SP8854DKGHCAR [ZARLINK]

1.7GHz PARALLEL LOAD PROFESSIONAL SYNTHESISER; 1.7GHz的并行加载专业合成器
SP8854DKGHCAR
型号: SP8854DKGHCAR
厂家: ZARLINK SEMICONDUCTOR INC    ZARLINK SEMICONDUCTOR INC
描述:

1.7GHz PARALLEL LOAD PROFESSIONAL SYNTHESISER
1.7GHz的并行加载专业合成器

信号电路 锁相环或频率合成电路 输入元件
文件: 总14页 (文件大小:559K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
This product is obsolete.  
This information is available for your  
convenience only.  
For more information on  
Zarlink’s obsolete products and  
replacement product lists, please visit  
http://products.zarlink.com/obsolete_products/  
SP8854D  
PACKAGE DETAILS  
Dimensions are shown thus: mm (in). For further package information please contact your local Customer Service Centre.  
17.27/17.78  
(0.680/0.700)  
12.45/12.95  
(0.490/0.510)  
16.33/16.81  
(0.643/0.662)  
0.51 (0.02) NOM  
INDEX CORNER  
AT 45°  
1.02MM/(0.040  
45° AT 3 PLACES  
)NOM  
0.89(0.035)  
03.05/3.43  
(0.120/0.135)  
HC44 MULTILAYER CERAMIC J LEADED CHIP CARRIER  
CUSTOMER SERVICE CENTRES  
HEADQUARTERS OPERATIONS  
FRANCE & BENELUX Les Ulis Cedex Tel: (1) 64 46 23 45  
Fax: (1) 69 18 90 00  
GEC PLESSEY SEMICONDUCTORS  
Cheney Manor, Swindon,  
GERMANY Munich Tel: (089) 3609 06 0 Fax: (089) 3609 06 55  
ITALY Milan Tel: (02) 66040867 Fax: (02) 66040993  
JAPAN Tokyo Tel: (03) 5276–5501 Fax: (03) 5276–5510  
NORTH AMERICA Scotts Valley, USA  
Wiltshire United Kingdom SN2 2QW.  
Tel: (01793) 518000  
Fax: (01793) 518411  
Tel: (408) 438 2900 Fax: (408) 438 7023  
SOUTH EAST ASIA Singapore Tel: (65) 3827708 Fax: (65) 3828872  
SWEDEN Stockholm Tel: 46 8 7029770 Fax: 46 8 6404736  
TAIWAN, ROC Taipei Tel: 886 2 5461260 Fax: 886 2 7190260  
UK, EIRE, DENMARK, FINLAND & NORWAY  
Swindon Tel: (01793) 518527/518566 Fax: (01793) 518582  
These are supported by Agents and Distributors in major countries world–wide.  
GEC PLESSEY SEMICONDUCTORS  
P.O. Box 660017 1500 Green Hills Road,  
Scotts Valley, California 95067–0017,  
United States of America. Tel: (408) 438 2900  
Fax: (408) 438 5576  
GEC Plessey Semiconductors 1995 Publication No. D.S. 3701 Issue No. 2.6 October 1995  
TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM  
This publication is issued to provide information only, which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any  
order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability,  
performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design, or price of any product or service. Information  
concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It  
is the user’s responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and  
has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and  
materials are sold and services provided subject to the Company’s conditions of sale, which are available on request.  
