X24C01PI-3.5 [XICOR]

Serial E2PROM; 串行E2PROM
X24C01PI-3.5
型号: X24C01PI-3.5
厂家: XICOR INC.    XICOR INC.
描述:

Serial E2PROM
串行E2PROM

存储 内存集成电路 光电二极管 可编程只读存储器 电动程控只读存储器 电可擦编程只读存储器 时钟
文件: 总14页 (文件大小:58K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Preliminary Information  
1K  
X24C01  
128 x 8 Bit  
Serial E2PROM  
FEATURES  
DESCRIPTION  
2
2.7V to 5.5V Power Supply  
Low Power CMOS  
—Active Current Less Than 1 mA  
—Standby Current Less Than 50 µA  
Internally Organized 128 x 8  
2 Wire Serial Interface  
—Bidirectional Data Transfer Protocol  
Four Byte Page Write Mode  
Self Timed Write Cycle  
—Typical Write Cycle Time of 5 ms  
High Reliability  
The X24C01 is a CMOS 1024 bit serial E PROM,  
internally organized as 128 x 8. The X24C01 features a  
serialinterfaceandsoftwareprotocolallowingoperation  
on a simple two wire bus.  
2
Xicor E PROMs are designed and tested for applica-  
tions requiring extended endurance. Inherent data re-  
tention is greater than 100 years.  
—Endurance: 100,000 Cycles  
—Data Retention: 100 Years  
8-Pin Mini-DIP, 8-PIN MSOP, and 8-PIN SOIC  
Packages  
FUNCTIONAL DIAGRAM  
(8) V  
(4) V  
CC  
H.V. GENERATION  
START CYCLE  
SS  
TIMING  
& CONTROL  
START  
STOP  
(5) SDA  
LOGIC  
CONTROL  
LOGIC  
2
E PROM  
XDEC  
32 X 32  
LOAD  
INC  
(6) SCL  
WORD  
ADDRESS  
COUNTER  
R/W  
YDEC  
8
CK  
D
OUT  
PIN  
DATA REGISTER  
D
OUT  
ACK  
3837 FHD F01  
© Xicor, 1991 Patents Pending  
3837-1.2 7/28/97 T1/C0/D0 SH  
Characteristics subject to change without notice  
1
X24C01  
PIN DESCRIPTIONS  
Serial Clock (SCL)  
PIN CONFIGURATION  
The SCL input is used to clock all data into and out of the  
device.  
DIP  
Serial Data (SDA)  
NC  
NC  
NC  
1
2
3
4
8
7
6
5
V
CC  
SDA is a bidirectional pin used to transfer data into and  
out of the device. It is an open drain output and may be  
wire-ORed with any number of open drain or open  
collector outputs.  
NC  
X24C01  
SCL  
SDA  
V
SS  
3837 FHD F02  
An open drain output requires the use of a pull-up  
resistor. For selecting typical values, refer to the Guide-  
lines for Calculating Typical Values of Bus Pull-Up  
Resistors graph.  
SOIC/MSOP  
NC  
NC  
NC  
1
2
3
4
8
V
CC  
NC  
PIN NAMES  
7
6
5
X24C01  
SCL  
SDA  
Symbol  
Description  
No Connect  
Ground  
V
SS  
NC  
V
SS  
V
CC  
Supply Voltage  
Serial Data  
Serial Clock  
3837 FHD F03  
SDA  
SCL  
3837 PGM T01  
EQUIVALENT A.C. LOAD CIRCUIT  
A.C. CONDITIONS OF TEST  
5V  
Input Pulse Levels  
V
x 0.1 to V x 0.9  
CC  
CC  
Input Rise and  
Fall Times  
2190  
10 ns  
Input and Output  
Timing Levels  
OUTPUT  
V
CC  
x 0.5  
3837 PGM T02  
100pF  
3837 FHD F16  
2
X24C01  
DEVICE OPERATION  
Clock and Data Conventions  
DatastatesontheSDAlinecanchangeonlyduringSCL  
LOW. SDA state changes during SCL HIGH are re-  
served for indicating start and stop conditions. Refer to  
Figures 1 and 2.  
