UMK212SD103KD-T [TAIYO YUDEN]
Capacitor, Ceramic, Chip, General Purpose, 0.01uF, 50V, ±10%, SD, 0805 (2012 mm), 0.008"T, -55º ~ +125ºC, 7" Reel/4mm pitch;
| 型号： | UMK212SD103KD-T |
| 厂家： | 
TAIYO YUDEN (U.S.A.), INC |
| 描述： | Capacitor, Ceramic, Chip, General Purpose, 0.01uF, 50V, ±10%, SD, 0805 (2012 mm), 0.008"T, -55º ~ +125ºC, 7" Reel/4mm pitch 电容器 |
| 文件： | 总20页 (文件大小：850K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
[ For General Electronic Equipment
(General Environment) ]
Notice for TAIYO YUDEN Products
Please read this notice before using the TAIYO YUDEN products.
REMINDERS
■ Product information in this catalog is as of October 2017. All of the contents specified herein are subject to change
without notice due to technical improvements, etc. Therefore, please check for the latest information carefully
before practical application or use of our products.
Please note that TAIYO YUDEN shall not be in any way responsible for any damages and defects in products or
equipment incorporating our products, which are caused under the conditions other than those specified in this
catalog or individual product specification sheets.
■ Please contact TAIYO YUDEN for further details of product specifications as the individual product specification
sheets are available.
■ Please conduct validation and verification of our products in actual condition of mounting and operating
environment before using our products.
■ The products listed in this catalog are intended for use in general electronic equipment (e.g., AV equipment, OA
equipment, home electric appliances, office equipment, information and communication equipment including,
without limitation, mobile phone, and PC) and medical equipment classified as Class I or II by IMDRF. Please be
sure to contact TAIYO YUDEN for further information before using the products for any equipment which may
directly cause loss of human life or bodily injury (e.g., transportation equipment including, without limitation,
automotive powertrain control system, train control system, and ship control system, traffic signal equipment,
disaster prevention equipment, medical equipment classified as Class III by IMDRF, highly public information
network equipment including, without limitation, telephone exchange, and base station).
Please do not incorporate our products into any equipment requiring high levels of safety and/or reliability (e.g.,
aerospace equipment, aviation equipment*, medical equipment classified as Class IV by IMDRF, nuclear control
equipment, undersea equipment, military equipment).
*Note: There is a possibility that our products can be used only for aviation equipment that does not directly affect the safe operation of aircraft (e.g.,
in-flight entertainment, cabin light, electric seat, cooking equipment) if such use meets requirements specified separately by TAIYO YUDEN.
Please be sure to contact TAIYO YUDEN for further information before using our products for such aviation equipment.
When our products are used even for high safety and/or reliability-required devices or circuits of general electronic
equipment, it is strongly recommended to perform a thorough safety evaluation prior to use of our products and to
install a protection circuit as necessary.
Please note that unless you obtain prior written consent of TAIYO YUDEN, TAIYO YUDEN shall not be in any way
responsible for any damages incurred by you or third parties arising from use of the products listed in this catalog
for any equipment requiring inquiry to TAIYO YUDEN or prohibited for use by TAIYO YUDEN as described above.
■ Information contained in this catalog is intended to convey examples of typical performances and/or applications
of our products and is not intended to make any warranty with respect to the intellectual property rights or any
other related rights of TAIYO YUDEN or any third parties nor grant any license under such rights.
■ Please note that the scope of warranty for our products is limited to the delivered our products themselves and
TAIYO YUDEN shall not be in any way responsible for any damages resulting from a fault or defect in our products.
Notwithstanding the foregoing, if there is a written agreement (e.g., supply and purchase agreement, quality
assurance agreement) signed by TAIYO YUDEN and your company, TAIYO YUDEN will warrant our products in
accordance with such agreement.
■ The contents of this catalog are applicable to our products which are purchased from our sales offices or
authorized distributors (hereinafter“TAIYO YUDENs’official sales channel”). Please note that the contents of this
catalog are not applicable to our products purchased from any seller other than TAIYO YUDEN’s official sales
channel.
■ Caution for Export
Some of our products listed in this catalog may require specific procedures for export according to“U.S. Export
Administration Regulations”,“Foreign Exchange and Foreign Trade Control Law”of Japan, and other applicable
regulations. Should you have any questions on this matter, please contact our sales staff.
1
MULTILAYER CERAMIC CAPACITORS
WAVE
REFLOW
■PARTS NUMBER
△＝Blank space
J
M
K
3
1
6
