RFBPB20121G9D0T [WALSIN]
1.9 GHz PCS Band RF Application;![RFBPB20121G9D0T](http://pdffile.icpdf.com/pdf2/p00352/img/icpdf/RFBPB20121G9_2162720_icpdf.jpg)
型号: | RFBPB20121G9D0T |
厂家: | ![]() |
描述: | 1.9 GHz PCS Band RF Application PCS 过程控制系统 |
文件: | 总8页 (文件大小:595K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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Approval sheet
RFBPB Series – 2012(0805)- RoHS Compliance
MULTILAYER CERAMIC BAND PASS FILTER
- Balanced Type
Halogens Free Product
1.9 GHz PCS Band RF Application
P/N: RFBPB20121G9D0T
*Contents in this sheet are subject to change without prior notice.
Page 1 of 7
ASC_RFBPB20121G9D0T_V02
Feb. 2017
Approval sheet
FEATURES
1.
2.
3.
4.
Miniature footprint: 2.0 X 1.2 X 0.9 mm3.
Low Profile Thickness
Low Insertion loss
LTCC process
APPLICATIONS
1.
1900 MHz PCS band RF applications.
CONSTRUCTION
Top view
P3
P2
P1
PIN
1
Connection
PIN
5
Connection
Balanced Port
GND
Unbalanced Port
P4
P8
NC or DC feed
port
2
6
3
NC
7
Balanced Port
GND
P5
P6
P7
4
GND
8
DIMENSIONS
Figure
Symbol
Dimension (mm)
L
W
T
2.00 ± 0.15
1.25 ± 0.10
0.90 ± 0.10
0.20 ± 0.10
0.30 ± 0.10
0.35 ± 0.10
0.65 ± 0.10
0.20 ± 0.10
0.20 ± 0.10
0.475 ± 0.10
0.30 ± 0.10
Top view
A
B
C
D
E
F
Bottom view
Side view
Side view
G
H
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ASC_RFBPB20121G9D0T_V02
Feb. 2017
Approval sheet
ELECTRICAL CHARACTERISTICS
RFBPB20121G9D0T
Frequency Range
Specification
1880~ 1930 MHz
2.5 dB max.
Insertion Loss
10 dB min. @ 956 ~ 961 MHz
15 dB min. @ 2400 ~ 2500 MHz
20 dB min. @ 2868 ~ 2883 MHz
10 dB min. @ 3824 ~ 3844 MHz
20 dB min. @ 4780 ~ 4805 MHz
20 dB min. @ 5736 ~ 5766 MHz
1800 ± 150
Attenuation
Phase Difference
Amplitude balance
VSWR
2.0 dB max.
2.0 max.
Impedance (Unbalanced)
Impedance (Balanced)
50 Ω
Conjugate match to (20-j18) Ω
LEVEL 1 (Refer to : IPC/JEDEC J-STD-020)
Moisture sensitivity levels
Operating & Storage Condition (Component)
Operation Temperature Range: -40C ~ +85C
Storage Temperature Range: -40C ~ +85C
Storage Condition before Soldering (Included packaging material)
Storage Temperature Range: +5 ~ +40 ℃
Humidity: 30 to 70% relative humidity
Typical Electrical Chart
SOLDER LAND PATTERN
Figure
Page 3 of 7
ASC_RFBPB20121G9D0T_V02
Feb. 2017
Approval sheet
Unit : mm
Line width to be designed to match 50 Ω characteristic impedance, depending on PCB material and thickness.
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ASC_RFBPB20121G9D0T_V02
Feb. 2017
Approval sheet
RELIABILITY TEST
Test condition / Test method
Test item
Specification
Solderability
At least 95% of a surface of each terminal
*Solder bath temperature:235 5C
JIS C 0050-4.6
JESD22-B102D
electrode must be covered by fresh solder.
*Immersion time:2 0.5 sec
Solder:Sn3Ag0.5Cu for lead-free
*Solder bath temperature:260 5C
*Leaching immersion time:30 0.5 sec
Solder : SN63A
Leaching
Loss of metallization on the edges of each
electrode shall not exceed 25%.
(Resistance to
dissolution of
metallization)
IEC 60068-2-58
Resistance to soldering
heat
*Preheating temperature:120~150℃,
1 minute.
No mechanical damage.
Electrical specification shall satisfy the
descriptions in electrical characteristics under
the operational temperature range within -40
~ 85°C.
JIS C 0050-5.4
*Solder temperature:2705C
*Immersion time:101 sec
Solder:Sn3Ag0.5Cu for lead-free
Loss of metallization on the edges of each
electrode shall not exceed 25%.
Measurement to be made after keeping at
room temperature for 242 hrs
Drop Test
*Height:75 cm
No mechanical damage.
JIS C 0044
Electrical specification shall satisfy the
descriptions in electrical characteristics under
the operational temperature range within -40
~ 85°C.
*Test Surface:Rigid surface of concrete or
Customer’s specification.
steel.
*Times:6 surfaces for each units;2 times
for each side.
Vibration
*Frequency:10Hz~55Hz~10Hz(1min)
*Total amplitude:1.5mm
No mechanical damage.
