X76F102X-2 [XICOR]

The X76F102 is a Password Access Security Supervisor, containing one 896-bit Secure SerialFlash array; 该X76F102是一个密码访问安全监控器,包含一个896位安全SerialFlash阵列
X76F102X-2
型号: X76F102X-2
厂家: XICOR INC.    XICOR INC.
描述:

The X76F102 is a Password Access Security Supervisor, containing one 896-bit Secure SerialFlash array
该X76F102是一个密码访问安全监控器,包含一个896位安全SerialFlash阵列

监控
文件: 总18页 (文件大小:107K)
中文:  中文翻译
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ISO 7816 Compatible  
1K  
128 x 8 bit  
X76F102  
Secure SerialFlash  
FEATURES  
DESCRIPTION  
• 64-bit Password Security  
• One Array (112 Bytes)Two Passwords (16 Bytes)  
—Read Password  
—Write Password  
• Programmable Passwords  
• Retry Counter Register  
—Allows 8 tries before clearing of the array  
• 32-bit Response to Reset (RST Input)  
• 8 byte Sector Write mode  
• 1MHz Clock Rate  
The X76F102 is a Password Access Security Supervisor,  
containing one 896-bit Secure SerialFlash array. Access  
to the memory array can be controlled by two 64-bit  
passwords. These passwords protect read and write  
operations of the memory array.  
The X76F102 features a serial interface and software  
protocol allowing operation on a popular two wire bus.  
The bus signals are a clock Input (SCL) and a bidirec-  
tional data input and output (SDA).  
• 2 wire Serial Interface  
• Low Power CMOS  
—2.0 to 5.5V operation  
—Standby current Less than 1µA  
—Active current less than 3 mA  
• High Reliability Endurance:  
—100,000 Write Cycles  
• Data Retention: 100 years  
• Available in:  
The X76F102 also features a synchronous response to  
reset providing an automatic output of a hard-wired 32-bit  
data stream conforming to the industry standard for  
memory cards.  
TM  
The X76F102 utilizes Xicor’s proprietary Direct Write  
cell, providing a minimum endurance of 100,000 cycles  
and a minimum data retention of 100 years.  
—8 lead PDIP, SOIC, MSOP, TSSOP, and Smart  
Card Module  
FUNCTIONAL DIAGRAM  
Retry Counter  
Data Transfer  
SCL  
Erase Logic  
Array Access  
SDA  
Interface  
Enable  
Logic  
112 Byte  
EEPROM Array  
Password Array  
and Password  
Verification Logic  
RST  
ISO Reset  
Response Register  
1  
Xicor, Inc. 1999 Patents Pending  
9900-5004.2 1/26/99 EP  
Characteristics subject to change without notice  
1
X76F102  
PIN DESCRIPTIONS  
Serial Clock (SCL)  
If the X76F102 is in a nonvolatile write cycle a “no ACK”  
(SDA=High) response will be issued in response to load-  
ing of the command byte. If a stop is issued prior to the  
nonvolatile write cycle the write operation will be termi-  
nated and the part will reset and enter into a standby  
mode.  
The SCL input is used to clock all data into and out of the  
device.  
Serial Data (SDA)  
SDA is an open drain serial data input/output pin. During  
a read cycle, data is shifted out on this pin. During a write  
cycle, data is shifted in on this pin. In all other cases, this  
pin is in a high impedance state.  
PIN NAMES  
Symbol  
SDA  
Description  
Serial Data Input/Output  
Serial Clock Input  
Reset Input  
Reset (RST)  
SCL  
RST  
Vcc  
Vss  
NC  
RST is a device reset pin. When RST is pulsed high the  
X76F102 will output 32 bits of fixed data which conforms  
to the standard for “synchronous response to reset”. The  
part must not be in a write cycle for the response to reset  
to occur. See Figure 7. If there is power interrupted dur-  
ing the Response to Reset, the response to reset will be  
aborted and the part will return to the standby state. The  
response to reset is "mask programmable" only!  
