XC2V1500-6FF1517I [XILINX]
Virtex-II 1.5V Field-Programmable Gate Arrays; 的Virtex -II 1.5V的现场可编程门阵列
| 型号： | XC2V1500-6FF1517I |
| 厂家： | 
XILINX, INC |
| 描述： | Virtex-II 1.5V Field-Programmable Gate Arrays |
| 文件： | 总7页 (文件大小：128K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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Virtex-II 1.5V
Field-Programmable Gate Arrays
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DS031-1 (v1.7) October 2, 2001
Advance Product Specification
®
Summary of Virtex -II Features
•
Industry First Platform FPGA Solution
-
-
-
Digitally Controlled Impedance (DCI) I/O: on-chip
termination resistors for single-ended I/O standards
•
IP-Immersion™ Architecture
PCI-X @ 133 MHz, PCI @ 66 MHz and 33 MHz
compliance, and CardBus compliant
-
-
-
Densities from 40K to 8M system gates
420 MHz internal clock speed (Advance Data)
840+ Mb/s I/O (Advance Data)
Differential Signaling
·
840 Mb/s Low-Voltage Differential Signaling I/O
(LVDS) with current mode drivers
Bus LVDS I/O
Lightning Data Transport (LDT) I/O with current
driver buffers
•
SelectRAM™ Memory Hierarchy
-
3 Mb of True Dual-Port™ RAM in 18-Kbit block
SelectRAM resources
·
·
-
-
Up to 1.5 Mb of distributed SelectRAM resources
High-performance interfaces to external memory
·
Low-Voltage Positive Emitter-Coupled Logic
(LVPECL) I/O
·
·
·
·
DDR-SDRAM interface
FCRAM interface
QDR™-SRAM interface
Sigma RAM interface
·
Built-in DDR Input and Output registers
-
Proprietary high-performance SelectLink™
Technology
·
·
·
High-bandwidth data path
Double Data Rate (DDR) link
Web-based HDL generation methodology
•
•
Arithmetic Functions
-
-
Dedicated 18-bit x 18-bit multiplier blocks
Fast look-ahead carry logic chains
•
•
Supported by Xilinx Foundation™ and Alliance™
Series Development Systems
Flexible Logic Resources
-
Up to 93,184 internal registers / latches with Clock
-
-
-
Integrated VHDL and Verilog design flows
Compilation of 10M system gates designs
Internet Team Design (ITD) tool
Enable
-
Up to 93,184 look-up tables (LUTs) or cascadable
16-bit shift registers
SRAM-Based In-System Configuration
-
-
Wide multiplexers and wide-input function support
-
-
Fast SelectMAP™ configuration
Horizontal cascade chain and Sum-of-Products
support
Triple Data Encryption Standard (DES) security
option (Bitstream Encryption)
-
Internal 3-state bussing
-
-
-
-
IEEE1532 support
•
High-Performance Clock Management Circuitry
Partial reconfiguration
Unlimited re-programmability
Readback capability
-
Up to 12 DCM (Digital Clock Manager) modules
·
·
·
Precise clock de-skew
Flexible frequency synthesis
High-resolution phase shifting
•
•
0.15 µm 8-Layer Metal process with 0.12 µm
high-speed transistors
-
16 global clock multiplexer buffers
1.5 V (VCCINT) core power supply, dedicated 3.3 V
CCAUX auxiliary and VCCO I/O power supplies
•
•
Active Interconnect™ Technology
V
-
-
Fourth generation segmented routing structure
Predictable, fast routing delay, independent of
fanout
•
•
IEEE 1149.1 compatible boundary-scan logic support
Flip-Chip and Wire-Bond Ball Grid Array (BGA)
packages in three standard fine pitches (0.80mm,
1.00mm, and 1.27mm)
SelectI/O-Ultra™ Technology
-
-
Up to 1,108 user I/Os
19 single-ended standards and six differential
standards
•
100% factory tested
-
Programmable sink current (2 mA to 24 mA) per I/O
© 2001 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.