12  
SP8854D  
C
C
2
1
From equation 3:  
tan 45°  
1
cos 45°  
2
FROM  
CHARGE  
PUMP  
0 . 4142  
628319  
3
100kHz  
R
2
+
OUTPUT  
TO  
VCO  
9
FROM  
CHARGE  
PUMP  
659 10  
From equation 2:  
REFERENCE  
1
2
(100kHz 2 )2 659 10  
9
6
Fig. 8. Third order loop filter circuit diagram  
3 . 844 10  
2
Using these values in equation 1:  
3
1 x 10  
2
10MHz V  
[A]  
1
100 (2  
100kHz)2  
Loop Filter Design  
Generally the third order filter configuration shown in Fig.8  
gives better results than the more commonly used second  
order because the reference sidebands are reduced. Three  
equations are required to determine values for the three  
constants where;  
Where A is :  
2
2
2
n
6
1
1
(
)
(
)
2
100k  
100k  
3 . 844 x 10  
2
n
2
2
9
(
2
)
(
659 x 10  
)
1
1 = C1  
2 = R2 (C1 + C2)  
3 = C2 R2  
1
The equations are;  
9
1 . 59  
3 . 84 10  
C1 C1  
10  
x 2 . 415  
1
1
1
2
3
2
2
K
N
K0  
1
9
n
2
1
2
1
2
2
2
2
1
n
n
3
Now  
3 . 84nF  
1
R2 (C1 C2)  
C2 R2  
2
3
n
1
tan  
0
cos  
0
3
3
n
Substituting for C2  
Where;  
K
is the phase detector gain factor in mA/radian  
K0 is the VCO gain factor in radian/second/Volt  
R2 C1  
2
2
3
N
is the total division ratio from VCO to reference  
frequency  
is the natural loop bandwidth  
is the phase margin normally set to 45°  
n
0
Since the phase detector is linear over a range of 2 radian,  
K can be calculated from  
829  
K = Phase comparator current setting/2  
mA/radian  
These values can now be substituted in equation 1 to obtain  
a value for C1 and equation 2 and 3 used to determine values  
for C2 and R2  
0 . 794  
EXAMPLE  
Calculate values for a loop with the following parameters  
Frequency to be synthesised: 1000MHz  
Reference frequency  
Division ratio  
n natural loop frequency  
K0 VCO gain factor  
0 phase margin  
10MHz  
1000MHz/10MHz = 100  
100kHz  
2 x 10MHz/Volt  
45°  
Phase comparator current  
6.3mA  
The phase detector gain factor K  
= 6.3mA /2 = 1mA/radian  
11  
SP8854D  
gain can be modified when new frequency data is entered to  
compensate for change in the VCO gain characteristic over its  
frequency band. The charge pump pulse current is  
determined by the current fed into pin 19 and is approximately  
equal to pin 19 current when the programmed multiplication  
ratio is one. The circuit diagram Fig. 7e shows the internal  
components on pin 19 which mirror the input current into the  
charge pump. The voltage at pin 19 will be approximately 1.6V  
above ground due to two Vbe drops in the current mirror. This  
voltage will exhibit a negative temperature coefficient, causing  
the charge pump current to change with chip temperature by  
up to 10% over the full military temperature range if the current  
programming resistor is connected to VCC as shown in the  
application diagram Fig. 5. In critical applications where this  
change in charge pump current would be too large the resistor  
to pin 19 could be increased in value and connected to a  
higher supply to reduce the effect of Vbe variation on the  
current level. A suitable resistor connected to a 30V supply  
would reduce the variation in pin 19 current due to  
temperature to less than 1.5%. Alternatively a stable current  
source could be used to set pin 19 current.  
The charge pump output on pin 20 will only produce  
symmetricalupanddowncurrentsifthevoltageisequaltothat  
on the voltage reference pin 21. In order to ensure that this  
voltage relationship is maintained, an operational amplifier  
must be used as shown in the typical application Fig. 5. Using  
this configuration pin 20 voltage will be forced to be equal to  
that on pin 21 since the operational amplifier differential input  
voltage will be no more than a few millivolts (the input offset  
voltageoftheamplifier). Whenthesynthesiserisfirstswitched  
onorwhenafrequencyoutsidetheVCOrangeisprogrammed  
the amplifier output will limit, allowing pin 20 voltage to differ  
from that on pin 21. As soon as an achievable frequency value  
is programmed and the amplifier output starts to slew the  
correct voltage relationship between pin 20 and 21 will be  
restored. Because of the importance of voltage equality  
between the charge pump reference and output pins, a  
resistor should never be connected in series with the  
operational amplifier inverting input and pin 20 as is the case  
with a phase detector giving voltage outputs. Any current  
drawn from the charge pump reference pin should be limited  
to the few micro amps input current of a typical operational  
amplifier. A resistor between the charge pump reference and  
the non inverting input could be added to provide isolation but  
the value should not be so high that more than a few millivolts  
drop are produced by the amplifier input current.  
When selecting a suitable amplifer for the loop filter, a  
number of parameters are important; input offset voltage in  
most designs is only a few milivolts and an offset of 5mV will  
produce a mismatch in the up and down currents of about 4%  
with the charge pump multiplication factor set at 1. The  
mismatch in up down currents caused by input offset voltage  
will be reduced in proportion to the charge pump multiplication  
factor in use. If the linearity of the phase detector about the  
normal phase locked operating point is critical, the input offset  
voltage of most amplifiers can be adjusted to near zero by  
means of a potentiometer.  
The charge pump reference voltage on pin 21 is about 1.3V  
below the positive supply and will change with temperature  
and with the programmed charge pump multiplication factor.  