The X24C01 supports a bidirectional bus oriented pro-  
tocol. The protocol defines any device that sends data  
ontothebusasatransmitterandthereceivingdeviceas  
the receiver. The device controlling the transfer is a  
master and the device being controlled is the slave. The  
master will always initiate data transfers and provide the  
clock for both transmit and receive operations. There-  
fore, the X24C01 will be considered a slave in all  
applications.  
Start Condition  
All commands are preceded by the start condition,  
which is a HIGH to LOW transition of SDA when SCL is  
HIGH. The X24C01 continuously monitors the SDA and  
SCL lines for the start condition and will not respond to  
any command until this condition has been met.  
Figure 1. Data Validity  
SCL  
SDA  
DATA STABLE  
DATA  
CHANGE  
3837 FHD F06  
3
X24C01  
Stop Condition  
The X24C01 will respond with an acknowledge after  
recognitionofastartcondition, asevenbitwordaddress  
andaR/Wbit. Ifawriteoperationhasbeenselected, the  
X24C01 will respond with an acknowledge after each  
byte of data is received.  
All communications must be terminated by a stop con-  
dition, which is a LOW to HIGH transition of SDA when  
SCL is HIGH. The stop condition is also used by the  
X24C01 to place the device in the standby power mode  
after a read sequence. A stop condition can only be  
issued after the transmitting device has released the  
bus.  
In the read mode the X24C01 will transmit eight bits of  
data, release the SDA line and monitor the line for an  
acknowledge. If an acknowledge is detected and no  
stop condition is generated by the master, the X24C01  
will continue to transmit data. If an acknowledge is not  
detected, the X24C01 will terminate further data trans-  
missions. The master must then issue a stop condition  
to return the X24C01 to the standby power mode and  
place the device into a known state.  
Acknowledge  
Acknowledge is a software convention used to indicate  
successful data transfers. The transmitting device will  
release the bus after transmitting eight bits. During the  
ninth clock cycle the receiver will pull the SDA line LOW  
to acknowledge that it received the eight bits of data.  
Refer to Figure 3.  
Figure 2. Definition of Start and Stop  
SCL  
SDA  
START CONDITION  
STOP CONDITION  
3837 FHD F07  
Figure 3. Acknowledge Response From Receiver  
SCL FROM  
MASTER  
1
8
9
DATA  
OUTPUT  
FROM  
TRANSMITTER  
DATA  
OUTPUT  
FROM  
RECEIVER  
START  
ACKNOWLEDGE  
3837 FHD F08  
4
X24C01  
WRITE OPERATIONS  
Byte Write  
the page address. The X24C01 is capable of a four byte  
page write operation. It is initiated in the same manner as  
the byte write operation, but instead of terminating the  
transfer of data after the first data byte, the master can  
transmit up to three more bytes. After the receipt of each  
data byte, the X24C01 will respond with an acknowledge.  
To initiate a write operation, the master sends a start  
conditionfollowedbyasevenbitwordaddressandawrite  
bit. The X24C01 responds with an acknowledge, then  
waits for eight bits of data and then responds with an  
acknowledge. The master then terminates the transfer by  
generating a stop condition, at which time the X24C01  
begins the internal write cycle to the nonvolatile memory.  
While the internal write cycle is in progress, the X24C01  
inputs are disabled, and the device will not respond to any  
requests from the master. Refer to Figure 4 for the  
address, acknowledge and data transfer sequence.  
After the receipt of each data byte, the two low order  
addressbitsareinternallyincrementedbyone. Thehigh  
order five bits of the address remain constant. If the  
master should transmit more than four data bytes prior  
togeneratingthestopcondition,theaddresscounterwill  
“roll over” and the previously transmitted data will be  
overwritten. As with the byte write operation, all inputs  
are disabled until completion of the internal write cycle.  
RefertoFigure5fortheaddress, acknowledgeanddata  
transfer sequence.  
