UF15N0R5P500CG [WALSIN]
Microwave MLCC with Narrow-Tolerance;型号: | UF15N0R5P500CG |
厂家: | Walsin Technology |
描述: | Microwave MLCC with Narrow-Tolerance |
文件: | 总8页 (文件大小:2542K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Multilayer Ceramic Capacitors
Approval Sheet
MULTILAYER CERAMIC CAPACITORS
Microwave MLCC with Narrow-Tolerance (UF)
0402 Size (25V & 50V)
NP0 Dielectric
Halogen Free & RoHS Compliance
*Contents in this sheet are subject to change without prior notice.
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ASC_Microwave_with_Narrow_Tol_(UF)
Jul. 2019
Multilayer Ceramic Capacitors
Approval Sheet
1. INTRODUCTION
MLCC consists of a conducting material and electrodes. To manufacture a chip-type SMT and achieve
miniaturization, high density and high efficiency, ceramic condensers are used.
WTC UF series MLCC is used at high frequencies generally have a small temperature coefficient of capacitance,
typical within the ±30ppm/°C required for NP0 (C0G) classification, Ultra-narrow tolerance of capacitance and have
excellent conductivity internal electrode. Thus, WTC UF series MLCC will be with the feature of low ESR and high Q
characteristics.
2. FEATURES
3. APPLICATIONS
a. High Q and low ESR performance at high frequency.
a. Telecommunication products & equipments: Mobile
b. Ultra low capacitance to 0.05pF.
phone, WLAN, Base station.
c. Can offer ultra-narrow tolerance to ±0.02pF.
d. Quality improvement of telephone calls for low
power loss and better performance.
b. RF module: Power amplifier, VCO.
c. Tuners.
4. HOW TO ORDER
UF
15
N
R05
P
250
C
T
Series
Size
Dielectric
Capacitance
Tolerance
Rated voltage
Termination
Packaging
UF= Microwave 15=0402 (1005) N=NP0
MLCC with
Two significant
P=±0.02pF Two significant
C=Cu/Ni/Sn
T=7” reeled
digits followed by Q=±0.03pF digits followed by
no. of zeros. And A=±0.05pF no. of zeros. And
G= 13” reeled
narrow-tolerance
R is in place of
decimal point.
B=±0.1pF R is in place of
decimal point.
eg.:
250=25 VDC
500=50 VDC
R05=0.05pF
0R5=0.5pF
1R0=1.0pF
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Multilayer Ceramic Capacitors
Approval Sheet
5. EXTERNAL DIMENSIONS
Size
L
L (mm)
W (mm)
T (mm)/Symbol Remark
0.50±0.05
MB (mm)
Inch (mm)
0402 (1005)
1.00±0.05
0.50±0.05
N
#
0.25+0.05/-0.10
T
# Reflow soldering only is recommended.
W
MB
MB
Fig. 1 The outline of MLCC
6. GENERAL ELECTRICAL DATA
Dielectric
NP0
Size
0402
Capacitance*
0.05pF to 3pF
P (±0.02pF ), Q (±0.03pF), A (±0.05pF ), B (±0.1pF)
Capacitance tolerance
Rated voltage (WVDC)
Q**
25V, 50V
Q≥400+20C
Insulation resistance at Ur
Operating temperature
Capacitance change
Termination
≥10GΩ or RxC≥100Ω-F whichever is smaller.
-55 to +125°C
±30ppm/°C
Ni/Sn (lead-free termination)
** Measured at the conditions of 25°C ambient tempe rature and 30~70% related humidity.
Apply 1.0±0.2Vrms, 1.0MHz±10%
7. PACKAGING DIMENSION AND QUANTITY
Paper tape
Size
Thickness (mm)/Symbol
7” reel
13” reel
50,000
0402 (1005)
0.50±0.05
N
10,000
Unit: pieces
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ASC_Microwave_with_Narrow_Tol_(UF)
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Multilayer Ceramic Capacitors
Approval Sheet
8. CAPACITANCE RANGE
DIELECTRIC
SIZE
NP0
0402
Tolerance
RATED VOLTAGE (VDC)
25
50
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
0.05pF (R05)
0.1pF (0R1)
0.2pF (0R2)
0.3pF (0R3)
0.4pF (0R4)
0.5pF (0R5)
0.6pF (0R6)
0.7pF (0R7)
0.8pF (0R8)
0.9pF (0R9)
1.0pF (1R0)
1.1pF (1R1)
1.2pF (1R2)
1.3pF (1R3)
1.5pF (1R5)
1.6pF (1R6)
1.8pF (1R8)
2.0pF (2R0)
2.2pF (2R2)
2.4pF (2R4)
2.7pF (2R7)
3.0pF (3R0)
