WLPN505040 [WALSIN]
SMD Shielded Power Inductors;型号: | WLPN505040 |
厂家: | Walsin Technology |
描述: | SMD Shielded Power Inductors |
文件: | 总10页 (文件大小:278K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
WLPN505040 Series
SMD Shielded Power Inductors
*Contents in this sheet are subject to change without prior notice.
Page 1 of 10
ASC _WLPN505040 Series_V3.0
Nov. Y2017
Features
1. Close magnetic loop with magnetic resin shielded.
2. High inductance.
Applications
1. General propose power inductor in DC power system.
2. Inductor in DC/DC converter.
3. LC filter in Audio D class Amplifier.
4. Use in STB、Notebook、Radio、LCDs 、other electrical devices.
Shape and Dimension
Unit: mm
3.6
1.5
1.5
Recommended Land-Pattern
M3
M3
Package Size
WLPN505040
M1
M2
M4
1.2±0.2
M5
(N1R5~M100)
(M150~M470)
4.9±0.2
4.9±0.2
3.3±0.2
4.1 MAX.
4.0 MAX.
Ordering Information
WL
PN
5050
40
N
1R5
L
B
Product
Code
Series
Dimensions
Thickness
Tolerance
Value
Packing Code
WL:
Inductor
SMD
Shielded
Power
4.9 * 4.9 mm
4.1 mm
1R5 = 1.5uH
150 = 15.0uH
B:STD
M: ± 20%
N: ± 30%
L
=13” Reeled
(Embossed tape)
Inductors
Page 2 of 10
ASC _WLPN505040 Series_V3.0
Nov. Y2017
Electrical Characteristics
Rated Current (mA)
Test
Freq
(KHz)
SRF
Min.
(MHz)
Inductance
Tolerance
DCR (Ω)
±20%.
WLPN505040 Series
L (uH)
Saturation
Temperature
Rise Current
Idc2
Current
Idc1
WLPN505040N1R5LB
WLPN505040N2R2LB
WLPN505040N3R3LB
WLPN505040N4R7LB
WLPN505040M6R8LB
WLPN505040M100LB
WLPN505040M150LB
WLPN505040M220LB
WLPN505040M330LB
WLPN505040M470LB
1.5
2.2
3.3
4.7
6.8
10
N
N
100
100
100
100
100
100
100
100
100
100
0.017
0.022
0.027
0.029
0.049
0.056
0.080
0.126
0.180
0.310
60
42
32
28
21
18
13
9
6400
5000
4000
3300
2800
2300
2000
1500
1300
1100
4500
3700
3300
3100
2400
2100
1800
1400
1200
900
N
N
M
M
M
M
M
M
15
22
33
7
47
6
1. Test Frequency: 100KHz
2. Test Equipment:
Inductance: Chroma3302+1320+16502. or equivalent.
DCR: Chroma16502 or equivalent.
SRF: HP4291B or equivalent.
3. Saturation Current Idc1: The value of current causes a 30% inductance reduction from initial value.
4. Temperature rise current Idc2: The value of current causes a 40℃ temperature rise.
5. Rated Current: Either Idc1 or Idc2 whichever is smaller.
6. Operating Temperature Range:-25℃ to +125℃ (Including self-temperature rise)
7. Storage Temp. Range:-40℃ to +85℃.
8. MSL:Level 1
Structural Drawing:
Magnetic Shielded Type
1 Ferrite core.
2 Winding wire
Ni-Zn ferrite
. .Polyurethane-copper wire
3 Over-coating resin. Epoxy resin, containing ferrite powder
4 Electrode
.
.External electrode (substrate) Ag
External electrode (base plating) Ni-Sn
External electrode (top surface solder coating) Sn-Ag-Cu
Page 3 of 10
ASC _WLPN505040 Series_V3.0
Nov. Y2017
ELECTRICAL CURVE
Inductance vs. DC Current
100
470M
220M
100M
10
4R7M
2R2N
1
0.1
10
100
1.000
10.000
DC Current (m A)
Core Chipping
The appearance standard of the chipping size in top side, of bottom side ferrite core is following dimension.
L
W
1.5mmMax.
1.5mmMax.
a
..1 Width direction (dimension a): Acceptable when a<=w/2
Nonconforming when a>w/2
2
3
Length direction (dimension b): Dimension b is not specified.
When total area of exposed wire occurring to each sides is
not greater than 50% of coating resin area, that is acceptable.
b
w
Page 4 of 10
ASC _WLPN505040 Series_V3.0
Nov. Y2017
TYPICAL RoHS REFLOW PROFILE
Page 5 of 10
ASC _WLPN505040 Series_V3.0
Nov. Y2017
Mechanical Performance /Environmental Test Performance Specifications: (WLPN505040 series)
Test Item
Standard
Test method
Resistance to
Deflection
No damage.
20
R230
10
Force
Rod
Board
Test
Sample
R5
45±2
45±2
1.5
1.5
The test samples shall be soldered to the test board
by the reflow soldering conditions show in Table 1.
As illustrated below, apply force in the direction of the
Arrow indicating until deflection of the test board
Reaches to 2 mm.
