PHP00603E1000BBT1 [VISHAY]
RES SMD 100 OHM 0.1% 3/8W 0603;型号: | PHP00603E1000BBT1 |
厂家: | VISHAY |
描述: | RES SMD 100 OHM 0.1% 3/8W 0603 |
文件: | 总5页 (文件大小:142K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
PHP
www.vishay.com
Vishay Dale Thin Film
High Power Thin Film Wraparound Chip Resistor
FEATURES
• High purity ceramic substrate
• Power rating to 2.5 W
• Resistance range 10 Ω to 30.1 kΩ
• Resistor tolerance to 0.1 ꢀ
• TCR to 25 ppm/°C
• Flame resistant UL 94 V-0
LINKS TO ADDITIONAL RESOURCES
APPLICATIONS
• Power supplies
3
D
3D Models
Infographics
• Power switching
• Braking system
PHP series chip resistors are designed with enlarged
backside terminations to reduce the thermal resistance
between the topside resistor layer and the solder joint on the
end users circuit board.
• Test and measurement equipment
• Motor deflection circuits
TYPICAL PERFORMANCE
Actual power handling capability is limited by the end user
mounting process. As with any high power chip resistor the
ability to remove the generated heat is critical to the overall
performance of the device.
ABSOLUTE
TCR
TOL.
25
0.1
STANDARD ELECTRICAL SPECIFICATIONS
TEST
SPECIFICATIONS
CONDITIONS
Material
Nichrome
-
-
Resistance Range
10 Ω to 30.1 kΩ
25 ppm/°C, 50 ppm/°C (standard)
and, 100 ppm/°C
TCR: Absolute
-55 °C to +125 °C
Tolerance: Absolute
Power Rating: Resistor
Stability: Absolute
0.1 ꢀ, 0.5 ꢀ, 1.0 ꢀ and, 5.0 ꢀ
0.375 W to 2.5 W (1)
ΔR 0.1 ꢀ
+25 °C
Maximum at +70 °C
2000 h at +70 °C
Stability: Ratio
Not applicable
< 0.1 ppm/V
-
Voltage Coefficient
Working Voltage
-
75 V to 200 V
-
Operating Temperature Range
Storage Temperature Range
Noise
-55 °C to +155 °C
-55 °C to +155 °C
< -30 dB
-
-
-
Shelf Life Stability: Absolute
0.01 ꢀ
1 year at +25 °C
COMPONENT RATINGS
CASE SIZE
POWER RATING (mW)
WORKING VOLTAGE (V)
RESISTANCE RANGE (Ω)
10 to 30.1K
0603
375 (1)
625 (1)
1000 (1)
2500 (1)
75
0805
100
200
200
10 to 30.1K
1206
10 to 30.1K
2512
10 to 30.1K
Note
(1)
Dependent on component mounting by user
Revision: 08-Mar-2021
Document Number: 60076
1
For technical questions, contact: thinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PHP
www.vishay.com
Vishay Dale Thin Film
ENVIRONMENTAL TESTS (Vishay Performance vs. MIL-PRF-55342 Requirements)
LIMITS MIL-PRF-55342
ENVIRONMENTAL TEST
TYPICAL VISHAY PERFORMANCE
CHARACTERISTIC “E”
25 ppm/°C
+70 °C
Resistance Temperature Characteristic
Maximum Ambient Temperature at Rated Wattage
Maximum Ambient Temperature at Power Derating
Thermal Shock
15 ppm/°C
+70 °C
+150 °C
0.1 ꢀ
+150 °C
0.04 ꢀ
Low Temperature Operation
Short Time Overload
0.1 ꢀ
0.001 ꢀ
0.003 ꢀ
0.030 ꢀ
0.007 ꢀ
0.002 ꢀ
0.100 ꢀ
0.1 ꢀ
High Temperature Exposure
Resistance to Soldering Heat
Moisture Resistance
0.1 ꢀ
0.2 ꢀ
0.2 ꢀ
Life at +70 °C for 2000 h
0.5 ꢀ
DIMENSIONS in inches
D
W
T
E
L
WIDTH
W ( 0.005)
THICKNESS
MIN./MAX.
TOP PAD
D ( 0.005)
BOTTOM PAD
E ( 0.005)
CASE SIZE
LENGTH
0603
0805
1206
2512
0.064 0.006
0.080 0.006
0.032
0.050
0.063
0.124
0.020 max.