Supply Voltage  
Ground  
No Connect  
PIN CONFIGURATION  
PDIP  
The basic sequence is illustrated in Figure 1.  
V
RST  
SCL  
CC  
1
2
8
7
6
5
NC  
DEVICE OPERATION  
3
4
SDA  
NC  
NC  
The X76F102 memory array consists of fourteen 8-byte  
sectors. Read or write access to the array always begins  
at the first address of the sector. Read operations then  
can continue indefinitely. Write operations must total 8  
bytes.  
Vss  
SOIC  
Smart Card Module  
V
V
SS  
1
8
CC  
GND  
NC  
V
CC  
2
RST  
NC  
7
6
5
There are two primary modes of operation for the  
X76F102; Protected READ and protected WRITE. Pro-  
tected operations must be performed with one of two  
8-byte passwords.  
RST  
3
4
SCL  
NC  
SDA  
NC  
SCL  
NC  
SDA  
NC  
MSOP  
The basic method of communication for the device is  
generating a start condition, then transmitting a com-  
mand, followed by the correct password. All parts will be  
shipped from the factory with all passwords equal to ‘0’.  
The user must perform ACK Polling to determine the  
validity of the password, before starting a data transfer  
(see Acknowledge Polling.) Only after the correct pass-  
word is accepted and a ACK polling has been performed,  
can the data transfer occur.  
V
V
SS  
1
8
CC  
NC  
NC  
NC  
2
7
6
5
RST  
3
4
SCL  
SDA  
TSSOP  
SCL  
RST  
SDA  
NC  
V
CC  
1
2
8
NC  
NC  
To ensure the correct communication, RST must remain  
LOW under all conditions except when running a  
“Response to Reset sequence”.  
7
6
5
3
4
V
SS  
Data is transferred in 8-bit segments, with each transfer  
being followed by an ACK, generated by the receiving  
device.  
2
X76F102  
After each transaction is completed, the X76F102 will  
reset and enter into a standby mode.This will also be the  
response if an unsuccessful attempt is made to access a  
protected array.  
Clock and Data Conventions  
Data states on the SDA line can change only during SCL  
LOW. SDA changes during SCL HIGH are reserved for  
indicating start and stop conditions. Refer to Figure 2 and  
Figure 3.  
Figure 1. X76F102 Device Operation  
Start Condition  
All commands are preceeded by the start condition,  
which is a HIGH to LOW transition of SDA when SCL is  
HIGH. The X76F102 continuously monitors the SDA and  
SCL lines for the start condition and will not respond to  
any command until this condition is met.  
LOAD COMMAND/ADDRESS BYTE  
LOAD 8-BYTE  
PASSWORD  
A start may be issued to terminate the input of a control  
byte or the input data to be written. This will reset the  
device and leave it ready to begin a new read or write  
command. Because of the push/pull output, a start can-  
not be generated while the part is outputting data. Starts  
are inhibited while a write is in progress.  
VERIFY PASSWORD  
ACCEPTANCE BY  
USE OF ACK POLLING  
Stop Condition  
READ/WRITE  
DATA  
All communications must be terminated by a stop condi-  
tion. The stop condition is a LOW to HIGH transition of  
SDA when SCL is HIGH. The stop condition is also used  
to reset the device during a command or data input  
sequence and will leave the device in the standby power  
mode. As with starts, stops are inhibited when outputting  
data and while a write is in progress.  
BYTES  
Retry Counter  
The X76F102 contains a retry counter. The retry counter  
allows 8 accesses with an invalid password before any  
action is taken. The counter will increment with any com-  
bination of incorrect passwords. If the retry counter over-  
flows, the memory area and both of the passwords are  
cleared to "0". If a correct password is received prior to  
retry counter overflow, the retry counter is reset and  
access is granted.  
Acknowledge  
Acknowledge is a software convention used to indicate  
successful data transfer. The transmitting device, either  
master or slave, will release the bus after transmitting  
eight bits. During the ninth clock cycle the receiver will  
pull the SDA line LOW to acknowledge that it received  
the eight bits of data.  
