SI4719CY [VISHAY]

Battery Disconnect Switch; 蓄电池断路开关
SI4719CY
型号: SI4719CY
厂家: VISHAY    VISHAY
描述:

Battery Disconnect Switch
蓄电池断路开关

电源电路 电池 开关 电源管理电路 光电二极管
文件: 总8页 (文件大小:73K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Si4719CY  
Vishay Siliconix  
Battery Disconnect Switch  
FEATURES  
D Solution for Bi-Directional Blocking  
D Two Independent Inputs  
Bi-Directional Conduction Switch  
D Includes Precision Voltage Circuitry  
D 6- to 30-V Operation  
D Ultra Low Power Consumption in Off State  
D Ground Referenced Logic Level Inputs  
D Integrated Low rDS(on) MOSFET  
D Level-Shifted Gate Drive with Internal MOSFET  
(Leakage Current Only)  
D Logic Supply Voltage is Not Required  
DESCRIPTION  
The Si4719CY is two level-shifted p-channel MOSFETs.  
Operatingtogether, these MOSFETs can be used as a reverse  
blocking switch for battery disconnect applications. It is a  
solutionfor multiple battery technology designs or designsthat  
require isolation from the power bus during charging.  
The Si4719CY is available in a 16-pin SOIC package and is  
rated for the commercial temperature range of –25 to 85_C.  
FUNCTIONAL BLOCK DIAGRAM AND PIN CONFIGURATION  
5
9, 10, 11  
IN  
1
D
1
Logic  
and  
Gate  
Drive  
ESD  
Level  
Shift  
12  
6
GND  
G
1
7, 8  
V
GS  
S
1
1
Limiter  
Half a circuit shown here.  
Document Number: 70669  
S-59510—Rev. B, 31-Aug-98  
www.vishay.com S FaxBack 408-970-5600  
2-1  
Si4719CY  
Vishay Siliconix  
ABSOLUTE MAXIMUM RATINGS  
b
Voltage Referenced to GND  
a
Power Dissipation (t = 10 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.4 W  
V , V  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to 32 V  
(t = steady state) . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5 W  
S
D
V
V
V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to 30 V  
Notes  
SD  
a.  
V
30 V  
SD DC  
, V  
IN1 IN2  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to 15 V  
b. Device mounted with all leads soldered to 1” x 1” FR4 with laminated  
copper PC board.  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 V  
GS  
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –55 to 150_C  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation  
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating  
conditions for extended periods may affect device reliability.  
RECOMMENDED OPERATING RANGE  
V , V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 V to 30 V  
Operating Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . –25 to 85_C  
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –25 to 150_C  
S
D
V , V  
IN1 IN2  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V to 13.2 V  
I
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 A to 6 A  
DS  
SPECIFICATIONS  
Limits  
Tempa  
Minb  
Typc  
Maxb  
Unit  
W
Parameter  
Symbol  
Specific Test Conditions  
On-Resistance  
r
DS  
V
S
= 10 V, I = 1 A, V = H  
Room  
Room  
0.028  
0.040  
1
D
IN  
Leakage Current  
I
V
DS  
= 10 V  
DS(off)  
I
S
Room  
Room  
1
GND  
mA  
(off)  
Power Consumption  
V = 21 V  
S
I
S
1.0  
10  
GND  
(on)  
Input Voltage Low  
Input Voltage High  
Input Current  
V
Full  
3.3  
INL  
V
= 10 V and V = 21 V  
V
S
S
V
Full  
4.5  
2.2  
INH  
INH  
I
V
IN  
= 5.0 V  
Room  
Room  
Room  
Room  
Room  
Room  
Room  
Room  
25  
50  
10  
2
mA  
Turn-On Delay  
IN  
t
2.9  
ON(IN)  
V
S
= 10 V, R = 5 W, Test Circuit 1  
L
to D or S  
Turn-Off Delay  
t
1.15  
1.15  
0,73  
24  
OFF(IN)  
ms  
d
Break-Before-Make  
t
BBM  
Rise Time  
t
t
1.4  
50  
RISE  
FALL  
Fall Time  
ns  
V
Voltage Across Pin 6 and 7  
Forward Diode  
V
V
= 30 V  
= –1 A  
10.2  
18  
GS  
SD  
S
V
I
D
1.1  
Notes  
a. Room = 25_C, Full = as determined by the operating temperature suffix.  
b. The algebraic convention whereby the most negative value is a minimum and the most positive a maximum.  
c. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.  
d. Guaranteed by design, not subject to production testing.  