△
⑤
B
J
1
0
6
M
L
－
⑩
T
△
⑫
①
②
③
④
⑥
⑦
⑧
⑨
⑪
①Rated voltage
③End termination
Code
P
Rated voltage［VDC］
Code
End termination
2.5
4
K
S
Plated
A
Cu Internal Electrodes
J
6.3
10
④Dimension（L×W）
Type
L
Dimensions
E
16
EIA（inch）
（L×W）［mm］
0.25× 0.125
0.4 × 0.2
T
25
021
042
063
008004
01005
0201
0402
0204
0603
0306
0805
0508
1206
1210
1812
G
U
35
50
0.6 × 0.3
H
100
250
630
1.0 × 0.5
Q
S
105
107
212
0.52× 1.0 ※
1.6 × 0.8
0.8 × 1.6 ※
2.0 × 1.25
1.25× 2.0 ※
3.2 × 1.6
②Series name
Code
M
Series name
Multilayer ceramic capacitor
316
325
432
V
Multilayer ceramic capacitor for high frequency
LW reverse type multilayer capacitor
3.2 × 2.5
W
4.5 × 3.2
Note : ※LW reverse type（□WK） only
⑤Dimension tolerance
Code
△
Type
ALL
063
L［mm］
W［mm］
T［mm］
Standard
Standard
Standard
0.6±0.05
1.0±0.10
0.3±0.05
0.3±0.05
0.5±0.10
105
0.5±0.10
107
1.6＋0.15/－0.05
0.8＋0.15/－0.05
0.8＋0.15/－0.05
0.45±0.05
A
212
2.0＋0.15/－0.05
1.25＋0.15/－0.05
1.6±0.20
0.85±0.10
1.25＋0.15/－0.05
0.85±0.10
316
3.2±0.20
1.6±0.20
325
063
105
3.2±0.30
2.5±0.30
2.5±0.30
0.6±0.09
0.3±0.09
0.3±0.09
1.0＋0.15/－0.05
0.5＋0.15/－0.05
0.5＋0.15/－0.05
0.45±0.05
107
1.6＋0.20/－0
0.8＋0.20/－0
0.8＋0.20/－0
0.45±0.05
B
C
212
2.0＋0.20/－0
1.25＋0.20/－0
0.85±0.10
1.25＋0.20/－0
1.6±0.30
316
105
3.2±0.30
1.6±0.30
1.0＋0.20/－0
0.5＋0.20/－0
0.5＋0.20/－0
Note: cf. STANDARD EXTERNAL DIMENSIONS
△= Blank space
⑥Temperature characteristics code
■High dielectric type（Excluding Super low distortion multilayer ceramic capacitor）
Applicable
standard
Temperature
range［℃］
Capacitance
tolerance
±10％
±20％
±10％
±20％
±10％
±20％
±10％
±20％
±10％
±20％
±10％
Tolerance
Code
Ref. Temp.［℃］
Capacitance change
±10％
code
K
JIS
B
－25～＋ 85
－55～＋ 85
－55～＋125
－55～＋105
－55～＋125
－55～＋ 85
20
25
25
25
25
M
K
BJ
EIA
EIA
EIA
EIA
EIA
X5R
X7R
X6S
X7S
X5R
±15％
M
K
B7
C6
±15％
M
K
±22％
M
K
C7
±22％
M
K
LD(※)
25
±15％
M
±20％
Note : ※.LD Low distortion high value multilayer ceramic capacitor
△= Blank space
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀproductꢀspecificationꢀsheets.ꢀ
ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
1
12
■Temperature compensating type
Applicable
Temperature
range［℃］
Capacitance
tolerance
±0.05pF
±0.1pF
±0.25pF
±0.5pF
±5％
Tolerance
Code
Ref. Temp.［℃］
Capacitance change
0±30ppm/℃
standard
code
A
B
CG
UJ
EIA
C0G
－55～＋125
25
C
D
J
±0.25pF
±0.5pF
±5％
C
JIS
UJ
20
－55～＋125
－750±120ppm/℃
D
EIA
JIS
EIA
JIS
U2J
UK
25
20
25
20
J
－55～＋125
－55～＋125
－55～＋125
UK
SL
－750±250ppm/℃
±0.25pF
±5％
C
J
U2K
SL
＋350～－1000ppm/℃
⑥Series code
⑨Thickness
・Super low distortion multilayer ceramic capacitor
Code
K
Thickness［mm］
Code
SD
Series code
Standard
0.125
0.13
0.18
H
E
・Medium-High Voltage Multilayer Ceramic Capacitor
C
D
P
0.2
Code
SD
Series code
Standard
0.3
0.45（107type or more）
0.5
T
⑦Nominal capacitance
K
Code
V
Nominal capacitance
（example）
W
A
0R5
0.5pF
1pF
0.8
010
D
F
0.85（212type or more）
100
10pF
1.15
1.25
1.6
101
100pF
1,000pF
10,000pF
0.1μF
1.0μF
10μF
100μF
G
L
102
103
N
1.9
104
Y
2.0 max
2.5
105
M
106
107
⑩Special code
Note : R＝Decimal point
Code
－
Special code
Standard
⑧Capacitance tolerance
Code
A
Capacitance tolerance
±0.05pF
±0.1pF
⑪Packaging
Code
Packaging
B
F
T
φ178mm Taping （2mm pitch）
φ178mm Taping （4mm pitch）
C
±0.25pF
±0.5pF
D
φ178mm Taping （4mm pitch, 1000 pcs/reel）
325 type（Thickness code M）
P
F
±1pF
G
±2％
φ178mm Taping （2mm pitch）105type only
（Thickness code E,H）
R
J
±5％
K
±10％
W
φ178mm Taping（1mm pitch）021/042type only
M
Z
±20％
＋80/－20％
⑫Internal code
Code
△
Internal code
Standard
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀproductꢀspecificationꢀsheets.ꢀ
ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
1
13
■STANDARD EXTERNAL DIMENSIONS
Dimension [mm]
T
W
Type( EIA )
L
W
*1
K
K
C
D
C
P
T
H
E
e
L
□MK021（008004）
□VS021（008004）
0.25±0.013
0.25±0.013
0.125±0.013
0.125±0.013
0.125±0.013
0.125±0.013
0.0675±0.0275
0.0675±0.0275
T
□MK042（01005）
□VS042（01005）
□MK063（0201）
0.4±0.02
0.4±0.02
0.6±0.03
0.2±0.02
0.2±0.02
0.3±0.03
0.2±0.02
0.2±0.02
0.3±0.03
0.1±0.03
0.1±0.03
0.15±0.05
e
0.13±0.02
0.18±0.02
0.2±0.02
0.3±0.03
0.5±0.05
0.5±0.05
0.3±0.05
0.45±0.05
0.8±0.10
0.5±0.05
0.45±0.05
0.85±0.10
1.25±0.10
0.85±0.10
0.85±0.10
1.15±0.10
1.6±0.20
0.85±0.10
1.15±0.10
1.9±0.20
1.9＋0.1/－0.2
2.5±0.20
2.5±0.20
L
□MK105（0402）
1.0±0.05
0.5±0.05
C
P
V
W
P
K
A
V
K
D
G
D
D
F
0.25±0.10
W
□VK105（0402）
1.0±0.05
0.5±0.05
1.0±0.05
0.25±0.10
0.18±0.08
□WK105（0204）※
0.52±0.05
T
□MK107（0603）
1.6±0.10
0.8±0.10
0.8±0.10
1.6±0.10
0.35±0.25
0.25±0.15
□WK107（0306）※
e
□MK212（0805）
□WK212（0508）※
□MK316（1206）
2.0±0.10
1.25±0.15
3.2±0.15
1.25±0.10
2.0±0.15
1.6±0.15
0.5±0.25
0.3±0.2
※ LW reverse type
0.5＋0.35/－0.25
L
D
F
□MK325（1210）
□MK432（1812）
3.2±0.30
4.5±0.40
2.5±0.20
3.2±0.30
N
Y
M
M
0.6±0.3
0.9±0.6
Note : ※. LW reverse type, *1.Thickness code
■STANDARD QUANTITY
Dimension
Standard quantity［pcs］
Type
021
EIA（inch）
008004
［mm］
0.125
Code
K
Paper tape
－
Embossed tape
50000
C
D
P
042
01005
0201
0.2
0.3
－
40000
－
063
105
15000
T
0.13
0.18
0.2
H
E
－
20000
15000
－
－
C
P
20000
15000
0402
0.3
－
V
W
P
0.5
10000
－
0204 ※
0603
0.30
0.45
0.8
K
4000
－
－
4000
－
107
212
316
A
V
K
0306 ※
0.50
0.45
0.85
1.25
0.85
0.85
1.15
1.6
4000
0805
D
G
D
D
F
－
4000
4000
－
3000
－
0508 ※
1206
－