The X76F102 will respond with an acknowledge after  
recognition of a start condition and its slave address. If  
both the device and a write condition have been  
selected, the X76F102 will respond with an acknowledge  
after the receipt of each subsequent eight-bit word.  
Device Protocol  
The X76F102 supports a bidirectional bus oriented pro-  
tocol. The protocol defines any device that sends data  
onto the bus as a transmitter and the receiving device as  
a receiver. The device controlling the transfer is a master  
and the device being controlled is the slave. The master  
will always initiate data transfers and provide the clock for  
both transmit and receive operations. Therefore, the  
X76F102 will be considered a slave in all applications.  
3
X76F102  
Figure 2. Data Validity  
SCL  
SDA  
Data Stable  
Data  
Change  
Figure 3. Definition of Start and Stop Conditions  
SCL  
SDA  
Start Condition  
Stop Condition  
Table 1. X76F102 Instruction Set  
Command  
Password  
after Start  
Command Description  
used  
1 0 0 S3 S2 S1 S00  
Sector Write  
Sector Read  
Write  
1 0 0 S3 S2 S1 S0 1  
Read  
Write  
Write  
None  
1 1 1 1 1 1 0 0  
1 1 1 1 1 1 1 0  
0 1 0 1 0 1 0 1  
Change Write Password  
Change Read Password  
Password ACK Command  
Illegal command codes will be disregarded. The part will respond with a “no-ACK” to the illegal byte and then return to  
the standby mode. All write/read operations require a password.  
PROGRAM OPERATIONS  
Sector Write  
which starts the nonvolatile write cycle. If more or less  
than 8 bytes are transferred, the data in the sector  
remains unchanged.  
The sector write mode requires issuing the 8-bit write  
command followed by the password and then the data  
bytes transferred as illustrated in figure 4. The write com-  
mand byte contains the address of the sector to be writ-  
ten. Data is written starting at the first address of a sector  
and eight bytes must be transferred. After the last byte to  
be transferred is acknowledged a stop condition is issued  
ACK Polling  
Once a stop condition is issued to indicate the end of the  
host’s write sequence, the X76F102 initiates the internal  
nonvolatile write cycle. In order to take advantage of the  
typical 5ms write cycle, ACK polling can begin immedi-  
ately. This involves issuing the start condition followed by  
4
X76F102  
the new command code of 8 bits (1st byte of the proto-  
col.) If the X76F102 is still busy with the nonvolatile write  
operation, it will issue a “no-ACK” in response. If the non-  
volatile write operation has completed, an “ACK” will be  
returned and the host can then proceed with the rest of  
the protocol.  
Password ACK Polling Sequence  
PASSWORD LOAD  
COMPLETED  
ENTER ACK POLLING  
ISSUE START  
Data ACK Polling Sequence  
Write sequence completed  
Enter ACK Polling  
ISSUE  
PASSWORD  
ACK COMMAND  
ISSUE START  
ACK  
NO  
RETURNED?  
ISSUE NEW  
COMMAND  
CODE  
YES  
PROCEED  
NO  
ACK  
RETURNED?  
YES  
READ OPERATIONS  
PROCEED  
Read operations are initiated in the same manner as  
write operations but with a different command code.  
Sector Read  
After the password sequence, there is always a nonvola-  
tile write cycle. This is done to discourage random  
guesses of the password if the device is being tampered  
with. In order to continue the transaction, the X76F102  
requires the master to perform a password ACK polling  
sequence with the specific command code of 55h. As  
with regular Acknowledge polling the user can either time  
out for 10ms, and then issue the ACK polling once, or  
continuously loop as described in the flow.  
With sector read, a sector address is supplied with the  
read command. Once the password has been acknowl-  
edged data may be read from the sector. An acknowl-  
edge must follow each 8-bit data transfer. A read  
operation always begins at the first byte in the sector, but  
may stop at any time. Random accesses to the array are  
not possible. Continuous reading from the array will  
return data from successive sectors. After reading the  
last sector in the array, the address is automatically set to  
the first sector in the array and data can continue to be  
read out. After the last bit has been read, a stop condition  
is generated without sending a preceding acknowledge.  
