TTU08RNR3L5FTL [WALSIN]
Measuring instrument;型号: | TTU08RNR3L5FTL |
厂家: | Walsin Technology |
描述: | Measuring instrument |
文件: | 总11页 (文件大小:1549K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TTU25
ê5% , ê1%
Ultra Low TCR / High Power
Current Sensor
Size: 2512
*Contents in this sheet are subject to change without prior notice.
FEATURES
1. High Power rating in Small package size 2512 with Low TCR 50 ppm/
2. Extra low Resistance down to 0.001Ω with High Power Rating 3W
3. 170 Operating Temperature Certainly .
4.Suitable for Lead Free Soldering .
APPLICATIONS
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Current sensor
Medical equipment
Measuring instrument
Communication device
Power supply
Computer
White Good
DESCRIPTION
This specification describes TTU series current sensor – Extra high power and low TCR with lead-free
terminations made by metal alloy plate.
¢
High power (TTU25,100PPM )
¢
Ultra Low TCR /High Power ( TTU 25, 50ppm )
Quick Reference Data
High Power
¢
Functional code
Power
Resistance
Range
Operating
Temperature
Resistance
Tolerance
Series Size Code
TCR
P
( mΩ)
S
±1%
±5%
2512
TTU
-55 to +155
100ppm/
3W
1
(6342)
¢
Ultra Low TCR /High Power
Functional code
Power
Resistance
Range
Operating
Temperature
Resistance
Tolerance
Series Size Code
TCR
( mΩ)
Q
R
S
N
1, 1.5, 2,
2.5, 3, 3.5
3W
±1%
±5%
2512
TTU
-55 to +170
50ppm/
2.5W
4, 4.5, 5, 6
(6342)
6.5, 7, 7.5,
8, 9, 10
2W
Note :
1.
This is the maximum voltage that may be continuously supplied to the resistor element, see “IEC
publication 60115-8”
2.
Max. Operation Voltage : So called RCWV (Rated Continuous Working Voltage) is determined by
RCWV = RatedPower ìResistanceValue
DIMENSIONS:(unit:mm)
2512
¢
¢
High Power :
Type
Resistance Range
(mΩ)
L(mm)
W(mm)
C(mm)
TTU2512
1
6.40±0.25
3.20±0.25
2.65±0.25
Ultra Low TCR /High Power :
Resistance Range
Type
(mΩ)
L(mm)
W(mm)
C(mm)
TTU2512
TTU2512
TTU2512
TTU2512
TTU2512
TTU2512
TTU2512
1
1.5
6.35±0.25
6.35±0.25
6.35±0.25
6.35±0.25
6.35±0.25
6.35±0.25
6.35±0.25
3.0±0.2
3.0±0.2
3.0±0.2
3.0±0.2
3.0±0.2
3.0±0.2
3.0±0.2
1.93±0.25
1.43±0.25
1.18±0.25
2.18±0.25
1.93±0.25
1.43±0.25
1.18±0.25
2, 2.5, 3, 3.5
4, 4.5
5, 6
6.5, 7, 7.5
8, 9, 10
Marking
2512(4 digits)
R002=2mR
FUNCTIONAL DESCRIPTION
DERATING
The power that the resistor can dissipate depends on the operating temperature; see Fig2
¢
High Power :
¢
Ultra Low TCR /High Power :
MOUNTING
Due to their rectangular shapes and small tolerances, Surface Mountable Resistors are suitable for
handling by automatic placement systems.
Chip placement can be on ceramic substrates and printed-circuit boards (PCBs).
Electrical connection to the circuit is by individual soldering condition.
The end terminations guarantee a reliable contact.
SOLDERING CONDITION
The robust construction of chip resistors allows them to be completely immersed in a solder bath of 260èC
for 10 seconds. Therefore, it is possible to mount Surface Mount Resistors on one side of a PCB and other
discrete components on the reverse (mixed PCBs).
Surface Mount Resistors are tested for solderability at 235èC during 2 seconds within lead-free solder bath.
The test condition for no leaching is 260èC for 30 seconds. Typical examples of soldering profile and
condition that provide reliable joints without any damage are given in Fig 3. and Table 1.
