NP383-28804-P [YAMAICHI]

Chip Scale Package -TH (CSP, 0.50mm Pitch); 芯片级封装-TH ( CSP , 0.50毫米间距)
NP383-28804-P
型号: NP383-28804-P
厂家: YAMAICHI ELECTRONICS CO., LTD.    YAMAICHI ELECTRONICS CO., LTD.
描述:

Chip Scale Package -TH (CSP, 0.50mm Pitch)
芯片级封装-TH ( CSP , 0.50毫米间距)

文件: 总1页 (文件大小:170K)
中文:  中文翻译
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NP383 Series (Open Top)  
Chip Scale Package -TH (CSP, 0.50mm Pitch)  
Specifications  
Part Num ber (Details)  
1,000M m in. at 100V DC  
Dielectric Withstanding Voltage: 100V AC for 1 m inute  
Insulation Resistance:  
-
NP383  
Series No.  
*** 09 *  
100m m ax. at 10m A/20m V m ax.  
Contact Resistance:  
Operating Tem perature Range: –40°C to +150°C  
No. of Contact Pins  
Design Num ber  
10gf per pin approx.  
2.2kg ±0.5  
Contact Force:  
Operating Force:  
Positioning Pin: N = Without  
P = With  
Features  
Materials and Finish  
Housing:  
Polyetherim ide (PEI), glass-filled  
µ Open top socket for BGA  
Polyetherssulphone (PES), glass-filled  
µ
µ
Through hole 0.5m m pitch  
2-point Tweezer Contacts  
Contacts:  
Plating:  
Beryllium Copper (BeCu)  
Gold over Nickel  
Exam ple Socket Dim ensions  
Contact Details  
Recom m ended PC Board Layout  
Top View from Socket  
2-point Tweezer Style Contact  
Free  
Open  
Test  
Part Num ber  
Grid Size  
Body size  
Socket Dim ensions  
Centre Grid size  
NP383-18010-*  
NP383-28804-*  
NP383-84107-*  
10x18  
18x18  
29x29  
11.0x12.5  
10.0x10.0  
15.0x15.0  
19.5x26.0  
36.0x36.0  
33.0x33  
no grid centre  
6x6  
7x7  
SPECIFICATIONS ARE SUBJ ECT TO ALTERATION WITHOUT PRIOR NOTICE  
DIMENSIONS IN MILLIMETER  
Test & Burn-In  

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