BF961 [VISHAY]

N-Channel Dual Gate MOS-Fieldeffect Tetrode, Depletion Mode; N沟道双栅MOS -场效应四极管,耗尽型
BF961
型号: BF961
厂家: VISHAY    VISHAY
描述:

N-Channel Dual Gate MOS-Fieldeffect Tetrode, Depletion Mode
N沟道双栅MOS -场效应四极管,耗尽型

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BF961  
Vishay Semiconductors  
N-Channel Dual Gate MOS-Fieldeffect Tetrode, Depletion Mode  
3
Features  
4
• Integrated gate protection diodes  
2
• High cross modulation performance  
• Low noise figure  
1
• High AGC-range  
• Low feedback capacitance  
• Low input capacitance  
G
D
S
2
G
1
Electrostatic sensitive device.  
Applications  
Input- and mixer stages especially for FM- and VHF  
TV-tuners up to 300 MHz.  
Observe precautions for handling.  
13625  
Mechanical Data  
Case: TO-50 Plastic case  
Weight: approx. 124 mg  
Marking: BF961  
Pinning:  
1 = Drain, 2 = Source,  
3 = Gate 1, 4 = Gate 2  
Parts Table  
Part  
Ordering Ccode  
BF961A or BF961B  
Marking  
Package  
BF961  
BF961  
BF961  
BF961  
TO50  
TO50  
TO50  
BF961A  
BF961B  
BF961A  
BF961B  
Absolute Maximum Ratings  
Tamb = 25 °C, unless otherwise specified  
Parameter  
Test condition  
Symbol  
Value  
20  
Unit  
V
Drain - source voltage  
VDS  
ID  
Drain current  
30  
10  
mA  
mA  
Gate 1/Gate 2 - source peak  
current  
IG1/G2SM  
Total power dissipation  
Channel temperature  
Tamb 60 °C  
Ptot  
TCh  
Tstg  
200  
150  
mW  
°C  
Storage temperature range  
- 55 to + 150  
°C  
Maximum Thermal Resistance  
Parameter  
Test condition  
Symbol  
RthChA  
Value  
450  
Unit  
K/W  
1)  
Channel ambient  
1) on glass fibre printed board (40 x 25 x 1.5) mm3 plated with 35 µm Cu  
Document Number 85002  
Rev. 1.5, 25-Nov-04  
www.vishay.com  
1
BF961  
Vishay Semiconductors  
VISHAY  
Electrical DC Characteristics  
Tamb = 25 °C, unless otherwise specified  
Parameter  
Test condition  
Part  
Symbol  
V(BR)DS  
Min  
20  
Typ.  
Max  
Unit  
V
Drain - source breakdown  
voltage  
ID = 10 µA, - VG1S = - VG2S = 4 V  
IG1S = 10 mA, VG2S = VDS = 0  
IG2S = 10 mA, VG1S = VDS = 0  
VG1S = 5 V, VG2S = VDS = 0  
Gate 1 - source breakdown  
voltage  
V(BR)G1SS  
V(BR)G2SS  
8
8
14  
14  
V
V
Gate 2 - source breakdown  
voltage  
Gate 1 - source leakage current  
Gate 2 - source leakage current  
Drain current  
IG1SS  
IG2SS  
100  
100  
20  
nA  
nA  
mA  
mA  
mA  
V
V
G2S = 5 V, VG1S = VDS = 0  
V
DS = 15 V, VG1S = 0, VG2S = 4 V BF961  
IDSS  
4
4
BF961A  
BF961B  
IDSS  
10.5  
20  
IDSS  
9.5  
Gate 1 - source cut-off voltage  
Gate 2 - source cut-off voltage  
V
DS = 15 V, VG2S = 4 V,  
- VG1S(OFF)  
3.5  
ID = 20 µA  
DS = 15 V, VG1S = 0, ID = 20 µA  
V
- VG2S(OFF)  
3.5  
V
Electrical AC Characteristics  
Tamb = 25 °C, unless otherwise specified  
V
DS = 15 V, ID = 10 mA, VG2S = 4 V, f = 1 MHz  
Parameter Test condition  
Symbol  
| y21s  
Min  
12  
Typ.  
