TFDU6300_09 [VISHAY]
Fast Infrared Transceiver Module (FIR, 4 Mbit/s); 快速红外收发器模块（ FIR ， 4兆位/秒）
| 型号： | TFDU6300_09 |
| 厂家： | 
VISHAY |
| 描述： | Fast Infrared Transceiver Module (FIR, 4 Mbit/s) |
| 文件： | 总12页 (文件大小：193K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TFDU6300
Vishay Semiconductors
Fast Infrared Transceiver Module (FIR, 4 Mbit/s)
for 2.4 V to 3.6 V Operation
FEATURES
• Compliant to the latest IrDA physical layer
specification (up to 4 Mbit/s) with an extended
low power range of > 70 cm (typ. 1 m) and TV
remote control (> 9 m)
• Operates from 2.4 V to 3.6 V within specification
20101
• Low power consumption (1.8 mA typ. supply
current)
DESCRIPTION
• Power shutdown mode (0.01 µA typ. shutdown current)
The TFDU6300 transceiver is an infrared transceiver module
compliant to the latest IrDA® physical layer low-power
standard for fast infrared data communication, supporting
IrDA speeds up to 4 Mbit/s (FIR), HP-SIR®, Sharp ASK® and
carrier based remote control modes up to 2 MHz. Integrated
within the transceiver module is a photo PIN diode, an
infrared emitter (IRED), and a low-power control IC to
provide a total front-end solution in a single package.
This new Vishay FIR transceiver is built in a new smaller
package using the experiences of the lead frame BabyFace
technology. The transceivers are capable of directly
interfacing with a wide variety of I/O devices, which perform
the modulation/demodulation function. At a minimum, a VCC
bypass capacitor is the only external component required
implementing a complete solution. TFDU6300 has a tri-state
output and is floating in shutdown mode with a weak pull-up.
An otherwise identical transceiver with low-voltage (1.8 V)
logic levels is available as TFDU6301.
• Surface mount package
- universal (L 8.5 mm x H 2.5 mm x W 3.1 mm)
• Tri-state-receiver output, floating in shutdown with a weak
pull-up
• Low profile (universal) package capable of surface mount
soldering to side and top view orientation
• Directly interfaces with various super I/O and controller
devices
• Only one external component required
• Split power supply, transmitter and receiver can be
operated from two power supplies with relaxed
requirements saving costs
• Qualified for lead (Pb)-free and Sn/Pb processing (MSL4)
• Compliant to RoHS directive 2002/95/EC and in
accordance to WEEE 2002/96/EC
APPLICATIONS
• Notebook computers, desktop PCs, palmtop computers
(Win CE, Palm PC), PDAs
• Digital cameras and video cameras
• Printers, fax machines, photocopiers, screen projectors
• Telecommunication products (cellular phones, pagers)
• Internet TV boxes, video conferencing systems
• External infrared adapters (dongles)
• Medical and industrial data collection
PRODUCT SUMMARY
DIMENSIONS
H x L x W
(mm x mm x mm)
OPERATING
VOLTAGE
(V)
IDLE SUPPLY
CURRENT
(mA)
DATA RATE
(kbit/s)
LINK DISTANCE
(m)
PART NUMBER
TFDU6300
4000
2.5 x 8.5 x 3.1
0 to 0.7
2.4 to 3.6
2
PARTS TABLE
PART
DESCRIPTION
QTY/REEL OR TUBE
TFDU6300-TR3
TFDU6300-TT3
TFDU6300-TR1
TFDU6300-TT1
Oriented in carrier tape for side view surface mounting
Oriented in carrier tape for top view surface mounting
Oriented in carrier tape for side view surface mounting
Oriented in carrier tape for top view surface mounting
2500 pcs
2500 pcs
750 pcs
750 pcs
Document Number: 84763
Rev. 2.0, 04-Aug-09
For technical questions within your region, please contact one of the following:
irdasupportAM@vishay.com, irdasupportAP@vishay.com, irdasupportEU@vishay.com
www.vishay.com
1
TFDU6300
Fast Infrared Transceiver Module (FIR, 4 Mbit/s)
for 2.4 V to 3.6 V Operation
Vishay Semiconductors
FUNCTIONAL BLOCK DIAGRAM
VCC1
Tri-State
Driver
RXD
Amplifier
Comparator
VCC2
SD
Logic
and
Controlled
Driver
Control
TXD
18468_1
GND
Fig. 1 - Functional Block Diagram
PIN DESCRIPTION
PIN
SYMBOL
NUMBER
DESCRIPTION
I/O
ACTIVE
IRED anode to be externally connected to VCC2 (VIRED). For higher voltages
than 3.6 V an external resistor might be necessary for reducing the internal
power dissipation. This pin is allowed to be supplied from an uncontrolled
power supply separated from the controlled VCC1 - supply
VCC2
IRED anode
1
2
3
IRED cathode
TXD
IRED cathode, internally connected to driver transistor
This input is used to transmit serial data when SD is low. An on-chip
protection circuit disables the IRED driver if the TXD pin is asserted for longer
than 100 µs. When used in conjunction with the SD pin, this pin is also used
to control the receiver mode. Logic reference: VCC1
I
O
I
High
Low
High
Received data output, push-pull CMOS driver output capable of driving
standard CMOS. No external pull-up or pull-down resistor is required.
