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STD1109T-102M-B [YAGEO]

General Purpose Inductor, 1000uH, 20%, 1 Element, SMD, 5546,;
STD1109T-102M-B
型号： STD1109T-102M-B
厂家： YAGEO CORPORATION    YAGEO CORPORATION
描述：

General Purpose Inductor, 1000uH, 20%, 1 Element, SMD, 5546,
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YAGEO CORPORATION SMD INDUCTOR/BEADS  
STD1109 Series  
SMD Power Inductors  
Yageo SMD power inductors are best designed for noise / EMI / RFI filters for surface mounting  
applications.  
These components contain tremendous electrode straight, solder heat resistance and outstanding  
solderability.These products are specially designed for flow, reflow and wave soldering required for  
surface mounting applications.  
Applications  
Features  
• For high current applications.  
• Power supply, power amplifiers  
• Specially designed for high density surface applications.  
• Ideal for solder flow, reflow and wave soldering applications.  
• Switching regulators.  
PRODUCT IDENTIFICATION  
ELECTRICAL CHARACTERISTICS  
-
-
STD  
International No.  
Tolerance  
PART NO.  
INDUCTANCE  
DC  
RATED  
(PH r 20%) *  
RESISTANCE  
(:)  
CURRENT  
(A) Max.  
Inductance  
Packaging Style  
Dimensions  
STD1109T-100M-B  
STD1109T-120M-B  
STD1109T-150M-B  
STD1109T-180M-B  
STD1109T-220M-B  
STD1109T-270M-B  
STD1109T-330M-B  
STD1109T-390M-B  
STD1109T-470M-B  
STD1109T-560M-B  
STD1109T-680M-B  
STD1109T-820M-B  
STD1109T-101M-B  
STD1109T-121M-B  
STD1109T-151M-B  
STD1109T-181M-B  
STD1109T-221M-B  
STD1109T-271M-B  
STD1109T-331M-B  
STD1109T-391M-B  
STD1109T-471M-B  
STD1109T-561M-B  
STD1109T-681M-B  
STD1109T-821M-B  
STD1109T-102M-B  
STD1109T-122M-B  
10  
0.06  
0.07  
0.08  
0.09  
0.10  
0.11  
0.12  
0.14  
0.17  
0.19  
0.22  
0.25  
0.35  
0.40  
0.47  
0.63  
0.73  
0.97  
1.15  
1.30  
1.48  
1.90  
2.45  
2.55  
3.00  
3.50  
3.50  
3.40  
3.10  
3.00  
2.60  
2.40  
2.30  
2.10  
1.95  
1.85  
1.65  
1.50  
1.40  
1.30  
1.20  
1.00  
0.95  
0.90  
0.80  
0.75  
0.65  
0.60  
0.50  
0.48  
0.46  
0.35  
Product Symbol  
12  
15  
18  
• Packaging: T: Tape and Reel  
• Tolerance: M=r20%  
22  
• Note:YAGEO will start to release STD Series  
inductors with lead-free terminals which  
meet SONY SS-00259’s criteria for lead-  
free product in Q2 of 2004, and YAGEO  
Internal No will be changed to “N” as  
identification. Ex. STD1109T-100M-B-N  
27  
33  
39  
47  
56  
68  
SHAPESAND DIMENSIONS  
82  
100  
120  
150  
180  
220  
270  
330  
390  
470  
560  
680  
820  
1000  
1200  
11.6+0  
11.6+0  
8.5+0  
3+0  
14.0+0  
6
2.55  
2.55  
Test Instruments : HP4261 RF Impedance for L, IDC  
*Test at HP4263A 1KHz, 1Volt  
Digital Multimeter SC-7401 for RDC  
Dimensions : mm  
TAPE DIMENSIONS  
TAPE MATERIAL  
CarrierTape : Polystyrene  
CoverType : Polyethylene  
P0  
P2  
K0  
K0  
E
W
D
