RT15N0R5A250CT [WALSIN]
High Q and low ESR performance at high frequency;型号: | RT15N0R5A250CT |
厂家: | Walsin Technology |
描述: | High Q and low ESR performance at high frequency |
文件: | 总11页 (文件大小:3169K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Multilayer Ceramic Capacitors
Approval Sheet
MULTILAYER CERAMIC CAPACITORS
Microwave Capacitors Series (RT)
Qualified to AEC-Q200
0402 Size (25V to 50V)
NP0 Dielectric
Halogen Free & RoHS Compliance
*Contents in this sheet are subject to change without prior notice.
Page 1 of 11
ASC_Microwave_AECQ200_(RT)
May. 2019
Multilayer Ceramic Capacitors
Approval Sheet
1. DESCRIPTION
MLCC consists of a conducting material and electrodes. To manufacture a chip-type SMT and achieve miniaturization,
high density and high efficiency, ceramic condensers are used.
WTC’s RT series MLCC is used at high frequencies generally have a small temperature coefficient of capacitance,
typical within the ±30ppm/°C required for NP0 (C0G) classification and have excellent conductivity internal electrode.
Thus, WTC RT series MLCC will be with the feature of low ESR and high Q characteristics, stability and reliability. Besides,
RT series MLCC is tighten controlling in quality in line to assure quality performance in automotive applications. The RT
series is AEC-Q200 compliant.
2. FEATURES
a. High Q and low ESR performance at high frequency.
b. High reliability: AEC-Q200.
c. Ultra low capacitance to 0.1pF.
d. Can offer high precision tolerance to ±0.05pF.
e. Quality improvement of telephone calls for low power
loss and better performance.
3. APPLICATIONS
a. Automotive, power supply and related industries. .
b. The other mechanical stress concerned products or
the set having a high probability of fall.
c. Prevention of ceramic body cracks by board
bending.
d. RF module: Power amplifier, VCO.
e. Tuners.
4. HOW TO ORDER
RT
15
N
101
J
250
C
T
Series
Size
Dielectric
Capacitance
Tolerance Rated voltage
Termination Packaging style
RT=
15=0402 N=NP0
Two significant
A=±0.05pF Two significant C=
T=7” reeled
Microwave
MLCC (with
AEC-Q200
qualification)
(1005)
digits followed by B=±0.1pF
no. of zeros. And C=±0.25pF
digits followed Cu+Conductive G=13” reeled
by no. of zeros. resin /Ni /Sn
And R is in
R is in place of
decimal point.
D=±0.5pF
F=±1%
place of decimal
point.
G=±2%
J=±5%
eg.:
0R5=0.5pF
1R0=1.0pF
100=10x101
=100pF
250=25 VDC
500=50 VDC
5. EXTERNAL DIMENSIONS
Size
Inch (mm)
L (mm)
W (mm)
T (mm)/Symbol
Remark
MB (mm)
L
0.25
0402 (1005)
1.00±0.08
0.50±0.08
0.50±0.08
N
#
T
+0.05/-0.10
# Reflow soldering only is recommended.
W
MB
MB
Fig. 1 The outline of MLCC
Page 2 of 11
ASC_Microwave_AECQ200_(RT)
May. 2019
Multilayer Ceramic Capacitors
Approval Sheet
6. GENERAL ELECTRICAL DATA
Dielectric
Size
NP0
0402
Capacitance*
0.1pF to 56pF
#1
Cap≤5pF
:
A (±0.05pF ), B (±0.1pF), C (±0.25pF)
5pF<Cap<10pF:
Capacitance tolerance
B (±0.1pF), C (±0.25pF), D (±0.5pF)
Cap≥10pF:
F (±1%), G (±2%), J (±5%)
Rated voltage (WVDC)
Q*
25V, 50V
Cap<30pF:Q≥400+20C;
Cap≥30pF:Q≥1000
Insulation resistance at Ur
Operating temperature
Capacitance change
Termination
≥10GΩ or RxC≥100Ω-F whichever is smaller.
-55 to +125°C
±30ppm/°C
Ni/Sn (lead-free termination)
#1: Cap= 0.1pF product only provide B tolerance.
