WF128K32N-050H1C5 [WEDC]
128KX32 5V FLASH MODULE, SMD 5962-94716; 128KX32 5V闪存模块， SMD 5962-94716
| 型号： | WF128K32N-050H1C5 |
| 厂家： | 
WHITE ELECTRONIC DESIGNS CORPORATION |
| 描述： | 128KX32 5V FLASH MODULE, SMD 5962-94716 |
| 文件： | 总15页 (文件大小：420K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
WF128K32-XXX5
White Electronic Designs
128KX32 5V FLASH MODULE, SMD 5962-94716
FEATURES
ꢀ
Commercial, Industrial and Military Temperature
Ranges
ꢀ
ꢀ
Access Times of 50**, 60, 70, 90, 120, 150ns
Packaging:
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
5 Volt Programming. 5V 10ꢀ Supply
Low Power CMOS, 1mA Standby Typical
Embedded Erase and Program Algorithms
TTL Compatible Inputs and CMOS Outputs
•
66 pin, PGA Type, 1.075 inch square, Hermetic
Ceramic HIP (Package 400)
•
68 lead, Hermetic CQFP (G2U), 22.4mm
(0.880 inch) square, 3.56mm (0.140 inch) high
(Package 510)
Built-in Decoupling Caps and Multiple Ground Pins
for Low Noise Operation
•
68 lead, Hermetic CQFP (G2L), 22.4mm
(0.880 inch) square, 4.06mm (0.160 inch) high
(Package 528)
ꢀ
ꢀ
Page Program Operation and Internal Program
Control Time
ꢀ
Sector Architecture
Weight
WF128K32-XG2LX5 - 8 grams typical
WF128K32-XG2UX5 - 8 grams typical
WF128K32-XH1X5 - 13 grams typical
•
•
8 equal size sectors of 16KBytes each
Any combination of sectors can be concurrently
erased. Also supports full chip erase
ꢀ
ꢀ
100,000 Erase/Program Cycles Typical, 0°C to
+70°C
Note: For programming information refer to Flash Programming 1M5 Application Note.
Organized as 128Kx32
* This product is subject to change without notice.
* * The access time of 50ns is available in Industrial and Commercial temperature
ranges only.
FIGURE 1 – PIN CONFIGURATION FOR WF128K32N-XH1X5
Top View
Pin Description
I/O0-31
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
A0-16
I/O24
V
CC
I/O31
I/O30
I/O29
I/O28
I/O
I/O
8
9
WE
2
#
I/O15
I/O14
I/O13
I/O12
OE#
NC
WE1-4
#
I/O25
I/O26
CS4
#
#
CS2
#
CS1-4
OE#
VCC
#
WE4
I/O10
GND
I/O11
A
7
I/O27
A14
A16
A11
A0
GND
NC
A
12
A
A
A
4
5
6
A1
A2
A3
A
A
A
V
10
Not Connected
NC
9
Block Diagram
A
13
15
CC
WE1#
WE
1
#
CS
1
#
WE
2
#
CS
2
#
WE
3
#
CS
3
#
4 4
WE # CS #
OE#
A
8
WE
3
3
#
#
I/O23
I/O22
I/O21
I/O20
NC
I/O
I/O
I/O
I/O
7
A
0-16
I/O16
I/O17
I/O18
CS
I/O
I/O
I/O
0
CS
NC
I/O
1
#
6
5
4
128K x 8
128K x 8
128K x 8
128K x 8
GND
I/O19
1
2
8
8
8
8
3
I/O0-7
I/O8-15
I/O16-23
I/O24-31
March 2006
Rev. 8
1
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WF128K32-XXX5
White Electronic Designs
FIGURE 3 – PIN CONFIGURATION FOR WF128K32-XG2UX5 AND WF128K32-XG2LX5
TOP VIEW
PIN DESCRIPTION
I/O0-31
A0-16
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
9
8
7
6
5
4
3
2
1
68 67 66 65 64 63 62 61
60 I/O16
WE1-4
#
I/O0 10
I/O1 11
I/O2 12
I/O3 13
I/O4 14
I/O5 15
I/O6 16
I/O7 17
GND 18
I/O8 19
I/O9 20
I/O10 21
I/O11 22
I/O12 23
I/O13 24
I/O14 25
I/O15 26
CS1-4
OE#
VCC
#
59 I/O17
58 I/O18
57 I/O19
56 I/O20
55 I/O21
54 I/O22
53 I/O23
52 GND
51 I/O24
50 I/O25
49 I/O26
48 I/O27
47 I/O28
46 I/O29
45 I/O30
44 I/O31
GND
NC
Not Connected
BLOCK DIAGRAM
WE
1
#
CS
1
#
WE
2
#
CS
2
#
WE
3
#
CS
3
#
4 4
WE # CS #
OE#
A
0-16
128K x 8
128K x 8
128K x 8
128K x 8
2728 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43
8
8
8
8
I/O0-7
I/O8-15
I/O16-23
I/O24-31
March 2006
Rev. 8
2
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WF128K32-XXX5
White Electronic Designs
ABSOLUTE MAXIMUM RATINGS (1)
RECOMMENDED OPERATING CONDITIONS
Parameter
Operating Temperature
Supply Voltage Range (VCC
Signal voltage range (any pin except A9) (2)
Storage Temperature Range
Unit
°C
V
V
°C
°C
Parameter
Supply Voltage
Input High Voltage
Input Low Voltage
Operating Temp. (Mil.)