All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
DS031-1 (v1.7) October 2, 2001
Advance Product Specification
www.xilinx.com
1-800-255-7778
Module 1 of 4
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Virtex-II 1.5V Field-Programmable Gate Arrays
Table 1: Virtex-II Field-Programmable Gate Array Family Members
CLB
(1 CLB = 4 slices = Max 128 bits)
SelectRAM Blocks
Maximum
System
Gates Row x Col. Slices
Array
Distributed
RAM Kbits
Multiplier 18-Kbit Max RAM
Max I/O
Device
XC2V40
Blocks
4
Blocks
4
(Kbits)
72
DCMs Pads(1)
40K
80K
250K
500K
1M
8 x 8
16 x 8
256
8
16
4
4
88
120
200
264
432
528
624
720
912
1,104
1,108
XC2V80
512
8
8
144
XC2V250
XC2V500
XC2V1000
XC2V1500
XC2V2000
XC2V3000
XC2V4000
XC2V6000
XC2V8000
Notes:
24 x 16
32 x 24
40 x 32
48 x 40
56 x 48
64 x 56
80 x 72
96 x 88
112 x 104
1,536
3,072
5,120
7,680
10,752
14,336
23,040
33,792
46,592
48
24
24
432
8
96
32
32
576
8
160
240
336
448
720
1,056
1,456
40
40
720
8
1.5M
2M
48
48
864
8
56
56
1,008
1,728
2,160
2,592
3,024
8
3M
96
96
12
12
12
12
4M
120
144
168
120
144
168
6M
8M
1. See details in Table 2, “Maximum Number of User I/O Pads”.
General Description
The Virtex-II family is a platform FPGA developed for high
performance from low-density to high-density designs that
are based on IP cores and customized modules. The family
delivers complete solutions for telecommunication, wire-
less, networking, video, and DSP applications, including
PCI, LVDS, and DDR interfaces.
Table 2 shows the maximum number of user I/Os available.
The Virtex-II device/package combination table (Table 6 at
the end of this section) details the maximum number of I/Os
for each device and package using wire-bond or flip-chip
technology.
Table 2: Maximum Number of User I/O Pads
The leading-edge 0.15µm / 0.12µm CMOS 8-layer metal
process and the Virtex-II architecture are optimized for high
speed with low power consumption. Combining a wide vari-
ety of flexible features and a large range of densities up to
10 million system gates, the Virtex-II family enhances pro-
grammable logic design capabilities and is a powerful alter-
native to mask-programmed gates arrays. As shown in
Table 1, the Virtex-II family comprises 12 members, ranging
from 40K to 10M system gates.
Device
XC2V40
Wire-Bond
88
Flip-Chip
XC2V80
120
XC2V250
XC2V500
XC2V1000
XC2V1500
XC2V2000
XC2V3000
XC2V4000
XC2V6000
XC2V8000
200
264
328
432
528
392
Packaging
456
624
Offerings include ball grid array (BGA) packages with
0.80mm, 1.00mm, and 1.27mm pitches. In addition to tradi-
tional wire-bond interconnects, flip-chip interconnect is used
in some of the BGA offerings. The use of flip-chip intercon-
nect offers more I/Os than is possible in wire-bond versions
of the similar packages. Flip-Chip construction offers the
combination of high pin count with high thermal capacity.
516
720
912
1,104
1,108
Module 1 of 4
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DS031-1 (v1.7) October 2, 2001
Advance Product Specification
R
Virtex-II 1.5V Field-Programmable Gate Arrays
Architecture
Virtex-II Array Overview
Virtex-II devices are user-programmable gate arrays with various configurable elements. The Virtex-II architecture is
optimized for high-density and high-performance logic designs. As shown in Figure 1, the programmable device is
comprised of input/output blocks (IOBs) and internal configurable logic blocks (CLBs).
DCM
DCM
IOB
Global Clock Mux
Configurable Logic
Programmable I/Os
CLB
Block SelectRAM
Multiplier
DS031_28_100900
Figure 1: Virtex-II Architecture Overview
Programmable I/O blocks provide the interface between
package pins and the internal configurable logic. Most
popular and leading-edge I/O standards are supported by
the programmable IOBs.
