TTL12IPR2L5DTL [WALSIN]
High Power Thin Film Current Sensor;![TTL12IPR2L5DTL](http://pdffile.icpdf.com/pdf2/p00354/img/icpdf/TTL12QPR020F_2173055_icpdf.jpg)
型号: | TTL12IPR2L5DTL |
厂家: | ![]() |
描述: | High Power Thin Film Current Sensor |
文件: | 总12页 (文件大小:1650K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TTL02, TTL04, TTL06, TTL08, TTL12,
TTL20, TTL25
ꢀ5% , ꢀ1% , ꢀ0.5%
High Power Thin Film Current Sensor
Size:0201,0402,0603,0805,1206,2010,2512
*Contents in this sheet are subject to change without prior notice.
FEATURES
1. Extra high power rating and low TCR.
2. Extra low resistance and high precision.
3. High component and equipment reliability
4. Low resistances applied to current sensing
5. RoHS compliant & Halogen Free.
6. Suitable for lead free soldering.
APPLICATIONS
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
Current sensor
Medical equipment
Measuring instrument
Communication device
Power supply
Computer
DESCRIPTION
This specification describes TTL series current sensor – Extra high power and low TCR with lead-free
terminations made by metal film with substrate.
Quick Reference Data
Functional code
Power
Resistance Resistance
Series Size Code
Range
Tolerance
TCR
G
H
I
J
K
M
P
Q
0201
(0603)
350ppm/
150ppm/
75ppm/
75ppm/
75ppm/
5~20m
2.5~20m
5~20m
5~20m
5~20m
1/10W 1/8W 1/5W 1/4W 1/3W
0402
(1005)
1/8W 1/5W 1/4W 1/3W 1/2W
1/5W 1/4W 1/3W 1/2W
1/4W 1/3W 1/2W
0603
(1608)
±0.5%
0805
(2012)
(>10m
)
TTL
±1%
1206
(3216)
1/4W 1/3W 1/2W 1W
±5%
50ppm/
75ppm/
100ppm/
2010
(5025)
5~20m
5~20m
1W
2W
2W
50ppm/
75ppm/
100ppm/
2512
(6342)
1W
Note :
1.
This is the maximum voltage that may be continuously supplied to the resistor element, see “IEC publication
60115-8”
2.
Max. Operation Voltage : So called RCWV (Rated Continuous Working Voltage) is determined by
RCWV ꢁ RatedPower ꢀResistanceValue
Operating Temperature Range
3.
0201/0402 : -55°C to +125°C
0603/0805/1206/2010/2512 : -55°C to +170°C
DIMENSIONS:(unit:mm)
Type
Resistance Range
L(mm)
W(mm)
H(mm)
I1(mm)
0.60±0.03
1.00±0.10
1.60±0.20
2.03±0.25
3.20±0.25
5.08±0.25
6.35±0.25
0.31±0.04
0.55±0.10
0.76±0.25
1.27±0.25
1.60±0.25
2.54±0.25
3.18±0.25
Max:0.30
Max:0.35
0.56±0.25
0.56±0.25
0.64±0.25
0.64±0.25
0.64±0.25
0.14±0.16
0.25±0.10
0.38±0.25
0.38±0.25
0.51±0.25
0.51±0.25
0.76±0.25
5~20m
2.5~20m
5~20m
5~20m
5~20m
5~20m
5~20m
TTL02
TTL04
TTL06
TTL08
TTL12
TTL20
TTL25
0201/0402
0603/0805/1206/2010/2512
Marking
0201/0402(No Marking)
0603/0805(3 digits)
020=20m
1206/2010/2512(4 digits)
R020=20m
FUNCTIONAL DESCRIPTION
Product characterization
Standard values of nominal resistance are taken from the E96 & E24 series for resistors with a tolerance of
ꢂ5.0%,ꢂ1.0%. The values of the E24/E96 series are in accordance with “IEC publication 60063”.
DERATING
The power that the resistor can dissipate depends on the operating temperature; see Fig.1&Fig2
0201/0402 Range: -55°C to +125°C (Fig.1)
0603 to 2512 Range: -55°C to +170°C (Fig.2)
MOUNTING
Due to their rectangular shapes and small tolerances, Surface Mountable Resistors are suitable for
handling by automatic placement systems.