If the password that was inserted was correct, then an  
“ACK” will be returned once the nonvolatile cycle in  
response to the passwrod ACK polling sequence is over.  
If the password that was inserted was incorrect, then a  
“no ACK” will be returned even if the nonvolatile cycle is  
over. Therefore, the user cannot be certain that the pass-  
word is incorrect until the 10ms write cycle time has  
elapsed.  
5
X76F102  
Figure 4. Sector Write Sequence (Password Required)  
Write  
Password  
7
Write  
Password  
0
Host  
Commands  
WRITE  
COMMAND  
Wait tWC  
OR  
Password  
ACK  
SDA  
S
X76F102  
Response  
Command  
If ACK, Then  
Password Matches  
Host  
Commands  
Password ACK  
COMMAND  
Wait tWC  
Data ACK Polling  
. . .  
P
S
X76F102  
Responce  
Figure 5. Acknowledge Polling  
SCL  
SDA  
8th clk.  
of 8th  
pwd. byte  
8th  
‘ACK’  
clk  
‘ACK’  
clk  
clk  
8th bit  
‘ACK’  
START  
condition  
ACK or  
no ACK  
Figure 6. Sector Read Sequence (Password Required)  
Read  
Password  
7
Read  
Password  
Host  
Commands  
READ  
COMMAND  
Wait tWC  
OR  
0
Password  
ACK  
SDA  
S
X76F102  
Response  
Command  
If ACK, Then  
Password Matches  
Host  
Commands  
Password ACK  
COMMAND  
. . .  
P
S
Data n  
Data 0  
X76F102  
Responce  
6
X76F102  
PASSWORDS  
standard for “synchronous response to reset”. The part  
must not be in a write cycle for the response to reset to  
occur.  
Passwords are changed by sending the "change read  
password" or "change write password" commands in a  
normal sector write operation. A full eight bytes contain-  
ing the new password must be sent, following successful  
transmission of the current write password and a valid  
password ACK response. The user can use a repeated  
ACK Polling command to check that a new password has  
been written correctly. An ACK indicates that the new  
password is valid.  
After initiating a nonvolatile write cycle the RST pin must  
not be pulsed until the nonvolatile write cycle is complete.  
If not, the ISO response will not be activated. If the RST  
is pulsed HIGH and the CLK is within the RST pulse  
(meet the t  
spec.) in the middle of an ISO transaction,  
NOL  
it will output the 32 bit sequence again (starting at bit 0).  
Otherwise, this aborts the ISO operation and the part  
returns to standby state. If the RST is pulsed HIGH and  
the CLK is outside the RST pulse (in the middle of an  
ISO transaction), this aborts the ISO operation and the  
part returns to standby state.  
There is no way to read any of the passwords.  
RESPONSE TO RESET (DEFAULT = 19 02 AA 55)  
The ISO Response to reset is controlled by the RST and  
CLK pins. When RST is pulsed high during a clock pulse,  
the device will output 32 bits of data, one bit per clock,  
and it resets to the standy state.This conforms to the ISO  
If there is power interrupted during the Response to  
Reset, the response to reset will be aborted and the part  
will return to the standby state. A Response to Reset is  
not available during a nonvolatile write cycle.  
Figure 7. Response to RESET (RST)  
RST  
SCK  
0
1
0
1
0
0
1
0
1
0
1
1
0
0
0
1
1
0
0
0
0
1
0
0
0
0
1
1
0
0
0
1
SO  
MSB  
LSB  
LSB  
MSB  
MSB LSB  
MSB  
LSB  
2
3
Byte  
0
1
ABSOLUTE MAXIMUM RATINGS*  
*COMMENT  
Temperature under Bias ..................... –65°C to +135°C  
Storage Temperature ..........................–65°Cto+150°C  
Voltage on any Pin with  
Stresses above those listed under “Absolute Maximum  
Ratings” may cause permanent damage to the device.  
