/or a change in the mode of  
D
VOUT VDD  
16,384  
where D is the decimal equivalent of the binary code that is  
loaded to the DAC register; it can range from 0 to 16,384.  
SYNC  
operation). At this stage, the  
line can be kept low or  
brought high. In either case, it must be brought high for a  
minimum of 20 ns before the next write sequence, so that a  
RESISTOR STRING  
The resistor string structure is shown in Figure 34. It is simply a  
string of resistors, each of value R. The code loaded to the DAC  
register determines at which node on the string the voltage is  
tapped off to be fed into the output amplifier. The voltage is  
tapped off by closing one of the switches connecting the string  
to the amplifier. Because it is a string of resistors, it is guaran-  
teed monotonic.  
SYNC  
falling edge of  
can initiate the next write sequence.  
SYNC  
Because the  
buffer draws more current when VIN = 1.8 V  
SYNC  
than it does when VIN = 0.8 V,  
should be idled low between  
write sequences for even lower power operation of the part, as  
previously mentioned. However, it must be brought high again  
just before the next write sequence.  
INPUT SHIFT REGISTER  
The input shift register is 16 bits wide (see Figure 35). The first  
two bits are control bits, which determine the operating mode  
of the part (normal mode or any one of three power-down modes).  
For a complete description of the various modes, see the Power-  
Down Modes section. The next 14 bits are the data bits, which  
are transferred to the DAC register on the 16th falling edge  
of SCLK.  
R
R
TO OUTPUT  
AMPLIFIER  
R
SYNC INTERRUPT  
SYNC  
In a normal write sequence, the  
line is kept low for at  
least 16 falling edges of SCLK and the DAC is updated on the  
th  
SYNC  
16 falling edge. However, if  
is brought high before the  
R
R
16th falling edge, this acts as an interrupt to the write sequence.  
The shift register is reset and the write sequence is seen as  
invalid. Neither an update of the DAC register contents nor a  
change in the operating mode occurs (see Figure 36).  
Figure 34. Resistor String Structure  
Rev. D | Page 13 of 20  
 
 
 
 
 
 
 
 
 
AD5641  
Data Sheet  
DB15 (MSB)  
DB0 (LSB)  
PD1  
PD0  
D13  
D12  
D11  
D10  
D9  
D8  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
DATA BITS  
NORMAL OPERATION  
0
0
1
1
0
1
0
1
1 kTO GND  
100 kTO GND  
POWER-DOWN MODES  
THREE-STATE  
Figure 35. Input Register Contents  
SCLK  
SYNC  
SDIN  
DB15  
DB0  
DB16  
DB0  
INVALID WRITE SEQUENCE:  
SYNC HIGH BEFORE 16TH FALLING EDGE  
VALID WRITE SEQUENCE, OUTPUT UPDATES  
ON THE 16TH FALLING EDGE  
SYNC  
Figure 36.  
Interrupt Facility  
Not only does the supply current fall, but the output stage is  
also internally switched from the output of the amplifier to a  
resistor network of known values. This has the advantage that  
the output impedance of the part is known while the part is in  
power-down mode. There are three different options: the  
output is connected internally to GND through either a 1 kΩ  
resistor or a 100 kΩ resistor, or the output is left open-circuited  
(three-stated). Figure 37 shows the output stage.  
POWER-ON RESET  
The AD5641 contains a power-on reset circuit that controls the  
output voltage during power-up. The DAC register is filled with  
0s and the output voltage is 0 V. It remains there until a valid  
write sequence is made to the DAC. This is useful in applica-  
tions in which it is important to know the state of the DAC  
output while it is in the process of powering up.  
POWER-DOWN MODES  
The AD5641 has four separate modes of operation. These  
modes are software programmable by setting two bits (DB15  
and DB14) in the control register. Table 6 shows how the state  
of the bits corresponds to the operating mode of the device.  
RESISTOR  
STRING DAC  
AMPLIFIER  
V
OUT  
POWER-DOWN  
CIRCUITRY  
RESISTOR  
NETWORK  
Table 6. Operating Modes for the AD5641  
DB15  
DB14  
Operating Mode  
Normal operation  
Power-down mode:  
1 kΩ to GND  
100 kΩ to GND  
Three-state  
0
0
Figure 37. Output Stage During Power-Down  
The bias generator, output amplifier, resistor string, and other  
associated linear circuitry are all shut down when power-down  
mode is activated. However, the contents of the DAC register  
are unaffected when in power-down. The time to exit power-  
down is typically 13 µs for VDD = 5 V and 16 µs for VDD = 3 V.  
See Figure 29 for a plot.  
0
1
1
1
0
1
When both bits are set to 0, the part has normal power  
consumption of 100 µA maximum at 5 V. However, for the  
three power-down modes, the supply current falls to typically  
0.2 µA at 3 V.  
Rev. D | Page 14 of 20  
 
