WF1M32B-100G2UM3A [WEDC]
Flash Module, 1MX32, 100ns, CQFP68, 0.140 X 0.140 INCH, 3.50 MM HEIGHT, CERAMIC, QFP-68;
| 型号： | WF1M32B-100G2UM3A |
| 厂家： | 
WHITE ELECTRONIC DESIGNS CORPORATION |
| 描述： | Flash Module, 1MX32, 100ns, CQFP68, 0.140 X 0.140 INCH, 3.50 MM HEIGHT, CERAMIC, QFP-68 |
| 文件： | 总13页 (文件大小：600K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
WF1M32B-XXX3
White Electronic Designs
1Mx32 3.3V Flash Module
FEATURES
Access Times of 100, 120, 150ns
■
■
■
■
■
Boot Code Sector Architecture (Bottom)
■
Packaging
Low Power CMOS, 1.0mA Standby
Embedded Erase and Program Algorithms
Built-in Decoupling Caps for Low Noise Operation
Erase Suspend/Resume
• 66 pin, PGA Type, 1.075" square, Hermetic
Ceramic HIP (Package 400)
• 68 lead, Low Profile CQFP (G2U), 3.5mm
(0.140") square (Package 510)
• Supports reading data from or programing data to
a sector not being erased
■
■
1,000,000 Erase/Program Cycles
Sector Architecture
■
■
Low Current Consumption
Typical values at 5MHz:
• One 16KByte, two 8KBytes, one 32KByte, and
fifteen 64kBytes in byte mode
• 40mA Active Read Current
• 80mA Program/Erase Current
Weight
• Any combination of sectors can be concurrently
erased. Also supports full chip erase
■
■
Organized as 1Mx32
WF1M32B-XG2UX3 -8 grams typical
WF1M32B-XH1X3 -13 grams typical
Commercial, Industrial and Military Temperature
Ranges
■
3.3 Volt for Read and Write Operations
Note: For programming information refer to Flash Programming 8M3 Application Note.
PIN CONFIGURATION FOR WF1M32B-XH1X3
Top View
Pin Description
I/O0-31
A0-19
WE#
Data Inputs/Outputs
Address Inputs
Write Enable
1
12
23
34
45
56
I/O
I/O
8
RESET#
CS
I/O15
I/O14
I/O13
I/O12
OE#
I/O24
I/O25
I/O26
V
CC
I/O31
I/O30
I/O29
I/O28
CS1-4#
OE#
Chip Selects
9
2
#
CS
4#
Output Enable
I/O10
GND
I/O11
NC
RESET# Reset
VCC
GND
NC
Power Supply
A
A
A
A
A
14
16
11
0
A7
I/O27
Ground
A
A
A
V
10
A
12
NC
13
A4
A5
A6
A1
A2
A3
Not Connected
9
A17
15
CC
WE#
A
Block Diagram
18
I/O
I/O
I/O
I/O
7
6
5
4
A
8
I/O16
I/O17
I/O18
NC
CS
I/O23
I/O22
I/O21
I/O20
CS1#
CS2#
CS3#
CS4#
RESET#
WE#
I/O
I/O
I/O
0
1
2
CS1
#
3#
OE#
A0-19
A19
GND
I/O19
1M x 8
1M x 8
1M x 8
1M x 8
I/O
3
11
22
33
44
55
66
8
8
8
8
I/O16-23
I/O24-31
I/O0-7
I/O8-15
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
March 2007
Rev. 6
1
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
WF1M32B-XXX3
White Electronic Designs
Pin Configuration for WF1M32B-XG2UX3
Top View
Pin Description
I/O0-31
A0-19
WE1-4
CS1-4
OE
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
9
8
7
6
5
4
3
2
1
68 67 66 65 64 63 62 61
60
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
I/O0
I/O1
I/O2
I/O3
I/O4
I/O5
I/O6
I/O7
GND
I/O8
I/O16
I/O17
I/O18
I/O19
I/O20
I/O21
I/O22
I/O23
GND
I/O24
I/O25
I/O26
I/O27
I/O28
I/O29
I/O30
I/O31
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
Output Enable
Reset/Powerdown
Power Supply
Ground
RESET
VCC
The White 68 lead G2U CQFP fills the
same fit and function as the JEDEC 68 lead
CQFJ or 68 PLCC. But the G2U has the
TCE and lead inspection advantage of the
CQFP form.
