BAV99/E9 [VISHAY]
Rectifier Diode, 2 Element, 0.15A, 70V V(RRM), Silicon, PLASTIC PACKAGE-3;
| 型号： | BAV99/E9 |
| 厂家： | 
VISHAY |
| 描述： | Rectifier Diode, 2 Element, 0.15A, 70V V(RRM), Silicon, PLASTIC PACKAGE-3 光电二极管 |
| 文件： | 总2页 (文件大小：54K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
BAL99, BAV99
Small-Signal Diodes
TO-236AB (SOT-23)
Mounting Pad Layout
.122 (3.1)
.110 (2.8)
0.037 (0.95)
0.037 (0.95)
.016 (0.4)
Top View
3
0.079 (2.0)
1
2
0.035 (0.9)
.037(0.95)
.037(0.95)
0.031 (0.8)
Features
• Silicon Epitaxial Planar Diode
.102 (2.6)
.094 (2.4)
.016 (0.4) .016 (0.4)
• Fast switching diodes, especially suited for
automatic insertion
Dimensions in inches and (millimeters)
• This diode is also available in other configurations
including a dual common anode with type
designation BAW56
Top View
Mechanical Data
Top View
Case: SOT-23 Plastic Package
Weight: approx. 0.008g
BAL99
Marking: JF
BAV99
Marking: JE
Packaging Codes/Options:
E8/10K per 13” reel (8mm tape), 30K/box
E9/3K per 7” reel (8mm tape), 30K/box
Maximum Ratings and Thermal Characteristics (TA = 25°C unless otherwise noted)
Parameter
Symbol
VR, VRM
IF
Value
Unit
V
Reverse Voltage, Peak Reverse Voltage
Forward Current (continuous)
70
250
mA
Non-Repetitive Peak Forward Current
at t = 1µs
at t = 1ms
at t = 1s
IFSM
IFSM
IFSM
2
1
A
A
A
.
0 5
Power Dissipation at Tamb = 25°C
Thermal Resistance Junction to Ambient Air
Junction Temperature
Ptot
RθJA
Tj
350(1)
430(1)
mW
°C/W
°C
150
Storage Temperature Range
TS
–65 to +150
°C
Note:
(1) Device on Fiberglass Substrate, see layout on second page
5/16/00
BAL99, BAV99
Small-Signal Diodes
Electrical Characteristics(TJ = 25°C unless otherwise noted)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
at IF = 1mA
—
—
—
—
—
—
—
—
0.715
0.855
1.0
V
V
V
V
at IF = 10mA
at IF = 50mA
at IF = 150mA
Forward Voltage
VF
1.25
VR = 70V
VR = 70V, TJ = 150°C
VR = 25V, TJ = 150°C
—
—
—
—
—
—
2.5
100
30
µA
µA
µA
Leakage Current
Capacitance
IR
VF = VR = 0
f = 1MHz
Ciss
trr
—
—
—
—
1.5
6
pF
ns
IF = 10mA, IR = 10mA
Irr = 1mA, RL = 100Ω
Reverse Recovery Time
(1) Device on fiberglass substrate, see layout
Layout for R
test
thJA
Thickness: Fiberglass 0.059 in. (1.5 mm)
0.30 (7.5)
0.12 (3)
Copper leads 0.012 in. (0.3 mm)
.04 (1)
.08 (2)
.04 (1)
.08 (2)
0.59 (15)
0.03 (0.8)
0.47 (12)
0.2 (5)
Dimensions in inches (millimeters)
0.06 (1.5)
0.20 (5.1)
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