Chip placement can be on ceramic substrates and printed-circuit boards (PCBs).
Electrical connection to the circuit is by individual soldering condition.
The end terminations guarantee a reliable contact.
SOLDERING CONDITION
The robust construction of chip resistors allows them to be completely immersed in a solder bath of 260ꢃC
for 10 seconds. Therefore, it is possible to mount Surface Mount Resistors on one side of a PCB and other
discrete components on the reverse (mixed PCBs).
Surface Mount Resistors are tested for solderability at 235ꢃC during 2 seconds within lead-free solder bath.
The test condition for no leaching is 260ꢃC for 30 seconds. Typical examples of soldering profile and
condition that provide reliable joints without any damage are given in Fig 3. and Table 1.
Fig. 3 Infrared soldering profile for Chip Resistors
Table 1. Infrared soldering condition for Chip Resistors
Temperature Condition
Average ramp-up rate (217ꢃC to 260ꢃC)
Between 150 and 200ꢃC
> 217ꢃC
Exposure Time
Less than 3ꢃC/second
Between 60-120 seconds
Between 60-150 seconds
260ºC +0/-5ꢃC
Peak Temperature
Min. 30 seconds
Time within 245ꢃC
Ramp-down rate (Peak to 217ꢃC)
Time from 25ꢃC to Peak
Less than 6ꢃC/second
No greater than 480 seconds
CATALOGUE NUMBERS
TTL
02
Q
N
XXXX
F
T
L
Tolerance
Packaging
code
Termination
Code
Type code
Size code
02: 0201
04: 0402
06: 0603
08: 0805
12: 1206
20: 2010
25: 2512
Power Rating
Q:2W
TCR
N:50ppm/
O:75ppm/
P:100ppm/
Q:150ppm/
R:200ppm/
U:350ppm/
Resistance
e.g. :
Low
Resistance
D: 0.5%
F: 1.0%
J : 5.0%
R020 = 20mΩ
R005 = 5mΩ
R2L5 =2.5mΩ
P:1W
L: Sn base
(lead-free)
T: 7” Taped &
Reeled
M:1/2W
K:1/3W
J:1/4W
I:1/5W
H:1/8W
G:1/10W
Recommend Solder Pad Dimensions
Type
Resistance Range
5~20m
A(mm)
1.00
2.00
2.52
2.54
3.90
6.10
7.36
B(mm)
0.30
0.40
0.50
0.50
0.76
3.30
4.06
C(mm)
D(mm)
TTL02
TTL04
TTL06
TTL08
TTL12
TTL20
TTL25
0.35
0.80
1.01
1.02
1.57
1.40
1.65
0.40
0.60
1.01
1.27
1.78
3.05
3.68
2.5~20m
5~20m
5~20m
5~20m
5~20m
5~20m
TEST AND REQUIREMENTS(JIS C 5201-1 : 1998)
REQUIREMENT
Resistor
TEST
PROCEDURE
D: ±0.5%,F: ±1%, G: ±5%
DC resistance
IEC 60115-1 / JIS
C 5201-1 , Clause
4.5
Within the specified tolerance
Temperature
Coefficient of
Natural resistance change per change in degree Refer to
centigrade.
“ QUICK REFERENCE DATA “
Resistance(T.C.R)
(ppm/ C)
R1 : Resistance at reference temperature
R2 : Resistance at test temperature
t1 : 20°C+5°C-1°C
t2 : 125°C+5°C-1°C
5 times of rated power for 5 seconds at room temperature No visible damage
±(1.0%+0.0005Ω)
Short time overload
(S.T.O.L)
IEC60115-1 4.13
Resistance to
soldering
heat(R.S.H)
MIL-STD-202G-
method 210F
IEC 60115-1 4.18
Condition B, no pre-heat of samples
No visible damage
Leadfree solder, 260 °C, 10 seconds immersion time
±(0.5%+0.0005Ω)
Procedure 2 for SMD: devices fluxed and cleaned with
isopropanol
SMD conditions:
1st step: method B, aging 4 hours at 155 °C dry heat
2nd step: leadfree solder bath at 245± 3 °C
Solderability
good tinning (>95% covered)
IPC/JEDEC
no visible damage
J-STD-002B test B
Dipping time: 3± 0.5 seconds
Thermal Shock
MIL-STD-202G-
method 107
-55/+125 °C
±(1.0%+0.0005Ω)
Note: Number of cycles required is 300. Devices mounted
Maximum transfer time is 20 seconds. Dwell time is 15
minutes. Air – Air
Endurance
MIL-STD-202G-
method 108
70±2ºC, 1000 hours, loaded with RCWV,,1.5 hours on ±(1.0%+0.0005Ω)
and 0.5 hours off
IEC 60115-1 4.25.1
1,000 hours at 85ºC/85%R.H. 10% of operating power,
±(1.0%+0.0005Ω)
Bias Humidity
MIL-STD-202
no condensation on the devices, circulating air.
