VSM0805RTSW [VISHAY]
Bulk Metal Foil Technology Discrete Surface Mount Chip Resistors; Bulk Metal箔技术分立表面贴装片式电阻器
| 型号： | VSM0805RTSW |
| 厂家： | 
VISHAY |
| 描述： | Bulk Metal Foil Technology Discrete Surface Mount Chip Resistors |
| 文件： | 总2页 (文件大小：67K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
VSM0805
Vishay Foil Resistors
Bulk Metal® Foil Technology
Discrete Surface Mount Chip Resistors
FEATURES
• Nominal TCR: + 0.6ppm/°C (0 to 25°C)
- 0.6ppm/C° (+ 25°C to + 60°C)
+ 2.2ppm/°C (- 55°C to + 25°C)
- 1.8ppm/°C (+ 25°C to + 125°C)
•
Absolute Tolerance: to ± 0.01%
Product may not
be to scale
• Resistance Range: 5.5Ω to 12K
• Load Life Stability: ± 0.025% (2000 hours @ 70°C)
• Shelf Life Stability: 0.005% Maximum ∆R
• Voltage Coefficient: < 0.00001%/volt (< 0.1ppm/V)
• Current Noise: < - 40dB
The VSM0805 represents the latest addition and smallest size
to the Precision Bulk Metal® Foil (BMF) technology surface
mount chip resistor series. The VSM0805 has a conventional
full wrap around termination.
• Non Inductive: < 0.08µH
• Terminal Finishes Available:
Lead (Pb)-free (Sn 99.3% Cu 0.7%)
Tin/Lead Alloy (Sn 62% Pb 36% Ag 2%)
The BMF technology offers designers the lowest and most
predictable absolute Temperature Coefficient Resistance
available. The TCR is a process capability not a selection
process and for the most part is independent of ohmic value
and lot related variations.
TABLE 1 - TOLERANCE VERSUS RESISTANCE VALUE
VALUE
TIGHTEST
(Ω)
TOLERANCE (%)*
The availability of tight absolute tolerance provides a good cost
solution for the variability of other components when compiling
the total error budget. BMF offers the best stability available;
and is an order of magnitude better than thin film technology.
The noise generated by the resistor is non measurable and its
design and construction make it well suited for high frequency
applications. The BMF is the ultimate resistor component for
analog applications.
250Ω to 12K
100Ω to < 250
50Ω to < 100
25Ω to < 50
10Ω to < 25
5.5Ω to <10
± 0.01
± 0.02
± 0.05
± 0.1
± 0.25
± 0.5
FIGURE 1 - NOMINAL TCR CURVE
*Tighter tolerances are available. Please contact Application
Engineering. Soldering temperatures used during installation may
cause resistance to shift up to 0.05%.
–55
–50
–25
0
+25
+50
+75
+100
+125
+500
+400
+300
+200
+100
+5 ppm
-5 ppm
TABLE 2 - TYPICAL PERFORMANCE SPECIFICATIONS
Nominal Resistance/
Temperature (RT) Curve
MIL-PRF-55342G
CHARACTERISTIC. E
∆R LIMITS
VSM
MAXIMUM
∆R LIMITS*
∆R
TEST
0
R
Maximum
(ppm)
Spread
–100
±2.3 ppm/°C
–200
–300
Thermal Shock
± 0.10%
± 0.10%
± 0.10%
± 0.10%
± 0.20%
± 0.20%
± 0.50%
± 0.02%
± 0.02%
± 0.02%
± 0.05%
± 0.05%
± 0.10%
± 0.025%
Standard
Spread
±2.0 ppm/°C
–1.8 ppm/°C
Nominal Chord
Slope (TCR)
+2.2 ppm/°C
Nominal Chord
Slope (TCR)
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Resistance to Bonding
Moisture Resistance
Life 2000 hours @ + 70°C
–400
–500
–55°C / +25°C / +125°C are the test points
with +25°C as the reference temperature
The TCR for values < 100Ω are influenced by the termination
composition and result in a deviation from this curve. Contact our
application engineering department for detailed specification on low
values
*As shown + 0.01 Ohms to allow for measurement errors at low values.
