VSSAF522-M3/I [VISHAY]
Surface-Mount TMBS® (Trench MOS Barrier Schottky) Rectifier;型号: | VSSAF522-M3/I |
厂家: | VISHAY |
描述: | Surface-Mount TMBS® (Trench MOS Barrier Schottky) Rectifier |
文件: | 总5页 (文件大小:123K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
VSSAF522
Vishay General Semiconductor
www.vishay.com
Surface-Mount TMBS® (Trench MOS Barrier Schottky) Rectifier
FEATURES
®
Available
eSMP Series
• Very low profile - typical height of 0.95 mm
• Trench MOS Schottky technology
• Low power losses, high efficiency
• Low forward voltage drop
• Meets MSL level 1, per J-STD-020,
LF maximum peak of 260 °C
Bottom View
Top View
SlimSMA (DO-221AC)
• AEC-Q101 qualified available
- Automotive ordering code: base P/NHM3
Cathode
Anode
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
DESIGN SUPPORT TOOLS AVAILABLE
TYPICAL APPLICATIONS
3
D
For use in high frequency inverters, freewheeling, DC/DC
converters, and polarity protection in commercial, industrial,
and automotive applications.
3D Models
PRIMARY CHARACTERISTICS
MECHANICAL DATA
IF(AV)
5.0 A
200 V
90 A
Case: SlimSMA (DO-221AC)
Molding compound meets UL 94 V-0 flammability rating
VRRM
IFSM
Base P/N-M3
commercial grade
Base P/NHM3
AEC-Q101 qualified
-
halogen-free, RoHS-compliant, and
VF at IF = 5.0 A (125 °C)
TJ max.
0.69 V
175 °C
-
halogen-free, RoHS-compliant, and
Package
SlimSMA (DO-221AC)
Single
Terminals: matte tin plated leads, solderable per
J-STD-002 and JESD 22-B102
Circuit configuration
M3 and HM3 suffix meets JESD 201 class 2 whisker test
Polarity: color band denotes cathode end
MAXIMUM RATINGS (TA = 25 °C unless otherwise noted)
PARAMETER
SYMBOL
VSSAF522
UNIT
Device marking code
V522
200
2
Maximum repetitive peak reverse voltage
VRRM
V
A
(1)
IF(AV)
Maximum average forward rectified current
(2)
IF(AV)
5.0
Peak forward surge current 10 ms single half sine-wave
superimposed on rated load
IFSM
90
A
(3)
Operating junction temperature range
Storage temperature range
TJ
-40 to +175
-55 to +175
°C
°C
TSTG
Notes
(1)
(2)
(3)
Free air, mounted on recommended copper pad area
Mounted on 30 mm x 30 mm pad areas aluminum PCB
The heat generated must be less than the thermal conductivity from junction-to-ambient: dPD/dTJ < 1/RJA
Revision: 09-Jan-2018
Document Number: 87453
1
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSSAF522
Vishay General Semiconductor
www.vishay.com
ELECTRICAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)
PARAMETER
TEST CONDITIONS
SYMBOL
TYP.
0.76
0.82
0.61
0.69
0.001
0.3
MAX.
