WF512K32N-120G2LI5A [WEDC]
512Kx32 5V FLASH MODULE, SMD 5962-94612; 512Kx32 5V闪存模块， SMD 5962-94612
| 型号： | WF512K32N-120G2LI5A |
| 厂家： | 
WHITE ELECTRONIC DESIGNS CORPORATION |
| 描述： | 512Kx32 5V FLASH MODULE, SMD 5962-94612 |
| 文件： | 总16页 (文件大小：502K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
WF512K32-XXX5
White Electronic Designs
512Kx32 5V FLASH MODULE, SMD 5962-94612
FEATURES
ꢀ
Access Times of 60, 70, 90, 120, 150ns
Packaging
ꢀ
Commercial, Industrial and Military Temperature
Ranges
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
5 Volt Programming. 5V 10ꢀ Supply.
Low Power CMOS, 6.5mA Standby
•
•
•
•
•
66 pin, PGA Type, 1.075" square, Hermetic
Ceramic HIP (Package 400(1)).
68 lead, 40mm, Low Capacitance Hermetic
CQFP (Package 501)1
Embedded Erase and Program Algorithms
TTL Compatible Inputs and CMOS Outputs
Built-in Decoupling Caps for Low Noise Operation
68 lead, 40mm, Low Profile 3.5mm (0.140"),
CQFP (Package 502)1
Page Program Operation and Internal Program
Control Time
68 lead, 22.4mm (0.880") Low Profile CQFP
(G2U) 3.5mm (0.140") high, (Package 510)1
ꢀ
Weight
68 lead, 22.4mm (0.880") CQFP (G2L) 5.08mm
(0.200") high, Package (528)
WF512K32 - XG2UX5 - 8 grams typical
WF512K32N - XH1X5 - 13 grams typical
WF512K32 - XG4TX51 - 20 grams typical
WF512K32-XG2LX5 - 8 grams typical
ꢀ
ꢀ
1,000,000 Erase/Program Cycles Minimum
Sector Architecture
•
•
8 equal size sectors of 64KBytes each
* This product is subject to change without notice.
Note 1: Package Not Recommended for New Design
See Flash Programming Application Note 4M5 for algorithms.
Any combination of sectors can be concurrently
erased. Also supports full chip erase
ꢀ
Organized as 512Kx32
FIGURE 1 – PIN CONFIGURATION FOR WF512K32N-XH1X5
Top View Pin Description
1
12
23
34
45
56
I/O0-31
A0-18
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
I/O8
I/O9
I/O10
A14
A16
A11
WE2#
CS2#
GND
I/O11
A10
I/O15
I/O24
I/O25
I/O26
A7
VCC
CS4#
WE4#
I/O27
A4
I/O31
I/O30
I/O29
I/O28
A1
WE1-4
#
I/O14
I/O13
I/O12
OE#
A17
CS1-4
OE#
VCC
#
GND
NC
A12
Not Connected
A9
NC
A5
A2
Block Diagram
A0
A15
WE1#
I/O7
A13
A6
A3
WE
1
#
CS
1
#
WE
2
#
CS
2
#
WE
3
#
CS
3
#
4 4
WE # CS #
OE#
A18
I/O0
I/O1
I/O2
VCC
CS1#
NC
A8
WE3#
CS3#
GND
I/O19
I/O23
I/O22
I/O21
I/O20
A
0-18
I/O6
I/O16
I/O17
I/O18
512K x 8
512K x 8
512K x 8
512K x 8
I/O5
8
8
8
8
I/O3
I/O4
I/O0-7
I/O8-15
I/O16-23
I/O24-31
11
22
33
44
55
66
March 2006
Rev. 11
1
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WF512K32-XXX5
White Electronic Designs
FIGURE 2 – PIN CONFIGURATION FOR WF512K32-XG4TX51
Top View Pin Description
I/O0-31
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
A0-18
WE#
CS1-4
OE#
VCC
9
8 7 6 5 4 3 2 1 68 67 66 65 64 63 62 61
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
0
1
2
3
4
5
6
7
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
I/O16
I/O17
I/O18
I/O19
I/O20
I/O21
I/O22
I/O23
GND
I/O24
I/O25
I/O26
I/O27
I/O28
I/O29
I/O30
I/O31
#
GND
NC
Not Connected