* Measured at the conditions of 25°C ambient temper ature and 30~70% related humidity.
Apply 1.0±0.2Vrms, 1.0MHz±10% for Cap≤1000pF and 1.0±0.2Vrms, 1.0kHz±10% for Cap>1000pF.
Page 3 of 11
ASC_Microwave_AECQ200_(RT)
May. 2019
Multilayer Ceramic Capacitors
Approval Sheet
7. CAPACITANCE RANGE
DIELECTRIC
SIZE
NP0
0402
Tolerance
RATED VOLTAGE (VDC)
25
50
0.1pF (0R1)
0.2pF (0R2)
0.3pF (0R3)
0.4pF (0R4)
0.5pF (0R5)
0.6pF (0R6)
0.7pF (0R7)
0.75pF (R75)
0.8pF (0R8)
0.9pF (0R9)
1.0pF (1R0)
1.1pF (1R1)
1.2pF (1R2)
1.3pF (1R3)
1.5pF (1R5)
1.6pF (1R6)
1.8pF (1R8)
2.0pF (2R0)
2.2pF (2R2)
2.4pF (2R4)
2.7pF (2R7)
3.0pF (3R0)
3.3pF (3R3)
3.6pF (3R6)
3.9pF (3R9)
4.0pF (4R0)
4.3pF (4R3)
4.7pF (4R7)
5.0pF (5R0)
5.1pF (5R1)
5.6pF (5R6)
6.0pF (6R0)
6.2pF (6R2)
6.7pF (6R7)
6.8pF (6R8)
7.0pF (7R0)
7.5pF (7R5)
8.0pF (8R0)
8.2pF (8R2)
9.0pF (9R0)
9.1pF (9R1)
10pF (100)
11pF (110)
12pF (120)
13pF (130)
15pF (150)
16pF (160)
18pF (180)
20pF (200)
22pF (220)
24pF (240)
27pF (270)
30pF (300)
33pF (330)
36pF (360)
39pF (390)
43pF (430)
47pF (470)
51pF (510)
56pF (560)
62pF (620)
68pF (680)
75pF (750)
82pF (820)
91pF (910)
100pF (101)
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
B
A, B
A, B
A, B
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
A, B, C
B, C, D
B, C, D
B, C, D
B, C, D
B, C, D
B, C, D
B, C, D
B, C, D
B, C, D
B, C, D
B, C, D
B, C, D
F, G, J
F, G, J
F, G, J
F, G, J
F, G, J
F, G, J
F, G, J
F, G, J
F, G, J
F, G, J
F, G, J
F, G, J
F, G, J
F, G, J
F, G, J
F, G, J
F, G, J
F, G, J
F, G, J
1. The letter in cell is expressed the symbol of product thickness.
2. For more information about products with special capacitance or other data, please contact WTC local representative
Page 4 of 11
ASC_Microwave_AECQ200_(RT)
May. 2019
Multilayer Ceramic Capacitors
Approval Sheet
8. PACKAGING STYLE AND QUANTITY
Paper tape
Size
Thickness (mm)/Symbol
7” reel
13” reel
50,000
0402 (1005)
0.50±0.08
N
10,000
Unit: pieces
Page 5 of 11
ASC_Microwave_AECQ200_(RT)
May. 2019
Multilayer Ceramic Capacitors
Approval Sheet
9. RELIABILITY TEST CONDITIONS AND REQUIREMENTS
AEC-Q200
Test Item
No.
AEC-Q200 Test Condition
Requirements
1. Pre-and
Post-Stress
Electrical Test
---
2. High Temperature * Test temp.: 150±3°C
Exposure (Storage) * Unpowered.
* No remarkable damage.
* Cap change:NPO: within ±2.5% or ±0.25pF whichever is larger.
* Q. value: NPO: Cap≥30pF, Q≥1000 ; Cap<30pF, Q≥400+20C.
* I.R.: ≥10GΩ or RxC≥500Ω-F whichever is smaller.
MIL-STD-202
Method 108
* Test time: 1000+24/-0 hrs.
* Measurement to be made after keeping at room
temp. for 24±2 hrs.