Floating with a weak pull-up of 500 k (typ.) in shutdown mode.
High/low levels related to VCC1. RXD echoes the TXD signal
4
5
RXD
SD
Shutdown, also used for dynamic mode switching. Setting this pin active
places the module into shutdown mode. On the falling edge of this signal, the
state of the TXD pin is sampled and used to set receiver low bandwidth
(TXD = low: SIR) or high bandwidth (TXD = high: MIR and FIR) mode
6
7
8
VCC1
NC
Supply voltage
Internally not connected
Ground
I
GND
Definitions:
PINOUT
In the Vishay transceiver datasheets the following
nomenclature is used for defining the IrDA operating modes:
SIR: 2.4 kbit/s to 115.2 kbit/s, equivalent to the basic serial
infrared standard with the physical layer version IrPhy 1.0
MIR: 576 kbit/s to 1152 kbit/s
Weight 0.075 g
FIR: 4 Mbit/s
VFIR: 16 Mbit/s
MIR and FIR were implemented with IrPhy 1.1, followed by
IrPhy 1.2, adding the SIR low power standard. IrPhy 1.3
extended the low power option to MIR and FIR and VFIR was
added with IrPhy 1.4. A new version of the standard in any
case obsoletes the former version. With introducing the
updated versions the old versions are obsolete. Therefore
the only valid IrDA standard is the actual version IrPhy 1.4 (in
Oct. 2002).
19531
Fig. 2 - Pinning
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2
For technical questions within your region, please contact one of the following:
irdasupportAM@vishay.com, irdasupportAP@vishay.com, irdasupportEU@vishay.com
Document Number: 84763
Rev. 2.0, 04-Aug-09
TFDU6300
Fast Infrared Transceiver Module (FIR, 4 Mbit/s)
for 2.4 V to 3.6 V Operation
Vishay Semiconductors
ABSOLUTE MAXIMUM RATINGS
PARAMETER
TEST CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
Supply voltage range,
transceiver
VCC1
0 V < VCC2 < 6 V
- 0.5
6
V
Supply voltage range,
transmitter
VCC2
0 V < VCC1 < 6 V
- 0.5
- 0.5
6.5
V
Voltage at all I/O pins
Input currents
V
in < VCC1 is allowed
6
V
For all pins, except IRED anode pin
10
mA
mA
mW
°C
Output sinking current
Power dissipation
Junction temperature
25
PD
TJ
500
125
Ambient temperature range
(operating)
Tamb
Tstg
- 25
- 25
+ 85
+ 85
260
°C
°C
°C
Storage temperature range
See section
“Recommended Solder Profiles”
Soldering temperature
I
IRED (DC)
IRED (RP)
Average output current
Repetitive pulse output current
ESD protection
150
700
mA
mA
kV
I
< 90 µs, ton < 20 %
Human body model
1
Note
Reference point pin 8, (ground) unless otherwise noted.
Typical values are for design aid only, not guaranteed nor subject to production testing.