Page Write  
The most significant five bits of the word address define  
Figure 4. Byte Write  
S
T
A
R
T
S
WORD  
ADDRESS (n)  
BUS ACTIVITY:  
SDA LINE  
T
O
P
DATA n  
S
P
M
S
B
L R A  
/
W
A
C
K
BUS ACTIVITY:  
X24C01  
S
B
C
K
3837 FHD F09  
Figure 5. Page Write  
S
T
A
R
T
S
T
WORD  
ADDRESS (n)  
BUS ACTIVITY:  
SDA LINE  
DATA n  
DATA n+1  
DATA n+3  
O
P
S
P
M
S
B
L R A  
/
W
A
C
K
A
C
K
A
C
K
BUS ACTIVITY:  
X24C01  
S
B
C
K
3837 FHD F10  
5
X24C01  
Acknowledge Polling  
Figure 6. ACK Polling Sequence  
The disabling of the inputs can be used to take advan-  
tage of the typical 5 ms write cycle time. Once the stop  
condition is issued to indicate the end of the host’s write  
operation the X24C01 initiates the internal write cycle.  
ACK polling can be initiated immediately. This involves  
issuing the start condition followed by the word address  
for a write operation. If the X24C01 is still busy with the  
write operation no ACK will be returned. If the X24C01  
has completed the write operation an ACK will be  
returned and the controller can then proceed with the  
next read or write operation.  
WRITE OPERATION  
COMPLETED  
ENTER ACK POLLING  
ISSUE  
START  
ISSUE SLAVE  
ISSUE STOP  
ADDRESS AND R/W = 0  
READ OPERATIONS  
Read operations are initiated in the same manner as  
write operations with exception that the R/W bit of the  
word address is set to a one. There are two basic read  
operations: byte read and sequential read.  
ACK  
NO  
RETURNED?  
YES  
It should be noted that the ninth clock cycle of the read  
operation is not a “don’t care.” To terminate a read  
operation, the master must either issue a stop condition  
duringtheninthcycleorholdSDAHIGHduringtheninth  
clock cycle and then issue a stop condition.  
NEXT  
NO  
OPERATION  
A WRITE?  
YES  
ISSUE STOP  
PROCEED  
Byte Read  
To initiate a read operation, the master sends a start  
condition followed by a seven bit word address and a  
read bit. The X24C01 responds with an acknowledge  
and then transmits the eight bits of data. The read  
operationisterminatedbythemaster;bynotresponding  
with an acknowledge and by issuing a stop condition.  
Refer to Figure 7 for the start, word address, read bit,  
acknowledge and data transfer sequence.  
PROCEED  
3837 FHD F11  
Figure 7. Byte Read  
S
T
A
R
T
S
T
O
P
WORD  
ADDRESS n  
BUS ACTIVITY:  
MASTER  
SDA LINE  
S
P
M
S
B
L R A  
/
W
BUS ACTIVITY:  
X24C01  
S
B
C
K
DATA n  
3837 FHD F12  
6
X24C01  
Sequential Read  
Thedataoutputissequential,withthedatafromaddress  
n followed by the data from n + 1. The address counter  
for read operations increments all address bits, allowing  
the entire memory contents to be serially read during  
oneoperation. Attheendoftheaddressspace(address  
127) the counter “rolls over” to zero and the X24C01  
continues to output data for each acknowledge re-  
ceived. Refer to Figure 8 for the address, acknowledge  
and data transfer sequence.  
Sequential read is initiated in the same manner as the  
byte read. The first data byte is transmitted as with the  
byte read mode, however, the master now responds  
with an acknowledge, indicating it requires additional  
data. The X24C01 continues to output data for each  
acknowledge received. The read operation is termi-  
natedbythemaster;bynotrespondingwithanacknowl-  
edge and by issuing a stop condition.  
Figure 8. Sequential Read  
S
T
O
P
A
C
K
A
C
K
A
C
K
BUS ACTIVITY: ADDRESS  
SDA LINE  
P
R A  
/
W
BUS ACTIVITY:  
X24C01  
C
K
DATA n  
DATA n+1  
DATA n+2  
DATA n+x  
3837 FHD F13  
Figure 9. Typical System Configuration  
V
CC  
PULL-UP  
RESISTORS  
SDA  
SCL  
MASTER  
SLAVE  
SLAVE  
TRANSMITTER/  
RECEIVER  
MASTER  
TRANSMITTER/  
RECEIVER  
MASTER  
TRANSMITTER  
TRANSMITTER/  
RECEIVER  
RECEIVER  
3837 FHD F14  
7
X24C01  
ABSOLUTE MAXIMUM RATINGS*  
*COMMENT  
Temperature Under Bias.................. –65°C to +135°C  
Storage Temperature ....................... –65°C to +150°C  
Voltage on any Pin with  
Stresses above those listed under “Absolute Maximum  
Ratings” may cause permanent damage to the device.  