3. Temperature
Cycling
* Conduct 1000 cycles according to the temperatures * No remarkable damage.
and time.
* Cap change:NPO: within ±2.5% or 0.25pF whichever is larger.
JESD22
* Q. value: NPO: Cap≥30pF, Q≥1000 ; Cap<30pF, Q≥400+20C.
* I.R.: ≥10GΩ or RxC≥500Ω-F whichever is smaller.
Step
Temp. (°C)
-55°C +0/-3
Time (min.)
5±1
5±1
Method JA-104
1
2
+125°C +3/-0
*Measurement to be made after keeping at room
temp. for 24±2 hrs.
4. Destructive
Physical Analysis
EIA-469
Per EIA-469
No defects or abnormalities
5. Moisture
Resistance
* Test temp.: 25~65°C
* No remarkable damage.
* Humidity: 80~100% RH
* Cap change : NPO: within ±3.0% or 0.30pF whichever is larger
* Q. value: NPO: More than 30pF Q≥350 ; 10pF≤C≤30pF, Q≥275+2.5C
Less than 10pF Q≥200+10C
MIL-STD-202
Method 106
* Test time: 10 cycles, t=24hrs/cycle.
* Measurement to be made after keeping at room
temp. for 24±2 hrs.
* I.R.: ≥10GΩ or RxC≥500Ω-F whichever is smaller.
6. Biased Humidity
MIL-STD-202
* Test temp.: 85±3°C
* No remarkable damage.
* Humidity: 85%RH
* Cap change: NPO: within ±3.0% or 0.30pF whichever is larger.
* Q. value: NPO: C≥30pF , Q≥200 ; C<30pF , Q≥100+10/3C
* I.R.: ≥1GΩ or RxC≥50Ω-F whichever is smaller.
Method 103
* Test time: 1000+24/-0 hrs.
* To apply voltage:rated voltage and 1.3~1.5Vdc.
(add 100k ohm resistor)
* Measurement to be made after keeping at room
temp. for 24±2 hrs.
7. Operational Life
MIL-STD-202
* Test temp.: 125±3°C
* No remarkable damage.
* To apply voltage: full rated voltage.
* Test time: 1000+24/-0 hrs.
* Cap change: NPO: within ±3.0% or ±0.3pF whichever is larger
* Q. value: NPO: More than 30pF, Q≥350 ; 10pF≤C<30pF, Q≥275+2.5C
Less than 10pF, Q≥200+10C
Method 108
* Measurement to be made after keeping at room
temp. for 24±2 hrs.
* I.R.: ≥1GΩ or RxC≥50Ω-F whichever is smaller.
No remarkable defect.
8. External Visual
MIL-STD-883
Method 2009
9. Physical
Dimension
Visual inspection
Using by calipers
Within the specified dimensions
JESD22
Method JB-100
Page 6 of 11
ASC_Microwave_AECQ200_(RT)
May. 2019
Multilayer Ceramic Capacitors
AEC-Q200
Approval Sheet
No.
AEC-Q200 Test Condition
Requirements
Test Item
10. Resistance to
Solvents
* Temperature: 25±5°C
* Time: 3+0.5/-0 min.
* No remarkable damage.
* Cap.: within the specified tolerance.
MIL-STD-202
Method 215
* Solvent: Iso-propyl alcohol.
* Q. value: NPO: Cap≥30pF, Q≥1000 ; Cap<30pF, Q≥400+20C.
* I.R.: ≥10GΩ or RxC≥500Ω-F whichever is smaller.
* No remarkable damage.
11. Mechanical Shock * Peak value: 1500g’s.
MIL-STD-202
* Wave: 1/2 sine.
* Cap.: within the specified tolerance.
Method 213
* Velocity: 15.4 ft/sec
* Q. value: NPO: Cap≥30pF, Q≥1000 ; Cap<30pF, Q≥400+20C.
* Three shocks in each direction should be applied * I.R.: ≥10GΩ or RxC≥500Ω-F whichever is smaller.
along
3 mutually perpendicular axes of the test specimen
(18 shocks)
12.
13.
Vibration
* Vibration frequency: 10~2000 Hz/min.