All programmable elements, including the routing
resources, are controlled by values stored in static memory
cells. These values are loaded in the memory cells during
configuration and can be reloaded to change the functions
of the programmable elements.
The internal configurable logic includes four major elements
organized in a regular array.
Virtex-II Features
•
Configurable Logic Blocks (CLBs) provide functional
elements for combinatorial and synchronous logic,
including basic storage elements. BUFTs (3-state
buffers) associated with each CLB element drive
dedicated segmentable horizontal routing resources.
This section briefly describes Virtex-II features.
Input/Output Blocks (IOBs)
IOBs are programmable and can be categorized as follows:
•
Input block with an optional single-data-rate or
double-data-rate (DDR) register
•
•
•
Block SelectRAM memory modules provide large
18-Kbit storage elements of True Dual-Port RAM.
•
Output block with an optional single-data-rate or DDR
register, and an optional 3-state buffer, to be driven
directly or through a single or DDR register
Multiplier blocks are 18-bit x 18-bit dedicated
multipliers.
DCM (Digital Clock Manager) blocks provide
self-calibrating, fully digital solutions for clock
distribution delay compensation, clock multiplication
and division, coarse and fine-grained clock phase
shifting.
•
Bi-directional block (any combination of input and
output configurations)
These registers are either edge-triggered D-type flip-flops
or level-sensitive latches.
A new generation of programmable routing resources called
Active Interconnect Technology interconnects all of these
elements. The general routing matrix (GRM) is an array of
routing switches. Each programmable element is tied to a
switch matrix, allowing multiple connections to the general
routing matrix. The overall programmable interconnection is
hierarchical and designed to support high-speed designs.
IOBs support the following single-ended I/O standards:
•
•
•
•
LVTTL, LVCMOS (3.3 V, 2.5 V, 1.8 V, and 1.5 V)
PCI-X at 133 MHz, PCI (3.3 V at 33 MHz and 66 MHz)
GTL and GTLP
HSTL (Class I, II, III, and IV)
DS031-1 (v1.7) October 2, 2001
Advance Product Specification
www.xilinx.com
1-800-255-7778
Module 1 of 4
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Virtex-II 1.5V Field-Programmable Gate Arrays
•
•
SSTL (3.3 V and 2.5 V, Class I and II)
AGP-2X
A multiplier block is associated with each SelectRAM mem-
ory block. The multiplier block is a dedicated 18 x 18-bit
multiplier and is optimized for operations based on the block
SelectRAM content on one port. The 18 x 18 multiplier can
be used independently of the block SelectRAM resource.
Read/multiply/accumulate operations and DSP filter struc-
tures are extremely efficient.
The digitally controlled impedance (DCI) I/O feature auto-
matically provides on-chip termination for each I/O element.
The IOB elements also support the following differential sig-
naling I/O standards:
•
•
•
•
•
LVDS
Both the SelectRAM memory and the multiplier resource
are connected to four switch matrices to access the general
routing resources.
BLVDS (Bus LVDS)
ULVDS
Global Clocking
LDT
LVPECL
The DCM and global clock multiplexer buffers provide a
complete solution for designing high-speed clocking
schemes.
Two adjacent pads are used for each differential pair. Two or
four IOB blocks connect to one switch matrix to access the
routing resources.
Up to 12 DCM blocks are available. To generate de-skewed
internal or external clocks, each DCM can be used to elimi-
nate clock distribution delay. The DCM also provides 90-,
180-, and 270-degree phase-shifted versions of its output
clocks. Fine-grained phase shifting offers high-resolution
phase adjustments in increments of 1/256 of the clock
period. Very flexible frequency synthesis provides a clock
output frequency equal to any M/D ratio of the input clock
frequency, where M and D are two integers. For the exact
timing parameters, see Virtex™-II Electrical Characteris-
tics.
Configurable Logic Blocks (CLBs)
CLB resources include four slices and two 3-state buffers.