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
P, Q, A
P, Q, A
P, Q, A
P, Q, A
P, Q, A
P, Q, A
P, Q, A
P, Q, A
P, Q, A
P, Q, A
P, Q, A
A, B
A, B
A, B
A, B
A, B
A, B
A, B
A, B
A, B
A, B
A, B
1. The letter in cell is expressed the symbol of product thickness.
2. For more information about products with special capacitance or other data, please contact WTC local representative.
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Multilayer Ceramic Capacitors
Approval Sheet
9. RELIABILITY TEST CONDITIONS AND REQUIREMENTS
No.
Item
Test Conditions
Requirements
1. Visual and
Mechanical
---
* No remarkable defect.
* Dimensions to conform to individual specification sheet.
2. Capacitance
3. Q/ D.F.
(Dissipation
Factor)
1.0±0.2Vrms, 1MHz±10%
* Shall not exceed the limits given in the detailed spec.
At 25°C ambient temperature.
* 0402/25V~50V: Q≥400+20C
*To apply voltage: 250% of rated voltage.
*Duration: 1 to 5 sec.
4. Dielectric
Strength
* No evidence of damage or flash over during test.
*Charge & discharge current less than 50mA.
5. Insulation
Resistance
To apply rated voltage for max. 120 sec.
≥10GΩ or RxC≥100Ω-F whichever is smaller
6. Temperature
Coefficient
With no electrical load.
* Capacitance change: within ±30ppm/°C;
Operating temperature: -55~125°C at 25°C
7. Adhesive
Strength of
Termination
8. Vibration
Resistance
* Pressurizing force:
* No remarkable damage or removal of the terminations.
0402 to 0603: 5N
* Test time: 10±1 sec.
* Vibration frequency: 10~55 Hz/min.
* Total amplitude: 1.5mm
* No remarkable damage.
* Cap change and Q/D.F.: To meet initial spec.
* Test time: 6 hrs. (Two hrs each in three mutually
perpendicular directions.)
*Cap./DF(Q) Measurement to be made after de-aging at 150°C
for 1hr then set for 24±2 hrs at room temp.
* Solder temperature: 235±5°C
* Dipping time: 2±0.5 sec.
9. Solderability
95% min. coverage of all metalized area.
10. Bending Test * The middle part of substrate shall be pressurized by means * No remarkable damage.
of the pressurizing rod at a rate of about 1 mm per second until * Cap change: within ±5.0% or ±0.5pF whichever is larger.
the deflection becomes 1 mm and then the pressure shall be
maintained for 5±1 sec.
(This capacitance change means the change of capacitance under
specified flexure of substrate from the capacitance measured before
the test.)
* Measurement to be made after keeping at room temp. for
24±2 hrs.
11. Resistance to * Solder temperature: 260±5°C
Soldering Heat * Dipping time: 10±1 sec
* Preheating: 120 to 150°C for 1 minute before imme rse the
* No remarkable damage.
* Cap change: within ±2.5% or ±0.25pF whichever is larger.
* Q/D.F., I.R. and dielectric strength: To meet initial requirements.
* 25% max. leaching on each edge.
capacitor in a eutectic solder.
*Cap. / DF(Q) / I.R. Measurement to be made after de-aging at
150°C for 1hr then set for 24±2 hrs at room temp.
Page 5 of 8
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Multilayer Ceramic Capacitors
Approval Sheet
No.
Item
Test Condition
Requirements
12. Temperature
Cycle
* Conduct the five cycles according to the temperatures and
time.
* No remarkable damage.
* Cap change:within ±2.5% or ±0.25pF whichever is larger.
Step
Temp. (°C)
Min. operating temp. +0/-3
Room temp.
Time (min.)
30±3
* Q/D.F., I.R. and dielectric strength: To meet initial requirements.
1
2
3
4
2~3
Max. operating temp. +3/-0
Room temp.
30±3
2~3
* Cap. / DF(Q) / I.R. Measurement to be made after de-aging at
150°C for 1hr then set for 24±2 hrs at room temp.
* Test temp.: 40±2°C
13. Humidity
(Damp Heat)
Steady State
* No remarkable damage.
* Humidity: 90~95% RH
* Cap change: within ±5.0% or ±0.5pF whichever is larger.