A9 Voltage for Sector Protect
Symbol
VCC
VIH
VIL
TA
Min
4.5
2.0
-0.5
-55
11.5
Max
5.5
VCC + 0.3
+0.8
+125
12.5
Unit
V
V
V
°C
V
-55 to +125
-2.0 to +7.0
-2.0 to +7.0
-65 to +150
+300
)
Lead Temperature (soldering, 10 seconds)
Data Retention Mil Temp
VID
10 years
Endurance (write/erase cycles) Mil Temp
A9 Voltage for sector protect (VID) (3)
10,000 cycles min.
-2.0 to +14.0
V
CAPACITANCE
NOTES:
Ta = +25°C
1. Stresses above the absolute maximum rating may cause permanent damage to
the device. Extended operation at the maximum levels may degrade performance
and affect reliability.
Parameter
Symbol
COE
CWE
Conditions
Max Unit
OE# capacitance
WE1-4# capacitance
HIP (PGA) H1
VIN = 0V, f = 1.0 MHz 50 pF
2. Minimum DC voltage on input or I/O pins is -0.5V. During voltage transitions,
inputs may overshoot VSS to -2.0 V for periods of up to 20ns. Maximum DC
voltage on output and I/O pins is Vcc + 0.5V. During voltage transitions, outputs
may overshoot to VCC + 2.0 V for periods of up to 20ns.
3. Minimum DC input voltage on A9 pin is -0.5V. During voltage transitions, A9 may
overshoot Vss to -2V for periods of up to 20ns. Maximum DC input voltage on A9
is +13.5V which may overshoot to 14.0 V for periods up to 20ns.
VIN = 0V, f = 1.0 MHz
pF
20
15
CQFP G2U/G2L
CS1-4# capacitance
Data# I/O capacitance
Address input capacitance
CCS
CI/O
CAD
VIN = 0V, f = 1.0 MHz 20 pF
VI/O = 0V, f = 1.0 MHz 20 pF
VIN = 0V, f = 1.0 MHz 50 pF
This parameter is guaranteed by design but not tested.
DC CHARACTERISTICS – CMOS COMPATIBLE
VCC = 5.0V, VSS = 0V, -55°C ≤ TA ≤ +125°C
Parameter
Symbol
ILI
ILOx32
ICC1
Conditions
Min
Max
10
10
140
200
Unit
µA
µA
mA
mA
Input Leakage Current
Output Leakage Current
VCC Active Current for Read (1)
VCC Active Current for Program or
Erase (2)
VCC = 5.5, VIN = GND to VCC
VCC = 5.5, VIN = GND to VCC
CS# = VIL, OE# = VIH
CS# = VIL, OE# = VIH
ICC2
VCC Standby Current
ICC3
ICC4
VOL
VCC = 5.5, CS# = VIH, f = 5MHz
VCC = 5.5, CS# = VIH
IOL = 8.0 mA, VCC = 4.5
IOH = -2.5 mA, VCC = 4.5
6.5
0.6
0.45
mA
mA
V
VCC Static Current
Output Low Voltage
Output High Voltage
VOH1
0.85 x
VCC
V
Output High Voltage
VOH2
VLKO
IOH = -100 µA, VCC = 4.5
VCC
V
V
-0.4
Low VCC Lock Out Voltage
NOTES:
3.2
1. The ICC current listed includes both the DC operating current and the frequency
dependent component (at 5 MHz).