This is a stress rating only and the functional operation of  
the device at these or any other conditions above those  
indicatedintheoperationalsectionsofthisspecificationis  
not implied. Exposure to absolute maximum rating condi-  
tions for extended periods may affect device reliability.  
Respect to V  
............................ –1.0V to +7.0V  
SS  
D.C. Output Current ............................................ 5 mA  
Lead Temperature  
(Soldering, 10 Seconds) ............................. 300°C  
RECOMMENDED OPERATING CONDITIONS  
Temperature  
Min.  
Max.  
Supply Voltage  
Limits  
Commercial  
Industrial  
Military  
0°C  
–40°C  
–55°C  
70°C  
+85°C  
X24C01  
4.5V to 5.5V  
3.5V to 5.5V  
3.0V to 5.5V  
2.7V to 5.5V  
X24C01-3.5  
X24C01-3  
X24C01-2.7  
+125°C  
D.C. OPERATING CHARACTERISTICS (Over recommended operating conditions, unless otherwise specified)  
Limits  
Symbol  
Parameter  
Min.  
Max.  
1
Units  
Test Conditions  
(1)  
I
I
I
V
CC  
V
CC  
V
CC  
Supply Current (Read)  
Supply Current (Write)  
Standby Current  
mA SCL = V x 0.1/V x 0.9 Levels  
CC  
CC  
CC  
(2)  
2
@ 100 KHz, SDA = Open  
SCL = SDA = V  
CC  
(1)  
100  
µA  
,
CC  
SB1  
V
CC  
= 5V ± 10%  
(1)  
I
I
I
V
Standby Current  
50  
10  
10  
µA  
µA  
µA  
V
SCL = SDA = V , V = 2.7V  
SB2  
CC  
CC  
CC  
CC  
Input Leakage Current  
Output Leakage Current  
Input Low Voltage  
V
V
= GND to V  
LI  
IN  
= GND to V  
CC  
LO  
OUT  
(2)  
V
V
V
–1.0  
V
x 0.3  
lL  
CC  
(2)  
Input High Voltage  
V
x 0.7 V + 0.5  
V
IH  
CC  
CC  
Output Low Voltage  
0.4  
V
I
OL  
= 2.1 mA  
OL  
3837 PGM T03  
CAPACITANCE T = 25°C, f = 1.0 MHz, V = 5V  
A
CC  
Symbol  
Parameter  
Max.  
Units  
Test Conditions  
(3)  
C
C
Input/Output Capacitance (SDA)  
Input Capacitance (SCL)  
8
6
pF  
pF  
V
V
= 0V  
= 0V  
I/O  
I/O  
(3)  
IN  
IN  
3837 PGM T05  
Notes: (1) Must perform a stop command prior to measurement.  
(2) V min. and V max. are for reference only and are not tested.  
IL  
IH  
(3) This parameter is periodically sampled and not 100% tested.  
8
X24C01  
A.C. CHARACTERISTICS (Over recommended operating conditions, unless otherwise specified)  
Read & Write Cycle Limits  
Symbol  
Parameter  
Min.  
Max.  
Units  
f
SCL Clock Frequency  
0
100  
100  
KHz  
ns  
SCL  
T
Noise Suppression Time  
I
Constant at SCL, SDA Inputs  
t
t
SCL Low to SDA Data Out Valid  
0.3  
4.7  
3.5  
µs  
µs  
AA  
Time the Bus Must Be Free Before a  
New Transmission Can Start  
BUF  
t
t
t
t
t
t
t
t
t
t
Start Condition Hold Time  
Clock Low Period  
4.0  
4.7  
4.0  
4.7  
0
µs  
µs  
µs  
µs  
µs  
ns  
µs  
ns  
µs  
ns  
HD:STA  
LOW  
Clock High Period  
HIGH  
SU:STA  
HD:DAT  
SU:DAT  
R
Start Condition Setup Time  
Data In Hold Time  
Data In Setup Time  
250  
SDA and SCL Rise Time  
SDA and SCL Fall Time  
Stop Condition Setup Time  
Data Out Hold Time  
1
300  
F
4.7  
SU:STO  
DH  
300  
3837 PGM T06  
POWER-UP TIMING  
Symbol  
Parameter  
Max.  
