V3FM12-M3/I [VISHAY]
Surface-Mount TMBS® (Trench MOS Barrier Schottky) Rectifiers;
| 型号： | V3FM12-M3/I |
| 厂家： | 
VISHAY |
| 描述： | Surface-Mount TMBS® (Trench MOS Barrier Schottky) Rectifiers |
| 文件： | 总5页 (文件大小：106K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
V3FM12
Vishay General Semiconductor
www.vishay.com
Surface-Mount TMBS® (Trench MOS Barrier Schottky) Rectifiers
FEATURES
®
Available
• Trench MOS Schottky technology
• Low profile package
eSMP Series
• Ideal for automated placement
• Low forward voltage drop, low power losses
• Meets MSL level 1, per J-STD-020,
LF maximum peak of 260 °C
Top view
Bottom view
• Wave and reflow solderable
SMF (DO-219AB)
• AEC-Q101 qualified available
- Automotive ordering code: base P/NHM3
Cathode
Anode
• Compatible to SOD-123W package case outline
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
LINKS TO ADDITIONAL RESOURCES
3
D
3D Models
TYPICAL APPLICATIONS
For use in high frequency inverters, freewheeling, DC/DC
converters, and polarity protection in commercial, industrial,
and automotive applications.
PRIMARY CHARACTERISTICS
IF(AV)
3.0 A
120 V
60 A
VRRM
IFSM
MECHANICAL DATA
Case: SMF (DO-219AB)
Molding compound meets UL 94 V-0 flammability rating
Base P/N-M3 - halogen-free, RoHS-compliant
VF at IF = 3 A (TA = 125 °C)
TJ max.
0.64 V
175 °C
Package
SMF (DO-219AB)
Single
Base P/NHM3
- halogen-free, RoHS-compliant, and
Circuit configuration
AEC-Q101 qualified
Terminals: matte tin plated leads, solderable per
J-STD-002 and JESD 22-B102
M3 and HM3 suffix meet JESD 201 class 2 whisker test
Polarity: color band denotes the cathode end
MAXIMUM RATINGS (TA = 25 °C unless otherwise noted)
PARAMETER
SYMBOL
V3FM12
3MS
120
UNIT
Device marking code
Maximum repetitive peak reverse voltage
VRRM
V
A
(1)
IF(AV)
2.5
Maximum average forward rectified current (fig.1)
(2)
IF(AV)
3.0
Peak forward surge current 8.3 ms single half
sine-wave superimposed on rated load
IFSM
60
A
(3)
Operating junction temperature range
Storage temperature range
TJ
-40 to +175
-55 to +175
°C
TSTG
Notes
(1)
(2)
(3)
Free air, mounted on FR4 PCB, 2 oz. standard footprint
Mounted on FR4 PCB, 2 oz.10 mm x 10 mm copper pad area
The heat generated must be less than the thermal conductivity from junction-to-ambient: dPD/dTJ < 1/RθJA
Revision: 13-May-2020
Document Number: 87570
1
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
V3FM12
Vishay General Semiconductor
www.vishay.com
ELECTRICAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)
PARAMETER
TEST CONDITIONS
SYMBOL
TYP.
0.65
0.84
0.55
0.64
0.7
MAX.