3000
2000
L
－
0.85
1.15
1.9
D
F
－
2000
325
432
1210
1812
N
Y
2.0 max
2.5
M
M
－
－
1000
500
2.5
Note : ※.LW Reverse type（□WK）
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀproductꢀspecificationꢀsheets.ꢀ
ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
1
14
■PARTS NUMBER
LW Reversal Decoupling Capacitors（LWDCTM
）
●105TYPE
【Temperature Characteristic BJ : X5R】 0.3mm thickness（P）
Soldering
R:Reflow
W:Wave
HTLT
Rated voltage
[V]
Temperature
characteristics
Capacitance
[F]
Capacitance tolerance
[％]
tanδ
[％]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage x ％
TWK105 BJ104MP-F
EWK105 BJ224MP-F
LWK105 BJ474MP-F
JWK105 BJ104MP-F
JWK105 BJ474MP-F
JWK105 BJ105MP-F
JWK105 BJ225MP-F
25
16
10
X5R
X5R
X5R
X5R*1
X5R*1
X5R
0.1 μ
0.22 μ
0.47 μ
0.1 μ
0.47 μ
1 μ
±20
±20
±20
±20
±20
±20
±20
5
150
150
150
150
150
150
150
0.3±0.05
0.3±0.05
0.3±0.05
0.3±0.05
0.3±0.05
0.3±0.05
0.3±0.05
R
R
R
R
R
R
R
10
10
5
10
10
10
6.3
X5R
2.2 μ
【Temperature Characteristic C6 : X6S , C7 : X7S】 0.3mm thickness（P）
Soldering
R:Reflow
W:Wave
HTLT
Rated voltage
[V]
Temperature
characteristics
Capacitance
[F]
Capacitance tolerance
[％]
tanδ
[％]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage x ％
EWK105 C6104MP-F
LWK105 C7104MP-F
LWK105 C6224MP-F
JWK105 C7104MP-F
JWK105 C7224MP-F
JWK105 C6474MP-F
AWK105 C6224MP-F
AWK105 C6474MP-F
AWK105 C6105MP-F
AWK105 C6225MP-F
16
10
X6S
X7S
X6S
X7S
X7S
X6S
X6S
X6S
X6S
X6S
0.1 μ
0.1 μ
0.22 μ
0.1 μ
0.22 μ
0.47 μ
0.22 μ
0.47 μ
1 μ
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
5
150
150
150
150
150
150
150
150
150
150
0.3±0.05
0.3±0.05
0.3±0.05
0.3±0.05
0.3±0.05
0.3±0.05
0.3±0.05
0.3±0.05
0.3±0.05
0.3±0.05
R
R
R
R
R
R
R
R
R
R
5
10
5
6.3
4
10
10
10
10
10
10
2.2 μ
●107TYPE
【Temperature Characteristic BJ : X5R】 0.5mm thickness（V）
Soldering
R:Reflow
W:Wave
HTLT
Rated voltage
[V]
Temperature
characteristics
Capacitance
[F]
Capacitance tolerance
[％]
tanδ
[％]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage x ％
X5R*1
X5R*1
X5R*1
X5R
TWK107 BJ104MV-T
EWK107 BJ224MV-T
EWK107 BJ474MV-T
LWK107 BJ105MV-T
LWK107 BJ225MV-T
JWK107 BJ105MV-T
JWK107 BJ225MV-T
JWK107 BJ475MV-T
AWK107 BJ106MV-T
25
16
0.1 μ
0.22 μ
0.47 μ
1 μ
±20
±20
±20
±20
±20
±20
±20
±20
±20
5
150
150
150
150
150
150
150
150
150
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
R
R
R
R
R
R
R
R
R
5
5
10
10
10
10
10
10
10
X5R
2.2 μ
1 μ
X5R*1
X5R
X5R
X5R
6.3
4
2.2 μ
4.7 μ
10 μ
【Temperature Characteristic B7 : X7R , C6 : X6S , C7 : X7S】 0.5mm thickness（V）
Soldering
R:Reflow
W:Wave
HTLT
Rated voltage
[V]
Temperature
characteristics
Capacitance
[F]
Capacitance tolerance
[％]
tanδ
[％]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage x ％
TWK107 B7104MV-T
EWK107 B7224MV-T
EWK107 B7474MV-T
JWK107 C7105MV-T
AWK107 C7225MV-T
AWK107 C6475MV-T
PWK107 C6106MV-T
25
16
6.3
4
X7R
X7R
X7R
X7S
X7S
X6S
X6S
0.1 μ
0.22 μ
0.47 μ
1 μ
±20
±20
±20
±20
±20
±20
±20
5
5
150
150
150
150
150
150
150
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
R
R
R
R
R
R
R
5
10
10
10
10
2.2 μ
4.7 μ
10 μ
2.5
●212TYPE
【Temperature Characteristic BJ : X5R】 0.85mm thickness（D）
Soldering
R:Reflow
W:Wave
HTLT
Rated voltage
[V]
Temperature
characteristics
Capacitance
[F]
Capacitance tolerance
[％]
tanδ
[％]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage x ％
25
16
X5R
X5R
X5R
X5R
X5R
4.7 μ
10 μ
4.7 μ
10 μ
22 μ
±10, ±20
±20
10
10
10
10
10
150
150
150
150
150
0.85±0.10
0.85±0.10
0.85±0.10
0.85±0.10
0.85±0.10
R
R
R
R
R
TWK212 BJ475[]D-T
EWK212 BJ106MD-T
LWK212 BJ475[]D-T
LWK212 BJ106MD-T
JWK212 BJ226MD-T
±10, ±20
±20
10
6.3
±20
【Temperature Characteristic B7 : X7R , C6 : X6S】 0.85mm thickness（D）
Soldering
R:Reflow
W:Wave
HTLT
Rated voltage
[V]
Temperature
characteristics
Capacitance
[F]
Capacitance tolerance
[％]
tanδ
[％]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage x ％
25
16
10
4
X7R
X6S
X6S
X6S
2.2 μ
4.7 μ
10 μ
22 μ
±10, ±20
±10, ±20
±20
5
150
150
150
150
0.85±0.10
0.85±0.10
0.85±0.10
0.85±0.10
R
R
R
R
TWK212 B7225[]D-T
EWK212 C6475[]D-T
LWK212 C6106MD-T
AWK212 C6226MD-T
10
10
10
±20
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀproductꢀspecificationꢀsheets.ꢀ
ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
1
43
Multilayer Ceramic Capacitors
■PACKAGING
①Minimum Quantity
●Taped package
Thickness
Standard quantity [pcs]
Type(EIA)
mm
code
K
Paper tape
Embossed tape
□MK021(008004)
□VS021(008004)
□MK042(01005)
□VS042(01005)
□MK063(0201)
0.125
－
－
50000
0.2
0.2
C, D
C
P,T
P
40000
0.3
15000
10000
－
－
－
□WK105(0204) ※
0.3
0.13
0.18
0.2
H
E
20000
15000
－
－
□MK105(0402)
□MF105(0402)
C
P
20000
15000
10000
10000
4000
－
0.3
－
0.5
V
W
K
－
□VK105(0402)
□MK107(0603)
□WK107(0306) ※
□MF107(0603)
□VS107(0603)
□MJ107(0603)
0.5
－
0.45
0.5
－
V
A
C
A
K
4000
－
0.8
4000
4000
3000
0.7
－
0.8
3000
0.45
0.85
1.25
0.85
0.85
1.25
0.85
1.15
1.6
□MK212(0805)
4000
－
□WK212(0508)
□MF212(0805)
※
D
G
D
D
G
D
F
－
4000
4000
－
3000
－
□VS212(0805)
□MJ212(0805)
－
2000
－
4000
－
□MK316(1206)
□MF316(1206)
3000
2000
3000
2000
L
－
1.15
1.6
F
－
□MJ316(1206)
L
－
0.85
1.15
1.9
D
F
－
2000
□MK325(1210)
□MF325(1210)
N
Y
2.0max.
2.5
M
N
M
M
－
－
－
－
1000
2000
1.9
□MJ325(1210)
□MK432(1812)
2.5
500(T), 1000(P)
500
2.5
Note : ※ LW Reverse type.
