BAY321609T-601Y-N [YAGEO]
Ferrite Chip, 4 Function(s), 0.1A, LEAD FREE, SMD, 8 PIN;
| 型号： | BAY321609T-601Y-N |
| 厂家： | 
YAGEO CORPORATION |
| 描述： | Ferrite Chip, 4 Function(s), 0.1A, LEAD FREE, SMD, 8 PIN |
| 文件： | 总5页 (文件大小：401K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
YAGEO CORPORATION SMD INDUCTOR/BEADS
Multilayer Ferrite
Chip Beads
BA Series
[ Berd Arrary For High Density Circuit Design]
applICaTIOns
• Computers • LCD Monitor • Hard Disk Drives • CD-ROMs • Motherboard
FeaTuRes
These multi-layered chip bead arrays are surface mounting EMI components.
Four lines in one chip for suppressing noise
suitable for high density circuit design.
eleCTRICal ChaRaCTeRIsTICs
pROduCT IdenTIFICaTIOn
paRT nO.
IMpedanCe
dC ResIsTanCe
(Ω) Mꢀx.
RaTed CuRRenT
(ma) Mꢀx.
ꢀt 100Mhz (Ω ± 25%)
-
BA
BAY321609T-300Y-S
BAY321609T-600Y-S
BAY321609T-121Y-S
BAY321609T-241Y-S
BAY321609T-301Y-S
BAY321609T-471Y-S
BAY321609T-601Y-S
BAY321609T-102Y-S
BAQ321609T-600Y-S
BAQ321609T-121Y-S
BAQ321609T-221Y-S
BAQ321609T-471Y-S
BAQ321609T-601Y-S
BAQ321609T-102Y-S
30
0.4
0.4
0.8
0.8
0.8
1
350
250
150
150
150
100
100
50
Internal No.
60
Tolerance (**)
Impedance
120
240
300
470
600
1000
60
Packaging Style
Dimensions
Design Code (*)
Product Symbol
Bead Array
1.5
1.7
0.8
0.8
0.8
1
*Y = General Purpose; Q = Narrow Band
**Y = ±25%
150
150
150
150
100
100
YAGEO will start to release lead-free that meet
SONY SS-00259's criteria, and Internal No. well
be changed to "N" as identification.
120
220
470
600
1000
Ex. SBY321609T-300Y-N
1.5
1.8
shapesand dIMensIOns
eleCTRICal ChaRaCTeRIsTICs:lead-FRee & ROhs COMplIanCe!!
Parts Dimensions : 3.20 x 1.60 x 0.90 mm
paRT nO.
TesT FReq
MhZ
IMpedanCe
Ω ± 25%)
RdC
) Mꢀx.
RaTed CuRRenT
(ma) Mꢀx.
(
)
(
(
Ω
BAY321609T-300Y-N 100
BAY321609T-600Y-N 100
BAY321609T-800Y-N 100
BAY321609T-121Y-N 100
BAY321609T-151Y-N 100
BAY321609T-181Y-N 100
BAY321609T-221Y-N 100
BAY321609T-241Y-N 100
BAY321609T-301Y-N 100
BAY321609T-471Y-N 100
BAY321609T-601Y-N 100
BAY321609T-102Y-N 100
30
0.4
0.4
0.8
0.8
0.8
0.8
0.8
0.8
0.8
1
350
250
150
150
150
150
150
150
150
100
100
50
60
80
120
150
180
220
240
300
470
600
1000
0.3±0.2
3.2±0.2
0.4±0.2
0.8±0.1
0.9±0.2
1.5
1.7
1.60.2
0.35±0.15
0.4±0.1
35
Tape dIMensIOns
Tape MaTeRIal
Dimensions : mm
CarrierTape : Polystyrene for 321609
CoverType : Polystyene
Reel dIMensIOns
ReCOMMended paTTeRn
Dimensions : mm
Dimensions : mm
0.8
0.4
paCKagIng quanTITY
TYpe
quanTITY/Reel
BAY321609
3000
3000
BAQ321609
TYpICal eleCTRICal ChaRaCTeRIsTICs
Test Instruments : HP4291A Impedance / Material Analyzer
4±0.1
2±0.05
0.2±0.05
1.75±0.1
3.54±0.1
1.94±0.1
4.0±0.1
1.29±0.05
1.29±0.05
Type A
Type B
36
sB/pB/up/nB/gB/Ba seRIes RelIaBIlITY TesT
1-1 MeChanICal peRFORManCe
NO.
ITEM
SPECIFICATION
TEST CONDITIONS
1-1-1 Flexure Strength
Appearance : No Damage
Z Change : within ±20%
RDC : within Specification
Test device shall be soldered on the substrate.
Substrate Dimension : 100 x 40 x 1.6mm
Deflection : 2.0mm
KeepingTime : 30Sec.
* For 100505, substrate dimension is 100 x 40 x 0.8mm.
Test device shall be soldered on the substrate.
Oscillation Frequency : 10 to 55 to 10Hz for 1Min.