GND
I/O
8
I/O
9
Block Diagram
I/O10
I/O11
I/O12
I/O13
I/O14
I/O15
CS
1
#
CS
2
#
CS
3
#
4
CS #
WE#
OE#
A
0-18
512K X 8
8
512K X 8
8
512K X 8
8
512K X 8
8
2728 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43
I/O
0
-
7
I/O
8
-
15
I/O16
-
23
I/O24
- 31
Note 1: Package not recommended for new designs
FIGURE 3 – PIN CONFIGURATION FOR WF512K32-XG2UX5 AND WF512K32-XG2LX5
Top View Pin Description
I/O0-31
A0-18
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
9
8
7
6
5
4
3
2
1
68 67 66 65 64 63 62 61
60 I/O16
WE1-4
#
I/O0 10
I/O1 11
I/O2 12
I/O3 13
I/O4 14
I/O5 15
I/O6 16
I/O7 17
GND 18
I/O8 19
I/O9 20
I/O10 21
I/O11 22
I/O12 23
I/O13 24
I/O14 25
I/O15 26
CS1-4
OE#
VCC
#
59 I/O17
58 I/O18
57 I/O19
56 I/O20
55 I/O21
54 I/O22
53 I/O23
52 GND
51 I/O24
50 I/O25
49 I/O26
48 I/O27
47 I/O28
46 I/O29
45 I/O30
44 I/O31
GND
NC
Not Connected
Block Diagram
WE1# CS1#
WE2# CS2#
WE3# CS3#
WE4# CS4#
OE#
A0-18
512K x 8
512K x 8
512K x 8
512K x 8
2728 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43
8
8
8
8
I/O0-7
I/O8-15
I/O16-23
I/O24-31
March 2006
Rev. 11
2
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WF512K32-XXX5
White Electronic Designs
Absolute Maximum Ratings (1)
CAPACITANCE
TA = +25°C
Parameter
Unit
°C
V
V
°C
°C
Parameter
Symbol
COE
CWE
Conditions
VIN = 0V, f = 1.0 MHz 50 pF
VIN = 0V, f = 1.0 MHz pF
Max Unit
Operating Temperature
-55 to +125
-2.0 to +7.0
-2.0 to +7.0
-65 to +150
+300
OE# capacitance
WE1-4# capacitance
HIP (PGA)
Supply Voltage Range (VCC)
Signal voltage range (any pin except A9) (2)
Storage Temperature Range
Lead Temperature (soldering, 10 seconds)
Data Retention (Mil Temp)
20
50
15
CQFP G4T
CQFP G2U/G2L
20 years
CS1-4# capacitance
Data# I/O capacitance
Address input capacitance
CCS
CI/O
CAD
VIN = 0V, f = 1.0 MHz 20 pF
VI/O = 0V, f = 1.0 MHz 20 pF
VIN = 0V, f = 1.0 MHz 50 pF
Endurance - write/erase cycles (Mil Temp)
A9 Voltage for sector protect (VID) (3)
1,000,000 cycles min.
-2.0 to +14.0
V
NOTES:
This parameter is guaranteed by design but not tested.
1. Stresses above the absolute maximum rating may cause permanent damage to the
device. Extended operation at the maximum levels may degrade performance and
affect reliability.
2. Minimum DC voltage on input or I/O pins is -0.5V. During voltage transitions,inputs
may overshoot Vss to -2.0 V for periods of up to 20ns. Maximum DC voltage on
output and I/O pins is Vcc + 0.5V. During voltage transitions, outputs may overshoot
to Vcc + 2.0 V for periods of up to 20ns.
3. Minimum DC input voltage on A9 pin is -0.5V. During voltage transitions, A9 may
overshoot Vss to -2V for periods of up to 20ns. Maximum DC input voltage on A9 is
+13.5V which may overshoot to 14.0 V for periods up to 20ns.
RECOMMENDED OPERATING CONDITIONS
Parameter
Symbol
VCC
VIH
VIL
TA
Min
4.5
2.0
-0.5
-55
Max
5.5
VCC + 0.5
+0.8
+125
+85
Unit
V
V
Supply Voltage
Input High Voltage
Input Low Voltage
Operating Temp. (Mil.)
Operating Temp. (Ind.)
