NP383-28804-P [YAMAICHI]
Chip Scale Package -TH (CSP, 0.50mm Pitch); 芯片级封装-TH ( CSP , 0.50毫米间距)型号: | NP383-28804-P |
厂家: | YAMAICHI ELECTRONICS CO., LTD. |
描述: | Chip Scale Package -TH (CSP, 0.50mm Pitch) |
文件: | 总1页 (文件大小:170K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
NP383 Series (Open Top)
Chip Scale Package -TH (CSP, 0.50mm Pitch)
Specifications
Part Num ber (Details)
Ω
1,000M m in. at 100V DC
Dielectric Withstanding Voltage: 100V AC for 1 m inute
Insulation Resistance:
-
NP383
Series No.
*** 09 *
Ω
100m m ax. at 10m A/20m V m ax.
Contact Resistance:
Operating Tem perature Range: –40°C to +150°C
No. of Contact Pins
Design Num ber
10gf per pin approx.
2.2kg ±0.5
Contact Force:
Operating Force:
Positioning Pin: N = Without
P = With
Features
Materials and Finish
Housing:
Polyetherim ide (PEI), glass-filled
µ Open top socket for BGA
Polyetherssulphone (PES), glass-filled
µ
µ
Through hole 0.5m m pitch
2-point Tweezer Contacts
Contacts:
Plating:
Beryllium Copper (BeCu)
Gold over Nickel
Exam ple Socket Dim ensions
Contact Details
Recom m ended PC Board Layout
Top View from Socket
2-point Tweezer Style Contact
Free
Open
Test
Part Num ber
Grid Size
Body size
Socket Dim ensions
Centre Grid size
NP383-18010-*
NP383-28804-*
NP383-84107-*
10x18
18x18
29x29
11.0x12.5
10.0x10.0
15.0x15.0
19.5x26.0
36.0x36.0
33.0x33
no grid centre
6x6
7x7
SPECIFICATIONS ARE SUBJ ECT TO ALTERATION WITHOUT PRIOR NOTICE
–
DIMENSIONS IN MILLIMETER
Test & Burn-In
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