This is a stress rating only and the functional operation of  
the device at these or any other conditions above those  
listed in the operational sections of this specification is  
not implied. Exposure to absolute maximum rating condi-  
tions for extended periods may affect device reliability.  
Respect to V .......................................–1V to +7V  
SS  
D.C. Output Current..................................................5mA  
Lead Temperature  
(Soldering, 10 seconds).................................. 300°C  
7
X76F102  
RECOMMENDED OPERATING CONDITIONS  
Supply Voltage  
X76F102  
Limits  
Temp  
Commercial  
Industrial  
Min.  
0°C  
Max.  
+70°C  
+85°C  
4.5V to 5.5V  
2.0V to 5.5V  
X76F102 – 2  
–40°C  
7025 FM T06  
D.C. OPERATING CHARACTERISTICS (Over the recommended operating conditions unless otherwise specified.)  
Limits  
Symbol  
Parameter  
Min.  
Max.  
Units  
Test Conditions  
fSCL = VCC x 0.1/VCC x 0.9 Levels @ 400 KHz,  
SDA = Open  
RST = VSS  
VCC Supply Current  
(Read)  
ICC1  
1
mA  
fSCL = VCC x 0.1/VCC x 0.9 Levels @ 400 KHz,  
SDA = Open  
RST = VSS  
VCC Supply Current  
(Write)  
(3)  
3
mA  
ICC2  
VIL = VCC x 0.1, VIH = VCC x 0.9  
VCC Supply Current  
(Standby)  
(1)  
1
1
µA  
µA  
ISB1  
fSCL = 400 KHz, fSDA = 400 KHz  
VSDA = VSCC = VCC  
VCC Supply Current  
(Standby)  
(1)  
ISB2  
Other = GND or VCC–0.3V  
ILI  
V
IN = VSS to VCC  
Input Leakage Current  
Output Leakage Current  
Input LOW Voltage  
10  
µA  
µA  
V
ILO  
VOUT = VSS to VCC  
10  
(2)  
V
CC x 0.1  
–0.5  
VIL  
(2)  
V
CC x 0.9 VCC + 0.5  
Input HIGH Voltage  
Output LOW Voltage  
V
V
VIH  
VOL  
IOL = 3mA  
0.4  
CAPACITANCE T = +25°C, f = 1MHz, V = 5V  
A
CC  
Symbol  
(3)  
Test  
Max.  
Units  
Conditions  
I/O = 0V  
IN = 0V  
V
Output Capacitance (SDA)  
8
pF  
COUT  
(3)  
V
Input Capacitance (RST, SCL)  
6
pF  
CIN  
NOTES:(1) Must perform a stop command after a read command prior to measurement  
(2) V min. and V max. are for reference only and are not tested.  
IL  
IH  
(3) This parameter is periodically sampled and not 100% tested.  
EQUIVALENT A.C. LOAD CIRCUIT  
A.C. TEST CONDITIONS  
V
CC x 0.1 to VCC x 0.9  
Input Pulse Levels  
5V  
3V  
Input Rise and Fall Times  
10ns  
1.53KW  
1.3KW  
100pF  
Input and Output Timing  
Level  
VCC x 0.5  
100pF  
OUTPUT  
OUTPUT  
100pF  
Output Load  
8
X76F102  
AC CHARACTERISTICS  
(T = -40˚C to +85˚C, V = +3.0V to +5.5V, unless otherwise specified.)  