In many cases it is convenient to operate the amplifier with the  
negative power supply pin connected to 0V as this removes  
theneedforanadditionalpowersupply. Theamplifierselected  
must have a common mode range to within 3.4V (minimum  
charge pump reference voltage) of the negative supply pin to  
operate correctly without a negative supply. Most popular  
amplifiers can be operated from a 30V positive supply to give  
a wide VCO voltage drive range and have adequate common  
mode range to operate with inputs at +3.4V with respect to the  
negative supply. Input bias and offset current levels to most  
operational amplifiers are unlikely to be high enough to  
significantly affect the accuracy of the charge pump circuit  
currents but the bias current can be important in reducing  
referencesidebandsandlocaloscillatordriftduringfrequency  
changes. When the loop is locked, the charge pump produces  
only very narrow pulses of sufficient width to make up for any  
charge lost from the loop filter components during the  
reference cycle. The charge lost will be due to leakage from  
the charge pump output pin and to the amplifier input bias  
current, the latter usually being more significant. The result of  
the lost charge is a sawtooth ripple on the VCO control line  
which frequency modulates the phase locked oscillator at the  
reference frequency and its harmonics. A similar effect will  
occur whenever the strobe input is taken high during a  
programming sequence. In this case the charge pump is  
disabledwhenthestrobeinputishighandanyleakagecurrent  
will cause the oscillator to drift off frequency. To reduce this  
effect, the duration of the strobe pulse should be minimised.  
F
and F outputs  
ref  
These outputs provide access to the outputs from the RF  
pd  
and reference dividers and are provided for monitoring  
purposes during product development or test, and for  
connection of an external phase detector if required. the  
output circuit is of ECL type, the circuit diagram being shown  
in Fig. 7g. The outputs can be enabled or disabled under  
software control by the address 0 control word but are best left  
in the disabled state when not required as the fast edge  
speeds on the output can increase the level of reference  
sidebands on the synthesised oscillator.  
The emitter follower outputs have no internal down resistor  
to save current and if the outputs are required an external pull  
down resistor should be fitted.The value should be kept as  
high as possible to reduce supply current, about 2.2k being  
suitable for monitoring with a high impedance oscilloscope  
probe or for driving an AC coupled 50ohm load. A minimum  
value for the pull down resistor is 330ohms. When the Fpd and  
Fref outputs are disabled the output level will be at the logic low  
level of about 3.5V so that the additional supply current due to  
the load resistors will be present even when the outputs are  
disabled.  
Reference input  
The reference input circuit functions as an input amplifier or  
crystal oscillator. When an external reference signal is used  
thisissimplyACcoupledtopin28, thebaseoftheinputemitter  
follower. When a low phase noise synthesiser is required the  
reference signal is critical since any noise present here will be  
multiplied by the loop. To obtain the lowest possible phase  
noise from the SP8854D it is best to use the highest possible  
reference input frequency and to divide this down internally to  
obtain the required frequency at the phase detector. The  
amplitude of the reference input is also important, and a level  
close to the maximum will give the lowest noise. When the use  
of a low reference input frequency say 4–10MHz is essential  
some advantage may be gained by using a limiting amplifier  
such as a CMOS gate to square up the reference input.  
In cases where a suitable reference signal is not available,  
it may be more convenient to use the input buffer as a crystal  
oscillator in this case the emitter follower input transistor is  
connected as a colpitts oscillator with the crystal connected  
from the base to ground and with the feedback necessary for  
oscillation provided by a capacitor tap at the emitter. The  
arrangement is shown inset in Fig. 5  
.
10  
SP8854D  
V
CC  
V
CC  
3k  
3k  
296  
296  
296  
40k  
40k  
24,25  
28  
27  
F
F
pd ref  
OUTPUTS  
60k  
60k  
3.3mA  
50 A  
50 A  
100 A  
0V  
0V  
100 A  
100 A  
Fig. 7g Fpd and F outputs  
Fig. 7h Reference oscillator  
ref  
Fig. 7 Interface circuit diagrams (cont)  
using a chip capacitor. The remaining input should be  
decoupled to ground, again using a chip capacitor. The inputs  
can be driven differentially but the input circuit should not  
provide a DC path between inputs or to ground.  
APPLICATIONS  
RF layout  
The SP8854D can operate with input frequencies up to  
1.7GHz but to obtain optimum performance, good RF layout  
practices should be used. A suitable layout technique is to use  
double sided printed circuit board with through plated holes.  