(5g’s for 20 min)
* No remarkable damage.
MIL-STD-202
Method 204
* Cap.: within the specified tolerance.
* Total amplitude: 1.5mm
* Q. value: NPO:Cap≥30pF, Q≥1000 ; Cap<30pF, Q≥400+20C.
* I.R.: ≥10GΩ or RxC≥500Ω-F whichever is smaller.
* No remarkable damage.
* 12 cycles each of 3 orientations (36 times)
* Solder temperature: 270±5°C
* Dipping time: 10±1 sec
Resistance to
Soldering Heat
MIL-STD-202
Method 210
* Cap change: NPO: within ±2.5% or 0.25pF whichever is larger
* Q. value: NPO: Cap≥30pF, Q≥1000 ; Cap<30pF, Q≥400+20C.
* I.R.: ≥10GΩ or RxC≥500Ω-F whichever is smaller.
* Measurement to be made after keeping at room
temp. for 24±2 hrs.
14 Thermal Shock
MIL-STD-202
* Conduct 300 cycles according to the temperatures * No remarkable damage.
and time.
* Cap change:NPO: within ±2.5% or 0.25pF whichever is larger.
Method 107
* Q. value: NPO: Cap≥30pF, Q≥1000 ; Cap<30pF, Q≥400+20C.
* I.R.: ≥10GΩ or RxC≥500Ω-F whichever is smaller.
Step
Temp. (°C)
-55°C +0/-3
+125°C +3/-0
Time (min.)
15±3
1
2
15±3
* Max. transfer time: 20 sec.
* Measurement to be made after keeping at room
temp. for 24±2 hrs.
15.
ESD
Per AEC-Q200-002
* No remarkable damage.
AEC-Q200-002
* Cap.: within the specified tolerance.
* Q. value: NPO: Cap≥30pF, Q≥1000 ; Cap<30pF, Q≥400+20C.
* I.R.: ≥10GΩ or RxC≥500Ω-F whichever is smaller.
All terminations shall exhibit a continuous solder coating free from
16. Solderability
J-STD-002
* Condition A
Un-mounted chips 4hrs / 155°C*dry then completely defects from a minimum of 95% of the critical surface area of any individual
JESD22-B102E
immersed for 5 0.5 sec in solder bath at 245 5°C.
* Condition B
termination.
Un-mounted chips steam 8 hrs then completely
immersed for 10 1sec in solder bath at 220+5/-0°C.
* Condition C
Un-mounted chips steam 8 hrs then completely
immersed for 10 1 sec. in solder bath at 260+0/-5°C.
Page 7 of 11
ASC_Microwave_AECQ200_(RT)
May. 2019
Multilayer Ceramic Capacitors
AEC-Q200
Approval Sheet
No.
AEC-Q200 Test Condition
Requirements
Test Item
17. Electrical
Characterization
* Capacitance
* Capacitance within the specified tolerance.
* Q. value
* Q. value: NPO: Cap≥30pF, Q≥1000 ; Cap<30pF, Q≥400+20C.
Cap≤1000pF 1.0±0.2Vrms, 1MHz±10%
Cap>1000pF 1.0±0.2Vrms, 1KHz±10%
* Insulation Resistance
* IR. ≥10GΩ or RxC≥500Ω-F whichever is smaller.
To apply rated voltage(500V max.) for max. 120 sec.
* Dielectric Strength
* Dielectric strength
To apply voltage:
No evidence of damage or flash over during test.
≦100
≥2.5 times VDC
, duration 1~5 sec,
charge and discharge current less than 50mA.
* Temperature Coefficient (with no electrical load)
Operation temperature: -55~125°C at 25°C
* Temperature Coefficient
Capacitance Change: NPO: Within ±30ppm/°C
18.
Board Flex
* The middle part of substrate shall be pressurized by * No remarkable damage.
AEC-Q200-005
means of the pressurizing rod at a rate of about 1
* Cap change: NPO: within ±5% or 0.5pF whichever is larger
mm per second until the deflection becomes 5 mm (This capacitance change means the change of capacitance under specified
and then the pressure shall be maintained for 60±1 flexure of substrate from the capacitance measured before the test.)
sec.