EYE SAFETY INFORMATION
STANDARD
CLASSIFICATION
Class 1
IEC/EN 60825-1 (2007-03), DIN EN 60825-1 (2008-05) “SAFETY OF LASER PRODUCTS -
Part 1: equipment classification and requirements”, simplified method
IEC 62471 (2006), CIE S009 (2002) “Photobiological Safety of Lamps and Lamp Systems”
Exempt
DIRECTIVE 2006/25/EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL of 5th April 2006
on the minimum health and safety requirements regarding the exposure of workers to risks arising from
physical agents (artificial optical radiation) (19th individual directive within the meaning of article 16(1)
of directive 89/391/EEC)
Exempt
Note
Vishay transceivers operating inside the absolute maximum ratings are classified as eye safe according the above table.
ELECTRICAL CHARACTERISTICS (1)
PARAMETER
TRANSCEIVER
Supply voltage
TEST CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
VCC
2.4
3.6
V
Receive mode only, idle
In transmit mode, add additional 85 mA (typ) for IRED current.
Add RXD output current depending on RXD load.
Dynamic Supply current
SIR mode
ICC
ICC
1.8
2
3
mA
mA
MIR/FIR mode
3.3
SD = high
T= 25 °C, not ambient light
sensitive, detector is disabled in
shutdown mode
Shutdown supply current
Shutdown supply current
ISD
0.01
µA
SD = high, full specified
temperature range, not ambient
light sensitive
ISD
1
µA
Operating temperature range
Input voltage low (TXD, SD)
TA
- 25
+ 85
0.5
°C
V
VIL
- 0.5
Document Number: 84763
Rev. 2.0, 04-Aug-09
For technical questions within your region, please contact one of the following:
irdasupportAM@vishay.com, irdasupportAP@vishay.com, irdasupportEU@vishay.com
www.vishay.com
3
TFDU6300
Fast Infrared Transceiver Module (FIR, 4 Mbit/s)
for 2.4 V to 3.6 V Operation
Vishay Semiconductors
ELECTRICAL CHARACTERISTICS (1)
PARAMETER
TEST CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
TRANSCEIVER
Input voltage high (TXD, SD)
Input leakage current (TXD, SD)
Input capacitance, TXD, SD
CMOS level (2)
VIH
IICH
CI
VCC - 0.3
- 1
6
+ 1
5
V
VIN = 0.9 x VCC1
µA
pF
I
OL = 500 µA
Output voltage low
Output voltage high
VOL
VOH
0.4
V
V
Cload = 15 pF
I
OH = - 250 µA
0.9 x VCC1
Cload = 15 pF
Output RXD current limitation
high state
low state
Short to ground
Short to VCC1
20
20
mA
mA
SD shutdown pulse duration
RXD to VCC1 impedance
Activating shutdown
30
µs
RRXD
400
500
600
k
SD mode programming pulse
duration
All modes
tSDPW
200
ns
Notes
(1)
Tamb = 25 °C, VCC1 = VCC2 = 2.4 V to 3.6 V unless otherwise noted.
Typical values are for design aid only, not guaranteed nor subject to production testing.
The typical threshold level is 0.5 x VCC1 (VCC1 = 3 V) . It is recommended to use the specified min./max. values to avoid increased operating
current.
(2)
OPTOELECTRONIC CHARACTERISTICS (1)
PARAMETER
TEST CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
RECEIVER
9.6 kbit/s to 115.2 kbit/s
Minimum irradiance Ee (2) in
angular range (3)
50
(5)
80
(8)
mW/m2
= 850 nm to 900 nm,
Ee
Ee
(µW/cm2)
V
CC = 2.4 V
1.152 Mbit/s
Minimum irradiance Ee in angular
range, MIR mode
100
(10)
mW/m2
= 850 nm to 900 nm,
(µW/cm2)
V
CC = 2.4 V
4 Mbit/s
= 850 nm to 900 nm,
CC = 2.4 V
Minimum irradiance Ee inangular
range, FIR mode
130
(13)
200
(20)
mW/m2
Ee
Ee
(µW/cm2)
V
Maximum irradiance Ee in angular
range (4)
5
kW/m2
= 850 nm to 900 nm
(500)
(mW/cm2)
Rise time of output signal
Fall time of output signal
10 % to 90 %, CL = 15 pF
90 % to 10 %, CL = 15 pF
tr (RXD)
tf (RXD)
10
10
40
40
ns
ns
RXD pulse width of output signal,
50 %, SIR mode
Input pulse length
1.4 µs < PWopt < 25 µs
tPW
tPW
tPW
tPW
1.6
105
