T1610P [VISHAY]
Silicon PIN Photodiode; 硅PIN光电二极管
| 型号： | T1610P |
| 厂家： | 
VISHAY |
| 描述： | Silicon PIN Photodiode |
| 文件： | 总4页 (文件大小：76K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
T1610P
Vishay Semiconductors
Silicon PIN Photodiode
FEATURES
• Package type: chip
• Package form: single chip
• Dimensions (L x W x H in mm): 2.97 x 2.97 x 0.28
• Wafer diameter (in mm): 100
• Radiant sensitive area (in mm2): 7.7
• High photo sensitivity
• High radiant sensitivity
• Suitable for visible light
• Fast response times
21591
• Angle of half sensitivity: = 60ꢀ
DESCRIPTION
• Compliant to RoHS Directive 2002/95/EC and in
accordance to WEEE 2002/96/EC
T1610P is a high speed and high sensitive PIN photodiode
chip with 7.7 mm2 sensitive area. It is sensitive to visible light
much like the human eye and has peak sensitivity at 560 nm.
Anode is the bond pad on top, cathode is the backside
contact.
APPLICATIONS
• Ambient light sensor
• Backlight dimmer
GENERAL INFORMATION
The datasheet is based on Vishay optoelectronics sample testing under certain predetermined and assumed conditions, and is
provided for illustration purpose only. Customers are encouraged to perform testing in actual proposed packaged and used
conditions. Vishay optoelectronics die products are tested using Vishay optoelectronics based quality assurance procedures
and are manufactured using Vishay optoelectronics established processes. Estimates such as those described and set forth in
this datasheet for semiconductor die will vary depending on a number of packaging, handling, use, and other factors. Therefore
sold die may not perform on an equivalent basis to standard package products.
PRODUCT SUMMARY
COMPONENT
Ira (μA)
(deg)
0.5 (nm)
T1610P
2.9
60
390 to 800
Note
•
Test conditions see table “Basic Characteristics”
ORDERING INFORMATION
ORDERING CODE
PACKAGING
Wafer sawn on foil with disco frame
REMARKS
PACKAGE FORM
T1610P-SD-F
MOQ: 3500 pcs
Chip
Note
MOQ: minimum order quantity
•
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 ꢀC, unless otherwise specified)
PARAMETER
TEST CONDITION
SYMBOL
VALUE
16
UNIT
V
Reverse voltage
VR
Junction temperature
Tj
100
ꢀC
Operating temperature range
Storage temperature range
Storage temperature range on foil
Tamb
Tstg1
Tstg2
- 40 to + 100
- 40 to + 100
- 40 to + 50
ꢀC
ꢀC
ꢀC
Document Number: 81998
Rev. 1.4, 23-Mar-11
For technical questions, contact: optochipsupport@vishay.com
This datasheet is subject to change without notice.
www.vishay.com
1
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
T1610P
Vishay Semiconductors
Silicon PIN Photodiode
BASIC CHARACTERISTICS (Tamb = 25 ꢀC, unless otherwise specified)
PARAMETER
TEST CONDITION
R = 100 μA, E = 0
R = 10 V, E = 0
R = 3 V, f = 1 MHz, E = 0
EV = 100 lx, CIE illuminant A,
R = 5 V
SYMBOL
V(BR)
Iro
MIN.
TYP.
MAX.
UNIT
V
Breakdown voltage
Reverse dark current
Diode capacitance
I
16
V
2
5
nA
V
CD
730
pF
Reverse light current
Ira
2.9
μA
V
Angle of half sensitivity
60
560
deg
nm
nm
Wavelength of peak sensitivity
Range of spectral bandwidth
p
0.5
390 to 800
V
V
R = 5 V, RL = 50 ,
= 515 nm
Rise time
Fall time
tr
tf
100
100
ns
ns
R = 5 V, RL = 50 ,
= 515 nm
Note
The measurements are based on samples of die which are mounted on a TO-header without resin coating
•
BASIC CHARACTERISTICS (Tamb = 25 ꢀC, unless otherwise specified)
1800
1600
1400
1200
1000
800
600
400
200
0
1.0
0.8
0.6
0.4
0.2
0.0
0
5
10
15
20
25
30
35
400 500 600 700 800 900 1000 1100
21742
21741
λ - Wavelength (nm)
VR - Reverse Voltage (V)
Fig. 1 - Diode Capacitance vs. Reverse Voltage
Fig. 2 - Relative Spectral Sensitivity vs. Wavelength
MECHANICAL DIMENSIONS
PARAMETER
SYMBOL
MIN.
TYP.
2.97
MAX.
UNIT
mm
Length of chip edge (x-direction)
Length of chip edge (y-direction)
Sensitive area
Lx
Ly
2.97
mm
mm2
AS
H
7.7
Die height
0.28
mm
Bond pad anode
x * y
0.125 x 0.11
mm2
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2
For technical questions, contact: optochipsupport@vishay.com
This datasheet is subject to change without notice.
Document Number: 81998
Rev. 1.4, 23-Mar-11
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
T1610P
Vishay Semiconductors
Silicon PIN Photodiode
(1)
ADDITIONAL INFORMATION
Frontside metallization, anode
Backside metallization, cathode
Dicing
AlSi
NiV-Ag
Sawing
Die bonding technology
Epoxy bonding
Note
(1)
All chips are checked in accordance with the Vishay Semiconductor, specification of visual inspection FVOV6870.
The visual inspection shall be made in accordance with the “specification of visual inspection as referenced”. The visual inspection of chip
backside is performed with stereo microscope with incident light and 40x to 80x magnification.
The quality inspection (final visual inspection) is performed by production. An additional visual inspection step as special release procedure
by QM is not installed.
HANDLING AND STORAGE CONDITIONS
• The hermetically sealed shipment lots shall be opened in temperature and moisture controlled cleanroom environment only.
It is mandatory to follow the rules for disposition of material that can be hazardous for humans and environment.
• Product must be handled only at ESD safe workstations. Standard ESD precautions and safe work environments are as
defined in MIL-HDBK-263.
• Singulated die are not to be handled with tweezers. A vacuum wand with non metallic ESD protected tip should be used.
PACKING
Chips are fixed on adhesive foil. Upon request the foils can be mounted on plastic frame or disco frame. For shipment, the
wafers are arranged to stacks and hermetically sealed in plastic bags to ensure protection against environmental influence
(humidity and contamination).
Use for recycling reliable operators only. We can help getting in touch with your nearest sales office. By agreement we will take
back packing material, if it is sorted. You will have to bear the costs of transport. We will invoice you for any costs incurred for
packing material that is returned unsorted or which we are not obliged to accept.
Document Number: 81998
Rev. 1.4, 23-Mar-11
For technical questions, contact: optochipsupport@vishay.com
This datasheet is subject to change without notice.
www.vishay.com
3
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Legal Disclaimer Notice
Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
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the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular
product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
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Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk and agree
to fully indemnify and hold Vishay and its distributors harmless from and against any and all claims, liabilities, expenses and
damages arising or resulting in connection with such use or sale, including attorneys fees, even if such claim alleges that Vishay
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Document Number: 91000
Revision: 11-Mar-11
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