A9 Voltage for Sector Protect
V
°C
°C
V
TA
-40
VID
11.5
12.5
DC CHARACTERISTICS
VCC = 5.0V, VSS = 0V, -55°C ≤ TA ≤ +125°C
Parameter
Sym
ILI
Conditions
Min
Max
10
Units
VCC = 5.5, VIN = GND to VCC
Input Leakage Current
Output Leakage Current
VCC Active Current for Read (1)
VCC Active Current for Program or Erase (2)
VCC Standby Current
µA
µA
mA
mA
mA
mA
V
CS# = VIH, OE# = VIH, VOUT = GND to VCC
CS# = VIL, OE# = VIH, f = 5MHz, VCC = 5.5
CS# = VIH, OE# = VIH
ILOx32
ICC1
ICC2
ICC4
ICC3
VOL
10
190
240
6.5
VCC = 5.5, CS = VIH, f = 5MHz
VCC Static Current
VCC = 5.5, CS = VIH
0.6
IOL = 8.0mA, VCC = 4.5
Output Low Voltage
0.45
IOH = 2.5mA, VCC = 4.5
Output High Voltage
VOH1
VLKO
0.85 X VCC
V
Low VCC Lock-Out Voltage
3.2
4.2
V
DC test conditions: VIL = 0.3V, VIH = VCC - 0.3V
NOTES:
1. The ICC current listed includes both the DC operating current and the frequency dependent component
(at 5 MHz). The frequency component typically is less than 2 mA/MHz, with OE at VIH
CC active while Embedded Algorithm (program or erase) is in progress.
.
2.
I
March 2006
Rev. 11
3
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WF512K32-XXX5
White Electronic Designs
AC CHARACTERISTICS – WRITE/ERASE/PROGRAM OPERATIONS,CS# CONTROLLED
VCC = 5.0V, GND = 0V, -55°C ≤ TA ≤ +125°C
Parameter
Symbol
-60
-70
-90
-120
-150
Unit
Min
60
0
Max
Min
70
0
Max
Min
90
0
Max
Min
120
0
Max
Min
150
0
Max
Write Cycle Time
tAVAV
tWC
tWS
tCP
ns
ns
Write Enable Setup Time
Chip Select Pulse Width
Address Setup Time
Data Setup Time
tWLEL
tELEH
tAVEL
tDVEH
tEHDX
tELAX
tEHEL
40
0
45
0
45
0
50
0
50
0
ns
tAS
ns
tDS
40
0
45
0
45
0
50
0
50
0
ns
Data Hold Time
tDH
tAH
ns
Address Hold Time
Chip Select Pulse Width High
40
20
45
20
45
20
50
20
50
20
ns
tCPH
ns
Duration of Byte Programming Operation (1) tWHWH1
300
15
300
15
300
15
300
15
300
15
µs
sec
ns
Sector Erase Time (2)
Read Recovery Time
Chip Programming Time
Chip Erase Time (3)
tWHWH2
tGHEL
0
0
0
0
0
11
64
11
64
11
64
11
64
11
64
sec
sec
NOTES:
1. Typical value for tWHWH1 is 7µs.
2. Typical value for tWHWH2 is 1sec.
3. Typical value for Chip Erase Time is 8sec.
FIGURE. 4 – AC TEST CIRCUIT
AC Test Conditions
Parameter
Input Pulse Levels
Input Rise and Fall
Input and Output Reference Level
Output Timing Reference Level
Notes:
Typ
IL = 0, VIH = 3.0
Unit
IOL
V
V
ns
V
Current Source
5
1.5
1.5
V
VZ 1.5V
(Bipolar Supply)
D.U.T.
Ceff = 50 pf
V
Z is programmable from -2V to +7V.
OL & IOH programmable from 0 to 16mA.
Tester Impedance Z0 = 75 Ω.
Z is typically the midpoint of VOH and VOL
OL & IOH are adjusted to simulate a typical resistive load circuit.
ATE tester includes jig capacitance.
I
V
.
IOH
I
Current Source
March 2006
Rev. 11
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White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WF512K32-XXX5
White Electronic Designs
AC CHARACTERISTICS – WRITE/ERASE/PROGRAM OPERATIONS,WE# CONTROLLED
VCC = 5.0V, GND = 0V, -55°C ≤ TA ≤ +125°C
Parameter
Symbol
-60
-70
-90
-120
-150
Unit
Min
60
0
Max
Min
70
0
Max
Min
90
0
Max
Min
120
0
Max
Min
150
0
Max
Write Cycle Time
tAVAV
tWC
tCS
tWP
tAS
ns
ns
Chip Select Setup Time
Write Enable Pulse Width
Address Setup Time
Data Setup Time
tELWL
tWLWH
tAVWH
tDVWH
tWHDX
tWHAX
tWHWL
40
0
45
0
45
0
50
0
50
0
ns
ns
tDS
40
0
45
0
45
0
50
0
50
0
ns
Data Hold Time
tDH
tAH
ns
Address Hold Time
40
20
45
20
45
20
50
20
50
20
ns
Write Enable Pulse Width High
tWPH
ns
Duration of Byte Programming Operation (1) tWHWH1
300
15
300
15
300
15
300
15
300
15
µs
sec
ns
Sector Erase Time (2)
tWHWH2
tGHWL
Read Recovery Time before Write
VCC Set-up Time
0
0
0
0
0
tVCS
50
50
50
50
50
µs
sec
ns
Chip Programming Time
Output Enable Setup Time
Output Enable Hold Time (4)
Chip Erase Time (3)
11
64
11
64
11
64
11
64
11
64
tOES
tOEH
0
0
0
0
0
10
10
10
10
10
ns
sec
NOTES:
1. Typical value for tWHWH1 is 7µs.
2. Typical value for tWHWH2 is 1sec.
3. Typical value for Chip Erase Time is 8sec.
4. For Toggle and Data Polling.
AC CHARACTERISTICS – WRITE/ERASE/PROGRAM OPERATIONS,WE# CONTROLLED
VCC = 5.0V, -55°C ≤ TA ≤ +125°C
Parameter
Symbol
-60
-70
-90
-120
-150
Unit
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Read Cycle Time
tAVAV
tRC
tACC
tCE
tOE
tDF
60
70
90
120
150
ns
ns
ns
ns
ns
ns
ns
Address Access Time
tAVQV
tELQV
tGLQV
tEHQZ
tGHQZ
tAXQX
60
60
30
20
20
70
70
35
20
20
90
90
35
20
20
120
120
50
150
150
55
Chip Select Access Time
Output Enable to Output Valid
Chip Select to Output High Z (1)
Output Enable High to Output High Z (1)
30
35
tDF
30
35
Output Hold from Address, CS# or OE#
Change, whichever is First
tOH
0
0
0
0
0
1. Guaranteed by design, but not tested
March 2006
Rev. 11
5
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WF512K32-XXX5
White Electronic Designs
FIGURE 5 – AC WAVEFORMS FOR READ OPERATIONS
CS#
OE#
WE#
March 2006
Rev. 11
6
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WF512K32-XXX5
White Electronic Designs
FIGURE 6 – WRITE/ERASE/PROGRAM OPERATION, WE# CONTROLLED
Data# Polling
CS#
OE#
WE#
D7#
NOTES:
1. PA is the address of the memory location to be programmed.
2. PD is the data to be programmed at byte address.
3. D7# is the output of the complement of the data written to the device (for each chip).
4. DOUT is the output of the data written to the device.
5. Figure indicates last two bus cycles of four bus cycle sequence.
March 2006
Rev. 11
7
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WF512K32-XXX5
White Electronic Designs
FIGURE 7 – AC WAVEFORMS CHIP/SECTOR ERASE OPERATIONS
tAH
Addresses
CS#
5555H
2AAAH
5555H
5555H
2AAAH
SA
tAS
tGHWL
OE#
WE#
tWP
t
t
WPH
tCS
DH
Data
AAH
55H
80H
AAH
55H
10H/30H
tDS
V
CC
tVCS
NOTE:
1. SA is the sector address for Sector Erase.
March 2006
Rev. 11
8
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WF512K32-XXX5
White Electronic Designs
FIGURE 8 – AC WAVEFORMS FOR DATA# POLLING DURING EMBEDDED
ALGORITHM OPERATIONS
t
CH
CS#
OE#
WE#
t
DF
t
OE
tOEH
tCE
t
OH
High Z
D7 =
Valid Data
D7#
D7
tWHWH 1 or 2
Data
D0-D7
Valid Data
D0-D6 = Invalid
D0-D6
t
OE
March 2006
Rev. 11
9
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WF512K32-XXX5
White Electronic Designs
FIGURE 9 – ALTERNATE CS# CONTROLLED PROGRAMMING OPERATION TIMINGS
Data# Polling
CS#
OE#
WE#
D7#
Notes:
1. PA represents the address of the memory location to be programmed.
2. PD represents the data to be programmed at byte address.
3. D7# is the output of the complement of the data written to the device (for each chip).
4. DOUT is the output of the data written to the device.
5. Figure indicates the last two bus cycles of a four bus cycle sequence.
March 2006
Rev. 11
10
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WF512K32-XXX5
White Electronic Designs
PACKAGE 400: 66 PIN, PGA TYPE, CERAMIC HEX-IN-LINE PACKAGE, HIP (H1)
4.60 (0.181)
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
March 2006
Rev. 11
11
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WF512K32-XXX5
White Electronic Designs
PACKAGE 510: 68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G2U)
o
o
The White 68 lead G2U CQFP fills the same fit
and function as the JEDEC 68 lead CQFJ or
68 PLCC. But the G2U has the TCE and lead
inspection advantage of the CQFP form.
