IRFU9022PBF [VISHAY]

Power MOSFET; 功率MOSFET
IRFU9022PBF
型号: IRFU9022PBF
厂家: VISHAY    VISHAY
描述:

Power MOSFET
功率MOSFET

文件: 总9页 (文件大小:1210K)
中文:  中文翻译
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IRFR9022, IRFU9022, SiHFR9022, SiHFU9022  
Vishay Siliconix  
Power MOSFET  
FEATURES  
PRODUCT SUMMARY  
VDS (V)  
Surface Mountable (Order as IRFR9022/SiHFR9022)  
- 50  
Available  
Straight Lead Option (Order as IRFU9022/SiHFU9022)  
R
DS(on) (Ω)  
VGS = - 10 V  
0.33  
RoHS*  
• Repetitive Avalanche Ratings  
• Dynamic dV/dt Rating  
Qg (Max.) (nC)  
14  
6.5  
6.5  
COMPLIANT  
Q
Q
gs (nC)  
gd (nC)  
• Simple Drive Requirements  
• Ease of Paralleling  
Configuration  
Single  
• Lead (Pb)-free Available  
S
DESCRIPTION  
DPAK  
IPAK  
The Power MOSFET technology is the key to Vishay’s  
advanced line of Power MOSFET transistors. The efficient  
geometry and unique processing of this latest “State of the  
Art” design achieves: very low on-state resistance combined  
with high transconductance; superior reverse energy and  
diode recovery dV/dt.  
(TO-252)  
(TO-251)  
G
The Power MOSFET transistors also feature all of the well  
established advantages of MOSFET’S such as voltage  
control, very fast switching, ease of paralleling and  
temperature stability of the electrical parameters.  
D
P-Channel MOSFET  
Surface mount packages enhance circuit performance by  
reducing stray inductances and capacitance. The TO-252  
surface mount package brings the advantages of Power  
MOSFET’s to high volume applications where PC Board  
surface mounting is desirable. The surface mount option  
IRFR9022/SiHFR9022 is provided on 16mm tape. The  
straight lead option IRFR9022/SiHFR9022 of the device is  
called the IPAK (TO-251).  
They are well suited for applications where limited heat  
dissipation is required such as, computers and peripherals,  
telecommunication equipment, DC/DC converters, and a  
wide range of consumer products.  
ORDERING INFORMATION  
Package  
DPAK (TO-252)  
IRFR9022PbF  
SiHFR9022-E3  
IRFR9022  
DPAK (TO-252)  
DPAK (TO-252)  
IRFR9022TRLPbFa  
SiHFR9022TL-E3a  
IRFR9022TRLa  
SiHFR9022TLa  
IPAK (TO-251)  
IRFU9022PbF  
SiHFU9022-E3  
IRFU9022  
IRFR9022TRPbFa  
SiHFR9022T-E3a  
IRFR9022TRa  
Lead (Pb)-free  
SnPb  
SiHFR9022  
SiHFR9022Ta  
SiHFU9022  
Note  
a. See device orientation.  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
LIMIT  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
- 50  
20  
V
VGS  
T
C = 25 °C  
- 9.0  
- 5.7  
- 36  
0.33  
440  
- 9.9  
4.2  
Continuous Drain Current  
V
GS at - 10 V  
ID  
TC =100°C  
A
Pulsed Drain Currenta  
IDM  
Linear Derating Factor  
W/°C  
mJ  
A
Single Pulse Avalanche Energyb  
Repetitive Avalanche Currenta  
Repetitive Avalanche Energya  
EAS  
IAR  
EAR  
mJ  
* Pb containing terminations are not RoHS compliant, exemptions may apply  
Document Number: 91349  
S-Pending-Rev. A, 10-Jun-08  
www.vishay.com  
1
WORK-IN-PROGRESS  
IRFR9022, IRFU9022, SiHFR9022, SiHFU9022  
Vishay Siliconix  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
LIMIT  
42  
UNIT  
W
Maximum Power Dissipation  
TC = 25 °C  
PD  
Peak Diode Recovery dV/dtc  
dV/dt  
5.8  
V/ns  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)  
TJ, Tstg  
- 55 to + 150  
300d  
°C  
for 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 14).  
b. VDD = - 25 V, Starting TJ = 25 °C, L = 5.1 mH, RG = 25 Ω, Peak IL = - 9.9 A  
c. ISD - 9.9 A, dI/dt -120 A/µs, VDD 40 V, TJ 150 °C.  
d. 0.063" (1.6 mm) from case.  
e. When mounted on 1" square PCB (FR-4 or G-10 material).  