0.015/0.033
0.015/0.033
0.015/0.033
0.012
0.016
0.021
0.025
0.126 0.008
0.020 + 0.005/- 0.010
0.02
0.040
0.259 + 0.009/- 0.015
0.050
LAND PATTERN DIMENSIONS in inches
0603 Land Pattern
0.0920
1206 Land Pattern
0.1730
0.0340
0.0710
0.0140
0.0390
0.0220
0.0755
0805 Land Pattern
0.1050
2512 Land Pattern
0.2910
0.0520
0.1260
0.0200
0.0425
0.1090
0.0910
Revision: 08-Mar-2021
Document Number: 60076
2
For technical questions, contact: thinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PHP
www.vishay.com
Vishay Dale Thin Film
STANDARD MATERIAL SPECIFICATIONS
Resistive Element
Nichrome
Substrate Material
Alumina (Al2O3)
Terminations (Tin/Lead)
Tin/lead solder over nickel barrier
Terminations (Lead (Pb)-free)
Tin/silver/copper (Sn96.5Ag3.0Cu0.5) solder over nickel barrier
PHP CHIP TEMP. VS. APPLIED POWER
PHP CHIP TEMP. VS. APPLIED POWER
5.00
4.50
4.00
5.00
4.50
4.00
0603 - 100 Ω
0603 - 5 kΩ
0603 - 18.8 kΩ
0805 - 100 Ω
0805 - 5 kΩ
0805 - 20 kΩ
3.50
3.00
2.50
2.00
1.50
1.00
0.50
0.00
3.50
3.00
2.50
2.00
1.50
1.00
0.50
0.00
70
150
200
70
150
200
Chip Surface Temperature (°C)
Chip Surface Temperature (°C)
Note
Note
•
Chip surface temperature measured using FLIR SC645 thermal
imaging system with an approximate test card surface
temperature of 85 °C
•
Chip surface temperature measured using FLIR SC645 thermal
imaging system with an approximate test card surface
temperature of 85 °C
PHP CHIP TEMP. VS. APPLIED POWER
PHP CHIP TEMP. VS. APPLIED POWER
5.00
4.50
4.00
10.00
9.00
8.00
1206 - 100 Ω
1206 - 5 kΩ
1206 - 10 kΩ
2512 - 10 Ω
2512 - 10 kΩ
2512 - 30 kΩ
3.50
3.00
2.50
2.00
1.50
1.00
0.50
0.00
7.00
6.00
5.00
4.00
3.00
2.00
1.00
0.00
70
150
200
70
150
200
Chip Surface Temperature (°C)
Chip Surface Temperature (°C)
Notes
Notes
•
Chip surface temperature measured using FLIR A40 thermal
imaging system with an approximate test card surface
temperature of 25 °C
•
•
•
Chip surface temperature measured using FLIR A40 thermal
imaging system with an approximate test card surface
temperature of 25 °C
Thermal imaging was conducted under ambient conditions
resulting in a steady state test card surface temperature of 85 °C
over the full range of power levels
Thermal imaging and load life testing was conducted mounting
one device to 2" x 3" test cards with 2.5 mil copper plating on
both surfaces. Thermal vias on 120 mil centers were utilized for
heat transfer between surfaces of the test card
Case Size
2512
2512
2512
Resistance
Value
Temperature
Up to 10 Ω
Up to 10 kΩ
Up to 30 kΩ
Power (W)
1.81
70
2.44
6.82
9.33
1.87
5.19
7.09
150
200
4.89
6.63
Revision: 08-Mar-2021
Document Number: 60076
3
For technical questions, contact: thinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PHP
www.vishay.com
Vishay Dale Thin Film
SINGLE PULSE CURVES
1000
100
10
100 Ω - 2512
100 Ω - 1206
100 Ω - 0805
100 Ω - 0603
1
0.1
0.00001 0.0001
0.001
0.01
0.1
1
10
Pulse Duration (s)
DERATING CURVE
100
80
60
40
20
0
0
70
125
155
Ambient Temperature °C
GLOBAL PART NUMBER INFORMATION
P
H
P
0
1
2
0
6
E
1
0
0
2
B
B
T
1
GLOBAL
MODEL
CASE
SIZE
SUBSTRATE
TCR
RESISTANCE
TOLERANCE
TERMINATION
PACKAGING
BS = BULK
100 min., 1 mult.
WS = WAFFLE
100 min., 1 mult.
WI = WAFFLE
PHP
0 = alumina
0603
0805
1206
2512
E =
25 ppm/°C
H =
50 ppm/°C
K =
100 ppm/°C
The first 3 digits B = 0.1 ꢀ B =wraparound
are significant
figures and the F = 1.0 ꢀ
last digit
specifies the
number of
zeros to follow.
“R” designates
the decimal
point.
D = 0.5 ꢀ
Sn/Pb solder
w/nickel barrier
G = 2.0 ꢀ
J = 5.0 ꢀ S = wraparound
lead (Pb)-free solder
SAC-305
RoHS-compliant - e1
(item single lot
day code)
100 min., 1 mult.
TAPE AND REEL
T1 = 1000 min.,
1000 mult.
T3 = 300 min., 300 mult.
T5 = 500 min., 500 mult.
TF = full reel
TS = 100 min., 1 mult.
TI = 100 min., 1 mult.
(item single lot
Example:
10R0 = 10 Ω
1000 = 100 Ω
1001 = 1 kΩ
date code)
TP = 100 min., 1 mult.
(package unit
single lot date)
Revision: 08-Mar-2021
Document Number: 60076
4
For technical questions, contact: thinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Disclaimer
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Revision: 09-Jul-2021
Document Number: 91000
1
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