The frequency component typically is less than 2 mA/MHz, with OE# at VIH
.
2.
ICC active while Embedded Algorithm (program or erase) is in progress.
3. DC test conditions: VIL = 0.3V, VIH = VCC - 0.3V
March 2006
Rev. 8
3
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WF128K32-XXX5
White Electronic Designs
AC CHARACTERISTICS – WRITE/ERASE/PROGRAM OPERATIONS, CS# CONTROLLED
VCC = 5.0V, VSS = 0V, -55°C ≤ TA ≤ +125°C
Parameter
Symbol
-50
-60
-70
-90
-120
-150
Unit
Min Max Min Max Min Max Min Max Min Max Min Max
Write Cycle Time
tAVAV tWC
tWLEL tWS
tELEH tCP
tAVEL tAS
tDVEH tDS
tEHDX tDH
tELAX tAH
tEHWH tWH
tEHEL tCPH
tWHWH1
50
0
60
0
70
0
90
0
120
0
150
0
ns
ns
ns
ns
ns
ns
ns
ns
ns
µs
sec
ns
WE# Setup Time
CS# Pulse Width
25
0
30
0
35
0
45
0
50
0
50
0
Address Setup Time
Data Setup Time
25
0
30
0
30
0
45
0
50
0
50
0
Data Hold Time
Address Hold Time
40
0
45
0
45
0
45
0
50
0
50
0
WE# Hold from WE# High
CS# Pulse Width High
Duration of Programming Operation
Duration of Erase Operation
Read Recovery before Write
Chip Programming Time
20
14
2.2
0
20
14
2.2
0
20
14
2.2
0
20
14
2.2
0
20
14
2.2
0
20
14
2.2
0
tWHWH2
60
60
60
60
60
60
tGHEL
12.5
12.5
12.5
12.5
12.5
12.5 sec
FIGURE 4 – AC TEST CIRCUIT
AC Test Conditions
Parameter
Input Pulse Levels
Input Rise and Fall
Input and Output Reference Level
Output Timing Reference Level
Notes:
Typ
IL = 0, VIH = 3.0
Unit
V
ns
V
V
5
1.5
1.5
V
V
Z is programmable from -2V to +7V.
OL & IOH programmable from 0 to 16mA.
Tester Impedance Z0 = 75 Ω.
Z is typically the midpoint of VOH and VOL
OL & IOH are adjusted to simulate a typical resistive load circuit.
ATE tester includes jig capacitance.
I
V
.
I
March 2006
Rev. 8
4
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WF128K32-XXX5
White Electronic Designs
AC CHARACTERISTICS – WRITE/ERASE/PROGRAM OPERATIONS, WE# CONTROLLED
VCC = 5.0V, VSS = 0V, -55°C ≤ TA ≤ +125°C
Parameter
Symbol
-50
-60
-70
-90
-120
-150
Unit
Min Max Min Max Min Max Min Max Min Max Min Max
Write Cycle Time
tAVAV tWC
tELWL tCS
tWLWH tWP
tAVWL tAS
tDVWH tDS
tWHDX tDH
tWLAX tAH
tWHEH tCH
tWHWL tWPH
50
0
60
0
70
0
90
0
120
0
150
0
ns
ns
ns
ns
ns
ns
ns
ns
ns
µs
Chip Select Setup Time
Write Enable Pulse Width
Address Setup Time
Data Setup Time
25
0
30
0
35
0
45
0
50
0
50
0
25
0
30
0
30
0
45
0
50
0
50
0
Data Hold Time
Address Hold Time
40
0
45
0
45
0
45
0
50
0
50
0
Chip Select Hold Time
Write Enable Pulse Width High
20
14
20
14
20
14
20
14
20
14
20
14
Duration of Byte Programming Operation tWHWH1
(min)
Sector Erase Time
tWHWH2
tGHWL
2.2
0
60
2.2
0
60
2.2
0
60
2.2
0
60
2.2
0
60
2.2
0
60
sec
ns
Read Recovery Time Before Write
VCC Setup Time
tVCS
50
50
50
50
50
50
µs
Chip Programming Time
Output Enable Setup Time
Output Enable Hold Time (1)