* Q/D.F. value: Q≥200+10C
* Test time: 500+24/-0hrs.
* Cap. / DF(Q) / I.R. Measurement to be made after de-aging at
150°C for 1hr then set for 24±2 hrs at room temp.
* Test temp.: 40±2°C
* I.R.: ≥1GΩ.
14. Humidity
(Damp Heat)
Load
* No remarkable damage.
* Humidity: 90~95%RH
* Cap change: within ±7.5% or ±0.75pF whichever is larger.
* Q/D.F. value: Q≥100+10/3C
* Test time: 500+24/-0 hrs.
* To apply voltage:rated voltage
* I.R.: ≥500MΩ.
* Cap. / DF(Q) / I.R. Measurement to be made after de-aging at
150°C for 1hr then set for 24±2 hrs at room temp.
* Test temp.: 125±3°C
15. High
Temperature
Load
* No remarkable damage.
* To apply voltage: 200% of rated voltage.
* Test time: 2000+24/-0 hrs.
* Cap change: within ±3.0% or ±0.3pF whichever is larger.
* Q/D.F. value: Q≥200+10C
(Endurance)
* Cap. / DF(Q) / I.R. Measurement to be made after de-aging at * I.R.: ≥1GΩ.
150°C for 1hr then set for 24±2 hrs at room temp
The ESR should be measured at room temperature and tested
at frequency 1±0.1 GHz.
16. ESR
0402
0.1pF≤Cap≤1pF:< 350mΩ/pF
1pF<Cap≤5pF:< 300mΩ
5pF<Cap≤100pF:< 250mΩ
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Multilayer Ceramic Capacitors
Approval Sheet
APPENDIXES
◙ Tape & reel dimensions
Size
0402
N
Thickness
0.70
A0
B0
T
+/-0.20
1.20
+/-0.20
≦0.80
-
K0
W
8.00
+/-0.30
4.00
+/-0.10
P0
Fig. 2 The dimension of paper tape
40.00
10xP0
P1
+/-0.10
2.00
+/-0.05
2.00
+/-0.05
P2
1.50
D0
D1
E
+0.1/-0
-
1.75
+/-0.10
3.50
+/-0.05
F
Size
0402
Reel size
7”
13”
C
W1
A
13.0+0.5/-0.2
8.4+1.5/-0
13.0+0.5/-0.2
8.4+1.5/-0
330.0±1.0
100±1.0
178.0±1.0
Fig. 3 The dimension of reel
N
60.0+1.0/-0
◙ Example of customer label
a. Customer name
b. WTC order series and item number
c. Customer P/O
d. Customer P/N
e. Description of product
f. Quantity
g. Bar code including quantity & WTC P/N or customer
h. WTC P/N
i. Shipping date
j. Order bar code including series and item numbers
k. Serial number of label
*Customized label is available upon request
Page 7 of 8
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Multilayer Ceramic Capacitors
Approval Sheet
◙ Constructions
No.
1
2
3
4
5
Name
NP0
Ceramic material
Inner electrode
Hi-Q dielectric ceramic
Cu
Cu
Inner layer
Termination
Middle layer
Outer layer
Ni
Sn (Matt)
Fig. 4 The construction of MLCC
◙ Storage and handling conditions
(1) To store products at 5 to 40°C ambient temperature and 20 to 70%. related humidity conditions.
(2) The product is recommended to be used within one year after shipment. Check solderability in case of shelf life
extension is needed.
Cautions:
a. The corrosive gas reacts on the terminal electrodes of capacitors, and results in the poor solderability.
Do not store the capacitors in the ambience of corrosive gas (e.g., hydrogen sulfide, sulfur dioxide,
chlorine, ammonia gas etc.)
b. In corrosive atmosphere, solderability might be degraded, and silver migration might occur to cause low
reliability.
c. Due to the dewing by rapid humidity change, or the photochemical change of the terminal electrode by
direct sunlight,the solderability and electrical performance may deteriorate. Do not store capacitors under
direct sunlight or dewing condition. To store products on the shelf and avoid exposure to moisture.
◙ Recommended soldering conditions
The lead-free termination MLCCs are not only to be used on SMT against lead-free solder paste, but also suitable
against lead-containing solder paste. If the optimized solder joint is requested, increasing soldering time, temperature and
concentration of N2 within oven are recommended.
Fig. 5 Recommended reflow soldering profile for SMT process
with SnAgCu series solder paste.
Page 8 of 8
ASC_Microwave_with_Narrow_Tol_(UF)
Jul. 2019
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