Chip Mounting  
Part  
Blank  
160mm Min.  
Blank Part  
P
330mm Min.  
Leader  
CoverTape  
REEL DIMENSIONS  
RECOMMENDED PATTERN  
B
C
B
A
A
C
D
Solder Land  
Inductor  
Dimensions : mm  
TYPE  
TAPE  
DIMENSIONS  
RECOMMENDED  
PATTERN  
REEL  
DIMENSIONS  
QUANTITY  
/REEL  
K0  
5.4  
8.7  
D
E
W
P
P0  
P2  
A
4.0  
6
B
C
4.5  
5
A
B
C
D
STD0804  
STD1109  
1.55  
1.55  
1.75  
1.75  
24  
24  
16  
20  
4
4
2
2
9
330  
330  
100  
100  
13  
13  
24.4  
24.4  
750  
400  
12~14  
TYPICAL INDUCTANCE ENERGY STORAGE VS.CURRENT  
Test instruments : HP4191A RF Impedance Analyzer  
Q vs. FREQUENCY CHARACTERISTICS  
INDUCTANCE vs. FREQUENCY CHARACTERISTICS  
150  
35  
30  
25  
20  
15  
10  
5
33uH  
120  
33uH  
90  
60  
15uH  
10uH  
15uH  
30  
10uH  
0
0
1
10  
100  
1000  
10000  
100000  
0
1
2
3
4
5
6
7
8
FREQUENCY (kHz)  
IDC (A)  
STD SERIES RELIABILITY TEST  
1-1 MECHANICAL PERFORMANCE  
NO.  
ITEM  
SPECIFICATION  
TEST CONDITIONS  
1-1-1 Vibration  
Appearance : No Damage  
L Change : within r10%  
Q Change : within r30%  
RDC : within Specification  
Appearance : No Damage  
Test device shall be soldered on the substrate.  
Oscillation Frequency : 10 to 55 to 10Hz for 1Min.  
Amplitude : 1.5mm  
Time : 2Hrs. for each Axis (X,Y & Z), Total 6Hrs.  
Pre-heating : 150qC, 1Min.  
1-1-2 Resistance to  
Soldering Heat  
Solder Composition : Sn/Pb = 63/37  
SolderTemperature : 260 r 5qC  
ImmersionTime : 10 r 1Sec.  
1-1-3 Solderability  
The electrodes shall be at least 90% covered  
with new solder coating.  
Pre-heating : 150qC, 1Min.  
Solder Composition : Sn/Pb = 63/37  
SolderTemperature : 230 r 5qC  
ImmersionTime : 4 r 1Sec.  
1-2 ENVIRONMENTAL PERFORMANCE  
NO.  
ITEM  
SPECIFICATION  
TEST CONDITIONS  
1-2-1 Temperature Shock  
Appearance : No Damage  
L Change : within r10%  
L Change : within r30%  
RDC : within Specification  
10 Cycles (Air to Air) 1 Cycles shall Consist of :  
30Min. Exposure to -55qC  
30Min. Exposure to 125qC  
15Sec. Max.Transition betweenTemperatures  
Measured after Exposure in the Room Condition for 24Hrs.  
One Cycle  
1-2-2 Temperature Cycle  
Step  
Temperature (qC)  
-25 r 3  
Time (Min.)  
1
30  
3
2
25 r 2  
3
85 r 3  
30  
3
4
25 r 2  
Total : 100 Cycles  
Measured after Exposure in the Room Condition for 24Hrs.  
Temperature : 40 r 2qC  
1-2-3 Humidity Resistance  
Relative Humidity : 90 ~ 95%  
Time : 1000Hrs.  
Measured after Exposure in the Room Condition for 24Hrs.  
Temperature : 85 r 3qC  
1-2-4 HighTemperature  
Resistance  
Relative Humidity : 20%  
Applied Current : Rated Current  
Time : 1000Hrs.  
Measured after Exposure in the Room Condition for 24Hrs.  
Temperature : -25 r 3qC  
1-2-5 LowTemperature  
Resistance  
Relative Humidity : 0%  
Time : 1000Hrs.  
Measured after Exposure in the Room Condition for 24Hrs.  

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