ZXFV302EV [ZETEX]
4:1 CHANNEL VIDEO MULTIPLEXER EVALUATION BOARD; 4 ： 1路视频多路复用器评估板
| 型号： | ZXFV302EV |
| 厂家： | 
ZETEX SEMICONDUCTORS |
| 描述： | 4:1 CHANNEL VIDEO MULTIPLEXER EVALUATION BOARD |
| 文件： | 总3页 (文件大小：115K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ZXFV302EV
4:1 CHANNEL VIDEO MULTIPLEXER EVALUATION BOARD
Evaluation board description
The wide bandwidth of the ZXFV302 4:1 channel video Figures 1, 2 and 3 show the schem atic and copper
m ultiplexer necessitates som e care in the layout of the layout of a double-sided printed circuit board suitable
printe d circuit. For this re a son Ze te x ha s m a de for evaluation of the device in the laboratory.
available an Evaluation Board.
BNC connector sockets allow connection to test
The Evaluation Board layout serves as
a useful instrum ents via 50⍀ cables. The output circuit includes
exam ple for m any applications, showing a practical a resistor m atching circuit to present a load of 150⍀ to
im plem entation of the advice given below.
the am plifier (equivalent to a 75⍀ back-term inated
video line) and sim ultaneously provide 50⍀ output
im pedance.
The ZXFV302EV can also be used to evaluate the
ZXFV301 4:1 channel m ultiplexer. The ZXFV301 and
ZXFV302 devices have very sim ilar ac perform ance,
with the only difference being in the active channel
selection.
The attenuation of this m atching circuit is 15.45 dB. As
the m ultiplexer is internally configured for a voltage
gain of 1, the overall gain from input to output is
-15.45dB.
Figure 1 Circuit schem atic
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ZXFV302EV
PCB design
A continuous ground plane is required under the A double-sided or m ulti-layer PCB construction is
device and its signal connection paths, to provide the required, with plated-through via holes providing
shortest possible ground return paths for signals and closely spaced low-inductance connections from som e
power supply filtering.
com ponents to the continuous ground plane (som e of
these holes are not visible in the figures for the
Evaluation Board – artworks and NC drill output can be
provided if required).
Figure 2 Evaluation circuit top copper layout
(overall dim ensions 2.5 x 2.25 inches)
Figure 3 Evaluation board bottom copper layout
(view ed through from top)
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ZXFV302EV
Evaluation board parts list
Pow er supply filtering
For the power supply filtering, low inductance surface
m ount capacitors are norm ally required. It has been
found that very good RF decoupling is provided on
each supply using a 1000pF NPO size 0805 or sm aller
ceram ic surface m ount capacitor, closest to the device
pin, with an adjacent 0.1F X7R capacitor. Other
configurations are possible and it m ay be found that a
single 0.01F X7R capacitor on each supply gives good
results. However this should be supported by larger
decoupling capacitors elsewhere on the printed circuit
b o a rd . Va lu e s o f 1 to 10F a re re co m m e n d e d
particularly where the voltage regulators are located
m ore than a few inches from the device. These larger
capacitors are recom m ended to be solid tantalum
electrolytic or ceram ic types.
QTY CCT - REF VALUE DES CRIPTION
Re s is t o rs , s u rfa ce m o u n t
1
2
1
1
1
4
4
1
1
1
5
R1,
51R
0805
0805
R2,R3
R4
1k⍀
120R 0805
R5
10R
62R
51R
0805
0805
0805
R6
R1 to R4
R5 to R8
R9
22k⍀ 0805
120R 0805
R10
62R
10R
0805
0805
R11
R12 - R16
47k⍀ 0805
Ca p a cit o rs , s u rfa ce m o u n t
2
1n F
50V ceram ic 0805 NPO
6
100n F 25V ceram ic 0805 XR7
2
10F 16V Ta n t Ele c s ize C
In t e g ra t e d circu it s
1
U1
Ze te x ZXFV302N16
Mis ce lla n e o u s
5
BNC socket, PCB straight flange,
e .g . Tyco B35N14H999X99
1
3-w a y PCB s cre w te rm in a l
b lo ck IMO 20.501/3S B
1
S W1
DIL s w itch , 8 w a y
10 TP1 to
TP10
PCB te s t te rm in a l, re d ,
W.Hu g h e s 100-107
© Zetex Sem iconductors plc 2004
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ISSUE 1 - SEPTEMBER 2004
S E M IC O N D U C T O R S
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