* Measurement to be made after keeping at room
temp. for 24±2 hrs.
19.
Terminal Strength * Pressurizing force:
AEC-Q200-006 2N (0201 & 0402), 10N(0603), 18N(≥0805).
* No remarkable damage or removal of the terminations.
* Capacitance within the specified tolerance.
* Test time: 60±1 sec.
* Q. value: NPO: Cap≥30pF, Q≥1000 ; Cap<30pF, Q≥400+20C.
20 Beam Load Test
* Break strength test
The chip endure following force
AEC-Q200-003
* Beam speed: 2.5±0.25 mm/sec
* Chip length ≤2.5mm: Thickness >0.5mm (20N), ≤0.5mm (8N)
* Chip length ≥3.2mm: Thickness ≥1.25mm (54.5N), <1.25mm (15N)
21 ESR
The ESR should be measured at room temperature
and tested at frequency 1±0.1 GHz.
0402
0.1pF≤Cap≤1pF:< 350mΩ/pF
1pF<Cap≤5pF:< 300mΩ
5pF<Cap≤100pF:< 250mΩ
Page 8 of 11
ASC_Microwave_AECQ200_(RT)
May. 2019
Multilayer Ceramic Capacitors
APPENDIXES
Approval Sheet
◙ Tape & reel dimensions
Fig. 2 The dimension of paper tape
Fig. 3 The dimension of plastic tape
Size
0201
L
0402
N,E
0603
0805
B,T
1206
C,J,D
< 2.00
1210
C,D,G,K
< 3.05
S,H,X
A,H
D,I
B,T
G,P
T
M
Thickness
0.40
+/-0.10
0.70
+/-0.10
0.70
+/-0.20
1.20
+/-0.20
1.05
+/-0.30
1.80
+/-0.30
1.50
+/-0.20
2.30
+/-0.20
1.50
+/-0.20
2.30
+/-0.20
1.90
+/-0.50
3.50
+/-0.50
< 1.80
<2.30
< 3.05
< 3.20
A0
B0
T
< 2.70
< 3.70
< 4.00
< 3.80
< 3.80
<4.00
0.23
+/-0.1
0.23
+/-0.1
0.23
+/-0.1
0.23
+/-0.1
0.23
+/-0.1
0.23
+/-0.1
≦0.55
≦0.80
≦1.20
≦1.15
≦1.20
≦1.20
-
-
-
-
-
< 2.50
-
< 2.50
< 2.50
< 1.50
< 2.50
< 3.20
K0
W
8.00
+/-0.30
8.00
+/-0.30
8.00
+/-0.30
8.00
+/-0.30
8.00
+/-0.30
8.00
+/-0.30
8.00
+/-0.30
8.00
+/-0.30
8.00
+/-0.30
8.00
+/-0.30
8.00
+/-0.30
8.00
+/-0.30
4.00
+/-0.10
4.00
+/-0.10
4.00
+/-0.10
4.00
+/-0.10
4.00
+/-0.10
4.00
+/-0.10
4.00
+/-0.10
4.00
+/-0.10
4.00
+/-0.10
4.00
+/-0.10
4.00
+/-0.10
4.00
+/-0.10
P0
40.00
40.00
40.00
40.00
40.00
40.00
40.00
40.00
40.00
40.00
40.00
40.00
10xP0
P1
+/-0.10
+/-0.10
+/-0.20
+/-0.20
+/-0.20
+/-0.20
+/-0.20
+/-0.20
+/-0.20
+/-0.20
+/-0.20
+/-0.20
2.00
+/-0.05
2.00
+/-0.05
4.00
+/-0.10
4.00
+/-0.10
4.00
+/-0.10
4.00
+/-0.10
4.00
+/-0.10
4.00
+/-0.10
4.00
+/-0.10
4.00
+/-0.10
4.00
+/-0.10
4.00
+/-0.10
2.00
+/-0.05
2.00
+/-0.05
2.00
+/-0.05
2.00
+/-0.05
2.00
+/-0.05
2.00
+/-0.05
2.00
+/-0.05
2.00
+/-0.05
2.00
+/-0.05
2.00
+/-0.05
2.00
+/-0.05
2.00
+/-0.05
P2
1.50
1.50
1.50
1.50
1.50
1.50
1.50
1.50
1.50
1.50
1.50
1.50
D0
D1
E
+0.1/-0
+0.1/-0
+0.1/-0
+0.1/-0
+0.1/-0
+0.1/-0
+0.1/-0
+0.1/-0
+0.1/-0
+0.1/-0
+0.1/-0
+0.1/-0
1.00
+/-0.10
1.75
+/-0.10
1.00
+/-0.10
1.75
+/-0.10
1.00
+/-0.10
1.75
+/-0.10
1.00
+/-0.10
1.75
+/-0.10
1.00
+/-0.10
1.75
+/-0.10
1.00
+/-0.10
1.75
+/-0.10
-
-
-
-
-
-
1.75
+/-0.10
1.75
+/-0.10
1.75
+/-0.10
1.75
+/-0.10
1.75
+/-0.10
1.75
+/-0.10
3.50
+/-0.05
3.50