Amplitude : 1.5mm
1-1-2 Vibration
Time : 2Hrs. for each Axis (X,Y & Z), Total 6Hrs.
Pre-heating : 150ºC, 1Min.
1-1-3 Resistance to
Soldering Heat
Appearance : No Damage
Solder Composition : Sn/Pb = 63/37
SolderTemperature : 260 ± 5ºC
ImmersionTime : 10 ± 1Sec.
1-1-4 Solderability
The electrodes shall be at least 90% covered
with new solder coating.
Pre-heating : 150°C, 1Min.
Solder Composition : Sn/Pb = 63/37
SolderTemperature : 230 ± 5°C
ImmersionTime : 4 ± 1Sec.
1-1-5 Terminal StrengthTest
100505 Series : ≥ 0.2kg
160808 Series : ≥ 0.5kg
201209 Series : ≥ 1.0kg
Other Series : ≥ 2.0kg
Test device shall be soldered on the substrate.
W
1-2 enVIROnMenTal peRFORManCe
NO.
ITEM
SPECIFICATION
TEST CONDITIONS
One Cycle
1-2-1 Temperature Cycle
Appearance : No Damage
Z Change : within ±20%
RDC : within Specification
Step
Temperature (°C)
-55 ± 3
Time (Min.)
1
30
3
2
25 ± 2
3
125 ± 3
30
3
4
25 ± 2
Total : 100 Cycles
Measured after Exposure in the Room Condition for 24Hrs.
Temperature : 40 ±2°C
1-2-2 Humidity Resistance
Relative Humidity : 90 ~ 95%
Time : 1000Hrs.
Measured after Exposure in the Room Condition for 24Hrs.
Temperature : 125 ± 3°C
1-2-3 HighTemperature
Resistance
Relative Humidity : 0%
Applied Current : Rated Current
Time : 1000Hrs.
Measured after Exposure in the Room Condition for 24Hrs.
Temperature : -55 ± 3°C
1-2-4 LowTemperature
Resistance
Relative Humidity : 0%
Time : 1000Hrs.
Measured after Exposure in the Room Condition for 24Hrs.
37
MulTIlaYeR FeRRITe BeadaRRaY - Ba seRIes
Test Instruments : HP4291A Impedance / Material Analyzer
BAY321609T-300Y-S
BAY321609T-600Y-S
BAY321609T-121Y-S
180
160
140
120
100
80
60
40
20
0
80
70
60
50
40
30
20
10
0
100
80
60
40
20
0
R
Z
Z
R
Z
R
X
X
X
1
10
100
1000
1
10
100
1000
1
10
100
1000
FREQUENCY (MHz)
FREQUENCY (MHz)
FREQUENCY (MHz)
RDC<0.4Ω Rated Current: 350mA
RDC<0.4Ω Rated Current: 250mA
RDC<0.8Ω Rated Current: 150mA
BAY321609T-241Y-S
BAY321609T-301Y-S
BAY321609T-471Y-S
300
250
200
150
100
50
450
400
350
300
250
200
150
100
50
600
500
400
300
200
100
0
Z
Z
Z
R
R
R
X
X
X
0
0
1
10
100
1000
1
10
100
1000
1
1
1
10
100
1000
FREQUENCY (MHz)
FREQUENCY (MHz)
FREQUENCY (MHz)
RDC<0.8Ω Rated Current: 150mA
RDC<0.8Ω Rated Current: 150mA
RDC<1Ω Rated Current: 100mA
BAY321609T-601Y-S
BAY321609T-102Y-S
BAQ321609T-600Y-S
800
700
600
500
400
300
200
100
0
1200
1000
800
600
400
200
0
300
250
200
150
100
50
Z
Z
Z
R
R
X
R
X
X
0
1
10
100
1000
1
10
100
1000
FREQUENCY (MHz)
10
100
1000
FREQUENCY (MHz)
FREQUENCY (MHz)
RDC<1.5Ω Rated Current: 100mA
RDC<1.7Ω Rated Current: 50mA
RDC<0.40Ω Rated Current: 250mA
BAQ321609T-221Y-S
BAQ321609T-601Y-S
BAQ321609T-102Y-S
800
2500
2000
1500
1000
500
2000
1500
1000
500
0
600
400
200
Z
Z
Z
7
X
R
X
R
X
R
0
0
1
10
100
1000
1
10
100
1000
10
100
1000
FREQUENCY (MHz)
FREQUENCY (MHz)
FREQUENCY (MHz)
RDC<0.80Ωꢀ Rated Current: 150mA
RDC<1.50Ωꢀ Rated Current: 100mA
RDC<1.80Ω Rated Current: 100mA
38
ReCOMMend sOldeRIng COndITIOns
for:CL/ CLH/ SQV/ SMD power inductors/ SMD Chip Beads/ SMD Filters,Transformers, Current Sensors
temperature °C
pre-heating
soldering
natural cooling
260 °C
230 °C
160 °C
150 °C
time:second
60 second
120 second
80 second
5~10 second
for: lead solder
for: lead-free solder
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