 
 
 
 
 
Data Sheet  
AD5641  
the SDIN pin of the AD5641, while TSCLK0 drives the SCLK of  
MICROPROCESSOR INTERFACING  
AD5641 to ADSP-2101 Interface  
SYNC  
the part. The  
is driven from TFS0.  
Figure 38 shows a serial interface between the AD5641 and the  
ADSP-2101. The ADSP-2101 should be set up to operate in  
SPORT transmit alternate framing mode. The ADSP-2101  
SPORT is programmed through the SPORT control register and  
should be configured as follows: internal clock operation, active  
low framing, and 16-bit word length. Transmission is initiated  
by writing a word to the Tx register after the SPORT is enabled.  
AD5641*  
ADSP-BF53x*  
DT0PRI  
TSCLK0  
TFS0  
SDIN  
SCLK  
SYNC  
*ADDITIONAL PINS OMITTED FOR CLARITY  
Figure 40. AD5641 to Blackfin ADSP-BF53x Interface  
ADSP-2101*  
AD5641*  
AD5641 to 80C51/80L51 Interface  
TFS  
DT  
SYNC  
SDIN  
SCLK  
Figure 41 shows a serial interface between the AD5641 and the  
80C51/80L51 microcontroller. The setup for the interface is as  
follows: TxD of the 80C51/80L51 drives SCLK of the AD5641,  
SCLK  
SYNC  
while RxD drives the serial data line of the part. The  
*ADDITIONAL PINS OMITTED FOR CLARITY  
signal is again derived from a bit-programmable pin on the  
port. In this case, Port Line P3.3 is used. When data is to be  
transmitted to the AD5641, P3.3 is taken low.  
Figure 38. AD5641 to ADSP-2101 Interface  
AD5641 to 68HC11/68L11 Interface  
Figure 39 shows a serial interface between the AD5641 and the  
68HC11/68L11 microcontroller. SCK of the 68HC11/68L11  
drives the SCLK of the AD5641, while the MOSI output drives  
The 80C51/80L51 transmits data only in 8-bit bytes; therefore,  
only eight falling clock edges occur in the transmit cycle. To  
load data to the DAC, P3.3 is left low after the first eight bits are  
transmitted, and a second write cycle is initiated to transmit the  
second byte of data. P3.3 is taken high following the completion  
of this cycle. The 80C51/80L51 outputs the serial data LSB first.  
The AD5641 requires its data with the MSB as the first bit  
received. The 80C51/80L51 transmit routine should take this  
into account.  
SYNC  
the serial data line of the DAC. The  
signal is derived  
from a port line (PC7). The setup conditions for correct  
operation of this interface are as follows: the 68HC11/68L11  
should be configured so that the CPOL bit is 0 and the CPHA  
SYNC  
bit is 1. When data is being transmitted to the DAC, the  
line is taken low (PC7). When the 68HC11/68L11 are config-  
ured as previously described, data appearing on the MOSI  
output is valid on the falling edge of SCK. Serial data from the  
68HC11/68L11 is transmitted in 8-bit bytes with only eight  
falling clock edges occurring in the transmit cycle. Data is  
transmitted MSB first. To load data to the AD5641, PC7 is left  
low after the first eight bits are transferred and a second serial  
write operation is performed to the DAC. PC7 is taken high at  
the end of this procedure.  
AD5641*  
80C51/80L51*  
P3.3  
TxD  
RxD  
SYNC  
SCLK  
SDIN  
*ADDITIONAL PINS OMITTED FOR CLARITY  
Figure 41. AD5641 to 80C51/80L51 Interface  
68HC11/  
68L11*  
AD5641*  
AD5641 to MICROWIRE Interface  
Figure 42 shows an interface between the AD5641 and any  
MICROWIRE-compatible device. Serial data is shifted out on  
the falling edge of the serial clock and is clocked into the  
AD5641 on the rising edge of SK.  
PC7  
SCK  
SYNC  
SCLK  
SDIN  
MOSI  
*ADDITIONAL PINS OMITTED FOR CLARITY  
AD5641*  
MICROWIRE*  
Figure 39. AD5641 to 68HC11/68L11 Interface  
AD5641 to Blackfin® ADSP-BF53x Interface  
CS  
SK  
SO  
SYNC  
SCLK  
SDIN  
Figure 40 shows a serial interface between the AD5641 and  
the Blackfin ADSP-BF53x microprocessor. The ADSP-BF53x  
processor family incorporates two dual-channel synchronous  
serial ports, SPORT1 and SPORT0, for serial and multi-  
processor communications. Using SPORT0 to connect to the  
AD5641, the setup for the interface is as follows: DT0PRI drives  
*ADDITIONAL PINS OMITTED FOR CLARITY  
Figure 42. AD5641 to MICROWIRE Interface  
Rev. D | Page 15 of 20  
 