1. For Toggle and Data Polling.
12.5
12.5
12.5
12.5
12.5
12.5 sec
tOES
tOEH
0
0
0
0
0
0
ns
ns
10
10
10
10
10
10
AC CHARACTERISTICS – READ ONLY OPERATIONS
VCC = 5.0V, VSS = 0V, -55°C ≤ TA ≤ +125°C
Parameter
Symbol
-50
-60
-70
-90
-120
-150
Unit
Min Max Min Max Min Max Min Max Min Max Min Max
Read Cycle Time
tAVAV tRC
tAVQV tACC
tELQV tCE
tGLQV tOE
tEHQZ tDF
tGHQZ tDF
tAXQX tOH
50 60 70 90 120 150
ns
ns
ns
ns
ns
ns
ns
Address Access Time
50
50
25
20
20
60
60
30
20
20
70
70
35
20
20
90
90
40
25
25
120
120
50
150
150
55
Chip Select Access Time
OE# to Output Valid
Chip Select to Output High Z (1)
OE# High to Output High Z (1)
30
35
30
35
Output Hold from Address, CS# or OE#
Change, whichever is first
0
0
0
0
0
0
1. Guaranteed by design, not tested.
March 2006
Rev. 8
5
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WF128K32-XXX5
White Electronic Designs
FIGURE 5 – AC WAVEFORMS FOR READ OPERATIONS
tRC
Addresses
Addresses Stable
DX
tACC
CS1#/CS2#
tDF
tOE
OE#
WE#
tCE
tOH
DX
High Z
High Z
Outputs
Output Valid
March 2006
Rev. 8
6
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WF128K32-XXX5
White Electronic Designs
FIGURE 6 – WRITE/ERASE/PROGRAM OPERATION, WE# CONTROLLED
Data# Polling
Addresses
CS#
5555H
tWC
PA
PA
tAH
tRC
tAS
tGHWL
OE#
tWP
tWHWH1
WE#
Data
tWPH
tDH
tCS
tDF
tOE
AOH
PD
D7#
DOUT
tDS
tOH
5.0 V
tCE
NOTES:
1. PA is the address of the memory location to be programmed.
2. PD is the data to be programmed at byte address.
3. D7# is the output of the complement of the data written to the device (for each chip).
4.
DOUT is the output of the data written to the device.
5. Figure indicates last two bus cycles of four bus cycle sequence.
March 2006
Rev. 8
7
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WF128K32-XXX5
White Electronic Designs
FIGURE 7 – AC WAVEFORMS CHIP/SECTOR ERASE OPERATIONS
tAH
Addresses
CS#
5555H
tAS
2AAAH
5555H
5555H
2AAAH
SA
tGHWL
OE#
tWP
WE#
Data
tWPH
tDH
tCS
AAH
55H
80H
AAH
55H
10H/30H
tDS
VCC
tVDS
Notes:
1. SA is the sector address for Sector Erase.
March 2006
Rev. 8
8
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WF128K32-XXX5
White Electronic Designs
FIGURE 8 – AC WAVEFORMS FOR DATA# POLLING DURING EMBEDDED ALGORITHM OPERATIONS
tCH
CS#
tDF
tOE
OE#
tOEH
WE#
tCE
tOH
High Z
D7 =
Valid Data
D7#
D7
tWHWH 1 or 2
Data
D0-D7
Valid Data
D0-D6
D0-D6 = Invalid
tOE
March 2006
Rev. 8
9
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WF128K32-XXX5
White Electronic Designs
FIGURE 9 – WRITE/ERASE/PROGRAM OPERATION, CS# CONTROLLED
Data# Polling
Addresses
WE#
5555H
tWC
PA
PA
tAH
tAS
tGHEL
OE#
tCP
tWHWH1
CS#
Data
tCPH
tWS
tDH
D7#
AOH
PD
DOUT
tDS
5.0 V
NOTES:
1. PA represents the address of the memory location to be programmed.
2. PD represents the data to be programmed at byte address.
3. D7# is the output of the complement of the data written to the device (for each chip).
4.
