GBPC1506W1-E4 [VISHAY]
DIODE 15 A, 600 V, SILICON, BRIDGE RECTIFIER DIODE, PLASTIC, GBPC-W, 4 PIN, Bridge Rectifier Diode;型号: | GBPC1506W1-E4 |
厂家: | VISHAY |
描述: | DIODE 15 A, 600 V, SILICON, BRIDGE RECTIFIER DIODE, PLASTIC, GBPC-W, 4 PIN, Bridge Rectifier Diode PC |
文件: | 总4页 (文件大小:40K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
GBPC12, 15, 25 and 35
Vishay Semiconductors
formerly General Semiconductor
Glass Passivated Single-Phase
Bridge Rectifier
Reverse Voltage 50 and 1000V
Forward Current 12 to 35A
GBPC
GBPC-W
1.135 (28.8)
1.115 (28.3)
1.135 (28.8)
1.115 (28.3)
Hole for
#10 Screw
0.220 (5.59)
0.200 (5.08)
Hole for
#10 Screw
0.220 (5.59)
DIA.
0.672 (17.1)
0.632 (16.1)
0.24 (6.0)
0.18 (4.6)
DIA.
0.732 (18.6)
0.692 (17.6)
0.200 (5.08)
AC
1.135 (28.8)
1.115 (28.3)
1.135 (28.8)
1.115 (28.3)
0.672 (17.1)
0.632 (16.1)
0.732 (18.6)
0.692 (17.6)
0.582 (14.8)
0.542 (13.8)
0.50 (12.7)
0.44 (11.7)
0.470 (11.9)
0.430 (10.9)
0.24 (6.0)
0.18 (4.6)
0.732 (18.6)
0.692 (17.6)
0.094 (2.4)
DIA.
0.042 (1.07)
0.25
(6.35)
0.038 (0.97)
DIA.
0.034 (0.86)
0.030 (0.76)
1.25
(31.8)
MIN.
0.840 (21.3)
0.740 (18.8)
0.310 (7.62)
0.310 (7.62)
0.290 (7.36)
0.290 (7.36)
Dimensions in inches and (millimeters)
Mechanical Data
Features
Case: Molded plastic with heatsink integrally mounted in
the bridge encapsulation
• Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
Terminals: Either plated 0.25" (6.35mm) Faston lugs or
plated copper leads 0.040" (1.02mm) diameter. Suffix letter
“W” added to indicate wire leads (e.g. GBPC12005W)
• This series is UL listed under the Recognized
Component Index, file number E54214
• Integrally molded heatsink provides very low thermal
resistance for maximum heat dissipation
• Universal 3-way terminals; snap-on, wire wrap-around,
or P.C.B. mounting
• High forward surge current capability
• Glass passivated chip junctions
• Typical IR less than 0.3µA
Mounting Position: See (Note 2)
Polarity: Polarity symbols molded on body
Mounting Torque: 20 in. - lb. max.
Weight: 0.53 ounce, 15 grams
Packaging codes/options:
1/100 EA. per Bulk Box
• High temperature soldering guaranteed:
260°C/10 seconds at 5lbs. (2.3kg) tension
Document Number 88612
09-Jul-02
www.vishay.com
1
GBPC12, 15, 25 and 35
Vishay Semiconductors
formerly General Semiconductor
Maximum Ratings and Thermal Characteristics(TA = 25°C unless otherwise noted)
GBPC12, 15, 25, 35
Symbols 005
01
100 200 400 600 800 1000
70 140 280 420 560 700
02
04
06
08
10
Units
Maximum repetitive peak reverse voltage
Maximum RMS voltage
VRRM
VRMS
VDC
50
35
50
V
V
V
Maximum DC blocking voltage
100 200 400 600 800 1000
Maximum average forward
rectified output current
(See Fig.1)
GBPC12
12
15
25
35
GBPC15
GBPC25
GBPC35
IF(AV)
A
A
Peak forward surge current single
sine-wave superimposed on
rated load (JEDEC Method)
GBPC12
GBPC15
GBPC25
GBPC35
200
300
300
400
IFSM
Rating (non-repetitive, for t
greater than 1ms and less
than 8.3ms) for fusing
GBPC12
GBPC15
GBPC25
GBPC35
160
375
375
660
I2t
A2 sec
RMS isolation voltage from case to leads
VISO
RΘJC
2500
V
Typical thermal resistance per leg (1) GBPC12-25
GBPC35
1.9
1.4
°C/W
°C
Operating junction storage temperature range
TJ, TSTG
-55 to +150
Electrical Characteristics Ratings at 25°C ambient temperature unless otherwise specified.