②Taping material
※No bottom tape for pressed carrier tape
●Card board carrier tape
●Embossed tape
Top tape
Top tape
Base tape
Sprocket hole
Chip cavity
Sprocket hole
Chip cavity
Bottom tape
Base tape
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack_e-E06R01
Chip filled
Chip
※ LW Reverse type.
③Representative taping dimensions
●Paper Tape（8mm wide）
●Pressed carrier tape（ 2mm pitch）
Unit：mm（inch）
T
1.75±0.1
φ1.5＋0.1/－0
(0.069±0.004）
(φ0.059＋0.004/-0)
Sprocket hole
A
B
T1
2.0±0.05
4.0±0.1
F
(0.079±0.002) (0.157±0.004)
Chip Cavity
Insertion Pitch
Tape Thickness
Type(EIA)
Ａ
Ｂ
Ｆ
Ｔ
T1
□MK063(0201)
0.37
0.67
0.45max.
0.42max.
□WK105(0204) ※
□MK105(0402) （*1 C）
□MK105(0402) （*1 P）
2.0±0.05
0.65
1.15
0.4max.
0.3max.
0.42max.
Unit：mm
0.45max.
Note *1 Thickness, C：0.2mm ,P：0.3mm. ※ LW Reverse type.
●Punched carrier tape （2mm pitch）
Unit：mm（inch）
1.75±0.1
φ1.5＋0.1/－0
(0.069±0.004）
(φ0.059＋0.004/-0)
Sprocket hole
T
A
B
F
2.0±0.05
4.0±0.1
(0.079±0.002) (0.157±0.004)
Chip Cavity
Insertion Pitch
Ｆ
Tape Thickness
Ｔ
Type(EIA)
Ａ
Ｂ
□MK105 (0402)
□MF105 (0402)
□VK105 (0402)
0.65
1.15
2.0±0.05
0.8max.
Unit：mm
●Punched carrier tape （4mm pitch）
φ1.5＋0.1/－0
Unit：mm（inch）
T
1.75±0.1
(0.069±0.004）
(φ0.059＋0.004/-0)
Sprocket hole
A
B
4.0±0.1
(0.157±0.004)
2.0±0.1
F
(0.079±0.004)
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack_e-E06R01
Chip Cavity
Insertion Pitch
Ｆ
Tape Thickness
Ｔ
Type(EIA)
Ａ
Ｂ
□MK107(0603)
□WK107(0306)
□MF107(0603)
□MK212(0805)
□WK212(0508)
□MK316(1206)
※
※
1.0
1.8
1.1max.
4.0±0.1
1.65
2.0
2.4
3.6
1.1max.
Note：Taping size might be different depending on the size of the product. ※ LW Reverse type.
Unit：mm
●Embossed tape（4mm wide）
Sprocket hole
Unit：mm（inch）
0.9±0.05
φ0.8±0.04
(0.035±0.002)
(φ0.031±0.002)
A
B
F
1.0±0.02
2.0±0.04
(0.039±0.001) (0.079±0.002)
Chip Cavity
Insertion Pitch
Tape Thickness
Type(EIA)
Ａ
Ｂ
Ｆ
K
T
□MK021(008004)
□VS021(008004)
□MK042(01005)
□VS042(01005)
0.135
0.27
1.0±0.02
0.5max.
0.25max.
Unit：mm
0.23
0.43
●Embossed tape（8mm wide）
Unit：mm（inch）
1.75±0.1
φ1.5＋0.1/－0
(0.069±0.004）
(φ0.059＋0.004/-0)
Sprocket hole
A
B
F
4.0±0.1
(0.157±0.004)
2.0±0.1
(0.079±0.004)
Chip Cavity
Insertion Pitch
Tape Thickness
Type(EIA)
Ａ
Ｂ
Ｆ
K
T
□MK105(0402)
0.6
1.0
1.1
1.8
2.0±0.1
0.6max
1.3max.
0.2±0.1
0.25±0.1
□WK107(0306) ※
□MK212(0805)
1.65
2.0
2.4
3.6
3.6
□MF212(0805)
4.0±0.1
□MK316(1206)
□MF316(1206)
3.4max.
0.6max.
□MK325(1210)
2.8
□MF325(1210)
Note： ※ LW Reverse type.
Unit：mm
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack_e-E06R01
●Embossed tape（12mm wide）
φ1.5＋0.1/－0
(φ0.059＋0.004/-0)
Unit：mm（inch）
1.75±0.1
(0.069±0.004）
Sprocket hole
A
B
4.0±0.1
2.0±0.1
(0.157±0.004)
F
(0.079±0.004)
Chip Cavity
Insertion Pitch
Ｆ
Tape Thickness
Type(EIA)
Ａ
Ｂ
K
T
□MK325(1210)
□MK432(1812)
3.1
3.7
4.0
4.9
8.0±0.1
8.0±0.1
4.0max.
4.0max.
0.6max.
0.6max.
Unit：mm
④Trailer and Leader
Blank portion
Chip cavity
Blank portion
Leader
100mm or more
160mm or more
(3.94inches or more)
(6.3inches or more)
400mm or more
(15.7inches or more)
Direction of tape feed
⑤Reel size
t
E
C
B
A
R
D
W
A
B
C
φ13.0±0.2
D
E
R
φ178±2.0
φ50min.
φ21.0±0.8
2.0±0.5
1.0
T
W
4mm wide tape
8mm wide tape
12mm wide tape
1.5max.
2.5max.
2.5max.
5±1.0
10±1.5
14±1.5
Unit：mm
⑥Top Tape Strength
The top tape requires a peel-off force of 0.1 to 0.7N in the direction of the arrow as illustrated below.
Pull direction
0～20°
Top tape
Base tape
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack_e-E06R01
Super Low Distortion Multilayer Ceramic Capacitors , Medium-High Voltage Multilayer Ceramic Capacitors and
High Reliability Application Multilayer Ceramic Capacitors are noted separately.
Multilayer Ceramic Capacitors
■RELIABILITY DATA
1.Operating Temperature Range
Standard
Temperature
－55 to ＋125℃
Compensating（Class1）
High Frequency Type
Specification
Temperature Range
－25 to ＋85℃
－55 to ＋85℃
－55 to ＋125℃
－55 to ＋105℃
－55 to ＋125℃
B
BJ
Specified
Value
X5R
X7R
X6S
X7S
B7
C6
C7
High Permittivity （Class2）
LD(※)
X5R
－55 to ＋85℃
Note: ※LD Low distortion high value multilayer ceramic capacitor
2. Storage Conditions
Temperature
Standard
－55 to ＋125℃
Compensating（Class1）
High Frequency Type
Specification
Temperature Range
－25 to ＋85℃
－55 to ＋85℃
－55 to ＋125℃
－55 to ＋105℃
－55 to ＋125℃
－55 to ＋85℃
B
BJ
Specified
Value
X5R
X7R
X6S
X7S
X5R
B7
C6
High Permittivity （Class2）
C7
LD(※)
Note: ※LD Low distortion high value multilayer ceramic capacitor
3. Rated Voltage
Standard
50VDC, 25VDC, 16VDC
Temperature
Specified
Value
Compensating（Class1）
High Frequency Type 50VDC, 25VDC, 16VDC
50VDC, 35VDC, 25VDC, 16VDC, 10VDC, 6.3VDC, 4VDC, 2.5VDC
High Permittivity （Class2）
4. Withstanding Voltage （Between terminals）
Temperature
Standard
Specified
Compensating（Class1）
High Frequency Type No breakdown or damage
Value
High Permittivity （Class2）
Class 1
Class 2
Rated voltage×2.5
Test
Applied voltage
Methods and
Duration
Rated voltage×3
1 to 5 sec.