Wherever possible the top surface on which the SP8854D is  
mountedshouldbeleftasacontinuoussheetofcoppertoform  
a low impedance earth plane. The ground pins 12 and 16  
should be connected directly to the earth plane. Pins such as  
VCC and the unused RF input should be decoupled with chip  
capacitors mounted as close to the device pin as possible with  
a direct connection to the earth plane, suitable values are  
10nF for the power supplies and <1nF for the RF input pin.(a  
lower value should be used sufficient to give good  
decoupleing at the RF frequnecy of operation). A larger  
decoupling capacitor mounted as close as possible to pin 26  
should be used to prevent modulation of VCC by the charge  
pump pulses. The Rset resistor should also be mounted close  
to the Rset pin to prevent noise pickup, and the capacitor  
connected from the charge pump output should be a chip  
component with short connections to the SP8854D.  
When the reference is derived from a crystal connected to  
pins 27 and 28 as shown in Fig. 5 the oscillator components  
are best mounted close to the SP8854D.  
All signals such as the programming inputs, RF in,  
referenceinandtheconnectionstotheop–amparebesttaken  
through the pc board adjacent to the SP8854D with through  
plated holes allowing connections to remote points without  
fragmenting the earth plane.  
Lock detect circuit  
The lock detect circuit uses the up and down correction  
pulses from the phase detector to determine whether the loop  
is in or out of lock. When the loop is locked, both up and down  
pulses are very narrow compared to the reference frequency,  
but the pulse width in the out of lock condition continuously  
varies, depending on the phase difference between the  
outputs of the reference and RF counters. The logical AND of  
the up and down pulses is used to switch a 20mA current sink  
to pin 18 and a 50k resistor provides a load to VCC. The circuit  
is shown in Fig. 7c. When lock is established, the narrow  
pulses from the phase detector ensure that the current source  
isoffforthemajorityofthetimeandsopin18willbepulledhigh  
by the 50k resistor. A voltage comparator with a switching  
threshold at about 4.7V monitors the voltage at pin 18 and  
switches pin 17 low when pin 18 is more positive than the 4.7V  
threshold. When the loop is unlocked, the frequency  
difference at the counter outputs will produce a cyclic change  
in pulse width from the phase detector outputs with a  
frequency equal to the difference in frequency at the reference  
and RF counter outputs. A small capacitor connected to pin 18  
prevents the indication of false phase lock conditions at pin 17  
for momentary phase coincidence. Because of the variable  
width pulse nature of the signal at pin 18 the calculation of a  
suitable capacitor value is complex, but if an indication with a  
delay amounting to several times the expected lock up time is  
acceptable, the delay will be approximately equal to the time  
constant of the capacitor on pin 18 and the internal 50k  
resistor. If a faster indication is required, comparable with the  
loop lock up time, the capacitor will need to be 2–3 times  
smaller than the time constant calculation suggests. The time  
torespondtoanoutoflockconditionis23timeslessthanthat  
required to indicate lock.  
Programming bus  
The input pins are designed to be compatible with TTL or  
CMOS logic with a switching threshold set at about 2.4V by  
three forward biased base emitter diodes. The inputs will be  
taken high by an internal pull up resistor if left open circuit but  
for best noise immunity it is better to connect unused inputs  
directly to VCC or ground.  
Charge pump circuit  
RF inputs  
The charge pump circuit converts the variable width up and  
down pulses from the phase detector into adjustable current  
pulses which can be directly connected to the loop amplifer.  
Themagnitudeofthecurrentandthereforethephasedetector  
The prescaler has a differential input amplifer to improve  
input sensitivity. Generally the input drive will be single ended  
and the RF signal should be AC coupled to either of the inputs  
9
SP8854D  
V
CC  
V
CC  
4k  
325  
325  
40k  
40k  
5k  
5k  
RF  
INPUT  
13  
500  
500  
INPUT  
RF  
INPUT  
14  
50 A  
3mA  
0V  
3k  
0V  
Fig.7a 16 bit input bus, Fpd/F enable, control direction,  
Fig. 7b RF inputs  
ref  
reference divider inputs and strobe  
C–LOCK DETECT (HIGH WHEN LOCKED)  
18  
V
CC  
V
CC  
2k5  
2k5  
50k  
3k  
3k  
17  
LOW  
WHEN  
LOCK  
DETECT  
OUTPUT  
LOCKED  
V
REF  
4.7V  
3k  
3k  
400 A  
100 A  
20 A  
100  
100  
1k  
11  
0V  
0V  
Fig. 7c Lock detect decouple  
Fig. 7d Lock detect output  
CHARGE PUMP  
OUTPUT  
REFERENCE  
R
V
CC  
set  
20 21  
19  
450  
450  
V
CC  
CHARGE PUMP  
CURRENT SOURCES  
UP  
83  
83  
V
CC  
DOWN  
130  
2mA  
Fig. 7e Rset pin.  