105
225
2.2
250
125
250
3
µs
ns
ns
ns
RXD pulse width of output signal,
50 %, MIR mode
Input pulse length
Wopt = 217 ns, 1.152 Mbit/s
275
145
275
P
RXD pulse width of output signal,
50 %, FIR mode
Input pulse length
Wopt = 125 ns, 4 Mbit/s
P
P
RXD pulse width of output signal,
50 %, FIR mode
Input pulse length
Wopt = 250 ns, 4 Mbit/s
Input irradiance = 100 mW/m2,
4 Mbit/s
25
80
350
ns
ns
ns
Stochastic jitter, leading edge
1.152 Mbit/s
115.2 kbit/s
After completion of shutdown
programming sequence
power on delay
Receiver start up time
Latency
250
100
µs
µs
tL
40
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For technical questions within your region, please contact one of the following:
irdasupportAM@vishay.com, irdasupportAP@vishay.com, irdasupportEU@vishay.com
Document Number: 84763
Rev. 2.0, 04-Aug-09
TFDU6300
Fast Infrared Transceiver Module (FIR, 4 Mbit/s)
for 2.4 V to 3.6 V Operation
Vishay Semiconductors
OPTOELECTRONIC CHARACTERISTICS (1)
PARAMETER
TEST CONDITIONS
SYMBOL
MIN.
330
18
TYP.
MAX.
UNIT
TRANSMITTER
IRED operating current, switched
current limiter
Note: no external resistor current
limiting resistor is needed
ID
440
t
600
mA
Input pulse width t < 20 µs
Input pulse width 20 µs < t < 150 µs
Input pulse width t 150 µs
tPW
tPW
tPW_lim
IIRED
µs
µs
µs
µA
Output pulse width limitation
Output leakage IRED current
150
150
1
- 1
65
Output radiant intensity,
see figure 3,
recommended appl. circuit
V
CC = VIRED = 3.3 V, = 0°
TXD = high, SD = low
Ie
180
125
468 (5)
468 (5)
0.04
mW/sr
mW/sr
Output radiant intensity,
see figure 3,
recommended appl. circuit
V
CC = VIRED = 3.3 V, = 0°, 15°
Ie
50
TXD = high, SD = low
VCC1 = 3.3 V, = 0°, 15°
TXD = low or SD = high (receiver is
inactive as long as SD = high)
Output radiant intensity
Ie
mW/sr
deg
Output radiant intensity, angle of
half intensity
24
Peak - emission wavelength (6)
p
875
886
45
900
nm
nm
Spectral bandwidth
Optical rise time,
optical fall time
tropt
tfopt
,
10
40
ns
ns
ns
Input pulse width 217 ns,
1.152 Mbit/s
Optical output pulse duration
Optical output pulse duration
topt
topt
topt
207
117
242
217
125
250
227
133
Input pulse width 125 ns,
4 Mbit/s
Input pulse width 250 ns,
4 Mbit/s
Optical output pulse duration
Optical overshoot
258
25
ns
%
Notes
(1)
Tamb = 25 °C, VCC = 2.4 V to 3.6 V unless otherwise noted. Typical values are for design aid only, not guaranteed nor subject to production
testing. All timing data measured with 4 Mbit/s are measured using the IrDA FIR transmission header. The data given here are valid 5 µs after
starting the preamble.
(2)
(3)
IrDA low power specification is 90 mW/m2. Specification takes into account a window loss of 10 %.
IrDA sensitivity definition (equivalent to threshold irradiance): minimum irradiance Ee in angular range, power per unit area. The receiver must
meet the BER specification while the source is operating at the minimum intensity in angular range into the minimum half-angular range at
the maximum link length.
Maximum irradiance Ee in angular range, power per unit area. The optical delivered to the detector by a source operating at the maximum
intensity in angular range at minimum link length must not cause receiver overdrive distortion and possible related link errors. If placed at the
active output interface reference plane of the transmitter, the receiver must meet its bit error ratio (BER) specification. For more definitions
see the document “Symbols and Terminology” on the Vishay website
(4)
(5)
(6)
Maximum value is given by eye safety class 1, IEC 60825-1, simplified method.