50mA max.
Remarks
Charge/discharge current
5. Insulation Resistance
Temperature
Standard
High Frequency Type
10000 MΩmin.
Compensating（Class1）
Specified
Value
C≦0.047μF : 10000 MΩ min.
C＞0.047μF : 500MΩ・μF
High Permittivity （Class2） Note 1
Test
Applied voltage
Duration
: Rated voltage
Methods and
Remarks
: 60±5 sec.
: 50mA max.
Charge/discharge current
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_reli_e-E06R01
6. Capacitance （Tolerance）
0.2pF≦C≦5pF
0.2pF≦C≦10pF
C＞10pF
: ±0.25pF
C□
U□
SL
Standard
: ±0.5pF
Temperature
Specified
: ±5% or ±10%
Compensating（Class1）
Value
0.2pF≦C≦2pF
C＞2pF
: ±0.1pF
: ±5%
High Frequency Type
CG
High Permittivity （Class2）
±10% or ±20%
Class 1
Class 2
Standard
High Frequency Type
C≦10μF
C＞10μF
Test
Preconditioning
None
Thermal treatment （at 150℃ for 1hr） Note 2
Methods and
Remarks
Measuring frequency
Measuring voltage Nte
Bias application
1ＭHz±10%
0.5 to 5Vrms
1kHz±10%
1±0.2Vrms
120±10Hz
0.5±0.1Vrms
None
7. Q or Dissipation Factor
C＜30pF : Q≧400＋20C
C≧30pF : Q≧1000
Standard
Temperature
Compensating（Class1）
（C：Nominal capacitance）
Specified
Value
High Frequency Type Refer to detailed specification
High Permittivity （Class2） Note 1
BJ, B7, C6, C7：2.5% max.
Class 1
High Frequency Type
None
Class 2
Standard
C≦10μF
C＞10μF
Preconditioning
Thermal treatment （at 150℃ for 1hr） Note 2
Test
Measuring frequency
Measuring voltage Note 1
Bias application
1ＭHz±10%
1GHz
1ｋHz±10%
1±0.2Vrms
120±10Hz
Methods and
Remarks
0.5 to 5Vrms
0.5±0.1Vrms
None
High Frequency Type
Measuring equipment
Measuring jig
: HP4291A
: HP16192A
8. Temperature Characteristic （Without voltage application）
Temperature Characteristic ［ppm/℃］
Tolerance ［ppm/℃］
C□ :
0
CG
G : ±30
J：±120
K：±250
Standard
U□ : －750
UJ, UK
Temperature
Compensating（Class1）
SL : ＋350 to －1000
Temperature Characteristic ［ppm/℃］
Tolerance ［ppm/℃］
G : ±30
High Frequency Type
C□ :
0
CG
Specified
Value
Capacitance
change
±10%
Reference
Specification
Temperature Range
temperature
20℃
B
－25 to ＋85℃
－55 to ＋85℃
－55 to ＋125℃
－55 to ＋105℃
－55 to ＋125℃
－55 to ＋85℃
BJ
X5R
X7R
XS
±15%
25℃
High Permittivity （Class2）
B7
C6
±15%
25℃
±22%
25℃
C7
X7S
X5R
±22%
25℃
LD(※)
±15%
25℃
Note : ※LD Low distortion high value multilayer ceramic capacitor
Class 1
Capacitance at 20℃ and 85℃ shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the
following equation.
（C85－C20）
×106（ppm/℃）
C20×△T
△T＝65
Class 2
Test
Capacitance at each step shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the following
equation.
Methods and
Remarks
Step
B
X5R、X7R、X6S、X7S
Minimum operating temperature
1
2
3
20℃
25℃
Maximum operating temperature
（C－C2）
C2
C
：Capacitance in Step 1 or Step 3
×100（%）
C2 ：Capacitance in Step 2
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_reli_e-E06R01
9. Deflection
Appearance
Capacitance change : Within ±5% or ±0.5 pF, whichever is larger.
Appearance : No abnormality
Capacitance change : Within±0.5 pF
Appearance : No abnormality
: No abnormality
Standard
Temperature
Compensating（Class1）
Specified
Value
High Frequency Type
High Permittivity （Class2）
Capacitance change : Within ±12.5%
Multilayer Ceramic Capacitors
021, 042, 063, ※105 Type
The other types
Board
Glass epoxy-resin substrate
Test
Thickness
Warp
0.8mm
1.6mm
Methods and
Remarks
1mm
10 sec.
※105 Type thickness, C： 0.2mm ,P： 0.3mm.
Duration
Capacitance measurement shall be conducted
with the board bent
10. Body Strength
Standard
－
Temperature
Specified
Value
Compensating（Class1）
High Frequency Type No mechanical damage.
－
High Permittivity （Class2）
High Frequency 105Type
Applied force
Duraton
: 5N
Test
: 10 sec.
Methods and
Remarks
11. Adhesive Strength of Terminal Electrodes
Temperature
Standard
Specified
Compensating（Class1）
High Frequency Type No terminal separation or its indication.
Value
High Permittivity （Class2）
Multilayer Ceramic Capacitors
021, 042, 063 Type
2N
105 Type or more
5N
Test
Applied force
Duration
Methods and
Remarks
30±5 sec.
12. Solderability
Standard
High Frequency Type At least 95% of terminal electrode is covered by new solder.
Temperature
Specified
Value
Compensating（Class1）
High Permittivity （Class2）
Eutectic solder
H60A or H63A
230±5℃
Lead-free solder
Sn-3.0Ag-0.5Cu
245±3℃
Test
Solder type
Methods and
Remarks
Solder temperature
Duration
4±1 sec.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_reli_e-E06R01
13. Resistance to Soldering
Appearance
: No abnormality
Capacitance change
Q
: Within ±2.5% or ±0.25pF, whichever is larger.
: Initial value
Standard
Insulation resistance
Withstanding voltage
: Initial value
（between terminals） : No abnormality
Temperature
Compensating（Class1）
Appearance
: No abnormality
Capacitance change
Q
: Within ±2.5%
: Initial value
Specified
Value
High Frequency Type
Insulation resistance
Withstanding voltage
: Initial value
（between terminals） : No abnormality
Appearance
: No abnormality
Capacitance change
Dissipation factor
Insulation resistance
Withstanding voltage
: Within ±7.5%
High Permittivity （Class2） Note 1
: Initial value
: Initial value
（between terminals）: No abnormality
Class 1
021, 042, 063 Type
150℃, 1 to 2 min.
105 Type
Preconditioning
Preheating
None
80 to 100℃, 2 to 5 min.
150 to 200℃, 2 to 5 min.
Solder temp.
Duration
270±5℃
3±0.5 sec.
Recovery
6 to 24 hrs （Standard condition） Note 5
Test
Methods and
Remarks
Class 2
021, 042、063 Type
150℃, 1 to 2 min.