UNIT
IF = 2.5 A
-
TA = 25 °C
IF = 5.0 A
IF = 2.5 A
IF = 5.0 A
0.90
(1)
Instantaneous forward voltage
VF
V
-
TA = 125 °C
0.77
TA = 25 °C
TA = 125 °C
TA = 25 °C
TA = 125 °C
-
VR = 160 V
-
0.05
3
(2)
Reverse current
IR
mA
pF
-
VR = 200 V
0.7
Typical junction capacitance
4.0 V, 1 MHz
CJ
240
-
Notes
(1)
Pulse test: 300 μs pulse width, 1 % duty cycle
Pulse test: Pulse width 40 ms
(2)
THERMAL CHARACTERISTICS (TA = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
VSSAF522
UNIT
(1)(2)
RJA
115
12
Typical thermal resistance
°C/W
(3)
RJM
Notes
(1)
The heat generated must be less than thermal conductivity from junction-to-ambient: dPD/dTJ < 1/RJA
Free air, mounted on recommended copper pad area; thermal resistance RJA - junction-to-ambient
Mounted on 30 mm x 30 mm aluminum PCB; thermal resistance RJM - junction-to-mount
(2)
(3)
ORDERING INFORMATION (Example)
PREFERRED P/N
VSSAF522-M3/H
VSSAF522-M3/I
UNIT WEIGHT (g)
PREFERRED PACKAGE CODE
BASE QUANTITY
3500
DELIVERY MODE
0.032
H
I
7" diameter plastic tape and reel
13" diameter plastic tape and reel
7" diameter plastic tape and reel
13" diameter plastic tape and reel
0.032
14 000
VSSAF522HM3/H (1)
VSSAF522HM3/I (1)
0.032
H
I
3500
0.032
14 000
Note
(1)
AEC-Q101 qualified
Revision: 09-Jan-2018
Document Number: 87453
2
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSSAF522
Vishay General Semiconductor
www.vishay.com
RATINGS AND CHARACTERISTICS CURVES (TA = 25 °C unless otherwise noted)
Axis Title
Axis Title
6
5
4
3
2
1
0
10000
1000
100
100
10
10000
1000
100
RthJM = 12 °C/W
TJ = 175 °C
TM measured at cathode
1
terminal mount typical values
TJ = 150 °C
TJ = 125 °C
0.1
TJ = 100 °C
0.01
RthJA = 115 °C/W
0.001
0.0001
0.00001
0.000001
TJ = 25 °C
TJ = -40 °C
10
10
0
25
50
75
100 125 150 175
20
40
60
80
100
Mount Temperature (°C)
Percent of Rated Peak Reverse Voltage (%)
Fig. 1 - Maximum Forward Current Derating Curve
Fig. 4 - Typical Reverse Leakage Characteristics
Axis Title
Axis Title
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
10000
1000
10000
TJ = 25 °C
f = 1.0 MHz
D = 0.8
Vsig = 50 mVp-p
D = 0.5
1000
100
10
1000
100
10
D = 0.3
D = 0.2
D = 0.1
D = 1.0
100
10
T
D = tp/T
tp
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
6
0.1
1
10
100
1000
Average Forward Current (A)
Reverse Voltage (V)
Fig. 2 - Forward Power Loss Characteristics
Fig. 5 - Typical Junction Capacitance
Axis Title
Axis Title
100
10
1
10000
1000
100
1000
100
10
10000
1000
100
Junction to ambient
TJ = 175 °C
TJ = 150 °C
TJ = 125 °C
TJ = 100 °C
TJ = 25 °C
TJ = -40 °C
0.1
10
1
0.01
10
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
Instantaneous Forward Voltage (V)
0.1
1
10
100
t - Pulse Duration (s)
Fig. 3 - Typical Instantaneous Forward Characteristics
Fig. 6 - Typical Transient Thermal Impedance
Revision: 09-Jan-2018
Document Number: 87453
3
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSSAF522
Vishay General Semiconductor
www.vishay.com
Axis Title
120
100
80
60
40
20
0
10000
1000
100
Epoxy printed circuit
board FR4 copper
thickness = 70 µm
S (cm2)
10
0
1
2
3
4
5
6
7
8
9
Copper Pad Areas (cm2)
Fig. 7 - Thermal Resistance Junction to Ambient
vs. Copper Pad Area
PACKAGE OUTLINE DIMENSIONS in inches (millimeters)
SlimSMA (DO-221AC)
Cathode Band
0.057 (1.45)
0.049 (1.25)
0.106 (2.70)
0.098 (2.50)
0.171 (4.35)
0.163 (4.15)
0.211 (5.35)
0.199 (5.05)
0.047 (1.20)
Typ.: 0.019 (0.48)
0.030 (0.75)
Mounting Pad Layout
0.039 (1.00)
0.035 (0.90)
0.060 (1.52)
MIN.
0.012 (0.30)
0.006 (0.15)
0.123 (3.12) MAX.
0.217 (5.52) REF.
0.047 (1.20)
MIN.
0.047 (1.20)
MIN.
Revision: 09-Jan-2018
Document Number: 87453
4
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Revision: 01-Jan-2021
Document Number: 91000
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