Due to this wavelength restriction compared to the IrDA spec of 850 nm to 900 nm the transmitter is able to operate as source for the standard
remote control applications with codes as e.g. Philips RC5/RC6® or RECS 80. When operated under IrDA full range conditions (125 mW/sr)
the RC range to be covered is in the range from 8 m to 12 m, provided that state of the art remote control receivers are used.
Document Number: 84763
Rev. 2.0, 04-Aug-09
For technical questions within your region, please contact one of the following:
irdasupportAM@vishay.com, irdasupportAP@vishay.com, irdasupportEU@vishay.com
www.vishay.com
5
TFDU6300
Fast Infrared Transceiver Module (FIR, 4 Mbit/s)
for 2.4 V to 3.6 V Operation
Vishay Semiconductors
RECOMMENDED CIRCUIT DIAGRAM
Operated at a clean low impedance power supply the
TFDU6300 needs no additional external components.
However, depending on the entire system design and board
layout, additional components may be required
(see figure 3).
the I/O circuit.
The capacitor C2 combined with the resistor R2 is the low
pass filter for smoothing the supply voltage.
R2, C1 and C2 are optional and dependent on the quality of
the supply voltages VCCx and injected noise. An unstable
power supply with dropping voltage during transmission may
reduce the sensitivity (and transmission range) of the
transceiver.
The placement of these parts is critical. It is strongly
recommended to position C2 as close as possible to the
transceiver power supply pins. A tantalum capacitor should
be used for C1 while a ceramic capacitor is used for C2.
VCC2
VCC1
GND
IRED Anode
VCC
R1
R2
C1
C2
Ground
SD
SD
TXD
RXD
TXD
RXD
In addition, when connecting the described circuit to the
power supply, low impedance wiring should be used.
IREDCathode
19307
When extended wiring is used the inductance of the power
supply can cause dynamically a voltage drop at VCC2. Often
some power supplies are not able to follow the fast current
rise time. In that case another 4.7 µF (type, see table under
C1) at VCC2 will be helpful.
Fig. 3 - Recommended Application Circuit
The capacitor C1 is buffering the supply voltage and
eliminates the inductance of the power supply line. This one
should be a tantalum or other fast capacitor to guarantee the
fast rise time of the IRED current. The resistor R1 is only
necessary for high operating voltages and elevated
temperatures.
Vishay transceivers integrate a sensitive receiver and a
built-in power driver. The combination of both needs a
careful circuit board layout. The use of thin, long, resistive
and inductive wiring should be avoided. The inputs (TXD,
SD) and the output RXD should be directly (DC) coupled to
Keep in mind that basic RF-design rules for circuit design
should be taken into account. Especially longer signal lines
should not be used without termination. See e.g. “The Art of
Electronics” Paul Horowitz, Winfield Hill, 1989, Cambridge
University Press, ISBN: 0521370957.
TABLE 1 - RECOMMENDED APPLICATION CIRCUIT COMPONENTS
COMPONENT
RECOMMENDED VALUE
VISHAY PART NUMBER
C1
C2
4.7 µF, 16 V
293D 475X9 016B
0.1 µF, ceramic
VJ 1206 Y 104 J XXMT
No resistor necessary, the internal controller is able to
control the current
R1
R2
10 , 0.125 W
CRCW-1206-10R0-F-RT1
I/O AND SOFTWARE
SETTING TO THE HIGH BANDWIDTH MODE
(0.576 Mbit/s to 4 Mbit/s)
1. Set SD input to logic “high”.
In the description, already different I/Os are mentioned.
Different combinations are tested and the function verified
with the special drivers available from the I/O suppliers. In
special cases refer to the I/O manual, the Vishay application
notes, or contact directly Vishay Sales, Marketing or
Application.
2. Set TXD input to logic “high”. Wait ts 200 ns.
3. Set SD to logic “low” (this negative edge latches state of
TXD, which determines speed setting).
4. After waiting th 200 ns TXD can be set to logic “low”. The
hold time of TXD is limited by the maximum allowed pulse
length.
MODE SWITCHING
The TFDU6300 is in the SIR mode after power on as a
default mode, therefore the FIR data transfer rate has to be
set by a programming sequence using the TXD and SD
inputs as described below. The low frequency mode covers
speeds up to 115.2 kbit/s. Signals with higher data rates
should be detected in the high frequency mode. Lower
frequency data can also be received in the high frequency
mode but with reduced sensitivity. To switch the transceivers
from low frequency mode to the high frequency mode and
vice versa, the programming sequences described below are
required.