Each slice is equivalent and contains:
•
•
•
•
•
•
•
Two function generators (F & G)
Two storage elements
Arithmetic logic gates
Large multiplexers
Wide function capability
Fast carry look-ahead chain
Horizontal cascade chain (OR gate)
Virtex-II devices have 16 global clock MUX buffers, with up
to eight clock nets per quadrant. Each global clock MUX
buffer can select one of the two clock inputs and switch
glitch-free from one clock to the other. Each DCM block is
able to drive up to four of the 16 global clock MUX buffers.
The function generators F & G are configurable as 4-input
look-up tables (LUTs), as 16-bit shift registers, or as 16-bit
distributed SelectRAM memory.
Routing Resources
In addition, the two storage elements are either edge-trig-
gered D-type flip-flops or level-sensitive latches.
The IOB, CLB, block SelectRAM, multiplier, and DCM ele-
ments all use the same interconnect scheme and the same
access to the global routing matrix. Timing models are
shared, greatly improving the predictability of the perfor-
mance of high-speed designs.
Each CLB has internal fast interconnect and connects to a
switch matrix to access general routing resources.
Block SelectRAM Memory
There are a total of 16 global clock lines, with eight available
per quadrant. In addition, 24 vertical and horizontal long
lines per row or column as well as massive secondary and
local routing resources provide fast interconnect. Virtex-II
buffered interconnects are relatively unaffected by net
fanout and the interconnect layout is designed to minimize
crosstalk.
The block SelectRAM memory resources are 18 Kb of True
Dual-Port RAM, programmable from 16K x 1 bit to 512 x 36
bits, in various depth and width configurations. Each port is
totally synchronous and independent, offering three
"read-during-write" modes. Block SelectRAM memory is
cascadable to implement large embedded storage blocks.
Supported memory configurations for dual-port and sin-
gle-port modes are shown in Table 3.
Horizontal and vertical routing resources for each row or
column include:
Table 3: Dual-Port And Single-Port Configurations
•
•
•
•
24 long lines
16K x 1 bit
8K x 2 bits
4K x 4 bits
2K x 9 bits
1K x 18 bits
512 x 36 bits
120 hex lines
40 double lines
16 direct connect lines (total in all four directions)
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Virtex-II 1.5V Field-Programmable Gate Arrays
Boundary Scan
Readback and Integrated Logic Analyzer
Boundary scan instructions and associated data registers
support a standard methodology for accessing and config-
uring Virtex-II devices that complies with IEEE standards
1149.1 - 1993 and 1532. A system mode and a test mode
are implemented. In system mode, a Virtex-II device per-
forms its intended mission even while executing non-test
boundary-scan instructions. In test mode, boundary-scan
test instructions control the I/O pins for testing purposes.
The Virtex-II Test Access Port (TAP) supports BYPASS,
PRELOAD, SAMPLE, IDCODE, and USERCODE non-test
instructions. The EXTEST, INTEST, and HIGHZ test instruc-
tions are also supported.
Configuration data stored in Virtex-II configuration memory
can be read back for verification. Along with the configura-
tion data, the contents of all flip-flops/latches, distributed
SelectRAM, and block SelectRAM memory resources can
be read back. This capability is useful for real-time debug-
ging.
The Integrated Logic Analyzer (ILA) core and software pro-
vides a complete solution for accessing and verifying
Virtex-II devices.
Virtex-II Device/Package Combinations
and Maximum I/O
Wire-bond and flip-chip packages are available. Table 4 and
Table 5 show the maximum possible number of user I/Os in
wire-bond and flip-chip packages, respectively. Table 6
shows the number of available user I/Os for all device/pack-
age combinations.
Configuration
Virtex-II devices are configured by loading data into internal
configuration memory, using the following five modes:
•
•
•
•
•
Slave-serial mode
Master-serial mode
•
CS denotes wire-bond chip-scale ball grid array (BGA)
(0.80 mm pitch).
Slave SelectMAP mode
Master SelectMAP mode
Boundary-Scan mode (IEEE 1532)
•
•
•
•
FG denotes wire-bond fine-pitch BGA (1.00 mm pitch).
FF denotes flip-chip fine-pitch BGA (1.00 mm pitch).
BG denotes standard BGA (1.27 mm pitch).