105, 107, 212 Type
Thermal treatment （at 150℃ for 1 hr） Note 2
80 to 100℃, 2 to 5 min.
316, 325, 432 Type
Preconditioning
Preheating
80 to 100℃, 5 to 10 min.
150 to 200℃, 5 to 10 min.
150 to 200℃, 2 to 5 min.
270±5℃
Solder temp.
Duration
3±0.5 sec.
Recovery
24±2 hrs （Standard condition） Note 5
14. Temperature Cycle (Thermal Shock）
Appearance
: No abnormality
Capacitance change
Q
: Within ±2.5% or ±0.25pF, whichever is larger.
: Initial value
Standard
Insulation resistance
Withstanding voltage
: Initial value
（between terminals） : No abnormality
Temperature
Compensating（Class1）
Appearance
: No abnormality
Capacitance change
Q
: Within ±0.25pF
Specified
Value
High Frequency Type
: Initial value
Insulation resistance
Withstanding voltage
: Initial value
（between terminals） : No abnormality
Appearance
: No abnormality
Capacitance change
Dissipation factor
Insulation resistance
Withstanding voltage
: Within ±7.5%
High Permittivity （Class2） Note 1
: Initial value
: Initial value
（between terminals） : No abnormality
Class 1
None
Class 2
Thermal treatment （at 150℃ for 1 hr）
Note 2
Preconditioning
Step
Temperature（℃）
Time（min.）
30±3
Test
1
2
3
4
Minimum operating temperature
Normal temperature
Methods and
Remarks
1 cycle
2 to 3
Maximum operating temperature
Normal temperature
30±3
2 to 3
Number of cycles
Recovery
5 times
6 to 24 hrs （Standard condition） Note 5
24±2 hrs （Standard condition） Note 5
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_reli_e-E06R01
15. Humidity （Steady State）
Appearance
: No abnormality
Capacitance change
Q
: Within ±5% or ±0.5pF, whichever is larger.
: C＜10pF : Q≧200＋10C
Standard
10≦C＜30pF : Q≧275＋2.5C
C≧30pF:Q≧350（C：Nominal capacitance）
: 1000 MΩmin.
Temperature
Compensating（Class1）
Insulation resistance
Appearance
Specified
Value
: No abnormality
: Within ±0.5pF,
: 1000 MΩmin.
High Frequency Type Capacitance change
Insulation resistance
Appearance
: No abnormality
Capacitance change
: Within ±12.5%
High Permittivity （Class2） Note 1
Dissipation factor
: 5.0% max.
Insulation resistance
: 50 MΩμF or 1000 MΩwhichever is smaller.
Class 1
Class 2
All items
Standard
40±2℃
High Frequency Type
60±2℃
Preconditioning
Temperature
Humidity
None
Thermal treatment（ at 150℃ for 1 hr） Note 2
40±2℃
Test
Methods and
Remarks
90 to 95%RH
90 to 95%RH
Duration
500＋24/－0 hrs
500＋24/－0 hrs
Recovery
6 to 24 hrs （Standard condition） Note 5
24±2 hrs （Standard condition） Note 5
16. Humidity Loading
Appearance
: No abnormality
Capacitance change
: Within ±7.5% or ±0.75pF, whichever is larger.
: C＜30pF：Q≧100＋10C/3
C≧30pF：Q≧200 （C：Nominal capacitance）
: 500 MΩmin.
Standard
Q
Insulation resistance
Temperature
Compensating（Class1）
Appearance
: No abnormality
Specified
Value
Capacitance change
: C≦2pF：Within ±0.4 pF
C＞2pF：Within ±0.75 pF
（C：Nominal capacitance）
: 500 MΩmin.
High Frequency Type
Insulation resistance
Appearance
: No abnormality
Capacitance change
Dissipation factor
Insulation resistance
: Within ±12.5%
High Permittivity （Class2） Note 1
: 5.0% max.
: 25 MΩμF or 500 MΩ, whichever is smaller.
Class 1
Class 2
Standard
High Frequency Type
All items
Preconditioning
Voltage treatment
None
（Rated voltage are applied for 1 hour at 40℃） Note 3
Temperature
Humidity
40±2℃
60±2℃
40±2℃
Test
Methods and
Remarks
90 to 95%RH
500＋24/－0 hrs
Rated voltage
90 to 95%RH
Duration
500＋24/－0 hrs
Rated voltage
Applied voltage
Charge/discharge
current
50mA max.
50mA max.
Recovery
6 to 24 hrs （Standard condition） Note 5
24±2 hrs（Standard condition） Note 5
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_reli_e-E06R01
17. High Temperature Loading
Appearance
: No abnormality
Capacitance change
Q
: Within ±3% or ±0.3pF, whichever is larger.
: C＜10pF： Q≧200＋10C
Standard
10≦C＜30pF：Q≧275＋2.5C
C≧30pF： Q≧350（C：Nominal capacitance）
: 1000 MΩmin.
Temperature
Compensating（Class1）
Insulation resistance
Appearance
Specified
Value
: No abnormality
High Frequency Type Capacitance change
Insulation resistance
: Within ±3% or ±0.3pF, whichever is larger.
: 1000 MΩmin.
Appearance
: No abnormality
Capacitance change
: Within ±12.5%
High Permittivity （Class2） Note 1
Dissipation factor
: 5.0% max.
Insulation resistance
: 50 MΩμF or 1000 MΩ, whichever is smaller.
Class 1
High Frequency Type
Class 2
Standard
BJ, LD(※)
C6
B7, C7
Voltage treatment（Twice the rated voltage shall be applied for
1 hour at 85℃, 105℃ or 125℃） Note 3, 4
Maximum operating temperature
Preconditioning
None
Temperature
Duration
Maximum operating temperature
1000＋48/－0 hrs
Test
1000＋48/－0 hrs
Methods and
Remarks
Applied voltage
Charge/discharge
current
Rated voltage×2 Note 4
Rated voltage×2 Note 4
50mA max.
50mA max.
Recovery
6 to 24hr （Standard condition） Note 5
24±2 hrs （Standard condition） Note 5
Note: ※LD Low distortion high value multilayer ceramic capacitor
Note 1 The figures indicate typical specifications. Please refer to individual specifications in detail.
Note 2 Thermal treatment : Initial value shall be measured after test sample is heat-treated at 150＋0/－10℃ for an hour and kept at room temperature for
24±2hours.
Note 3 Voltage treatment : Initial value shall be measured after test sample is voltage-treated for an hour at both the temperature and voltage specified in
the test conditions, and kept at room temperature for 24±2hours.
Note 4 150% of rated voltage is applicable to some items. Please refer to their specifications for further information.
Note 5 Standard condition: Temperature: 5 to 35℃, Relative humidity: 45 to 85 % RH, Air pressure: 86 to 106kPa When there are questions concerning
measurement results, in order to provide correlation data, the test shall be conducted under the following condition.
Temperature: 20±2℃, Relative humidity: 60 to 70 % RH, Air pressure: 86 to 106kPa Unless otherwise specified, all the tests are conducted under the
"standard condition".
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_reli_e-E06R01
High Reliability Application Multilayer Ceramic Capacitors are noted separately.