UNIT
IF = 1.5 A
IF = 3.0 A
IF = 1.5 A
IF = 3.0 A
-
0.94
-
T
A = 25 °C
(1)
Instantaneous forward voltage
VF
V
TA = 125 °C
0.72
-
TA = 25 °C
TA = 125 °C
TA = 25 °C
TA = 125 °C
VR = 90 V
550
-
-
(2)
Reverse current
IR
μA
pF
100
3000
-
VR = 120 V
950
220
Typical junction capacitance
4.0 V, 1 MHz
CJ
Notes
(1)
Pulse test: 300 μs pulse width, 1 % duty cycle
Pulse test: Pulse width ≤ 5 ms
(2)
THERMAL CHARACTERISTICS (TA = 25 °c unless otherwise noted)
PARAMETER
SYMBOL
V3FM12
UNIT
(1)(2)
RθJA
125
22
Typical thermal resistance
°C/W
(3)
RθJM
Notes
(1)
The heat generated must be less than the thermal conductivity from junction-to-ambient: dPD/dTJ<1/RθJA
Device mounted on FR4 PCB, 2 oz. standard footprint, thermal resistance RθJA – junction-to-ambient
Device mounted on 10 mm x 10 mm pad size area footprint; thermal resistance RθJM – junction-to-mount
(2)
(3)
ORDERING INFORMATION (Example)
PREFERRED P/N
UNIT WEIGHT (g)
PREFERRED PACKAGE CODE BASE QUANTITY
DELIVERY MODE
V3FM12-M3/H
0.015
H
I
3000
10 000
3000
7" diameter plastic tape and reel
13" diameter plastic tape and reel
7" diameter plastic tape and reel
13" diameter plastic tape and reel
V3FM12-M3/I
0.015
V3FM12HM3/H (1)
V3FM12HM3/I (1)
0.015
H
I
0.015
10 000
Note
(1)
AEC-Q101 qualified
Revision: 13-May-2020
Document Number: 87570
2
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
V3FM12
Vishay General Semiconductor
www.vishay.com
RATINGS AND CHARACTERISTICS CURVES (TA = 25 °C unless otherwise noted)
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
100 000
10000
1000
100
RthJM = 22 °C/W
TJ = 175 °C
TJ = 125 °C
TJ = 150 °C
TJ = 100 °C
10
RthJA = 125 °C/W
1
TJ = 25 °C
0.1
0.01
0.001
TM measured at cathode terminal mount
typical values
TJ = -40 °C
60 70
0
25
50
75
100
125
150
175
20
30
40
50
80
90 100
Mount Temperature (°C)
Percent of Rated Peak Reverse Voltage (%)
Fig. 4 - Typical Reverse Leakage Characteristics
Fig. 1 - Maximum Forward Current Derating Curve
2.5
1000
D = 0.8
TJ = 25 °C
f = 1.0 MHz
D = 0.5
Vsig = 50 mVp-p
2.0
D = 0.3
D = 1.0
100
10
1
1.5
1.0
0.5
0.0
D = 0.2
D = 0.1
T
D = tp/T
tp
0
0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7
Average Forward Current (A)
3
3.3 3.6
0.1
1
10
100
1000
Reverse Voltage (V)
Fig. 5 - Typical Junction Capacitance
Fig. 2 - Average Power Loss Characteristics
10
1000
100
10
TJ = 175 °C
Junction to ambient
TJ = 150 °C
TJ = 125 °C
TJ = 100 °C
1
TJ = 25 °C
TJ = -40 °C
0.1
1
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
0.01
0.1
1
10
100
Instantaneous Forward Voltage (V)
t - Pulse Duration (s)
Fig. 6 - Typical Transient Thermal Impedance
Fig. 3 - Typical Instantaneous Forward Characteristics
Revision: 13-May-2020
Document Number: 87570
3
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
V3FM12
Vishay General Semiconductor
www.vishay.com
PACKAGE OUTLINE DIMENSIONS in millimeters (inches)
0.85 (0.033)
0.35 (0.014)
Detail Z
enlarged
1.08 (0.043)
0.88 (0.035)
2.9 (0.114)
2.7 (0.106)
3.9 (0.154)
3.5 (0.138)
Foot print recommendation:
1.3 (0.051)
1.3 (0.051)
Created - Date: 15. February 2005
Rev. 3 - Date: 13. March 2007
Document no.:S8-V-3915.01-001 (4)
17247
2.9 (0.114)
Revision: 13-May-2020
Document Number: 87570
4
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Legal Disclaimer Notice
www.vishay.com
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Disclaimer
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Revision: 01-Jan-2021
Document Number: 91000
1
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