A
CC  
Symbol  
Parameter  
Min  
0
Max  
1
Units  
MHz  
µs  
fSCL  
SCL Clock Frequency  
tAA(2)  
SCL LOW to SDA Data Out Valid  
0.1  
0.9  
Time the Bus Must Be Free Before a New Transmission Can  
Start  
tBUF  
1.2  
µs  
tHD:STA  
tLOW  
Start Condition Hold Time  
Clock LOW Period  
0.6  
1.2  
0.6  
0.6  
10  
µs  
µs  
µs  
µs  
ns  
ns  
ns  
tHIGH  
Clock HIGH Period  
tSU:STA  
tHD:DAT  
tSU:DAT  
tR  
Start Condition Setup Time (for a Repeated Start Condition)  
Data In Hold Time  
Data In Setup Time  
100  
(1)  
(1)  
SDA and SCL Rise Time  
300  
300  
20+0.1XCb  
tF  
SDA and SCL Fall Time  
ns  
µs  
µs  
ns  
ns  
ns  
µs  
ns  
20+0.1XCb  
tSU:STO  
tDH  
Stop Condition Setup Time  
Data Out Hold Time  
0.6  
0
tNOL  
tRDV  
tCDV  
tRST  
tSU:RST  
RST to SCL Non-Overlap  
500  
0
RST LOW to SDA Valid During Response to Reset  
CLK LOW to SDA Valid During Response to Reset  
RST High Time  
450  
450  
0
1.5  
500  
RST Setup Time  
Notes: 1. C = total capacitance of one bus line in pF  
b
2.  
t
= 1.1µs Max below V = 3.0V.  
AA CC  
RESET AC SPECIFICATIONS  
Power Up Timing  
(2)  
Symbol  
Parameter  
Min.  
Typ  
Max.  
Units  
(1)  
Time from Power Up to Read  
Time from Power Up to Write  
1
mS  
mS  
tPUR  
(1)  
5
tPUW  
Notes: 1. Delays are measured from the time V is stable until the specified operation can be initiated.These parameters are periodically sampled  
CC  
and not 100% tested.  
2. Typical values are for T = 25˚C and V = 5.0V  
A
CC  
Nonvolatile Write Cycle Timing  
Symbol  
Parameter  
Min.  
Typ.(1)  
Max.  
Units  
(1)  
Write Cycle Time  
5
10  
mS  
tWC  
Notes: 1.  
t
is the time from a valid stop condition at the end of a write sequence to the end of the self-timed internal nonvolatile write cycle.  
WC  
It is the minimum cycle time to be allowed for any nonvolatile write by the user, unless Acknowledge Polling is used.  
9
X76F102  
Bus Timing  
t
t
t
t
HIGH  
LOW  
R
F
SCL  
t
t
t
t
t
SU:STA  
HD:STA  
HD:DAT  
SU:DAT  
SU:STO  
SDA IN  
t
t
t
AA  
DH  
BUF  
SDA OUT  
Write Cycle Timing  
SCL  
8th bit of last byte  
ACK  
SDA  
t
WC  
Stop  
Condition  
Start  
Condition  
RST Timing Diagram – Response to a Synchronous Reset  
RST  
t
RST  
t
t
HIGH_RST  
t
NOL  
NOL  
1st  
clk  
pulse  
2nd  
clk  
3rd  
CLK  
I/O  
clk  
pulse  
pulse  
t
LOW_RST  
t
SU:RST  
t
t
CDV  
RDV  
DATA BIT (2)  
DATA BIT (1)  
10  
X76F102  
GUIDELINES FOR CALCULATING TYPICAL VALUES OF BUS PULL UP RESISTORS  
100  
V
CCMAX  
80  
60  
40  
20  
R
= ------------------------- = 1.8KΩ  
MIN  
I
R
MAX  
OLMIN  
t
R
R
= -----------------  
C
MAX  
R
BUS  
MIN  
20 40 60 80 100  
Bus capacitance in pF  
t
= maximum allowable SDA rise time  
R
11  
X76F102  
8-LEAD MINIATURE SMALL OUTLINE GULL WING PACKAGE TYPE M  
0.118 ± 0.002  
(3.00 ± 0.05)  
0.012 + 0.006 / -0.002  
0.0256 (0.65) TYP  
(0.30 + 0.15 / -0.05)  
R 0.014 (0.36)  
0.118 ± 0.002  
(3.00 ± 0.05)  
0.030 (0.76)  
0.0216 (0.55)  
7° TYP  
0.036 (0.91)  
0.032 (0.81)  
0.040 ± 0.002  
(1.02 ± 0.05)  
0.008 (0.20)  
0.004 (0.10)  
0.150 (3.81)  
0.007 (0.18)  
REF.  