0.940" TYP
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
March 2006
Rev. 11
12
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WF512K32-XXX5
White Electronic Designs
PACKAGE 528: 68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G2L)
25.15 (0.990) 0.25 (0.010) MAX
5.10 (0.200) MAX
22.36 (0.880) 0.25 (0.010) MAX
0.25 (0.010) 0.10 (0.002)
0.23 (0.009) REF
24.0 (0.946)
0.25 (0.010)
R 0.127
(0.005)
1.37 (0.054) MIN
0.004
2O / 9O
0.89 (0.035)
1.14 (0.045)
1.27 (0.050) TYP
0.38 (0.015) 0.05 (0.002)
20.31 (0.800) REF
0.940" TYP
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
March 2006
Rev. 11
13
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WF512K32-XXX5
White Electronic Designs
PACKAGE 502: 68 LEAD, CERAMIC QUAD FLAT PACK, LOW PROFILE CQFP (G4T)1
5.1 (0.200) MAX
39.6 (1.56) 0.38 (0.015) SQ
1.27 (0.050)
0.1 (0.005)
PIN 1 IDENTIFIER
Pin 1
12.7 (0.500)
0.5 (0.020)
4 PLACES
5.1 (0.200)
0.25 (0.010)
4 PLACES
0.25 (0.010)
0.05 (0.002)
1.27 (0.050)
TYP
0.38 (0.015)
0.08 (0.003)
68 PLACES
38 (1.50) TYP
4 PLACES
Note 1: Package Not Recommended for New Design
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
March 2006
Rev. 11
14
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WF512K32-XXX5
White Electronic Designs
ORDERING INFORMATION
W F 512K32 X - XXX X X 5 X
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
VPP PROGRAMMING VOLTAGE
5 = 5 V
DEVICE GRADE:
Q = MIL-STD-883 Compliant
M= Military Screened
I = Industrial
C = Commercial
-55°C to +125°C
-40°C to +85°C
0°C to +70°C
PACKAGE TYPE:
H1 = 1.075" sq. Ceramic Hex In Line Package, HIP (Package 400*)
G2U = 22.4mm Ceramic Quad Flat Pack, Low Profile CQFP (Package 510)
G2L = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 528)
G4T1 = 40mm Low Profile CQFP (Package 502)
ACCESS TIME (ns)
IMPROVEMENT MARK
N = No Connect at pins 21 and 39 in HIP for Upgrade
ORGANIZATION, 512K x 32
User configurable as 1M x 16 or 2M x 8
FLASH
WHITE ELECTRONIC DESIGNS CORP.
Note 1: Package Not Recommended for New Design
March 2006
Rev. 11
15
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WF512K32-XXX5
White Electronic Designs
DEVICE TYPE
SPEED
PACKAGE
SMD NO.
512K x 32 Flash Module
512K x 32 Flash Module
512K x 32 Flash Module
512K x 32 Flash Module
150ns
120ns
90ns
66 pin HIP (H1) 1.075" sq.
66 pin HIP (H1) 1.075" sq.
66 pin HIP (H1) 1.075" sq.
66 pin HIP (H1) 1.075" sq.
5962-94612 01H4X
5962-94612 02H4X
5962-94612 03H4X
5962-94612 04H4X
70ns
512K x 32 Flash Module
512K x 32 Flash Module
512K x 32 Flash Module
512K x 32 Flash Module
150ns
120ns
90ns
68 lead CQFP Low Profile (G4T)1
68 lead CQFP Low Profile (G4T)1
68 lead CQFP Low Profile (G4T)1
68 lead CQFP Low Profile (G4T)1
5962-94612 01HTX1
5962-94612 02HTX1
5962-94612 03HTX1
5962-94612 04HTX1
70ns
512K x 32 Flash Module
512K x 32 Flash Module
512K x 32 Flash Module
512K x 32 Flash Module
150ns
120ns
90ns
68 lead CQFP/J (G2U)
68 lead CQFP/J (G2U)
68 lead CQFP/J (G2U)
68 lead CQFP/J (G2U)
5962-94612 01HZX
5962-94612 02HZX
5962-94612 03HZX
5962-94612 04HZX
70ns
512K x 32 Flash Module
512K x 32 Flash Module
512K x 32 Flash Module
512K x 32 Flash Module
150ns
120ns
90ns
68 lead CQFP (G2L)
68 lead CQFP (G2L)
68 lead CQFP (G2L)
68 lead CQFP (G2L)
5962-94612 01HAX
5962-94612 02HAX
5962-94612 03HAX
5962-94612 04HAX
70ns
March 2006
Rev. 11
16
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
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