TXD is now enabled as normal TXD input for the high
bandwidth mode.
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For technical questions within your region, please contact one of the following:
irdasupportAM@vishay.com, irdasupportAP@vishay.com, irdasupportEU@vishay.com
Document Number: 84763
Rev. 2.0, 04-Aug-09
TFDU6300
Fast Infrared Transceiver Module (FIR, 4 Mbit/s)
for 2.4 V to 3.6 V Operation
Vishay Semiconductors
SETTING TO THE LOWER BANDWIDTH MODE
(2.4 kbit/s to 115.2 kbit/s
)
50 %
1. Set SD input to logic “high”.
SD
2. Set TXD input to logic “low”. Wait ts 200 ns.
3. Set SD to logic “low” (this negative edge latches state of
TXD, which determines speed setting).
t
t
h
s
High: FIR
Low: SIR
4. TXD must be held for th 200 ns.
50 %
50 %
TXD
TXD is now enabled as normal TXD input for the high
bandwidth mode.
Note
When applying this sequence to the device already in the lower
bandwidth mode, the SD pulse is interpreted as shutdown. In this
case the RXD output of the transceiver may react with a single pulse
(going active low) for a duration less than 2 µs. The operating
software should take care for this condition.
14873
In case the applied SD pulse is longer than 4 µs, no RXD pulse is to
be expected but the receiver startup time is to be taken into account
before the device is in receive condition.
Fig. 4 - Mode Switching Timing Diagram
TABLE 2 - TRUTH TABLE
INPUTS
OUTPUTS
SD
TXD
OPTICAL INPUT IRRADIANCE mW/m2
RXD
TRANSMITTER
High
x
High
x
x
Weakly pulled (500 k) to VCC1
0
Ie
0
0
Low (echo)
High
High > 150 µs
Low
x
< 4
High
Low
> min. detection threshold irradiance
< max. detection threshold irradiance
Low
Low
Low (active)
x
0
0
> max. detection threshold irradiance
Ramp-To-Spike profile is used increasingly. Shown in
figure 4 and 5 are Vishay’s recommended profiles for use
with the TFDU6300 transceivers. For more details please
refer to the application note “SMD Assembly Instructions”.
A ramp-up rate less than 0.9 °C/s is not recommended.
Ramp-up rates faster than 1.3 °C/s could damage an optical
part because the thermal conductivity is less than compared
to a standard IC.
RECOMMENDED SOLDER PROFILES
Solder Profile for Sn/Pb Soldering
260
10 s max. at 230 °C
240
220
200
180
160
140
120
100
80
240 °C max.
2 to 4 °C/s
160 °C max.
120 to180 s
Wave Soldering
90 s max.
For TFDUxxxx and TFBSxxxx transceiver devices wave
soldering is not recommended.
2 to 4 °C/s
60
40
20
Manual Soldering
0
Manual soldering is the standard method for lab use.
0
50
100
150
200
250
300
350
However, for
a
production process it cannot be
19535
Time/s
recommended because the risk of damage is highly
dependent on the experience of the operator. Nevertheless,
we added a chapter to the above mentioned application note,
describing manual soldering and desoldering.
Fig. 5 - Recommended Solder Profile for Sn/Pb soldering
Lead (Pb)-free, Recommended Solder Profile
The TFDU6300 is a lead (Pb)-free transceiver and qualified
for lead (Pb)-free processing. For lead (Pb)-free solder paste
like Sn(3.0 - 4.0)Ag(0.5 - 0.9)Cu, there are two standard reflow
profiles: Ramp-Soak-Spike (RSS) and Ramp-To-Spike
(RTS). The Ramp-Soak-Spike profile was developed
primarily for reflow ovens heated by infrared radiation. With
widespread use of forced convection reflow ovens the
Storage
The storage and drying processes for all Vishay transceivers
(TFDUxxxx and TFBSxxx) are equivalent to MSL4.
The data for the drying procedure is given on labels on the
packing and also in the application note “Taping, Labeling,
Storage and Packing”.