Document Number: 70669  
S-59510—Rev. B, 31-Aug-98  
www.vishay.com S FaxBack 408-970-5600  
2-2  
Si4719CY  
Vishay Siliconix  
TIMING DIAGRAMS  
10 V  
SOURCE  
50%  
50%  
V
V
IN  
0 V  
90%  
10%  
90%  
10%  
DRAIN  
D
5 W  
t
t
OFF(IN)  
ON(IN)  
t
r
t
f
TEST CIRCUIT 1  
PIN CONFIGURATION  
SO-16  
D
D
S
S
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
2
2
2
2
1
2
TRUTH TABLE  
2
VIN1  
VIN2  
Switch 1  
Switch 2  
D
G
2(OUT)  
GND  
IN  
IN  
2
0
0
1
1
0
1
0
1
Off  
Off  
On  
On  
Off  
On  
Off  
On  
GND  
1
G
D
1
1(OUT)  
S
1
D
1
S
1
D
1
Top View  
Order Number: Si4719CY  
PIN DESCRIPTION  
Pin Number  
Symbol  
Description  
1, 2, 3  
4, 12  
5
D
Drain connection for MOSFET-2.  
Ground  
2
GND  
IN  
Logic input, IN . High level turns on the switch.  
1
1
6
G
1(OUT)  
Gate output to MOSFET-1.  
7, 8  
S
Source connection for MOSFET-1  
Drain connection for MOSFET-1.  
1
9, 10, 11  
13  
D
1
IN  
Logic input, IN . High level turns on the switch.  
2
2
14  
G
2(OUT)  
Gate output to MOSFET-2.  
15, 16  
S
2
Source connection for MOSFET-2.  
Document Number: 70669  
S-59510—Rev. B, 31-Aug-98  
www.vishay.com S FaxBack 408-970-5600  
2-3  
Si4719CY  
Vishay Siliconix  
TYPICAL CHARACTERISTICS (_2C5 UNLESS NOTED)  
On-Resistance vs. Drain Current  
On-Resistance vs. Source Voltage  
0.10  
0.050  
0.040  
0.030  
0.020  
0.010  
0.000  
0.08  
0.06  
0.04  
0.02  
0
V
S
= 10 V  
I
S
= 1 A  
0
3
6
9
12  
15  
18  
21  
0
1
2
3
4
5
6
I
S
(A)  
V (V)  
S
Normalized On-Resistance vs.  
Junction Temperature  
Output Capacitance vs. Source Voltage  
1.8  
1200  
900  
600  
300  
0
V
I
= 10 V  
= 1 A  
S
S
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
V
IN  
= 0 V  
–50 –25  
0
25  
50  
75  
100 125 150  
0
5
10  
15  
(V)  
20  
25  
30  
T – Junction Temperature (_C)  
J
V
S
On-Supply Current vs. Source Voltage  
Off-Supply Current vs. Source Voltage  
10.000  
1.000  
0.100  
0.010  
0.001  
10.000  
1.000  
0.100  
0.010  
0.001  
T = 150_C  
J
T = 150_C  
J
T = 25_C  
J
T = 25_C  
J
0
5
10  
15  
(V)  
20  
25  
30  
0
5
10  
15  
(V)  
20  
25  
30  
V
V
S
S
Document Number: 70669  
S-59510—Rev. B, 31-Aug-98  
www.vishay.com S FaxBack 408-970-5600  
2-4  
Si4719CY  
Vishay Siliconix  
TYPICAL CHARACTERISTICS (_2C5 UNLESS NOTED)  
Drain-Source Diode Forward Voltage  
Input Voltage Trip Point vs. Temperature  
10  
4.30  
4.25  
4.20  
4.15  
4.10  
4.05  
4.0  
V
S
= 21 V  
T = 150_C  
J
V
S
= 10 V  
T = 25_C  
J
1
0
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
–50  
–25  
0
25  
50  
75  
100  
125  
125  
125  
150  
150  
150  
V
– Source-to-Drain Voltage (V)  