Precautions on the use of Multilayer Ceramic Capacitors
■PRECAUTIONS
1. Circuit Design
◆Verification of operating environment, electrical rating and performance
1. A malfunction of equipment in fields such as medical, aerospace, nuclear control, etc. may cause serious harm to human life or have
severe social ramifications.
Therefore, any capacitors to be used in such equipment may require higher safety and reliability, and shall be clearly differentiated from
them used in general purpose applications.
Precautions
◆Operating Voltage （Verification of Rated voltage）
1. The operating voltage for capacitors must always be their rated voltage or less.
If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages shall be the rated voltage or less.
For a circuit where an AC or a pulse voltage may be used, the sum of their peak voltages shall also be the rated voltage or less.
2. Even if an applied voltage is the rated voltage or less reliability of capacitors may be deteriorated in case that either a high frequency AC
voltage or a pulse voltage having rapid rise time is used in a circuit.
2. PCB Design
◆Pattern configurations （Design of Land-patterns）
1. When capacitors are mounted on PCBs, the amount of solder used （size of fillet） can directly affect the capacitor performance.
Therefore, the following items must be carefully considered in the design of land patterns:
（1）Excessive solder applied can cause mechanical stresses which lead to chip breaking or cracking. Therefore, please consider
appropriate land-patterns for proper amount of solder.
Precautions
（2）When more than one component are jointly soldered onto the same land, each component's soldering point shall be separated by
solder-resist.
◆Pattern configurations （Capacitor layout on PCBs）
After capacitors are mounted on boards, they can be subjected to mechanical stresses in subsequent manufacturing processes （PCB
cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering of the boards, etc.）. For this reason, land
pattern configurations and positions of capacitors shall be carefully considered to minimize stresses.
◆Pattern configurations （Design of Land-patterns）
The following diagrams and tables show some examples of recommended land patterns to prevent excessive solder amounts.
（1）Recommended land dimensions for typical chip capacitors
●Multilayer Ceramic Capacitors : Recommended land dimensions
Land patterns for PCBs
Land pattern
（unit: mm）
Solder-resist
Wave-soldering
Chip capacitor
Type
107
1.6
212
2.0
316
3.2
325
3.2
L
C
Size
W
0.8
1.25
1.6
2.5
A
B
C
0.8 to 1.0
0.5 to 0.8
0.6 to 0.8
1.0 to 1.4
0.8 to 1.5
0.9 to 1.2
1.8 to 2.5
0.8 to 1.7
1.2 to 1.6
1.8 to 2.5
0.8 to 1.7
1.8 to 2.5
B
A
B
Chip capacitor
W
L
Technical
Reflow-soldering
Type 021
considerations
042
0.4
0.2
063
0.6
0.3
105
1.0
0.5
107
1.6
212
2.0
316
3.2
325
3.2
432
4.5
3.2
L
0.25
Size
W
0.125
0.8
1.25
1.6
2.5
A
B
C
0.095～0.135 0.15～0.25 0.20～0.30 0.45～0.55
0.085～0.125 0.15～0.20 0.20～0.30 0.40～0.50
0.110～0.150 0.15～0.30 0.25～0.40 0.45～0.55
0.8～1.0
0.6～0.8
0.6～0.8
0.8～1.2
0.8～1.2
0.9～1.6
1.8～2.5
1.0～1.5
1.2～2.0
1.8～2.5
1.0～1.5
1.8～3.2
2.5～3.5
1.5～1.8
2.3～3.5
Note：Recommended land size might be different according to the allowance of the size of the product.
LWDC
●LWDC: Recommended land dimensions for reflow-soldering
（unit: mm）
Type
105
0.52
107
0.8
212
1.25
L
W
Size
W
1.0
1.6
2.0
A
B
C
0.18～0.22
0.2～0.25
0.9～1.1
0.25～0.3
0.3～0.4
1.5～1.7
0.5～0.7
0.4～0.5
1.9～2.1
L
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-E05R01
（2）Examples of good and bad solder application
Item
Not recommended
Recommended
Solder-resist
Lead wire of component
Mixed mounting of SMD and
leaded components
Chassis
Solder-resist
Solder (for grounding)
Component placement close to
the chassis
Electrode pattern
Lead wire of component
Soldering iron
Solder-resist
Hand-soldering of leaded
components near mounted
components
Solder-resist
Horizontal component
placement
◆Pattern configurations （Capacitor layout on PCBs）
1-1. The following is examples of good and bad capacitor layouts ; capacitors shall be located to minimize any
stresses from board warp or deflection.
possible mechanical
Items
Not recommended
Recommended
Place the product at a right
angle to the direction of the
anticipated mechanical
stress.
Deflection of board
1-2. The amount of mechanical stresses given will vary depending on capacitor layout. Please refer to diagram below.
E
D
Perforation
C
A
B
Slit
Magnitude of stress A＞B＝C＞D＞E
1-3. When PCB is split, the amount of mechanical stress on the capacitors can vary according to the method used. The following methods
are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, please consider the PCB,
split methods as well as chip location.
3. Mounting
Precautions
◆Adjustment of mounting machine
1. When capacitors are mounted on PCB, excessive impact load shall not be imposed on them.
2. Maintenance and inspection of mounting machines shall be conducted periodically.
◆Selection of Adhesives
1. When chips are attached on PCBs with adhesives prior to soldering, it may cause capacitor characteristics degradation unless the
following factors are appropriately checked : size of land patterns, type of adhesive, amount applied, hardening temperature and
hardening period. Therefore, please contact us for further information.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-E05R01
◆Adjustment of mounting machine
1. When the bottom dead center of a pick-up nozzle is too low, excessive force is imposed on capacitors and causes damages. To avoid
this, the following points shall be considerable.
（1）The bottom dead center of the pick-up nozzle shall be adjusted to the surface level of PCB without the board deflection.
（2）The pressure of nozzle shall be adjusted between 1 and 3 N static loads.
（3）To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins shall be
used on the other side of the PCB. The following diagrams show some typical examples of good and bad pick-up nozzle
placement:
Item
Improper method
Proper method
chipping
or cracking
Single-sided mounting
supporting pins
or back-up pins
Double-sided mounting
chipping
or cracking
supporting pins
or back-up pins
2. As the alignment pin is worn out, adjustment of the nozzle height can cause chipping or cracking of capacitors because of mechanical
impact on the capacitors.
Technical
considerations
To avoid this, the monitoring of the width between the alignment pins in the stopped position, maintenance, check and replacement of
the pin shall be conducted periodically.
◆Selection of Adhesives
Some adhesives may cause IR deterioration. The different shrinkage percentage of between the adhesive and the capacitors may result in
stresses on the capacitors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect
components. Therefore, the following precautions shall be noted in the application of adhesives.
（1）Required adhesive characteristics
a. The adhesive shall be strong enough to hold parts on the board during the mounting & solder process.
b. The adhesive shall have sufficient strength at high temperatures.
c. The adhesive shall have good coating and thickness consistency.
d. The adhesive shall be used during its prescribed shelf life.
e. The adhesive shall harden rapidly.
f. The adhesive shall have corrosion resistance.
g. The adhesive shall have excellent insulation characteristics.
h. The adhesive shall have no emission of toxic gasses and no effect on the human body.