GBPC12, 15, 25, 35
Symbols 005
01
02
04
06
08
10
Units
Maximum instantaneous
forward voltage drop per
leg at
GBPC12 IF=6.0A
GBPC15 IF=7.5A
GBPC25 IF=12.5A
GBPC35 IF=17.5A
VF
1.1
V
Maximum reverse DC current at rated TA=25°C
DC blocking voltage per leg TA=125°C
5.0
500
IR
µA
Typical junction capacitance per leg at 4V, 1MHZ
CJ
300
pF
Notes:
(1) Thermal resistance from junction to case per leg
(2) Bolt down on heatsink with silicone thermal compound between bridge and mounting surface for maximum heat transfer with #10 screw
www.vishay.com
2
Document Number 88612
09-Jul-02
GBPC12, 15, 25 and 35
Vishay Semiconductors
formerly General Semiconductor
Ratings and
Characteristic Curves (TA = 25°C unless otherwise noted)
Fig. 1 — Maximum Output
Fig. 2 — Maximum Output
Rectified Current
Rectified Current
40
35
30
25
20
15
10
5
40
GBPC35
RthS-A = 0.5°C/W
60 HZ Resistive or
Inductive Load
Bridges Mounted on
9.5 x 3.5 x 4.6"
(22.9 x 8.9 x 11.7cm)
AL. Finned Plate
35
30
25
20
15
10
5
GBPC25
RthS-A = 0.5°C/W
5 x 6 x 4.9"
AL, Finned Plate
5 x 4 x 3"
AL. Finned Plate
GBPC15
RthS-A = 1.0°C/W
6 x 2.2 x 2.2"
AL. Finned Plate
GBPC12
RthS-A = 1.0°C/W
60 HZ Resistive or
Inductive Load
0
0
0
25
50
75
100 125
150
175
200
0
10 20 30 40 50 60 70 80 90 100
Case Temperature (°C)
Ambient Temperature (°C)
Fig. 4 — Maximum Non-Repetitive
Fig. 3 — Maximum Power Dissipation
Peak Forward Surge Current Per Leg
500
80
70
60
50
40
30
20
10
0
TJ = TJ max.
0.5 Single Sine-Wave
(JEDEC Method)
Capacitive Load
TJ = TJ max.
GBPC35
GBPC15
GBPC25
Resistive or
Inductive Load
100
GBPC12
1.0 Cycle
1
10
100
0
10
20
30
40
Average Output Current (A)
Number of Cycles at 60 HZ
Document Number 88612
09-Jul-02
www.vishay.com
3
GBPC12, 15, 25 and 35
Vishay Semiconductors
formerly General Semiconductor
Ratings and
Characteristic Curves (TA = 25°C unless otherwise noted)
Fig. 5 — Typical Instantaneous
Fig. 6 — Typical Reverse Leakage
Forward Characteristics Per Leg
Characteristics Per Leg
100
TJ = 125°C
100
10
TJ = 150°C
10
TJ = 25°C
Pulse Width = 300µs
1% Duty Cycle
1
0.1
1
50 - 400V
600 - 1000V
TJ = 25°C
0.1
0.01
0.01
0
20
40
60
80
100
0.4
0.6
0.8
1
1.2
1.4
1.6
Instantaneous Forward Voltage (V)
Percent of Rated Peak Reverse Voltage (%)
Fig. 8 — Typical Transient
Fig. 7 — Typical Junction
Thermal Impedance Per Leg
Capacitance Per Leg
600
1,000
100
T
= 25°C
T
= 25°C
J
J
f = 1.0MHZ
Vsig = 50MVp-p
f = 1.0MHZ
Vsig = 50MVp-p
10
1
100
50
1
10
100
0.01
0.1
1
10
100
Reverse Voltage (V)
t, Heating Time (sec.)
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4
Document Number 88612
09-Jul-02
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