Max  
Unit  
Forward transadmittance  
Gate 1 input capacitance  
Gate 2 input capacitance  
Feedback capacitance  
Output capacitance  
Power gain  
|
15  
3.7  
1.6  
25  
mS  
pF  
pF  
fF  
Cissg1  
Cissg2  
Crss  
V
G1S = 0, VG2S = 4 V  
Coss  
Gps  
1.6  
20  
pF  
dB  
G
S = 2 mS, GL = 0.5 mS,  
f = 200 MHz  
G2S = 4 to - 2 V, f = 200 MHz  
S = 2 mS, GL = 0.5 mS,  
f = 200 MHz  
AGC range  
Noise figure  
V
Gps  
50  
dB  
dB  
G
F
1.8  
2.5  
Typical Characteristics (Tamb = 25 °C unless otherwise specified)  
300  
250  
200  
150  
100  
50  
22  
20  
18  
16  
14  
12  
10  
8
V
= 0.6 V  
G1S  
0.4 V  
0.2 V  
0
–0.2 V  
6
–0.4 V  
–0.6 V  
–0.8 V  
4
2
0
0
0
20 40 60 80 100 120 140 160  
0
2
4
6
8 10 12 14 16 18 20 22 24  
– Drain Source Voltage ( V )  
96 12159  
96 12160  
V
DS  
T
- Ambient Temperature ( °C )  
amb  
Figure 1. Total Power Dissipation vs. Ambient Temperature  
Figure 2. Drain Current vs. Drain Source Voltage  
www.vishay.com  
2
Document Number 85002  
Rev. 1.5, 25-Nov-04  
BF961  
Vishay Semiconductors  
VISHAY  
24  
4.0  
3.6  
3.2  
2.8  
2.4  
2.0  
1.6  
1.2  
0.8  
0.4  
0.0  
22  
20  
18  
16  
14  
12  
10  
8
6
4
2
0
V
= 15 V  
= 10 mA  
V
V
= 15 V  
= 0  
DS  
DS  
V
= 0.5 V  
0 V  
I
G1S  
DS  
G1S  
f = 1 MHz  
–0.5 V  
–2 –1  
0
1
2
3
4
5
6
–2 –1  
0
1
2
3
4
5
6
7
96 12161  
V
– Gate 2 Source Voltage ( V )  
96 12164  
V
– Gate 2 Source Voltage ( V )  
G2S  
G2S  
Figure 3. Forward Transadmittance vs. Gate 2 Source Voltage  
Figure 6. Gate 2 Input Capacitance vs. Gate 2 Source Voltage  
22  
3.0  
V
= 15 V  
f = 1 MHz  
DS  
20  
18  
16  
14  
12  
10  
8
V
= 4 V  
G2S  
V
= 5 V  
G2S  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
f = 1 MHz  
4 V  
3 V  
6
0 V  
4
2 V  
1 V  
2
0
-2 -1.5 -1 -0.5  
0
0.5  
1 1.5 2 2.5 3 3.5  
0
2
4
6
8
10 12 14 16 18 20 22  
V
96 12162  
- Gate 1 Source Voltage ( V )  
96 12165  
V
- Drain Source V oltage ( V )  
G1S  
DS  
Figure 4. Forward Transadmittance vs. Gate 1 Source Voltage  
Figure 7. Output Capacitance vs. Drain Source Voltage  
18  
4.0  
3.5  
f =700 MHz  
600 MHz  
16  
14  
12  
10  
8
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
V
V
= 15 V  
= 4 V  
DS  
G2S  
500 MHz  
400 MHz  
f = 1 MHz  
300 MHz  
200 MHz  
100 MHz  
6
V
V
= 15 V  
DS  
= 4 V  
G2S  
4
I
= 5...20 mA  
D
f = 50...700 MHz  
2
0
–2.0–1.5–1.0–0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0  
– Gate 1 Source Voltage ( V )  
0
1
2
3
4
5
6
7
8
9
10  
96 12163  
V
96 12166  
Re (y ) ( mS )  
11  
G1S  
Figure 5. Gate 1 Input Capacitance vs. Gate 1 Source Voltage  
Figure 8. Short Circuit Input Admittance  
Document Number 85002  
Rev. 1.5, 25-Nov-04  
www.vishay.com  
3
BF961  
Vishay Semiconductors  
VISHAY  
10  
V
V
= 15 V  
DS  
5
0
= 4 V  
G2S  
f = 50...700 MHz  
f = 50 MHz  
I
= 5 mA  
D
100 MHz  
200 MHz  
–5  
10 mA  
20 mA  
–10  
–15  
–20  
–25  
–30  
300 MHz  
400 MHz  
500 MHz  
600 MHz  
700 MHz  
0
2
4
6
8 10 12 14 16 18 20 22 24 26 28  
Re (y ( mS )  
96 12167  
)
21  
Figure 9. Short Circuit Forward Transfer Admittance  
7.0  
6.5  
f = 700 MHz  
6.0  
5.5  
600 MHz  
I
= 5 mA  
5.0  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
D
500 MHz  
= 20 mA  
I
D
400 MHz  
300 MHz  
V
V
= 15 V  
DS  
= 4 V  
G2S  
200 MHz  
100 MHz  
I