Units  
(4)  
t
t
Power-up to Read Operation  
Power-up to Write Operation  
1
5
ms  
ms  
PUR  
(4)  
PUW  
3837 PGM T07  
Bus Timing  
t
t
t
t
HIGH  
LOW  
R
F
SCL  
t
t
t
t
t
SU:STO  
SU:STA  
HD:STA  
HD:DAT  
SU:DAT  
SDA IN  
t
t
t
BUF  
AA  
DH  
SDA OUT  
3837 FHD F04  
Note: (4) t  
and t  
are the delays required from the time V is stable until the specified operation can be initiated. These parameters  
PUW CC  
PUR  
are periodically sampled and not 100% tested.  
9
X24C01  
WRITE CYCLE LIMITS  
(5)  
Symbol  
Parameter  
Write Cycle Time  
Min.  
Typ.  
Max.  
Units  
(6)  
t
5
10  
ms  
WR  
3837 PGM T08  
The write cycle time is the time from a valid stop  
condition of a write sequence to the end of the internal  
erase/programcycle.Duringthewritecycle,theX24C01  
bus interface circuits are disabled, SDA is allowed to  
remainhigh, andthedevicedoesnotrespondtoitsword  
address.  
Write Cycle Timing  
SCL  
ACK  
SDA  
8th BIT  
WORD n  
t
WR  
STOP  
CONDITION  
START  
CONDITION  
X24C01  
ADDRESS  
3837 FHD F05  
Notes: (5) Typical values are for T = 25°C and nominal supply voltage (5V).  
A
(6) t  
is the minimum cycle time to be allowed from the system perspective unless polling techniques are used. It is the maximum  
WR  
time the device requires to automatically complete the internal write operation.  
Guidelines for Calculating Typical Values of  
Bus Pull-Up Resistors  
SYMBOL TABLE  
WAVEFORM  
INPUTS  
OUTPUTS  
120  
Must be  
steady  
Will be  
steady  
V
CC MAX  
R
=
=2.6K  
MIN  
I
100  
80  
OL MIN  
t
May change  
from Low to  
High  
Will change  
from Low to  
High  
R
R
=
MAX  
C
BUS  
MAX.  
60  
40  
20  
0
RESISTANCE  
May change  
from High to  
Low  
Will change  
from High to  
Low  
MIN.  
Don’t Care:  
Changes  
Allowed  
Changing:  
State Not  
Known  
RESISTANCE  
20 40 60 80  
120  
100  
0
Center Line  
is High  
Impedance  
N/A  
BUS CAPACITANCE (pF)  
3837 FHD F15  
10  
X24C01  
PACKAGING INFORMATION  
8-LEAD PLASTIC IN-LINE PACKAGE TYPE P  
0.430 (10.92)  
0.360 (9.14)  
0.092 (2.34)  
DIA. NOM.  
0.255 (6.47)  
0.245 (6.22)  
PIN 1 INDEX  
PIN 1  
0.060 (1.52)  
0.020 (0.51)  
0.300  
(7.62) REF.  
HALF SHOULDER WIDTH ON  
ALL END PINS OPTIONAL  
0.140 (3.56)  
0.130 (3.30)  
SEATING  
PLANE  
0.020 (0.51)  
0.015 (0.38)  
0.150 (3.81)  
0.125 (3.18)  
0.062 (1.57)  
0.058 (1.47)  
0.110 (2.79)  
0.090 (2.29)  
0.020 (0.51)  
0.016 (0.41)  
0.325 (8.25)  
0.300 (7.62)  
0.015 (0.38)  
MAX.  