Fig. 7f Charge pump circuit  
Fig. 7 Interface circuit diagrams  
8
SP8854D  
The Fpd and Fref signals to the phase detector are available  
on pin 24 and 25 and may be used to monitor the frequency  
input to the phase detector or used in conjunction with an  
external phase detector. The outputs are disabled by taking  
pin 22 low. When the Fpd and Fref outputs are to be used at  
high frequencies, an external pull down resistor of minimum  
value330 maybeconnectedtogroundtoreducethefalltime  
of the output pulse.  
The charge pump connections to the loop amplifier consist  
of the charge pump output and the charge pump reference.  
The matching of the charge pump up and down currents will  
only be maintained if the charge pump output is held at a  
voltage equal to the charge pump reference using an  
operational amplifier to produce a virtual earth condition at pin  
20.  
The lock detect circuit can drive an LED to give visual  
indication of phase lock or provide an indication to the control  
system if a pull up resistor is used in place of the LED. A small  
capacitor connected from the c–lock detector pin to ground  
may be used to delay lock detect indication and remove  
glitches produced by momentary phase coincidence during  
lock up.  
Bit 15  
Bit 14  
Current Multiplication  
Factor  
0
0
1
1
0
1
0
1
1.0  
1.5  
2.5  
4.0  
Table 1  
Vcc 1 . 6V  
Rset  
Pin 19 current  
Phase detector gain  
Ipin 19(mA) multiplication factor  
2
mA radian  
To allow for control direction changes introduced by the  
design of the PLL, pin 23 is used to reverse the sense of the  
phase detector by transposing the Fpd and Fref connections.  
In order that any external phase detector will also be reversed,  
the Fpd/Fref outputs are interchanged by pin 23 as shown in  
Table 2.  
4
5
6
7
PIN  
11  
40 41 42 43  
1
44  
2
3
8
9
10  
13  
12  
11  
10  
9
8
7
6
5
4
3
2
1
0
2
2
2
2
2
2
2
2
2
2
2
2
2
2
M COUNTER  
3 BIT A  
COUNTER  
PHASE  
DETECTOR  
GAIN  
CONTROL  
See Table 1  
Output for RF Phase Lag  
Fig. 6 Programming pin allocation  
Control direction pin 23  
Pin 20  
1
0
Current Source  
Current Sink  
Table 2  
7
SP8854D  
+5V  
STROBE  
CONTROL  
MICRO  
1k  
7
8
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
9
* VALUES DEPEND  
ON APPLICATION  
10  
11  
12  
13  
14  
15  
16  
17  
SP8854D  
VCO  
1n  
LOOP  
FILTER  
*
APPLICATION USING  
CRYSTAL REFERENCE  
*
*
2k2  
SP8854  
+30V  
100n  
27  
28  
Fpd Fref  
+
OP27  
ETC  
33p  
1n  
10n  
* 100p  
1n  
in  
10MHz  
CRYSTAL  
1
10n  
100p  
R
ef  
Fig. 5 Typical application diagram  
DESCRIPTION  
when frequency changes are made, the strobe input disables  
the charge pump outputs when high. During this period the  
VCO control voltage will be maintained by the loop filter  
components around the loop amplifier, but due to the  
combined effects of the amplifier input current and charge  
pump leakage a gradual change will occur. In order to reduce  
the change, the duration of the strobe pulse should be  
minimised. Selection of a loop amplifer with low input current  
will reduce the VCO voltage droop during the strobe pulse and  
result in minimum reference sidebands from the synthesiser.  
Prescaler and AM counter  
The programmable divider chain is of A M counter  
construction and therefore contains a dual modulus front end  
prescaler, an A counter which controls the dual modulus ratio  
and an M counter which performs the bulk multi–modulus  
division. A programmable divider of this construction has a  
division ratio of MN+A and a minimum integer steppable  
division ratio of N(N–1), where N is the prescaler ratio.  