 
 
 
 
 
AD5641  
Data Sheet  
APPLICATIONS  
CHOOSING A REFERENCE AS POWER SUPPLY FOR  
THE AD5641  
BIPOLAR OPERATION USING THE AD5641  
The AD5641 has been designed for single-supply operation,  
but a bipolar output range is also possible using the circuit in  
Figure 44. The circuit in Figure 44 gives an output voltage  
range of 5 V. Rail-to-rail operation at the amplifier output is  
achievable using an AD820 or OP295 as the output amplifier.  
R2 = 10k  
The AD5641 comes in tiny LFCSP and SC70 packages with less  
than 100 μA supply current. Because of this, the choice of refer-  
ence depends on the application requirement. For space-saving  
applications, the ADR02 is available in an SC70 package and  
has excellent drift at 9 ppm/°C (3 ppm/°C in the R-8 package).  
It also provides very good noise performance at 3.4 μV p-p in  
the 0.1 Hz to 10 Hz range.  
+5V  
+5V  
R1 = 10k  
Because the supply current required by the AD5641 is  
extremely low, the parts are ideal for low supply applications.  
The ADR395 voltage reference is recommended in this case.  
It requires less than 100 μA of quiescent current and can,  
therefore, drive multiple DACs in one system, if required. It  
also provides very good noise performance at 8 μV p-p in the  
0.1 Hz to 10 Hz range.  
AD820/  
+5V  
OP295  
V
V
OUT  
DD  
10F  
0.1F  
AD5641  
–5V  
3-WIRE  
SERIAL  
INTERFACE  
7V  
Figure 44. Bipolar Operation with the AD5641  
5V  
ADR395  
The output voltage for any input code can be calculated as  
D
R1 R2  
R2  
R1  
VOUT V  
V  
DD  
DD  
SYNC  
3-WIRE  
V
= 0V TO 5V  
16,384  
R1  
OUT  
SERIAL  
INTERFACE  
SCLK  
SDIN  
AD5641  
where D represents the input code in decimal (0 – 16384).  
With VDD = 5 V, R1 = R2 = 10 kΩ,  
Figure 43. ADR395 as Power Supply to AD5641  
10 D   
VOUT  
5 V  
Table 7 lists some recommended precision references for use as  
supplies to the AD5641.  
16,384  
This is an output voltage range of 5 V with 0x0000 corre-  
sponding to a –5 V output, and 0x3FFF corresponding to a  
+5 V output.  
Table 7. Precision References for Use with AD5641  
Initial  
Temperature  
Accuracy Drift  
0.1 Hz to 10 Hz  
Part No.  
ADR435  
ADR425  
ADR02  
ADR02  
ADR395  
(mV max) (ppm/°C max)  
Noise (μV p-p typ)  
2
2
3
3
5
3 (R-8)  
3 (R-8)  
3 (R-8)  
3 (SC70)  
9 (TSOT-23)  
8
3.4  
10  
10  
8
Rev. D | Page 16 of 20  
 
 
 
 
 
Data Sheet  
AD5641  
USING THE AD5641 WITH A GALVANICALLY  
ISOLATED INTERFACE  
POWER SUPPLY BYPASSING AND GROUNDING  
When accuracy is important in a circuit, it is helpful to carefully  
consider the power supply and ground return layout on the  
board. The printed circuit board containing the AD5641 should  
have separate analog and digital sections, each having its own  
area of the board. If the AD5641 is in a system where other  
devices require an AGND-to-DGND connection, the  
In process control applications in industrial environments, it  
is often necessary to use a galvanically isolated interface to  
protect and isolate the controlling circuitry from any hazardous  
common-mode voltages that might occur in the area where  
the DAC is functioning. iCoupler® provides isolation in excess  
of 2.5 kV. The AD5641 use a 3-wire serial logic interface, so the  
ADuM1300 three-channel digital isolator provides the required  
isolation (see Figure 45). The power supply to the part also  
needs to be isolated, which is done by using a transformer. On  
the DAC side of the transformer, a 5 V regulator provides the  
5 V supply required for the AD5641.  
connection should be made at one point only. This ground  
point should be as close as possible to the AD5641.  
The power supply to the AD5641 should be bypassed with  
10 µF and 0.1 µF capacitors. The capacitors should be physically  
as close as possible to the device, with the 0.1 µF capacitor  
ideally right up against the device. The 10 µF capacitors are  
the tantalum bead type. It is important that the 0.1 µF capacitor  
has low effective series resistance (ESR) and effective series  
inductance (ESI), such as in common ceramic types of  
capacitors. This 0.1 µF capacitor provides a low impedance  
path to ground for high frequencies caused by transient  
currents due to internal logic switching.  
5V  
REGULATOR  
POWER  
10µF  
0.1µF  
V
DD  
SCLK  
VIA  
VOA  
SCLK  
The power supply line itself should have as large a trace as  
possible to provide a low impedance path and reduce glitch  
effects on the supply line. Clocks and other fast switching  
digital signals should be shielded from other parts of the board  
by digital ground. Avoid crossover of digital and analog signals,  
if possible. When traces cross on opposite sides of the board,  
ensure that they run at right angles to each other to reduce  
feedthrough effects on the board. The best board layout  
technique is the microstrip technique, where the component  
side of the board is dedicated to the ground plane only and the  
signal traces are placed on the solder side. However, this is not  
always possible with a 2-layer board.  
ADuM1300  
AD5641  
V
OUT  
SDI  
VIB  
VIC  
VOB  
VOC  
SYNC  
SDIN  
DATA  
GND  
Figure 45. AD5641 with a Galvanically Isolated Interface  
Rev. D | Page 17 of 20  
 