GND
I/O9
I/O10
I/O11
I/O12
I/O13
I/O14
I/O15
Block Diagram
27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43
WE1# CS1#
WE2# CS2#
WE3# CS3#
WE4# CS4#
RESET#
OE#
A0-19
1M x 8
1M x 8
1M x 8
1M x 8
8
8
8
8
I/O16-23
I/O24-31
I/O0-7
I/O8-15
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
March 2007
Rev. 6
2
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
WF1M32B-XXX3
White Electronic Designs
ABSOLUTE MAXIMUM RATINGS
CAPACITANCE
TA = +25°C
Parameter
Unit
Parameter
Symbol
Conditions
Max Unit
50 pF
20 pF
20 pF
20 pF
50 pF
Operating Temperature
Supply Voltage Range (VCC)
Signal Voltage Range
-55 to +125
-0.5 to +4.0
-0.5 to Vcc +0.5
-65 to +150
+300
°C
V
OE# capacitance
COE
CWE
CCS
CI/O
CAD
VIN = 0 V, f = 1.0 MHz
VIN = 0 V, f = 1.0 MHz
VIN = 0 V, f = 1.0 MHz
VI/O = 0 V, f = 1.0 MHz
VIN = 0 V, f = 1.0 MHz
WE#1-4 capacitance
CS1-4 capacitance
Data I/O capacitance
Address input capacitance
V
Storage Temperature Range
Lead Temperature (soldering, 10 seconds)
Endurance (write/erase cycles)
NOTES:
°C
°C
1,000,000 min. cycles
This parameter is guaranteed by design but not tested.
1. Stresses above the absolute maximum rating may cause permanent damage to the
device. Extended operation at the maximum levels may degrade performance and
affect reliability.
RECOMMENDED OPERATING CONDITIONS
DATA RETENTION
Parameter
Symbol
VCC
VIH
Min
Max
Unit
V
Parameter
Test Conditions
150°C
Min
10
Unit
Years
Years
Supply Voltage
3.0
3.6
Minimum Pattern Data
Retention Time
Input High Voltage
Input Low Voltage
Operating Temp. (Mil.)
Operating Temp. (Ind.)
0.7 x VCC VCC + 0.3
V
125°C
20
VIL
-0.5
-55
-40
+0.8
+125
+85
V
TA
°C
°C
TA
DC CHARACTERISTICS – CMOS COMPATIBLE
VCC = 3.3V, VSS = 0V, -55°C ≤ TA ≤ +125°C
Parameter
Symbol
ILI
Conditions
Min
Max
10
Unit
µA
µA
mA
mA
µA
V
Input Leakage Current
VCC = 3.6, VIN = GND or VCC
VCC = 3.6, VIN = GND or VCC
CS# = VIL, OE# = VIH, f = 5MHz
CS# = VIL, OE# = VIH
Output Leakage Current
VCC Active Current for Read (1)
VCC Active Current for Program or Erase (2)
ILOx32
ICC1
10
120
140
200
0.45
ICC2
V
CC Standby Current
ICC3
VCC = 3.6, CS = VIH, f = 5MHz
IOL =4.0 mA, VCC = 3.0
Output Low Voltage
Output High Voltage
Low VCC Lock-Out Voltage (4)
NOTES:
VOL
VOH1
VLKO
IOH = -2.0 mA, VCC = 3.0
0.85 X VCC
2.3
V
2.5
V
1. The ICC current listed includes both the DC operating current and the frequency dependent component (at 5 MHz). The frequency component typically is less than 8 mA/MHz, with
OE# at VIH
CC active while Embedded Algorithm (program or erase) is in progress.
.
2.