0°  
15°  
TYP. 0.010 (0.25)  
NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)  
11  
X24C01  
PACKAGING INFORMATION  
8-LEAD PLASTIC SMALL OUTLINE GULL WING PACKAGE TYPE S  
0.150 (3.80)  
0.158 (4.00)  
0.228 (5.80)  
0.244 (6.20)  
PIN 1 INDEX  
PIN 1  
0.014 (0.35)  
0.019 (0.49)  
0.188 (4.78)  
0.197 (5.00)  
(4X) 7°  
0.053 (1.35)  
0.069 (1.75)  
0.004 (0.19)  
0.010 (0.25)  
0.050 (1.27)  
0.010 (0.25)  
0.020 (0.50)  
X 45°  
0° – 8°  
0.0075 (0.19)  
0.010 (0.25)  
0.027 (0.683)  
0.037 (0.937)  
NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESIS IN MILLIMETERS)  
3926 FHD F22  
12  
X24C01  
PACKAGING INFORMATION  
8-LEAD MINIATURE SMALL OUTLINE GULL WING PACKAGE TYPE M  
0.118 ± 0.002  
(3.00 ± 0.05)  
0.012 + 0.006 / -0.002  
(0.30 + 0.15 / -0.05)  
0.0256 (0.65) TYP  
R 0.014 (0.36)  
0.118 ± 0.002  
(3.00 ± 0.05)  
0.030 (0.76)  
0.0216 (0.55)  
7° TYP  
0.036 (0.91)  
0.032 (0.81)  
0.040 ± 0.002  
(1.02 ± 0.05)  
0.008 (0.20)  
0.004 (0.10)  
0.150 (3.81)  
0.007 (0.18)  
0.005 (0.13)  
REF.  
0.193 (4.90)  
REF.  
NOTE:  
1. ALL DIMENSIONS IN INCHES AND (MILLIMETERS)  
3003 ILL 01  
13  
X24C01  
ORDERING INFORMATION  
X24C01  
X
X
-X  
V
CC  
Limits  
Device  
Blank = 4.5V to 5.5V  
3.5 = 3.5V to 5.5V  
3 = 3.0V to 5.5V  
2.7 = 2.7V to 5.5V  
Temperature Range  
Blank = Commercial = 0°C to +70°C  
I = Industrial = –40°C to +85°C  
M = Military = –55°C to +125°C  
Package  
P = 8-Lead Plastic DIP  
S = 8-Lead SOIC  
M = 8-Lead MSOP  
Blank = 8-Lead SOIC  
P = 8-Lead Plastic DIP  
M = 8-Lead MSOP  
Part Mark Convention  
X24C01  
X
X
Blank = 4.5V to 5.5V, 0°C to +70°C  
F = 2.7V to 5.5V, 0°C to +70°C  
G = 2.7V to 5.5V, –40°C to +85°C  
I = 4.5V to 5.5V, –40°C to +85°C  
B = 3.5V to 5.5V, 0°C to +70°C  
C = 3.5V to 5.5V, –40°C to +85°C  
D = 3.0V to 5.5V, 0°C to +70°C  
E = 3.0V to 5.5V, –40°C to +85°C  
M = 4.5V to 5.5V, –55°C to +125°C  
LIMITED WARRANTY  
Devices sold by Xicor, Inc. are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. Xicor, Inc. makes no warranty,  
express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement.  
Xicor, Inc. makes no warranty of merchantability or fitness for any purpose. Xicor, Inc. reserves the right to discontinue production and change specifications and  
prices at any time and without notice.  
Xicor, Inc. assumes no responsibility for the use of any circuitry other than circuitry embodied in a Xicor, Inc. product. No other circuits, patents, licenses are  
implied.  
U.S. PATENTS  
Xicor products are covered by one or more of the following U.S. Patents: 4,263,664; 4,274,012; 4,300,212; 4,314,265; 4,326,134; 4,393,481; 4,404,475;  
4,450,402; 4,486,769; 4,488,060; 4,520,461; 4,533,846; 4,599,706; 4,617,652; 4,668,932; 4,752,912; 4,829, 482; 4,874, 967; 4,883, 976. Foreign patents and  
additional patents pending.  
LIFE RELATED POLICY  
In situations where semiconductor component failure may endanger life, system designers using this product should design the system with appropriate error  
detection and correction, redundancy and back-up features to prevent such an occurence.  
Xicor's products are not authorized for use in critical components in life support devices or systems.  
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose  
failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant  
injury to the user.  
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life  
support device or system, or to affect its safety or effectiveness.  
14  

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