Fig. 3 Infrared soldering profile for Chip Resistors
Table 1. Infrared soldering condition for Chip Resistors
Temperature Condition
Average ramp-up rate (217èC to 260èC)
Between 150 and 200èC
> 217èC
Exposure Time
Less than 3èC/second
Between 60-120 seconds
Between 60-150 seconds
260ºC +0/-5èC
Peak Temperature
Min. 30 seconds
Time within 245èC
Ramp-down rate (Peak to 217èC)
Time from 25èC to Peak
Less than 6èC/second
No greater than 480 seconds
CATALOGUE NUMBERS
TTU
08
S
N
XXXX
F
T
L
Tolerance Packaging
code
F: 1.0%
Termination
Code
Type code
Size code
Power
Rating
TCR
Resistance
S: 3W
e.g. :
R001=1mΩ
R0L5=0.5mΩ
R3L5=3.5 mΩ
R010=10 mΩ
25: 2512
P: 100ppm
N: 50ppm
L: Sn base
(lead free)
High Power
&
J : 5.0%
T: 7” Taped
R: 2.5W
Q: 2W
P: 1W
& Reeled
.
Ultra Low TCR
/High Power
Current Sensor
Recommend Solder Pad Dimensions
2- wire pad layout
¢
High Power :
Type
Resistance Range
(mΩ)
A(mm)
B(mm)
C(mm)
D(mm)
TTU2512
1
8.00
1.00
3.50
4.00
¢
Ultra Low TCR /High Power :
TTU2512
TTU2512
TTU2512
TTU2512
TTU2512
TTU2512
TTU2512
1
1.5
6.8
6.8
6.8
6.8
6.8
6.8
6.8
2.04
3.04
3.54
1.54
2.04
3.04
3.54
2.38
1.88
1.63
2.63
2.38
1.88
1.63
3.4
3.4
3.4
3.4
3.4
3.4
3.4
2, 2.5, 3, 3.5
4, 4.5
5, 6
6.5, 7, 7.5
8, 9, 10
4-wire pad layout
¢
High Power/ Ultra Low TCR
Resistance Range
Type
(mΩ)
B(mm)
C(mm)
D(mm)
E(mm)
TTU2512
TTU2512
TTU2512
TTU2512
TTU2512
TTU2512
TTU2512
1
1.5
2.04
3.04
3.54
1.54
2.04
3.04
3.54
2.38
1.88
1.63
2.63
2.38
1.88
1.63
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.2
1.2
1.2
1.2
1.2
1.2
1.2
2, 2.5, 3, 3.5
4, 4.5
5, 6
6.5, 7, 7.5
8, 9, 10
TEST AND REQUIREMENTS(JIS C 5201-1 : 1998)
REQUIREMENT
Resistor
TEST
PROCEDURE
DC resistance
Within the specified
tolerance
F: ±1%, G: ±5%
IEC 60115-1 / JIS C
5201-1 , Clause 4.5
Natural resistance change per change in degree centigrade.
Refer to
Temperature
(ppm/èC)
R1 : Resistance at reference temperature
R2 : Resistance at test temperature
t1 : 20°C+5°C-1°C
“ QUICK REFERENCE
DATA “
Coefficient of
Resistance(T.C.R)
IEC 60115-1 4.8.4.1
t2 : 125°C+5°C-1°C
No visible damage
<±(0.5%)
¢
High Power series
2.5 times of rated power for 5 seconds at room temperature
Short time Overload
(S.T.O.L)
IEC60115-1 4.13
¢
Ultra Low TCR/High Power Series :
5 times the rated power is applied to the resistor for 5 seconds and
<±(1.0%)
the change in resistance is measured after 30mins
¢
High Power Series :
Condition B, no pre-heat of samples
No visible damage
<±(0.5%)
Resistance to soldering
heat(R.S.H)
Leadfree solder, 260 °C, 10 seconds immersion time
MIL-STD-202G-method Procedure 2 for SMD:devices fluxed and cleaned with isopropanol
210F
IEC 60115-1 4.18
¢
Ultra Low TCR/High Power Series :
The resistor is immersed in solder bath at 260±5oC for 10±1secs
<±(1.0%)
and the resistance is measured 1hr after the test.