THERMAL RESISTANCE RATINGS  
PARAMETER  
SYMBOL  
MIN.  
TYP.  
MAX.  
110  
-
UNIT  
Maximum Junction-to-Ambient  
Case-to-Sink  
RthJA  
-
-
-
-
1.7  
-
RthCS  
°C/W  
Maximum Junction-to-Case (Drain)  
RthJC  
3.0  
SPECIFICATIONS TJ = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
Static  
Drain-Source Breakdown Voltage  
Gate-Source Threshold Voltage  
Gate-Source Leakage  
VDS  
VGS(th)  
IGSS  
VGS = 0 V, ID = - 250 µA  
VDS = VGS, ID = - 250 µA  
- 50  
-
-
V
V
- 2.0  
-
- 4.0  
500  
250  
1000  
0.33  
-
VGS  
VDS = max. rating, VGS = 0 V  
= 0.8 x max. rating, V = 0 V, T = 125 °C  
=
20 V  
-
-
-
nA  
-
-
Zero Gate Voltage Drain Current  
IDSS  
µA  
V
-
DS  
GS  
J
Drain-Source On-State Resistance  
Forward Transconductance  
Dynamic  
RDS(on)  
gfs  
VGS = - 10 V  
ID = 5.7 Ab  
-
0.28  
3.5  
Ω
VDS - 50 V, IDS = - 5.7 A  
2.3  
S
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
Turn-On Delay Time  
Rise Time  
Ciss  
Coss  
Crss  
Qg  
-
-
-
-
-
-
-
-
-
-
490  
320  
70  
-
VGS = 0 V,  
V
DS = - 25 V,  
-
pF  
nC  
f = 1.0 MHz, see fig. 9  
-
9.4  
4.3  
4.3  
8.2  
57  
14  
6.5  
6.5  
12  
66  
18  
38  
ID = - 9.7 A, VDS = 0.8 x max.  
rating, see fig. 16  
Qgs  
Qgd  
td(on)  
tr  
VGS = - 10 V  
(Independent operating  
temperature)  
V
DD = - 25 V, ID = - 9.7 A,  
G = 18 Ω, RD = 2.4 Ω, see fig. 15  
(Independent operating temperature)  
R
ns  
Turn-Off Delay Time  
Fall Time  
td(off)  
tf  
12  
25  
D
Between lead,  
Internal Drain Inductance  
Internal Source Inductance  
LD  
LS  
-
-
4.5  
7.5  
-
-
6 mm (0.25") from  
package and center of  
die contact.  
nH  
G
S
www.vishay.com  
2
Document Number: 91349  
S-Pending-Rev. A, 10-Jun-08  
IRFR9022, IRFU9022, SiHFR9022, SiHFU9022  
Vishay Siliconix  
SPECIFICATIONS TJ = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
Drain-Source Body Diode Characteristics  
MOSFET symbol  
showing the  
integral reverse  
p - n junction diode  
D
Continuous Source-Drain Diode Current  
Pulsed Diode Forward Currenta  
IS  
-
-
-
-
- 9.9  
- 40  
A
G
ISM  
S
Body Diode Voltage  
VSD  
trr  
TJ = 25 °C, IS = - 9.9 A, VGS = 0 Vb  
-
-
- 6.3  
280  
V
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
Forward Turn-On Time  
56  
110  
0.34  
ns  
nC  
TJ = 25 °C, IF = - 9,7 A, dI/dt = 100 A/µsb  
Qrr  
ton  
0.17  
0.85  
Intrinsic turn-on time is negligible (turn-on is dominated by LS and LD)  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 14).  
b. Pulse width 300 µs; duty cycle 2 %.  