A Data Encryption Standard (DES) decryptor is available
on-chip to secure the bitstreams. One or two triple-DES key
sets can be used to optionally encrypt the configuration
information.
BF denotes flip-chip BGA (1.27 mm pitch).
The number of I/Os per package include all user I/Os except
the 15 control pins (CCLK, DONE, M0, M1, M2, PROG_B,
PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN,
DXP, AND RSVD) and VBATT.
Table 4: Wire-Bond Packages Information
Package
Pitch (mm)
CS144
0.80
FG256
1.00
FG456
1.00
FG676
1.00
BG575
1.27
BG728
1.27
Size (mm)
I/Os
12 x 12
92
17 x 17
172
23 x 23
324
27 x 27
484
31 x 31
408
35 x 35
516
Table 5: Flip-Chip Packages Information
Package FF896
Pitch (mm) 1.00
FF1152
1.00
FF1517
1.00
BF957
1.27
40 x 40
684
Size (mm)
I/Os
31 x 31
624
35 x 35
824
40 x 40
1,108
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Virtex-II 1.5V Field-Programmable Gate Arrays
Table 6: Virtex-II Device/Package Combinations and Maximum Number of Available I/Os (Advance Information)
Available I/Os
XC2V XC2V
XC2V
250
XC2V
500
XC2V
1000
XC2V
1500
XC2V
2000
XC2V
3000
XC2V
4000
XC2V
6000
XC2V
8000
Package
CS144
FG256
FG456
FG676
FF896
40
88
88
80
92
92
120
172
200
172
264
172
324
392
528
456
624
484
720
432
328
FF1152
FF1517
BG575
BG728
BF957
Notes:
824
912
824
824
1,104
1,108
392
408
456
624
516
684
684
684
684
1. All devices in a particular package are pin-out (footprint) compatible. In addition, the FG456 and FG676 packages are compatible, as
are the FF896 and FF1152 packages.
Virtex-II Ordering Information
Virtex-II ordering information is shown in Figure 2
Example: XC2V1000-5FG456C
Device Type
Temperature Range
C = Commercial (Tj = 0˚C to +85˚C)
I = Industrial (Tj = -40˚C to +100˚C)
Speed Grade
(-4, -5, -6)
Number of Pins
Package Type
DS031_35_033001
Figure 2: Virtex-II Ordering Information
Module 1 of 4
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DS031-1 (v1.7) October 2, 2001
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Virtex-II 1.5V Field-Programmable Gate Arrays
Revision History
This section records the change history for this module of the data sheet.
Date
Version
1.0
Revision
11/07/00
12/06/00
01/15/01
Early access draft.
Initial release.
1.1
1.2
Added values to the tables in the Virtex-II Performance Characteristics and Virtex-II
Switching Characteristics sections.
01/25/01
04/02/01
07/30/01
10/02/01
1.3
1.5
1.6
1.7
The data sheet was divided into four modules (per the current style standard).
Skipped v1.4 to sync up modules. Reverted to traditional double-column format.
Made minor changes to items listed under Summary of Virtex®-II Features.
Minor edits.
Virtex-II Data Sheet
The Virtex-II Data Sheet contains the following modules:
•
DS031-1, Virtex-II 1.5V FPGAs: Introduction and
Ordering Information (Module 1)
•
•
DS031-3, Virtex-II 1.5V FPGAs: DC and Switching
Characteristics (Module 3)
DS031-4, Virtex-II 1.5V FPGAs: Pinout Tables
(Module 4)
•
DS031-2, Virtex-II 1.5V FPGAs: Functional Description
(Module 2)
DS031-1 (v1.7) October 2, 2001
Advance Product Specification
www.xilinx.com
1-800-255-7778
Module 1 of 4
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相关型号：
XC2V1500-6FF896C
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XC2V1500-6FF896I
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XC2V1500-6FG256C
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XC2V1500-6FG256I
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XC2V1500-6FG456C
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XC2V1500-6FG456I
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XC2V1500-6FG676C
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XC2V1500-6FG676I
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XC2V2000
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XILINX
XC2V2000-4BF957C
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XC2V2000-4BG575C
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XILINX
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