Method 103
Device mounted on PCB test board as described, only 1
±(1.0%+0.0005Ω)
Bending Strength
IEC60115-1 4.33
board bending required
Bending for
0201: 3mm
0402 and above: 2mm
Holding time: minimum 60 seconds
High Temperature
Exposure
MIL-STD-202G-
1,000 hours at maximum operating temperature
±(1.0%+0.0005Ω)
depending on specification, unpowered
No direct impingement of forced air to the parts
Tolerances:
method 108
0201/0402 125± 3
IEC 60115-1 4.25.3
0603 and above 170± 3
Moisture Resistance Each temperature / humidity cycle is defined at 8 hours ± (0.5%+0.0005 Ω)
MIL-STD-202G-
method 106
(method 106F), 3 cycles / 24 hours for 10d with 25 °C / 65
°C 95% R.H, without steps 7a & 7b, unpowered
Parts mounted on test-boards, without condensation on
parts
Measurement at 24± 2 hours after test conclusion
PACKAGING
Paper Tape specifications (unit: mm)
Series No.
TTL02
TTL04
TTL06
TTL08
TTL12
TTL20
TTL25
A
B
W
F
E
0.720±0.05
1.20±0.10
1.90±0.20
2.40±0.20
3.60±0.20
5.50±0.20
6.90±0.20
0.42±0.05
0.7±0.10
1.10±0.20
1.65±0.20
2.00±0.20
2.80±0.20
3.60±0.20
8.00±0.30
8.00±0.30
8.00±0.30
8.00±0.30
8.00±0.30
12.00±0.30
12.00±0.30
3.50±0.05
3.50±0.05
3.50±0.20
3.50±0.20
3.50±0.20
5.50±0.10
5.50±0.10
1.75±0.10
1.75±0.10
1.75±0.10
1.75±0.10
1.75±0.10
1.75±0.10
1.75±0.10
Series No.
P1
P0
T
ꢀD
ꢁ0.1
ꢂ0.0
2.00±0.10
4.00±0.10
0.4±0.05
TTL02
ꢀ1.50
ꢁ0.1
2.00±0.10
4.00±0.10
4.00±0.10
4.00±0.10
4.00±0.10
4.00±0.10
4.00±0.10
4.00±0.10
4.00±0.10
4.00±0.10
4.00±0.10
4.00±0.10
0.40±0.05
0.65±0.05
Max. 1.0
Max. 1.0
Max 1.2
Max 1.2
TTL04
TTL06
TTL08
TTL12
TTL20
TTL25
ꢀ1.50
ꢂ0.0
ꢁ0.1
ꢂ0.0
ꢀ1.50
ꢁ0.1
ꢂ0.0
ꢀ1.50
ꢁ0.1
ꢂ0.0
ꢀ1.50
ꢁ0.1
ꢂ0.0
ꢀ1.50
ꢁ0.1
ꢂ0.0
ꢀ1.50
Reel Dimensions:
C
B
A
D
Symbol
(unit : mm)
A
B
C
D
13.0±0.2
9.0±0.5
ꢀ178.0±2.0
ꢀ60.0±1.0
Taping Quantity
-
-
-
-
Chip resistors 4,000 pcs per reel ( TTL25, TTL20 )
Chip resistors 5,000 pcs per reel ( TTL12, TTL08, TTL06 )
Chip resistors 10,000 pcs per reel ( TTL04 )
Chip resistors 15,000 pcs per reel ( TTL02 )
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