0.005 (0.13)  
0.193 (4.90)  
REF.  
NOTE:  
1. ALL DIMENSIONS IN INCHES AND (MILLIMETERS)  
12  
X76F102  
8-LEAD PLASTIC DUAL IN-LINE PACKAGETYPE P  
0.430 (10.92)  
0.360 (9.14)  
0.260 (6.60)  
0.240 (6.10)  
PIN 1 INDEX  
PIN 1  
0.060 (1.52)  
0.300  
(7.62) REF.  
0.020 (0.51)  
HALF SHOULDER WIDTH ON  
ALL END PINS OPTIONAL  
0.145 (3.68)  
0.128 (3.25)  
SEATING  
PLANE  
0.025 (0.64)  
0.015 (0.38)  
0.150 (3.81)  
0.125 (3.18)  
0.065 (1.65)  
0.045 (1.14)  
0.110 (2.79)  
0.090 (2.29)  
0.020 (0.51)  
0.016 (0.41)  
0.325 (8.25)  
0.300 (7.62)  
0.015 (0.38)  
MAX.  
0°  
TYP 0.010 (0.25)  
.
15°  
NOTE:  
1. ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)  
2. PACKAGE DIMENSIONS EXCLUDE MOLDING FLASH  
13  
X76F102  
8-LEAD PLASTIC SMALL OUTLINE GULL WING PACKAGE TYPE S  
0.150 (3.80)  
0.158 (4.00)  
0.228 (5.80)  
0.244 (6.20)  
PIN 1 INDEX  
PIN 1  
0.014 (0.35)  
0.019 (0.49)  
0.188 (4.78)  
0.197 (5.00)  
(4X) 7∞  
0.053 (1.35)  
0.069 (1.75)  
0.004 (0.19)  
0.010 (0.25)  
0.050 (1.27)  
0.010 (0.25)  
0.020 (0.50)  
0.050" TYPICAL  
X 45∞  
0.050"  
TYPICAL  
0– 8∞  
0.0075 (0.19)  
0.010 (0.25)  
0.250"  
0.016 (0.410)  
0.037 (0.937)  
0.030"  
TYPICAL  
8 PLACES  
FOOTPRINT  
NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)  
14  
X76F102  
8-LEAD PLASTIC, TSSOP, PACKAGE TYPE V  
.025 (.65) BSC  
.169 (4.3)  
.252 (6.4) BSC  
.177 (4.5)  
.114 (2.9)  
.122 (3.1)  
.047 (1.20)  
.0075 (.19)  
.0118 (.30)  
.002 (.05)  
.006 (.15)  
.010 (.25)  
Gage Plane  
0° – 8°  
Seating Plane  
.019 (.50)  
.029 (.75)  
(7.72)  
DetailA (20X)  
(4.16)  
(1.78)  
(0.42)  
.031 (.80)  
.041 (1.05)  
All MEASUREMENTS ARE TYPICAL  
See Detail “A”  
NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)  
15  
X76F102  
X76F102 8 PAD CHIP ON BOARD SMART CARD MODULE TYPE X  
0.465 ± 0.002  
(11.81 ± 0.05)  
0.088 (2.24) MIN EPOXY  
FREE AREA (TYP.)  
0.285 (7.24) MAX.  
SEE NOTE 7 SHT. 2  
R. 0.078 (2.00)  
0.069 (1.75) MIN EPOXY  
FREE AREA (TYP  
.)  
0.270 (6.86) MAX.  
SEE NOTE 7 SHT.2  
0.420± 0.002  
(10.67 ± 0.05)  
A
A
0.008± 0.001  
(0.20 ± 0.03)  
0.210 ± 0.002  
(5.33 ± 0.05)  
0.233± 0.002  
(5.92 ± 0.05)  
DIE  
0.0235 (0.60) MAX.  