I
3. DC test conditions: VIL = 0.3V, VIH = VCC - 0.3V
4. Guaranteed by design, but not tested.
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
March 2007
Rev. 6
3
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
WF1M32B-XXX3
White Electronic Designs
AC CHARACTERISTICS – WRITE/ERASE/PROGRAM OPERATIONS – CS# CONTROLLED
VCC = 3.3V, VSS = 0V, -55°C ≤ TA ≤ +125°C
Parameter
Symbol
-100
-120
-150
Unit
Min
100
0
Max
Min
120
0
Max
Min
150
0
Max
Write Cycle Time
tAVAV
tWLEL
tELEH
tWC
tWS
tCP
ns
ns
Write Enable Setup Time
Chip Select Pulse Width
Address Setup Time
45
0
50
0
50
0
ns
tAVEL
tAS
ns
Data Setup Time
tDVEH
tEHDX
tELAX
tDS
45
0
50
0
50
0
ns
Data Hold Time
tDH
tAH
ns
Address Hold Time
45
20
50
20
50
20
ns
Chip Select Pulse Width High
Duration of Byte Programming Operation (1)
Sector Erase Time
tEHEL
tCPH
ns
tWHWH1
tWHWH2
tGHEL
300
15
300
15
300
15
µs
sec
µs
sec
Read Recovery Time (2)
Chip Programming Time
0
0
0
50
50
50
1. Typical value for tWHWH1 is 9µs.
2. Guaranteed by design, but not tested.
AC TEST CIRCUIT
AC TEST CONDITIONS
Parameter
Typ
Unit
V
IOL
Input Pulse Levels
VIL = 0, VIH = 2.5
Current Source
Input Rise and Fall
5
ns
V
Input and Output Reference Level
Output Timing Reference Level
NOTES:
1.5
1.5
V
D.U.T.
VZ
≈
1.5V
(Bipolar Supply)
Ceff = 50 pf
V
I
Z is programmable from -2V to +7V.
OL & IOH programmable from 0 to 16mA.
Tester Impedance Z0 = 75 Ω.
Z is typically the midpoint of VOH and VOL
OL & IOH are adjusted to simulate a typical resistive load circuit.
ATE tester includes jig capacitance.
IOH
V
I
.
Current Source
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
March 2007
Rev. 6
4
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
WF1M32B-XXX3
White Electronic Designs
AC CHARACTERISTICS – WRITE/ERASE/PROGRAM OPERATIONS – WE# CONTROLLED
VCC = 3.3V, VSS = 0V, -55°C ≤ TA ≤ +125°C
Parameter
Symbol
-100
-120
-150
Unit
Min
100
0
Max
Min
120
0
Max
Min
150
0
Max
Write Cycle Time
tAVAV
tWC
tCS
tWP
tAS
ns
ns
Chip Select Setup Time
Write Enable Pulse Width
Address Setup Time
tELWL
tWLWH
tAVWL
tDVWH
tWHDX
tWLAX
tWHWL
tWHWH1
tWHWH2
tGH
50
0
50
0
65
0
ns
ns
Data Setup Time
tDS
50
0
50
0
65
0
ns
Data Hold Time
tDH
tAH
ns
Address Hold Time
50
30
50
30
65
35
ns
Write Enable Pulse Width High
Duration of Byte Programming Operation (1)
Sector Erase
tWPH
ns
300
15
300
15
300
15
µs
sec
µs
µs
sec
ns
Read Recovery Time before Write (3)
VCC Setup Time
0
0
0
W
L
tVCS
50
50
50
Chip Programming Time
Output Enable Setup Time
Output Enable Hold Time (2)
