MF388 [ZARLINK]
High Performance LED; 高性能LED
| 型号： | MF388 |
| 厂家： | 
ZARLINK SEMICONDUCTOR INC |
| 描述： | High Performance LED |
| 文件： | 总5页 (文件大小：203K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MF388
High Performance LED
DS5468
ISSUE 1
May 2001
Ordering Information
MF388
MF388 ST
12940.11 TO-46 Package
13208.11 ST Housing
Note: Rated Fiber coupled power apply only on the TO-46 package,
for housing options fiber coupled power is typically 10% less
Description
This device is designed for Ethernet 100 Mbps and
Intra-Office Telecom applications and offers an
excellent price/performance ratio for cost effective
solutions. Its double-lens optical system results in
optimum coupling of power into the fiber.
TO-46 Package with Lens
Optical and Electrical Characteristics - Case Temperature 25˚C
Parameter
Symbol
Min.
Typ.
Max.
Unit
Test Condition
Fiber-Coupled Power
(Fig. 1,2 & 3) (Table 1)
P
40
50
µW
I =50mA
Fiber:
fiber
F
(Note 1)
62.5/
125µm
Rise and Fall Time
(10-90%)
t t
2
ns
I =50mA
(no bias)
r’ f
F
Graded
Index
Bandwidth
f
200
800
250
820
MHz
I =50mA
F
c
(3dB )
el
NA=0.275
Peak Wavelength
Spectral Width (FWHM)
Forward Voltage (Fig. 5)
Reverse Current
λ
840
60
nm
nm
V
I =50mA
F
p
∆λ
I =50mA
F
V
1.85
20
I =50mA
F
F
I
µA
pF
V =1V
R
R
Capacitance
C
20
V =0V, f=1MHz
R
Note 1: Measured at the exit of 100 meters of fiber
Ø4.7
Ø1.5
0.6
CASE
3.7
ANODE
CATHODE
14
2.5
5.4
0.4
BOTTOM VIEW
The diode chip is isolated from the case
1
MF388
Absolute Maximum Ratings
Parameter
Symbol
Limit
Storage Temperature
T
-55 to +125˚C
-40 to +85˚C
250 mW
110 mA
stg
Operating Temperature see (derating: Fig. 4)
Electrical Power Dissipation (derating: Fig. 4)
Continuous Forward Current (f<10kHz)
Peak Forward Current (duty cycle<50%, f>1MHz)
Reverse Voltage
T
op
P
I
tot
F
I
180 mA
FRM
V
1.5V
R
Soldering Temperature (2mm from the case for 10sec)
T
260˚C
sld
Thermal Characteristics
Parameter
Symbol
Min.
Typ.
Max.
Unit
Thermal Resistance-Infinite Heat Sink
Thermal Resistance-No Heat Sink
Temperature Coefficient - Optical Power
Temperature Coefficient - Wavelength
R
R
100
400
˚C/W
˚C/W
%/˚C
thjc
thja
dP/dT
-0.6
0.3
j
dλ/dT
nm/˚C
j
Typical Fiber-Coupled Power
Core Diameter/Cladding Diameter Numberical Aperture
50/125 µm
62.5/125 µm
100/140 µm
200/230 µm
0.20
0.275
0.29
0.37
20µW
50µW
100µW
140µW
2
MF388
%
%
100
100
r
Ø
= 62.5ʵm
c
80
60
40
80
60
40
z
r
20
0
20
0
ʵm
c
0.5
2.0
3 0 mm
0
20
40
60
80
100 µm
z - AXIAL DISPLACEMENT OF FIBER
r
Figure 1
Figure 2
%
100
mW
300
80
60
40
50% DUTY CYCLE
200
INFINITE
HEAT SINK
DC
NO HEAT SINK
100
20
0
HEAT SINKED
0
0
40
80
120
160
200 mA
0
50
100
150¡C
FORWARD CURRENT
OPERATING TEMPERATURE
Figure 3
Figure 4
mA
200
100
0
0
1
2
3V
FORWARD VOLTAGE
Figure 5
3
BOTTOM VIEW ( 10 : 1 )
SIDE VIEW
13,46`0,76
3,8
2,54
0,6
0,03
0,04
+
0,05
0
+
n0,45
(3x)
n1,17
(3x)
-
-
R2,7
45°
Lens n1.5`0.05
R0,2 max (4x)
0,3 max glass overmould (2x)
R0,4 max
NOTES:-
1. All dimensions in mm.
2. General tol. ISO-2768-mK.
3. Coating:
Case: Ni 1,5-2,5 µm.
Header: Ni 2-3 µm / Au min 1,32 µm.
© Zarlink Semiconductor 2002. All rights reserved.
Package code
TB
ISSUE
ACN
1
Drawing type
Previous package codes
Package drawing, TO-46 with lens
JS004076R1A
22-MAR-03
DATE
Title
APPRD. TD/BE
JS004076
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