（2）The recommended amount of adhesives is as follows;
［Recommended condition］
Amount adhesive
After capacitor are bonded
a
a
Figure
212/316 case sizes as examples
a
b
c
0.3mm min
100 to 120μm
b
Adhesives shall not contact land
c
c
4. Soldering
◆Selection of Flux
Since flux may have a significant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use;
（1）Flux used shall be less than or equal to 0.1 wt%（ in Cl equivalent） of halogenated content. Flux having a strong acidity content shall
not be applied.
（2）When shall capacitors are soldered on boards, the amount of flux applied shall be controlled at the optimum level.
（3）When water-soluble flux is used, special care shall be taken to properly clean the boards.
Precautions
◆Soldering
Temperature, time, amount of solder, etc. shall be set in accordance with their recommended conditions.
Sn-Zn solder paste can adversely affect MLCC reliability.
Please contact us prior to usage of Sn-Zn solder.
◆Selection of Flux
1-1. When too much halogenated substance（Chlorine, etc.） content is used to activate flux, or highly acidic flux is used, it may lead to
corrosion of terminal electrodes or degradation of insulation resistance on the surfaces of the capacitors.
1-2. Flux is used to increase solderability in wave soldering. However if too much flux is applied, a large amount of flux gas may be emitted
and may adversely affect the solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.
1-3. Since the residue of water-soluble flux is easily dissolved in moisture in the air, the residues on the surfaces of capacitors in high
humidity conditions may cause a degradation of insulation resistance and reliability of the capacitors. Therefore, the cleaning
methods and the capability of the machines used shall also be considered carefully when water-soluble flux is used.
Technical
considerations
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-E05R01
◆Soldering
･ Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling.
･ Therefore, the soldering must be conducted with great care so as to prevent malfunction of the components due to excessive thermal
shock.
･ Preheating : Capacitors shall be preheated sufficiently, and the temperature difference between the capacitors and solder shall be within
130℃.
･ Cooling : The temperature difference between the capacitors and cleaning process shall not be greater than 100℃.
［Reflow soldering］
【Recommended conditions for eutectic
【Recommended condition for Pb-free
soldering】
soldering】
300
300
Peak
260℃ Max.
Within 10sec.
Preheating
230℃
Within 10sec.
60sec. 60sec
Min.
Min.
200
100
0
200
Slow
Slow cooling
cooling
100
Heating above
230℃
Preheating150℃
60sec. Min.
40sec. Max.
0
1/2T～1/3T
Capacitor
PC board
Caution
Solder
T
①The ideal condition is to have solder mass（fillet）controlled to 1/2 to 1/3 of the
thickness of a capacitor.
②Because excessive dwell times can adversely affect solderability, soldering duration shall
be kept as close to recommended times as possible. soldering for 2 times.
［Wave soldering］
【Recommended conditions for eutectic
【Recommended condition for Pb-free
soldering】
300
soldering】
300
Peak
230～250℃
Within 3sec.
260℃ Max.
Within 10sec.
Preheating
120sec. Min.
120sec. Min.
200
200
100
0
Slow
Slow cooling
Preheating
150℃
cooling
100
0
Caution
①Wave soldering must not be applied to capacitors designated as for reflow soldering only. soldering for 1 times.
［Hand soldering］
【Recommended conditions for eutectic
【Recommended condition for Pb-free
soldering】
400
soldering】
400
400
300
200
100
0
Peak
Peak
280℃ Max.
Within 3sec.
230～280℃
Within 3sec.
350℃ Max.
Within 3sec.
300
300
⊿T
Slow cooling
200
Slow cooling
⊿T
200
Slow cooling
Preheating
150℃ Min.
Preheating
150℃ Min.
100
100
Preheating
60sec. Min.
0
60sec. Min.
60sec. Min.
0
⊿T
⊿T
316type or less
⊿T≦150℃
325type or more
⊿T≦130℃
Caution
①Use a 50W soldering iron with a maximum tip diameter of 1.0 mm.
②The soldering iron shall not directly touch capacitors. soldering for 1 times.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-E05R01
5. Cleaning
Precautions
◆Cleaning conditions
1. When PCBs are cleaned after capacitors mounting, please select the appropriate cleaning solution in accordance with the intended use
of the cleaning. （e.g. to remove soldering flux or other materials from the production process.）
2. Cleaning condition shall be determined after it is verified by using actual cleaning machine that the cleaning process does not affect
capacitor's characteristics.
1. The use of inappropriate cleaning solutions can cause foreign substances such as flux residue to adhere to capacitors or deteriorate
their outer coating, resulting in a degradation of the capacitor's electrical properties （especially insulation resistance）.
2. Inappropriate cleaning conditions（ insufficient or excessive cleaning） may adversely affect the performance of the capacitors.
In the case of ultrasonic cleaning, too much power output can cause excessive vibration of PCBs which may lead to the cracking of
capacitors or the soldered portion, or decrease the terminal electrodes' strength. Therefore, the following conditions shall be carefully
checked;
Technical
considerations
Ultrasonic output :
20 W/ℓ or les
Ultrasonic frequency :
40 kHz or less
Ultrasonic washing period : 5 min. or less
6. Resin coating and mold
1. With some type of resins, decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while
left under normal storage conditions resulting in the deterioration of the capacitor's performance.
2. When a resin's hardening temperature is higher than capacitor's operating temperature, the stresses generated by the excessive heat
may lead to damage or destruction of capacitors.
Precautions
The use of such resins, molding materials etc. is not recommended.
7. Handling
◆Splitting of PCB
1. When PCBs are split after components mounting, care shall be taken so as not to give any stresses of deflection or twisting to the board.
2. Board separation shall not be done manually, but by using the appropriate devices.
◆Mechanical considerations
Precautions
Be careful not to subject capacitors to excessive mechanical shocks.
（1）If ceramic capacitors are dropped onto a floor or a hard surface, they shall not be used.
（2）Please be careful that the mounted components do not come in contact with or bump against other boards or components.
8. Storage conditions
◆Storage
1. To maintain the solderability of terminal electrodes and to keep packaging materials in good condition, care must be taken to control
temperature and humidity in the storage area. Humidity should especially be kept as low as possible.
・Recommended conditions
Ambient temperature : Below 30℃
Humidity : Below 70% RH
Precautions
The ambient temperature must be kept below 40℃. Even under ideal storage conditions, solderability of capacitor is deteriorated as
time passes, so capacitors shall be used within 6 months from the time of delivery.
・Ceramic chip capacitors shall be kept where no chlorine or sulfur exists in the air.
2. The capacitance values of high dielectric constant capacitors will gradually decrease with the passage of time, so care shall be taken to
design circuits. Even if capacitance value decreases as time passes, it will get back to the initial value by a heat treatment at 150℃ for
1hour.
If capacitors are stored in a high temperature and humidity environment, it might rapidly cause poor solderability due to terminal oxidation and
quality loss of taping/packaging materials. For this reason, capacitors shall be used within 6 months from the time of delivery. If exceeding the
above period, please check solderability before using the capacitors.
Technical
considerations
※RCR-2335B（Safety Application Guide for fixed ceramic capacitors for use in electronic equipment）is published by JEITA.
Please check the guide regarding precautions for deflection test, soldering by spot heat, and so on.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-E05R01
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