DOUT is the output of the data written to the device.
5. Figure indicates the last two bus cycles of a four bus cycle sequence.
March 2006
Rev. 8
10
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WF128K32-XXX5
White Electronic Designs
PACKAGE 400: 66 PIN, PGA TYPE, CERAMIC HEX-IN-LINE PACKAGE, HIP (H1)
4.60 (0.181)
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
March 2006
Rev. 8
11
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WF128K32-XXX5
White Electronic Designs
PACKAGE 510: 68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G2U)
o
o
The White 68 lead G2U CQFP fills the same fit
and function as the JEDEC 68 lead CQFJ or
68 PLCC. But the G2U has the TCE and lead
inspection advantage of the CQFP form.
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
March 2006
Rev. 8
12
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WF128K32-XXX5
White Electronic Designs
PACKAGE 528 : 68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G2L)
25.15 (0.990) 0.25 (0.010) MAX
5.10 (0.200) MAX
22.36 (0.880) 0.25 (0.010) MAX
0.25 (0.010) 0.10 (0.002)
0.23 (0.009) REF
24.0 (0.946)
0.25 (0.010)
R 0.127
(0.005)
1.37 (0.054) MIN
0.004
2O / 9O
0.89 (0.035)
1.14 (0.045)
1.27 (0.050) TYP
0.38 (0.015) 0.05 (0.002)
20.31 (0.800) REF
0.940" TYP
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
March 2006
Rev. 8
13
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WF128K32-XXX5
White Electronic Designs
ORDERING INFORMATION
W F 128K32 X - XXX X X 5 X
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
VPP PROGRAMMING VOLTAGE
5 = 5V
DEVICE GRADE:
Q = MIL - STD 833 Compliant
M = Military Screened
= Industrial
C = Commercial
-55°C to +125°C
-40°C to +85°C
0°C to + 70°C
I
PACKAGE TYPE:
H1 = 1.075" sq. Ceramic Hex In-line Package, HIP (Package 400)
G2U = 22.4mm Ceramic Quad Flat Pack, Low Profile CQFP (Package 510)
G2L = 22.4mm Ceramic Quad Flat Pack, Low Profile CQFP (Package 528)
ACCESS TIME (ns)
IMPROVEMENT MARK
N = No Connect at pin 8, 21, 28 and 39 in HIP for Upgrade
ORGANIZATION, 128K x 32
User configurable as 256K x 16 or 512K x 8
Flash
WHITE ELECTRONIC DESIGNS CORP.
March 2006
Rev. 8
14
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
WF128K32-XXX5
White Electronic Designs
DEVICE TYPE
128K x 32 Flash
128K x 32 Flash
128K x 32 Flash
128K x 32 Flash
128K x 32 Flash
SPEED
150ns
120ns
90ns
PACKAGE
66 pin HIP (H1)
66 pin HIP (H1)
66 pin HIP (H1)
66 pin HIP (H1)
66 pin HIP (H1)
SMD NO.
5962-94716 01H8X
5962-94716 02H8X
5962-94716 03H8X
5962-94716 04H8X
5962-94716 05H8X
70ns
60ns
128K x 32 Flash
128K x 32 Flash
128K x 32 Flash
128K x 32 Flash
128K x 32 Flash
150ns
120ns
90ns
68 lead CQFP (G2U)
68 lead CQFP (G2U)
68 lead CQFP (G2U)
68 lead CQFP (G2U)
68 lead CQFP (G2U)
5962-94716 01HNX
5962-94716 02HNX
5962-94716 03HNX
5962-94716 04HNX
5962-94716 05HNX
70ns
60ns
128K x 32 Flash
128K x 32 Flash
128K x 32 Flash
128K x 32 Flash
128K x 32 Flash
150ns
120ns
90ns
68 lead CQFP (G2L)
68 lead CQFP (G2L)
68 lead CQFP (G2L)
68 lead CQFP (G2L)
68 lead CQFP (G2L)
5962-94716 01HAX
5962-94716 02HAX
5962-94716 03HAX
5962-94716 04HAX
5962-94716 05HAX
70ns
60ns
Note 1: Package Not Recommended For New Design
March 2006
Rev. 8
15
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
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