Land dimensions
Test board size :100×40×10
Test board material l: glass epoxy-resin
Solder cream thickness:0.1
Unit: mm
Adhesion of
Terminal
Shall not come off PC
board
The test samples shall be soldered to the test board
By the reflow soldering conditions shown in Table 1.
Electrode
10 N, 5 s
Applied force:10 N to X and Y directions
Duration:5 s.
Solder cream thickness:0.1 mm
(Refer to recommended Land Pattern Dimensions
Defined in “Precaution”)
Body strength
No damage
Applied force :20 N
Duration :10 s
R0.5mm
Sample
0.6W
Page 6 of 10
ASC _WLPN505040 Series_V3.0
Nov. Y2017
Test Item
Standard
Test method
The test samples shall be soldered to the test board by
The reflow soldering conditions shown in Table 1.Then
It shall be submitted to below test conditions
Resistance to
Vibration
△L/L:within±10%
No abnormality
observed
In appearance
Frequency range 10Hz~55Hz
1.5mm(May not exceed acceleration
Total Amplitude
196 m/S2)
Sweeping Method 10Hz to 55Hz to 10 Hz for 1 min.
Time
For 2 hours on each X,Y, and Z axis.
The test sample shall be exposed to reflow oven at
230±5 deg C for 40 seconds, with peak temperature at
260±5 deg C for 5 seconds, 2 times.
Resistance to
Soldering heat
(Reflow)
△L/L:within±10%
No abnormality
observed
In appearance
Test board thickness:1.0 mm
Test board material :glass epoxy-resin
The test samples shall be dipped in flux, and then
Immersed in molten solder as shown in below table.
Flux: Methanol solution containing rosin 25%
Solder ability
At least 90% of surface
of terminal electrode is
covered by new solder.
Solder Temperature
Time
245±deg C
5±1.0 S.
Immersing Speed
25 mm/s
Temperature
Characteristics
Measurement of inductance shall be taken at temperature
Range within -25 deg C to +85 deg C.
With reference to inductance value at +20 deg C, change
Rate shall be calculated.
The test samples shall be soldered to test board
By the reflow soldering conditions shown in Table 1.
The test samples shall be placed at specified
Shown in below table in sequence.
△L/L:within±20%
No abnormality
observed
In appearance
△L/L:within±10%
No abnormality
observed
Thermal shock
In appearance
The temperature cycle shall be repeated 100 cycles.
Conditions of steps for 1 cycle
Step
1
Temperature
-40±3 deg C
Time(min)
30±3
2
3
4
Room Temp
85±2 deg C
Room Temp
3 maximum
30±3
3 maximum
Low
Temperature life
Test
△L/L:within±10%
No abnormality
observed
The test samples shall be soldered to the test board by
The reflow soldering conditions shown in Table 1.
After that, the test samples shall be placed at test
Conditions as shown in below table.
In appearance
Temperature
Time
-40±2 deg C
500 +24/-0 h
Page 7 of 10
ASC _WLPN505040 Series_V3.0
Nov. Y2017
Test Item
Standard
Test method
Loading at high △L/L:within±10%
The test samples shall be soldered to the test board by the
reflow soldering conditions shown in Table 1.
The test samples shall be placed in thermostatic oven set at
specified temperature and applied the rated current continuously
as shown in below table.
temperature life
test
No abnormality
observed in
appearance.
Temperature
Applied current
Time
85±2 deg C
Rated current
(Refer to Page 3)
500+24/-0 h
Damp heat life
test
△L/L:within±10%
No abnormality
observed
The test samples shall be soldered to the test board by the
reflow soldering conditions shown in Table 1.
The test samples shall be placed in thermostatic oven set at
specified temperature and humidity as shown in below table.
in appearance.
Temperature
Humidity
Time
60±2 deg C
90~95%RH
500+24/-0 h
Loading under
Damp heat life
test
△L/L:within±10%
No abnormality
observed
The test samples shall be soldered to the test board by the
reflow soldering conditions shown in Table 1.
The test samples shall be placed in thermostatic oven set at
specified temperature and humidity and applied the rated current
continuously as shown in below table.
in appearance.
Temperature
Humidity
60±2 deg C
90~95%RH
Rated current
(Refer to Page 3)
500+24/-0 h
Applied current
Time
Page 8 of 10
ASC _WLPN505040 Series_V3.0
Nov. Y2017
Tape & Reel Packaging Dimensions:
Dimensions
D0
P1
P0
P2
A0
Unit:mm
A0
B0
W
F
E
P1
P2
P0
D
0
T
K
Φ1.5
+0.1
-0
5.15
±0.1
5.15
±0.1
12.0
±0.3
5.5
±0.1
1.75
±0.1
8.0
±0.1
2.0
±0.1
4.0
±0.1
0.4
±0.1
4.2
±0.1
Direction of rolling
Direction of production
insertion
Position of wire
Page 9 of 10
ASC _WLPN505040 Series_V3.0
Nov. Y2017
Reel
Label position: on the opposite side of sprocket holes side of reel
Top tape strength
Peel-off strength: 0.1N~1.3N
Peel-off angle:165°~180°
Peel-off speed: 300mm/mm
Quantity per reel:1.5K pcs
Page 10 of 10
ASC _WLPN505040 Series_V3.0
Nov. Y2017
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