T = Ambient Temperature (_C)  
A
SD  
Turn-On Delay vs. Temperature  
Turn-off Delay vs. Temperature  
4.0  
3.6  
3.2  
2.8  
2.4  
2.0  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
V
= 10 V  
Rl = 5 W  
V = 10 V  
S
Rl = 5 W  
S
–50  
–25  
0
25  
50  
75  
100  
125  
150  
–50  
–25  
0
25  
50  
75  
100  
Temperature (_C)  
Temperature (_C)  
Rise Time vs. Temperature  
Fall Time vs. Temperature  
32  
30  
28  
26  
24  
22  
20  
18  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
V
S
= 10 V  
Rl = 5 W  
V = 10 V  
S
Rl = 5 W  
–50  
–25  
0
25  
50  
75  
100  
125  
150  
–50  
–25  
0
25  
50  
75  
100  
Temperature (_C)  
Temperature (_C)  
Document Number: 70669  
S-59510—Rev. B, 31-Aug-98  
www.vishay.com S FaxBack 408-970-5600  
2-5  
Si4719CY  
Vishay Siliconix  
TYPICAL CHARACTERISTICS (_2C5 UNLESS NOTED)  
Single Pulse Power  
40  
30  
20  
10  
0
0.01  
0.1  
1
10  
100  
Time (sec)  
Normalized Thermal Transient Impedance, Junction-to-Ambient  
2
1
Duty Cycle = 0.5  
0.2  
Notes:  
0.1  
P
DM  
0.1  
0.05  
t
1
t
2
t
t
1
1. Duty Cycle, D =  
2
0.02  
2. Per Unit Base = R  
= 83.3_C/W  
thJA  
(t)  
3. T – T = P  
Z
JM  
A
DM thJA  
Single Pulse  
4. Surface Mounted  
0.01  
–4  
–3  
–2  
–1  
10  
10  
10  
10  
1
10  
100  
Square Wave Pulse Duration (sec)  
Document Number: 70669  
S-59510—Rev. B, 31-Aug-98  
www.vishay.com S FaxBack 408-970-5600  
2-6  
Si4719CY  
Vishay Siliconix  
APPLICATION DRAWINGS  
Si4719CY  
Si4435DY  
D
1
S
1
Battery 1  
Logic In 1  
G
1
Drive  
Si4435DY  
D
2
S
2
DC/DC  
Battery 2  
Logic In 2  
G
2
Drive  
FIGURE 1  
S
1
G
1
S
2
G
2
Drive  
Drive  
Si4719CY  
D
1
D
2
Logic In  
Battery 2  
DC/DC  
S
1
G
1
S
2
G
2
Si4719CY  
Drive  
Drive  
D
1
D
2
Logic In  
Battery 1  
FIGURE 2  
Document Number: 70669  
S-59510—Rev. B, 31-Aug-98  
www.vishay.com S FaxBack 408-970-5600  
2-7  
Si4719CY  
Vishay Siliconix  
APPLICATION DRAWINGS  
1/2 Si4719  
AC/DC  
Display  
Power  
1/2 Si4719  
Charger  
Logic In  
Drive  
7 – 30 V  
3 – 5 Cell  
Li-Ion  
5 V  
3.3 V  
Logic In  
Drive  
DC/DC  
FIGURE 3: Low-Cost Laptop PC  
1/2 Si4719  
1/2 Si4719  
Display  
Power  
AC/DC  
Charger  
Logic In  
Logic In  
Drive  
Drive  
5 V  
DC/DC  
3.3 V  
1/2 Si4719  
1/2 Si4719  
7 – 30 V  
3 – 5 Cell  
Li-Ion  
Si6415  
Logic In  
Drive  
Logic In  
Drive  
7 – 30 V  
3 – 5 Cell  
Li-Ion  
1/2 Si4719  
1/2 Si4719  
Si6415  
Logic In  
Drive  
Logic In  
Drive  
FIGURE 4: High-Performance Laptop PC  
Document Number: 70669  
S-59510—Rev. B, 31-Aug-98  
www.vishay.com S FaxBack 408-970-5600  
2-8  

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