50
50
50
tOES
tOEH
0
0
0
10
10
10
ns
1. Typical value for tWHWH1 is 9µs.
2. For Toggle and Data Polling.
3. Guaranteed by design, but not tested.
AC CHARACTERISTICS – READ-ONLY OPERATIONS
VCC = 3.3V, VSS = 0V, -55°C ≤ TA ≤ +125°C
Parameter
Symbol
-100
-120
-150
Unit
Min
Max
Min
Max
Min
Max
Read Cycle Time
tAVAV
tRC
tACC
tCE
tOE
tDF
100
120
150
ns
ns
ns
ns
ns
ns
ns
Address Access Time
tAVQV
tELQV
tGLQV
tEHQZ
tGHQZ
tAXQX
100
100
40
120
120
50
150
150
55
Chip Select Access Time
Output Enable to Output Valid
Chip Select High to Output High Z (1)
Output Enable High to Output High Z (1)
30
30
40
tDF
30
30
40
Output Hold from Addresses, CS# or OE#
Change, whichever is First
tOH
0
0
0
1. Guaranteed by design, not tested.
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
March 2007
Rev. 6
5
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
WF1M32B-XXX3
White Electronic Designs
AC WAVEFORMS FOR READ OPERATIONS
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
March 2007
Rev. 6
6
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
WF1M32B-XXX3
White Electronic Designs
WRITE/ERASE/PROGRAM OPERATION, WE# CONTROLLED
NOTES:
1. PA is the address of the memory location to be programmed.
2. PD is the data to be programmed at byte address.
3. D7# is the output of the complement of the data written to each chip.
4.
DOUT is the output of the data written to the device.
5. Figure indicates last two bus cycles of four bus cycle sequence.
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
March 2007
Rev. 6
7
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
WF1M32B-XXX3
White Electronic Designs
AC WAVEFORMS CHIP/SECTOR ERASE OPERATIONS
NOTE:
1. SA is the sector address for Sector Erase.
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
March 2007
Rev. 6
8
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
WF1M32B-XXX3
White Electronic Designs
AC WAVEFORMS FOR DATA# POLLING DURING EMBEDDED ALGORITHM OPERATIONS
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
March 2007
Rev. 6
9
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
WF1M32B-XXX3
White Electronic Designs
ALTERNATE CS# CONTROLLED PROGRAMMING OPERATION TIMINGS
NOTES:
1. PA represents the address of the memory location to be programmed.
2. PD represents the data to be programmed at byte address.
3. D7# is the output of the complement of the data written to each chip.
4. DOUT is the output of the data written to the device.
5. Figure indicates the last two bus cycles of a four bus cycle sequence.
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
March 2007
Rev. 6
10
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
WF1M32B-XXX3
White Electronic Designs
PACKAGE 510: 68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G2U)
o
o
The White 68 lead G2U CQFP fills the same fit
and function as the JEDEC 68 lead CQFJ or
68 PLCC. But the G2U has the TCE and lead
inspection advantage of the CQFP form.
0.940" TYP
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
March 2007
Rev. 6
11
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
WF1M32B-XXX3
White Electronic Designs
PACKAGE 400: 66 PIN, PGA TYPE, CERAMIC HEX-IN-LINE PACKAGE, HIP (H1)
4.60 (0.181)
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
March 2007
Rev. 6
12
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
WF1M32B-XXX3
White Electronic Designs
ORDERING INFORMATION
W F 1M32 B - XXX X X 3 X
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
PROGRAMMING VOLTAGE
3 = 3.3V
DEVICE GRADE:
M = Military Screened
I = Industrial
C = Commercial
-55°C to +125°C
-40°C to +85°C
0°C to +70°C
PACKAGE TYPE:
H1 = Ceramic Hex In line Package, HIP (Package 401)
G2U = Ceramic Quad Flat Pack, Low Profile CQFP (Package 510)
ACCESS TIME (ns)
IMPROVEMENT MARK
B = Boot Block (Bottom Sector)
ORGANIZATION, 1M x 32
User configurable as 2M x 16 or 4M x 8
Flash
WHITE ELECTRONIC DESIGNS CORP.
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
March 2007
Rev. 6
13
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
相关型号：
WF1M32B-100H1C3A
Flash Module, 1MX32, 100ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
WEDC
WF1M32B-100H1I3
Flash Module, 1MX32, 100ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
MERCURY
©2020 ICPDF网 联系我们和版权申明