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted  
Fig. 1 - Typical Output Characteristics  
Fig. 3 - Typical Saturation Characteristics  
Fig. 2 - Typical Transfer Characteristics  
Fig. 4 - Maximum Safe Operating Area  
Document Number: 91349  
S-Pending-Rev. A, 10-Jun-08  
www.vishay.com  
3
IRFR9022, IRFU9022, SiHFR9022, SiHFU9022  
Vishay Siliconix  
Fig. 5 - Typical Transconductance vs. Drain Current  
Fig. 7 - Breakdown Voltage vs. Temperature  
Fig. 6 - Typical Source-Drain Diode Forward Voltage  
Fig. 8 - Normalized On-Resistance vs. Temperature  
www.vishay.com  
4
Document Number: 91349  
S-Pending-Rev. A, 10-Jun-08  
IRFR9022, IRFU9022, SiHFR9022, SiHFU9022  
Vishay Siliconix  
Fig. 9 - Typical Capacitance vs. Drain-to-Source Voltage  
Fig. 11 - Typical On-Resistance vs. Drain Current  
Fig. 10 - Typical Gate Charge vs. Gate-to-Source Voltage  
Fig. 12 - Maximum Drain Current vs. Case Temperature  
Document Number: 91349  
S-Pending-Rev. A, 10-Jun-08  
www.vishay.com  
5
IRFR9022, IRFU9022, SiHFR9022, SiHFU9022  
Vishay Siliconix  
Fig. 13b - Unclamped Inductive Test Circuit  
IAS  
VDS  
IL  
VDD  
tp  
VDS  
Fig. 13c - Unclamped Inductive Waveforms  
Fig. 13a - Maximum Avalanche vs. Starting Junction  
Temperature  
Fig. 14 - Maximum Effective Transient Thermal Impedance, Junction-to-Case vs. Pulse Duration  
www.vishay.com  
6
Document Number: 91349  
S-Pending-Rev. A, 10-Jun-08  
IRFR9022, IRFU9022, SiHFR9022, SiHFU9022  
Vishay Siliconix  
td(on) tr  
td(off) tf  
VGS  
10 %  
90 %  
VDS  
Fig. 15a - Switching Time Waveforms  
Fig. 15b - Switching Time Test Circuit  
QG  
- 10 V  
QGS  
QGD  
VG  
Charge  
Fig. 16a - Basic Gate Charge Waveform  
Fig. 16b - Gate Charge Test Circuit  
Document Number: 91349  
S-Pending-Rev. A, 10-Jun-08  
www.vishay.com  
7
IRFR9022, IRFU9022, SiHFR9022, SiHFU9022  
Vishay Siliconix  
Peak Diode Recovery dV/dt Test Circuit  
D.U.T.  
+
-
Circuit layout considerations  
Low stray inductance  
Ground plane  
Low leakage inductance  
current transformer  
+
-
+
-
RG  
+
-
dV/dt controlled by RG  
ISD controlled by duty factor "D"  
D.U.T. - device under test  
VDD  
Compliment N-Channel of D.U.T. for driver  
Driver gate drive  
P.W.  
Period  
Period  
D =  
P.W.  
V
= - 10 V*  
GS  
D.U.T. I waveform  
SD  
Reverse  
recovery  
current  
Body diode forward  
current  
dI/dt  
D.U.T. V waveform  
DS  
Diode recovery  
dV/dt  
V
DD  
Re-applied  
voltage  
Body diode forward drop  
Ripple 5 %  
Inductor current  
I
SD  
* VGS = - 5 V for logic level and - 3 V drive devices  
Fig. 17 - For P-Channel  
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon  
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and  
reliability data, see http://www.vishay.com/ppg?91349.  
www.vishay.com  
8
Document Number: 91349  
S-Pending-Rev. A, 10-Jun-08  
Legal Disclaimer Notice  
Vishay  
Disclaimer  
All product specifications and data are subject to change without notice.  
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf  
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein  
or in any other disclosure relating to any product.  
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any  
information provided herein to the maximum extent permitted by law. The product specifications do not expand or  
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed  
therein, which apply to these products.  
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this  
document or by any conduct of Vishay.  
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless  
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such  
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting  
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding  
products designed for such applications.  
Product names and markings noted herein may be trademarks of their respective owners.  
Document Number: 91000  
Revision: 18-Jul-08  
www.vishay.com  
1

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