¢
High Power Series:
SMD conditions:
1st step: method B, aging 4 hours at 155 °C dry heat
2nd step: lead-free solder bath at 245± 3 °C
Dipping time: 3 0.5 seconds
Solderability
good tinning (>95%
covered)
IPC/JEDEC
no visible damage
J-STD-002B test B
¢
Ultra Low TCR/High Power Series :
The resistor is immersed in solder bath at 260±5°C for 2±0.5secs.
High Power series
¢
-55/+155 °C
Note: Number of cycles required is 300. Devices mounted.
Maximum transfer time is 20 seconds. Dwell time is 15 minutes and
Thermal Shock
MIL-STD-202G-method
107
the change in resistance is measured after 2hrs.
<±(1.0%)
¢
Ultra Low TCR/High Power Series :
-55/+150 C
Note: Number of cycles required is 1000. Devices mounted .
Maximum transfer time is 20 seconds. Dwell time is 15 minutes and
the change in resistance is measured after 2hrs.
Endurance
MIL-STD-202G-method 70±2ºC, 1000 hours, loaded with RCWV,,1.5 hours on and 0.5
<±(1.0%)
<±(1.0%)
108
hours off
IEC 60115-1 4.25.1
¢
High Power series
1,000 hours at 85ºC/85%R.H. no condensation on the devices,
circulating air.
Humidity(Steady State)
MIL-STD-202
¢
Ultra Low TCR/High Power Series :
The resistor is placed in a chamber for 1000hrs at 40±2 ºC, 90~95%
RH. The rated power is applied to the resistor (duty cycle: 90mins
ON, 30mins OFF). The change in resistance is measured 60mins
after removal from test chamber.
Method 103 /
IEC 60115-1 4.24.2
¢
High Power series
Device mounted on PCB test board as described, only 1 board
bending required
Bending : 2mm
Bending Strength
IEC60115-1 4.33
Holding time: minimum 60±1secs
<±(1.0%)
¢
Ultra Low TCR/High Power Series :
The resistor is re-flow soldered to a test board and placed in a test
fixture. Pressure is applied to achieve bending amplitude of 3mm for
10secs. The change in resistance is measured before and during
the pressurization.
¢
High Power series
1,000 hours at maximum operating temperature depending on
specification, unpowered
No direct impingement of forced air to the parts
Tolerances:
High Temperature
Exposure
<±(1.0%)
MIL-STD-202G-method
108
0805 and above 155 5℃
¢
Ultra Low TCR/High Power Series :
IEC 60115-1 4.25.3
The resistor is placed in a constant temperature-humidity chamber
at 170±2oC for 1000hrs and the resistance is measured 60mins
after the end of the cycle.
¢
High Power series :
The resistor is placed in a chamber at -55℃ and the rated
Low Temperature
Storage
<±(0.5%)
power is applied to the resistor for 1,000 hrs. The change in
resistance is measured 60min after removal from test
chamber.
¢
Ultra Low TCR/High Power Series :
Low Temperature
Operation
The resistor is placed in a chamber at -65±2℃ and the rated power
is applied to the resistor for 24hrs. The change in resistance is
measured 60min after removal from test chamber.
<±(1.0%)
>100 MΩ
Insulation Resistance
Clause 4.6
100V DC for 1 minute.
PACKAGING
Paper Tape specifications (unit :mm)
Series No.
A
B
W
F
E
TTU25 /High Power (1mΩ )
TTU25 /Ultra Low TCR
6.70±0.20
6.75±0.10
3.50±0.20
3.40±0.10
12.00±0.30
12.00±0.1
5.50±0.05
5.50±0.05
1.75±0.10
1.75±0.10
Series No.
P1
P0
T
FD
+0.1
-0.0
4.00±0.10
4.00±0.10
TTU25 /High Power (1mΩ )
Max 1.1
F1.50
+0.1
-0.0
4.00±0.10
4.00±0.10
0.81±0.10
TTU25 /Ultra Low TCR
F1.50
Reel dimensions
B
A
C
D
Symbol
A
B
C
D
(unit : mm)
13.0±0.2
9.0±0.5
F178.0±2.0
F60.0±1.0
Taping quantity :
-
-
4,000 pcs per reel with embossed Tape: TTU25 /High Power (1mΩ )
2,000 pcs per reel with embossed Tape: TTU25 /Ultra Low TCR /High Power (1mΩ~10mΩ )
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