Document Number: 84763
Rev. 2.0, 04-Aug-09
For technical questions within your region, please contact one of the following:
irdasupportAM@vishay.com, irdasupportAP@vishay.com, irdasupportEU@vishay.com
www.vishay.com
7
TFDU6300
Fast Infrared Transceiver Module (FIR, 4 Mbit/s)
for 2.4 V to 3.6 V Operation
Vishay Semiconductors
280
275
Tpeak = 260 °C max.
≥
Tpeak = 260 °C
T
255 °C for 10 s....30 s
250
225
200
175
150
125
100
75
240
200
160
120
80
≥
T
217 °C for 70 s max.
< 4 °C/s
1.3 °C/s
30 s max.
70 s max.
Time above 217 °C t ≤ 70 s
< 2 °C/s
= 260 °C
peak
≤
90 s to 120 s
Time above 250 °C t 40 s
Peak temperature T
2 °C/s to 4 °C/s
2 °C/s to 3 °C/s
50
40
25
0
0
0
50
100
150
Time/s
Fig. 6 - Solder Profile, RSS Recommendation
200
250
300
350
0
50
100
150
200
250
300
TFDU Fig3
19532
Time/s
Fig. 7 - RTS Recommendation
PACKAGE DIMENSIONS in millimeters
TFDU6300 (universal) package
20627
Footprint
Mounting Center
Mounting Center
7 x 0.95 = 6.65
0.95
0.2*
0.7
0.7 (8 x)
Top View
Side View
* min 0.2 Photoimageable
solder mask recommended
between pads to prevent bridgeing
20626
Fig. 8 - Package Drawing
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8
For technical questions within your region, please contact one of the following:
irdasupportAM@vishay.com, irdasupportAP@vishay.com, irdasupportEU@vishay.com
Document Number: 84763
Rev. 2.0, 04-Aug-09
TFDU6300
Fast Infrared Transceiver Module (FIR, 4 Mbit/s)
for 2.4 V to 3.6 V Operation
Vishay Semiconductors
REEL DIMENSIONS in millimeters
Drawing-No.: 9.800-5090.01-4
Issue: 1; 29.11.05
14017
Fig. 9 - Reel Drawing
TAPE WIDTH
A MAX.
(mm)
N
(mm)
W1 MIN.
(mm)
W2 MAX.
(mm)
W3 MIN.
(mm)
W3 MAX.
(mm)
(mm)
16
180
330
60
60
16.4
16.4
22.4
22.4
15.9
15.9
19.4
19.4
16
Document Number: 84763
Rev. 2.0, 04-Aug-09
For technical questions within your region, please contact one of the following:
irdasupportAM@vishay.com, irdasupportAP@vishay.com, irdasupportEU@vishay.com
www.vishay.com
9
TFDU6300
Fast Infrared Transceiver Module (FIR, 4 Mbit/s)
for 2.4 V to 3.6 V Operation
Vishay Semiconductors
TAPE DIMENSIONS in millimeters
Drawing-No.: 9.700-5280.01-4
Issue: 1; 03.11.03
19855
Fig. 10 - Tape Drawing, TFDU6300 for Top View Mounting
www.vishay.com
10
For technical questions within your region, please contact one of the following:
irdasupportAM@vishay.com, irdasupportAP@vishay.com, irdasupportEU@vishay.com
Document Number: 84763
Rev. 2.0, 04-Aug-09
TFDU6300
Fast Infrared Transceiver Module (FIR, 4 Mbit/s)
for 2.4 V to 3.6 V Operation
Vishay Semiconductors
TAPE DIMENSIONS in millimeters
19856
Drawing-No.: 9.700-5279.01-4
Issue: 1; 08.12.04
19856
Fig. 11 - Tape Drawing, TFDU6300 for Side View Mounting
Document Number: 84763
Rev. 2.0, 04-Aug-09
For technical questions within your region, please contact one of the following:
irdasupportAM@vishay.com, irdasupportAP@vishay.com, irdasupportEU@vishay.com
www.vishay.com
11
Legal Disclaimer Notice
Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular
product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk and agree
to fully indemnify and hold Vishay and its distributors harmless from and against any and all claims, liabilities, expenses and
damages arising or resulting in connection with such use or sale, including attorneys fees, even if such claim alleges that Vishay
or its distributor was negligent regarding the design or manufacture of the part. Please contact authorized Vishay personnel to
obtain written terms and conditions regarding products designed for such applications.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by
any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000
Revision: 11-Mar-11
www.vishay.com
1
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