Data entry and storage  
Data is loaded from the 16 bit bus by applying a positive  
pulse to the strobe input. The input bus can be driven from TTL  
or CMOS logic levels. When the strobe input is low, the bus  
inputs are isolated and the data can be changed without  
affecting the programmed state. When the strobe input is  
taken high, the A and M and counters are reset and the input  
dataisappliedtotheinternalstorageregister. Whenthestrobe  
input is again taken low, the data on the input bus is stored in  
the internal register and the A and M counters released. The  
strobe input is level triggered so that if the data is changed  
whilst the input is high, the final value before the strobe goes  
low will be stored.  
Reference input  
The reference source can be either driven from an external  
sine or square wave source of up to 100MHz or a crystal can  
be connected as shown in Fig. 5.  
Phase Comparator and Charge pump  
The SP8854D has a digital phase/frequency comparator  
driving a charge pump with programmable current output. The  
charge pump current level at the minimum gain setting is  
approximately equal to the current fed into the Rset input pin  
19 and can be increased by programming the bus according  
to Table 1 by up to 4 times.  
InordertopreventdisturbancesontheVCOcontrolvoltage  
6
SP8854D  
TYPICAL OVERLOAD  
+20  
+10  
+7  
GUARANTEED  
OPERATING  
WINDOW  
INPUT TO  
PIN13  
(dBm)  
–5  
–10  
–20  
–30  
1.7GHz  
2GHz  
100MHz  
1GHz  
10GHz  
TYPICAL SENSITIVITY  
INPUT DRIVE REQUIREMENTS  
Fig. 5 SP8854D  
+j1  
+j0.5  
+j2  
Zo=50  
+j0.2  
+j5  
0
0.2  
0.5  
1
2
5
50MHz  
1.1GHz  
2.5GHz  
–j5  
–j0.2  
–j2  
–j0.5  
–j1  
Fig. 4 R.F. input impedance  
5
SP8854D  
ELECTRICAL CHARACTERISTICS  
Guaranteed over the full temperature and supply voltage range (unless otherwise stated)  
Temperature Tamb for KG parts –55°C and +100 °C  
Temperature Tamb for IG parts –40°C and +85°C  
Supply Voltage VCC = 4.75V and 5.25V  
Value  
Characteristics  
Supply current  
Pin  
Units  
Conditions  
Min  
Typ  
Max  
240  
15, 26  
13, 14  
13,14,24  
28, 25  
28,24,25  
28  
180  
mA  
RF input sensitivity  
–5.0  
56  
1
+7.0  
16383  
1023  
50  
dBm  
100MHz to 1.7GHz See Fig. 3  
RF division ratio  
Reference division ratio  
Comparison frequency  
Reference input frequency  
MHz  
MHz  
10  
0
100  
Reference division ratio 2 See  
Note 1  
Reference input voltage  
Fref/Fpd output voltage high  
Fref/Fpd output voltage low  
Lock detect output voltage  
28  
24, 25  
24, 25  
17  
+6  
+10  
dBm  
–0.8  
–1.4  
300  
Vwrt VCC 2.2K to 0V  
Vwrt VCC 2.2K to 0V  
2
500  
1.7  
mV  
mA  
Iout = 3mA  
Charge pump current at  
multiplication factor =1  
19,20,21  
Vpin 20 = Vpin 21  
,
1.4  
1.5  
I
pin 19 = 1.6mA  
Charge pump current at  
multiplication factor =1.5  
19,20,21  
19,20,21  
19,20,21  
mA  
mA  
mA  
V
Vpin 20 = Vpin 21  
,
,
,
2.0  
3.4  
2.3  
3.8  
6.1  
2.5  
4.1  
6.5  
Ipin 19 = 1.6mA  
Charge pump current at  
multiplication factor = 2.5  
Vpin 20 = Vpin 21  
Ipin 19 = 1.6mA  
Charge pump current at  
multiplication factor = 4.0  
Vpin 20 = Vpin 21  
pin 19 = 1.6mA  
5.4  
3.5  
I
Input bus high logic level  
Input bus low logic level  
Input bus current source  
Input bus current sink  
1–11,22  
23,29,44  
1–11,22,  
23,29–44  
1
V
A
1–11,22,  
23,29–44  
–200  
VIN = 0V  
1–11,22,  
23,29–44  
10  
5
A
VIN = VCC  
Up down current matching  
20  
%
Vpin 20 = Vpin 21,  
Ipin 19 = 1.6mA  
Charge pump reference  
voltage  
21  
21  
VCC – 0.5  
V
V
I
pin 19 = 1.6mA  
current multiplication factor =1  
pin 19 = 1.6mA  
Charge pump reference  
voltage  
VCC–1.6  
0.5  
I
current multiplication factor = 4  
Rset current  
19  
19  
18  
2
mA  
V
See Note 2  
Rset Voltage  
1.6  
Ipin 19 = 1.6 mA  
C–lock detect current  
Strobe pulse width  
Data set up time  
+10  
A
Vpin18=4.7V  
Note 3  
50  
nS  
nS  
100  
Note 3  
Notes: 1. Lower reference frequencies may be used if slew rates are maintained.  