+/-0.05
3.50
+/-0.05
3.50
+/-0.05
3.50
+/-0.05
3.50
+/-0.05
3.50
+/-0.05
3.50
+/-0.05
3.50
+/-0.05
3.50
+/-0.05
3.50
+/-0.05
3.50
+/-0.05
F
Size
0201, 0402, 0603, 0805, 1206, 1210
Reel size
7”
10”
13”
C
W1
A
13.0+0.5/-0.2
8.4+1.5/-0
13.0+0.5/-0.2
8.4+1.5/-0
250.0±1.0
100.0±1.0
13.0+0.5/-0.2
8.4+1.5/-0
330.0±1.0
100±1.0
178.0±1.0
N
60.0+1.0/-0
Fig. 4 The dimension of reel
Page 9 of 11
ASC_Microwave_AECQ200_(RT)
May. 2019
Multilayer Ceramic Capacitors
Approval Sheet
◙ Example of customer label
a. Customer name
b. WTC order series and item number
c. Customer P/O
d. Customer P/N
e. Description of product
f. Quantity
g. Bar code including quantity & WTC P/N or customer
h. WTC P/N
i. Shipping date
j. Order bar code including series and item numbers
k. Serial number of label
*Customized label is available upon request.
◙ Constructions
No.
1
2
3
4
5
Name
NP0
Ceramic material
Inner electrode
Hi-Q dielectric ceramic
Cu
Cu + Conductive Resin
Ni
Inner layer
Termination
Middle layer
Outer layer
Fig. 5 The construction of MLCC
Sn (Matt)
◙ Storage and handling conditions
(1) To store products at 5 to 40°C ambient temperature and 20 to 70%. related humidity conditions.
(2) The product is recommended to be used within one year after shipment. Check solderability in case of shelf life
extension is needed.
Cautions:
a. The corrosive gas reacts on the terminal electrodes of capacitors, and results in the poor solderability.
Do not store the capacitors in the ambience of corrosive gas (e.g., hydrogen sulfide, sulfur dioxide,
chlorine, ammonia gas etc.)
b. In corrosive atmosphere, solderability might be degraded, and silver migration might occur to cause low
reliability.
c. Due to the dewing by rapid humidity change, or the photochemical change of the terminal electrode by
direct sunlight,the solderability and electrical performance may deteriorate. Do not store capacitors under
direct sunlight or dewing condition. To store products on the shelf and avoid exposure to moisture.
Page 10 of 11
ASC_Microwave_AECQ200_(RT)
May. 2019
Multilayer Ceramic Capacitors
Approval Sheet
◙ Recommended soldering conditions
The lead-free termination MLCCs are not only to be used on SMT against lead-free solder paste, but also suitable
against lead-containing solder paste. If the optimized solder joint is requested, increasing soldering time, temperature and
concentration of N2 within oven are recommended.
Fig. 5 Recommended reflow soldering profile for SMT process
with SnAgCu series solder paste.
Fig. 6 Recommended wave soldering profile for SMT process
with SnAgCu series solder.
Page 11 of 11
ASC_Microwave_AECQ200_(RT)
May. 2019
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