 
 
AD5641  
Data Sheet  
OUTLINE DIMENSIONS  
2.20  
2.00  
1.80  
2.40  
2.10  
1.80  
6
1
5
2
4
3
1.35  
1.25  
1.15  
PIN 1  
1.30 BSC  
0.65 BSC  
1.00  
0.90  
0.70  
0.40  
0.10  
1.10  
0.80  
0.30  
0.10  
0.30  
0.15  
0.22  
0.08  
0.10 MAX  
SEATING  
PLANE  
0.10 COPLANARITY  
COMPLIANT TO JEDEC STANDARDS MO-203-AB  
Figure 46. 6-Lead Thin Shrink Small Outline Transistor Package [SC70]  
(KS-6)  
Dimensions shown in millimeters  
1.50  
1.40  
1.30  
2.10  
2.00  
1.90  
0.65 REF  
0.20 MIN  
4
6
3.10  
3.00  
2.90  
EXPOSED  
PAD  
1.70  
1.60  
1.50  
0.45  
0.40  
0.35  
PIN 1 INDEX  
AREA  
3
1
PIN 1  
INDICATOR  
(R 0.15)  
TOP VIEW  
BOTTOM VIEW  
FOR PROPER CONNECTION OF  
THE EXPOSED PAD, REFER TO  
THE PIN CONFIGURATION AND  
FUNCTION DESCRIPTIONS  
0.80  
0.75  
0.70  
0.05 MAX  
0.00 MIN  
0.203 REF  
SECTION OF THIS DATA SHEET.  
SEATING  
PLANE  
0.35  
0.30  
0.25  
COPLANARITY  
0.08  
COMPLIANT TOJEDEC STANDARDS MO-229  
Figure 47. 6-Lead Lead Frame Chip Scale Package [LFCSP_WD]  
2.00 × 3.00 mm Body, Very Very Thin, Dual Lead  
(CP-6-5)  
Dimensions shown in millimeters  
Rev. D | Page 18 of 20  
 
Data Sheet  
AD5641  
ORDERING GUIDE  
Temperature  
Range  
Package  
Option  
Model1  
Description  
Package Description  
Branding  
AD5641AKSZ-REEL7  
–40°C to +125°C  
–40°C to +125°C  
–40°C to +125°C  
–40°C to +125°C  
–40°C to +125°C  
16 LSB INL  
6-Lead Thin Shrink Small Outline Transistor  
Package [SC70]  
6-Lead Thin Shrink Small Outline Transistor  
Package [SC70]  
6-Lead Lead Frame Chip Scale Package  
[LFCSP_WD]  
KS-6  
KS-6  
CP-6-5  
KS-6  
KS-6  
D3Q  
AD5641AKSZ-500RL7  
AD5641ACPZ-REEL7  
AD5641BKSZ-REEL7  
AD5641BKSZ-500RL7  
16 LSB INL  
16 LSB INL  
4 LSB INL  
4 LSB INL  
D3Q  
8A  
6-Lead Thin Shrink Small Outline Transistor  
Package [SC70]  
6-Lead Thin Shrink Small Outline Transistor  
Package [SC70]  
D3P  
D3P  
1 Z = RoHS Compliant Part.  
Rev. D | Page 19 of 20  
 
 
AD5641  
NOTES  
Data Sheet  
©2005–2012 Analog Devices, Inc. All rights reserved. Trademarks and  
registered trademarks are the property of their respective owners.  
D04611-0-2/12(D)  
Rev. D | Page 20 of 20  

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