2. Pin 19 current x multiplication factor must be less than 5mA if charge pump current accuracy is to be maintained.  
3. Guaranteed but not tested.  
4
SP8854D  
PIN DESCRIPTION  
PIN  
DESCRIPTION  
1,2,3,4,5,6,7,8,9,10,11,42,43,44  
These pins are the data inputs used to set the RF divider ratio (M.N+A). Open  
circuit=1 (high) on these pins. Data is transparent from pins to RF buffer when Pin  
39 (strobe) is HI and frozen in RF buffer when Pin 39 is LO.  
13, 14 (RF INPUT)  
Balanced inputs to the RF pre–amplifier. For single ended operation the signal is  
AC coupled into pin 13 with pin 14 AC decoupled to ground (or vice–versa.) Pins  
13 and 14 are internally DC biased.  
17 (LOCK DETECT INPUT)  
18 (C–LOCK DETECT)  
A current sink into this pin is enabled when the lock detect circuit indicates lock.  
Used to give an external indication of phase lock.  
A capacitor connected to this point determines the lock detect integrator time  
constant and can be used to vary the sensitivity of the phase lock indicator.  
19 (Rset)  
An external resistor from Pin 19 to VCC sets the charge pump output current.  
20 (CP OUTPUT)  
The phase detector output is a single ended charge pump sourcing or sinking  
current to the inverting input of an external loop filter.  
21 (CP REF)  
Connected to the non–inverting input of the loop filter to set the optimum DC bias.  
22 (Fref/Fpd ENABLE)  
Part of the input bus. When this pin is logic HI the Fref and Fpd outputs are en-  
abled. Open circuit=HI.  
23 (CONTROL DIRECTION)  
This pin controls charge pump output direction. For Pin 23 HI the output sinks  
current when Fpd > Fref or when the RF phase leads Ref phase. for Pin 23 LO the  
relationship is reversed. (see table 2).  
24  
25  
=Fpd if Pin 23 is HI  
=Fref if Pin 23 is LO  
RF divider output pulses. Fpd=RF input frequency/(M.N+A). Pulse width=8  
RF input cycles (1 cycle of the divide by 8 prescaler output).  
=Fref if Pin 23 is HI  
=Fpd if pin 23 is LO  
Reference divider output pulses. Fref=Reference input frequency/R. Pulse width  
=high period of Ref input.  
27 (Reference Oscillator Capacitor)  
28 (Ref IN/XTAL)  
Leave open circuit if an external reference is used. See Fig. 5 for typical  
connection for use as an onboard crystal oscillator.  
This pin is the input buffer amplifier for an external reference signal. This amplifier  
provides the active element if an onboard crystal oscillator is used.  
29,30,31,32,33,34,35,36,37,38  
39 (Strobe)  
These pins set the Reference divider ratio R. Open circuit =HI.  
When Pin 39 is HI the A, M, and R counters are held in the reset state and the  
charge pump output is disabled. When Pin 39 is low the data on the RF data and  
PD Gain data inputs is fixed in the buffers, the buffers are loaded into the RF  
counters and the PD Gain control, all the counters are active, and the charge  
pump is enabled. Open circuit =HI.  
40, 41 (PD Gain)  
These pins set the charge pump current multiplication factor (see table 1). The  
data is transparent into the buffers when Pin 39 is HI and frozen when Pin 39 is  
LO. Open circuit =HI.  
3
SP8854D  
F.2SP854Dblockdigram  
2
OCTOBER 1995  
PRELIMINARY INFORMATION  
D.S. 3701 2.6  
SP8854D  
1.7GHz PARALLEL LOAD PROFESSIONAL SYNTHESISER  
The SP8854D is one of a family of parallel load  
synthesisers containing all the elements apart from the loop  
amplifier to fabricate a PLL synthesis loop. Other parts in the  
series are the SP8852D which is fully programmable requiring  
INDEX CORNER  
two 16 word bit words to set the RF and reference counters,  
and the SP8855D which is programmed by hard wired links or  
switches.  
1 44  
The SP8854D is programmed using a 16 bit parallel data  
bus. This Data is stored in an internal buffer. The 10 bit  
programmable reference divider is programmed by  
connecting the 10 programming pins either to ground or +5V.  