= 5...20 mA  
D
f = 50...700 MHz  
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4  
96 12168  
Re (y ) ( mS )  
22  
Figure 10. Short Circuit Output Admittance  
www.vishay.com  
4
Document Number 85002  
Rev. 1.5, 25-Nov-04  
BF961  
Vishay Semiconductors  
VISHAY  
V
S
= 15 V, I = 5 to 20 mA, V  
= 4 V, Z = 50  
DS  
11  
D
G2S  
0
S
12  
90°  
60°  
j
120°  
j0.5  
j2  
150°  
30°  
j0.2  
300  
j5  
600  
700 MHz  
180°  
0.04  
0.08 0°  
–30°  
0
0.2 0.5  
1
2
5
50  
100  
–j0.2  
–j5  
–150°  
700 MHz  
300  
500  
–j2  
–j0.5  
°
–60°  
–120  
–90°  
12921  
12920  
–j  
Figure 11. Input Reflection Coefficient  
Figure 13. Reverse Transmission Coefficient  
S
S
22  
21  
90°  
j
I
= 20 mA  
D
120°  
60°  
I
= 10 mA  
= 5 mA  
D
j0.5  
j2  
5
I
D
30°  
400  
j0.2  
0
200  
j5  
700MHz  
0.8  
50  
180 °  
1.6  
0°  
ı
0.2  
0.5  
1
2
100  
300  
500  
–j0.2  
–j5  
–30°  
–150°  
700 MHz  
–j2  
–j0.5  
–120°  
–60°  
–90°  
12923  
12922  
–j  
Figure 12. Forward Transmission Coefficient  
Figure 14. Output Reflection Coefficient  
Document Number 85002  
Rev. 1.5, 25-Nov-04  
www.vishay.com  
5
BF961  
Vishay Semiconductors  
VISHAY  
Package Dimensions in mm  
96 12242  
www.vishay.com  
6
Document Number 85002  
Rev. 1.5, 25-Nov-04  
BF961  
Vishay Semiconductors  
VISHAY  
Ozone Depleting Substances Policy Statement  
It is the policy of Vishay Semiconductor GmbH to  
1. Meet all present and future national and international statutory requirements.  
2. Regularly and continuously improve the performance of our products, processes, distribution and  
operatingsystems with respect to their impact on the health and safety of our employees and the public, as  
well as their impact on the environment.  
It is particular concern to control or eliminate releases of those substances into the atmosphere which are  
known as ozone depleting substances (ODSs).  
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs  
and forbid their use within the next ten years. Various national and international initiatives are pressing for an  
earlier ban on these substances.  
Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use  
of ODSs listed in the following documents.  
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments  
respectively  
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental  
Protection Agency (EPA) in the USA  
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.  
Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting  
substances and do not contain such substances.  
We reserve the right to make changes to improve technical design  
and may do so without further notice.  
Parameters can vary in different applications. All operating parameters must be validated for each  
customer application by the customer. Should the buyer use Vishay Semiconductors products for any  
unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all  
claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal  
damage, injury or death associated with such unintended or unauthorized use.  
Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany  
Telephone: 49 (0)7131 67 2831, Fax number: 49 (0)7131 67 2423  
Document Number 85002  
Rev. 1.5, 25-Nov-04  
www.vishay.com  
7

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