SECTION A-A  
GLOB SIZE  
0.015 (0.38) MAX.  
0.008 (0.20) MAX.  
FR4 TAPE  
SEE DETAIL SHEET 3  
COPPER, NICKEL PLATED, GOLD FLASH  
0.174 ± 0.002  
(4.42 ± 0.05)  
0.146 ± 0.002  
(3.71 ± 0.05)  
R.0.013 (0.33) (8x)  
Vcc  
RST  
SCL  
NC  
Vss  
NC  
0.105± 0.002  
TYP.  
(2.67 ± 0.05)  
(8x)  
SDA  
NC  
0.105 ± 0.002  
(8x)  
(2.67 ± 0.05)  
NOTE:  
1. ALL DIMENSIONS IN INCHES AND (MILLIMETERS)  
16  
X76F102  
8 CONTACT MODULE  
6 CONTACT MODULE  
11.4  
8
0.15  
0.2  
1.215  
1.3  
1.3  
2.54  
2.54  
35mm TAPE  
35mm TAPE  
1.422  
REJECT  
PUNCH  
POSITION  
8.82  
23.02  
35  
NOTE: ALL MEASUREMENTS IN MILLIMETERS  
17  
X76F102  
ORDERING INFORMATION  
X76F102  
X
X
–X  
Device  
V
Limits  
CC  
Blank = 5V ±10%  
2.0 = 2.0V to 5.5V  
Temperature Range  
Blank = Commercial = 0°C to +70°C  
I = Industrial= –40°C to +85°C  
Package  
S8 = 8-Lead SOIC  
M8 = 8-Lead MSOP  
P = 8-Lead PDIP  
V8 - 8-Lead TSSOP  
H = Die in Waffle Packs  
W = Die in Wafer Form  
X = Smart Card Module  
Part Mark Convention  
8-Lead SOIC/PDIP  
8-Lead MSOP  
Blank = 8-Lead SOIC  
X76F102 X  
XX  
EYWW  
XXX  
ACG = 2.0 to 5.5V, 0 to +70°C  
ACH = 2.0 to 5.5V, -40 to +85°C  
ABS = 4.5 to 5.5V, 0 to +70°C  
ABT = 4.5 to 5.5V, -40 to +85°C  
F = 2.0 to 5.5V, 0 to +70°C  
G = 2.0 to 5.5V, -40 to +85°C  
Blank = 4.5 to 5.5V, 0 to +70°C  
I = 4.5 to 5.5V, -40 to +85°C  
LIMITEDWARRANTY  
Devices sold by Xicor, Inc. are covered by the warranty and patent indemnification provisions appearing in its Terms of  
Sale only. Xicor, Inc. makes no warranty, express, statutory, implied, or by description regarding the information set forth  
herein or regarding the freedom of the described devices from patent infringement. Xicor, Inc. makes no warranty of  
merchantability or fitness for any purpose. Xicor, Inc. reserves the right to discontinue production and change specifica-  
tions and prices at any time and without notice.  
Xicor, Inc. assumes no responsibility for the use of any circuitry other than circuitry embodied in a Xicor, Inc. product. No  
other circuits, patents, licenses are implied.  
U.S. PATENTS  
Xicor products are covered by one or more of the following U.S. Patents: 4,263,664; 4,274,012; 4,300,212; 4,314,265;  
4,326,134; 4,393,481; 4,404,475; 4,450,402; 4,486,769; 4,488,060; 4,520,461; 4,533,846; 4,599,706; 4,617,652;  
4,668,932; 4,752,912; 4,829, 482; 4,874, 967; 4,883, 976. Foreign patents and additional patents pending.  
LIFE RELATED POLICY  
In situations where semiconductor component failure may endanger life, system designers using this product should  
design the system with appropriate error detection and correction, redundancy and back-up features to prevent such an  
occurence.  
18  

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