SALES
• ISRAEL: foilsales.israel@vishay.com
• FRANCE/SWITZERLAND/SOUTHERN EUROPE: foilsales.eusouth@vishay.com
• AMERICAS: foilsales.usa@vishay.com
• ASIA/JAPAN: foilsales.asia@vishay.com • UK/HOLLAND/SCANDANAVIA: foilsales.eunorth@vishay.com • GERMANY/CZECH REPUBLIC/AUSTRIA: foilsales.eucentral@vishay.com
For technical questions in the Americas, contact foilsupport1@vishay.com
For technical questions in Asia/Japan/Europe/Africa/Israel, contact foilsupport2@vishay.com
www.vishay.com
22
Document Number: 63061
Revision 17-Aug-04
VSM0805
Vishay Foil Resistors
Bulk Metal® Foil Technology
Discrete Surface Mount Chip Resistors
FIGURE 2 - POWER DERATING CURVE
FIGURE 3 - RECOMMENDED MOUNTING
–55°C
+70°C
125
100
75
50
25
0
Rated Power
25% to 85% of T
A low profile solder fillet is recommended
to avoid unnecessary stresses along
top edge of metallization. IR and vapor
phase reflow are best. Avoid the use of
cleaning agents which could attack
epoxy resins, which form part of the
resistor construction.
-75 –50 –25
0
+25 +50 +75 +100 +125 +150 +175
Ambient Temperature (°C)
TABLE 3 - CHIP SIZES AND SPECIFICATIONS in inches (millimeters)
Top View
L
Bottom View
L
Recommended Land Pattern
Footprint
X
W
W
G
T
T
Z
D
CHIP
SIZE
POWERMAXIMUM RESISTANCE MAXIMUM
L
W
T
D
+ 70°C VOLTAGE
RANGE
WEIGHT
Z*
G*
X*
± 0.005 (0.13) ± 0.005 (0.13) MAXIMUM ± 0.005 (0.13) (mW)
(V)
(Ω)
(mG) ± 0.004 (0.10) ± 0.004 (0.10) ± 0.004 (0.10)
0805 0.080 (2.03) 0.050 (1.27) 0.025 (0.64) 0.015 (0.38)
*Land Pattern Dimensions (Z, G, X) are per IPC-782A
50
22
5.5 - 12K
6
0.122 (3.10) 0.028 (0.70) 0.050 (1.27)
TABLE 4 - ORDERING INFORMATION - VSM STYLE CHIP RESISTORS
MODEL
CHIP SIZE
RESISTANCE VALUE
TOLERANCE
TERMINATION
PACKAGING
VSM
0805
RESISTANCE
RANGE
LETTER
DESIGNATOR
MULTIPLIER
FACTOR
T ± 0.01%
Q± 0.02%
A ± 0.05%
B ± 0.1%
C ± 0.25%
D ± 0.5%
F ± 1.0%
S - Lead (Pb)-free T = Tape and
B - Tin/Lead
Reel
W = Waffle
PacK
5Ω to <1KΩ
R
x 1.0
x 103
Example: 249R00 = 249Ω
1K to 12KΩ
K
Example: 10K000 = 10.0KΩ
SALES
• ISRAEL: foilsales.israel@vishay.com
• FRANCE/SWITZERLAND/SOUTHERN EUROPE: foilsales.eusouth@vishay.com
• AMERICAS: foilsales.usa@vishay.com
• ASIA/JAPAN: foilsales.asia@vishay.com • UK/HOLLAND/SCANDANAVIA: foilsales.eunorth@vishay.com • GERMANY/CZECH REPUBLIC/AUSTRIA: foilsales.eucentral@vishay.com
For technical questions in the Americas, contact foilsupport1@vishay.com
For technical questions in Asia/Japan/Europe/Africa/Israel, contact foilsupport2@vishay.com
Document Number: 63061
Revision 17-Aug-04
www.vishay.com
23
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