The device can therefore be programmed with a single  
transfer from the control microprocessor. Hard wired inputs  
can also control the Fpd and Fref outputs and the control sense  
of the loop.  
FEATURES  
1.7GHz Operating Frequency  
HC44  
Single 5V Supply Operation  
Low Power Consumption <1.3W  
High Comparison Frequency 20MHz  
High Gain Phase Detector 1mA/rad  
Zero ‘‘Dead Band” Phase Detector  
Wide Range of RF and Reference Divide Ratios  
Programming by Single Word Data Transfer  
Pin  
Description  
Pin  
Description  
1
Input bus bit 10  
Input bus bit 9  
Input bus bit 8  
Input bus bit 7  
Input bus bit 6  
Input bus bit 5  
Input bus bit 4  
Input bus bit 3  
Input bus bit 2  
Input bus bit 1  
Input bus bit 0  
0V (prescaler)  
RF input  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
41  
42  
43  
44  
Control direction  
2
F
F
pd*  
ref*  
3
4
+5V  
5
Ref. osc capacitor  
Ref in/XTAL  
6
ABSOLUTE MAXIMUM RATINGS  
7
Ref divider bit 9  
Ref divider bit 8  
Ref divider bit 7  
Ref divider bit 6  
Ref divider bit 5  
Ref divider bit 4  
Ref divider bit 3  
Ref divider bit 2  
Ref divider bit 1  
Ref divider bit 0  
Strobe  
Input bus bit 15  
Input bus bit 14  
Input bus bit 13  
Input bus bit 12  
Input bus bit 11  
8
Supply Voltage  
Storage Temperature  
Operating Temperature  
–0.3V to 6V  
–65°C to +150°C  
–55°C to +100°C  
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
Prescaler & reference Input Voltage  
Data inputs  
2.5V p–p  
VCC +0.3V  
VEE –0.3V  
+175°C  
RF input  
V
V
+5V (prescaler)  
0V  
CC  
EE  
Junction temperature  
Lock detect output  
C–lock detect  
ORDERING INFORMATION  
R
set  
SP8854D KG HCAR (non standard temperature range  
–55°C to +100°C standard product screening)  
Charge pump output  
Charge pump ref.  
F
/F enable  
pd ref  
SP8854D IG HCAR (Industrial temperature range  
–40°C to +85°C standard product screening)  
*F andF outputsarereversedusingthecontroldirectioninput.The  
pd  
ref  
table above is correct when pin 23 is high.  
Thermal Data  
ESD:  
JC=5°C/W  
JC=53°C/W  
1000V, Human body model  
Fig. 1 Pin connections – top view  
For more information about all Zarlink products  
visit our Web Site at  
www.zarlink.com  
Information relating to products and services furnished herein by Zarlink Semiconductor Inc. or its subsidiaries (collectively “Zarlink”) is believed to be reliable.  
However, Zarlink assumes no liability for errors that may appear in this publication, or for liability otherwise arising from the application or use of any such  
information, product or service or for any infringement of patents or other intellectual property rights owned by third parties which may result from such application or  
use. Neither the supply of such information or purchase of product or service conveys any license, either express or implied, under patents or other intellectual  
property rights owned by Zarlink or licensed from third parties by Zarlink, whatsoever. Purchasers of products are also hereby notified that the use of product in  
certain ways or in combination with Zarlink, or non-Zarlink furnished goods or services may infringe patents or other intellectual property rights owned by Zarlink.  
This publication is issued to provide information only and (unless agreed by Zarlink in writing) may not be used, applied or reproduced for any purpose nor form part  
of any order or contract nor to be regarded as a representation relating to the products or services concerned. The products, their specifications, services and other  
information appearing in this publication are subject to change by Zarlink without notice. No warranty or guarantee express or implied is made regarding the  
capability, performance or suitability of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute  
any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user’s responsibility to fully determine the performance and  
suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. Manufacturing does  
not necessarily include testing of all functions or parameters. These products are not suitable for use in any medical products whose failure to perform may result in  
significant injury or death to the user. All products and materials are sold and services provided subject to Zarlink’s conditions of sale which are available on request.  
Purchase of Zarlink’s I2C components conveys a licence under the Philips I2C Patent rights to use these components in and I2C System, provided that the system  
conforms to the I2C Standard Specification as defined by Philips.  
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Copyright Zarlink Semiconductor Inc. All Rights Reserved.  
TECHNICAL DOCUMENTATION - NOT FOR RESALE  

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