JIS C 0040
Electrical specification shall satisfy the
descriptions in electrical characteristics under
the operational temperature range within -40
~ 85°C.
*Test times:6hrs.(Two hrs each in three
mutually perpendicular directions)
Adhesive Strength
of Termination
*Pressurizing force:
No remarkable damage or removal of the
termination.
5N(≦0603);10N(>0603)
JIS C 0051- 7.4.3
*Test time:10±1 sec
Bending test
The middle part of substrate shall be
pressurized by means of the pressurizing rod
at a rate of about 1 mm/s per second until the
deflection becomes 1mm/s and then pressure
shall be maintained for 51 sec.
No mechanical damage.
JIS C 0051- 7.4.1
Electrical specification shall satisfy the
descriptions in electrical characteristics under
the operational temperature range within -40
~ 85°C.
Measurement to be made after keeping at
room temperature for 242 hours
Page 5 of 7
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Approval sheet
Temperature cycle
JIS C 0025
1. 303 minutes at -40C3C,
2. 10~15 minutes at room temperature,
3. 303 minutes at +85C3C,
No mechanical damage.
Electrical specification shall satisfy the
descriptions in electrical characteristics
under the operational temperature range
within -40 ~ 85°C.
4. 10~15 minutes at room temperature,
Total 100 continuous cycles
Measurement to be made after keeping at
room temperature for 242 hrs
High temperature
JIS C 0021
*Temperature:85C2C
No mechanical damage.
Electrical specification shall satisfy the
descriptions in electrical characteristics under
the operational temperature range within -40
~ 85°C.
*Test duration:1000+24/-0 hours
Measurement to be made after keeping at
room temperature for 242 hrs
Humidity
*Humidity:90% to 95% R.H.
*Temperature:402C
*Time:1000+24/-0 hrs.
No mechanical damage.
(steady conditions)
JIS C 0022
Electrical specification shall satisfy the
descriptions in electrical characteristics under
the operational temperature range within -40
~ 85°C.
Measurement to be made after keeping at
room temperature for 242 hrs
※ 500hrs measuring the first data then
1000hrs data
Low temperature
JIS C 0020
*Temperature:-40C2C
No mechanical damage.
Electrical specification shall satisfy the
descriptions in electrical characteristics under
the operational temperature range within -40
~ 85°C.
*Test duration:1000+24/-0 hours
Measurement to be made after keeping at
room temperature for 242 hrs
Page 6 of 7
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Approval sheet
SOLDERING CONDITION
Typical examples of soldering processes that provide reliable joints without any damage are given in Fig 2,
Fig 2. Infrared soldering profile
ORDERING CODE
RF
BPB
2012
1G9
Central
Frequency
D
0
T
Walsin
Product
Code
Dimension
code
Application
Specification
Design Code
Packing
T : Reeled
RF
D : GSM900 /
DSC1800
device
BPB :
Per 2 digits of
Length, Width,
Thickness :
1G9 : 1.9 GHz
Balanced
Type
e.g. :
Band Pass
Filter
2012 =
Length 20,
Width 12,
Minimum Ordering Quantity: 2000 pcs per reel.
PACKAGING
Plastic Tape specifications (unit :mm)
ΦD
Index
Ao
Bo
T
W
1.30 ± 0.10
2.25 ± 0.10
1.55 ± 0.10
1.10 ± 0.10
8.00 ± 0.30
Dimension (mm)
Index
E
F
Po
P1
P2
1.75 ± 0.10
3.50 ± 0.05
4.00 ± 0.10
4.00 ± 0.10
2.00 ± 0.10
Dimension (mm)
Page 7 of 7
ASC_RFBPB20121G9D0T_V02
Feb. 2017
Approval sheet
Reel dimensions
B
A
C
Index
A
B
C
Φ178.0
Φ60.0
Φ13.0
Dimension (mm)
Taping Quantity:2000 pieces per 7” reel
CAUTION OF HANDLING
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability for
the prevention of defects, which might directly cause damage to the third party’s life, body or property.
(1) Aircraft equipment
(2) Aerospace equipment
(3) Undersea equipment
(4) Medical equipment
(5) Disaster prevention / crime prevention equipment
(6) Traffic signal equipment
(7) Transportation equipment (vehicles, trains, ships, etc.)
(8) Applications of similar complexity and /or reliability requirements to the applications listed in the above.
Storage condition
(1) Products should be used in 6 months from the day of WALSIN outgoing inspection.
(2) Storage environment condition.
Products should be storage in the warehouse on the following conditions.
Temperature
Humidity
: +5 to +40℃
: 30 to 70% relative humidity
Don’t keep products in corrosive gases such as sulfur. Chlorine gas or acid or it may cause oxidization of
electrode, resulting in poor solderability.
Products should be storage on the palette for the prevention of the influence from humidity, dust and son on.
Products should be storage in the warehouse without heat shock, vibration, direct sunlight and so on.
Products should be storage under the airtight packaged condition.
Page 8 of 7
ASC_RFBPB20121G9D0T_V02
Feb. 2017
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