292D106X96R3R4W [VISHAY]
CAPACITOR, TANTALUM, SOLID, POLARIZED, 6.3V, 10uF, SURFACE MOUNT, 0805, CHIP, ROHS COMPLIANT;型号: | 292D106X96R3R4W |
厂家: | VISHAY |
描述: | CAPACITOR, TANTALUM, SOLID, POLARIZED, 6.3V, 10uF, SURFACE MOUNT, 0805, CHIP, ROHS COMPLIANT 电容器 |
文件: | 总8页 (文件大小:130K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Not Recommended for New Designs
292D
Vishay Sprague
®
Solid Tantalum Chip Capacitors, TANTAMOUNT ,
Leadframeless Molded
P and R cases
Image is not to scale
PERFORMANCE CHARACTERISTICS
Operating Temperature: - 55 °C to + 85 °C
(To + 125 °C with voltage derating)
Note
Capacitance Range: 1.0 µF to 47 µF
Capacitance Tolerance: 10 %, 20 % standard
Voltage Rating: 3 WVDC to 20 WVDC
• Refer to Doc. 40088
ORDERING INFORMATION
292D
106
X0
010
P
2
T
TYPE
CAPACITANCE
CAPACITANCE
TOLERANCE
DC VOLTAGE RATING
AT + 85 °C
CASE CODE
TERMINATION
REEL SIZE AND
PACKAGING
This is expressed in
picofarads. The first
two digits are the
significant figures.
The third is the
number of zeros to
follow.
X0 = 20 %
X9 = 10 %
This is expressed in volts.
To complete the three-digit
block, zeros precede the
voltage rating. A decimal
point is indicated by an “R”
(6R3 = 6.3 V).
See ratings
and case
codes table
2 = 100 % Tin
T = Tape and reel*
7" [178 mm] reel
4 = Gold plated
8 = Solder plated W = 13" [330 mm] reel
(60/40)
Special order
*Cathode nearest
sprocket hole
Note
• Preferred tolerance and reel sizes are in bold
DIMENSIONS in inches [millimeters]
P
Tantalum Wire Nib
Identifies Anode (+)
Terminal
L
P
W
H
H
CASE
EIA
L
W
P
0805
[2012]
0.079 0.008
[2.0 0.2]
0.051 0.008
[1.3 0.2]
0.047 (Max.)
[1.2 Max.]
0.020 0.012
[0.5 0.3]
R
0805
[2012]
0.079 0.010
[2.0 0.25]
0.053 0.008
[1.35 0.2]
0.053 0.008
[1.35 0.2]
0.020 0.012
[0.5 0.3]
P
RATINGS AND CASE CODES
µF
1.0
2.2
3.3
4.7
6.8
10
3 V
4 V
6.3 V
10 V
R
R
P/R
P/R
P/R
P/R
P
16 V
R
R
R
R
20 V
R
R
R
R
R
R
R
R
R
R
R
P/R
R
P
15
22
33
P/R
P/R
P/R
P
47
P
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 40042
Revision: 22-Apr-09
For technical questions, contact: tantalum@vishay.com
www.vishay.com
35
Not Recommended for New Designs
292D
Solid Tantalum Chip Capacitors,
TANTAMOUNT Leadframeless Molded
Vishay Sprague
®
STANDARD RATINGS
MAX RIPPLE
100 kHz Irms
(A)
MAX DCL
AT + 25 °C
(µA)
MAX DF
AT + 25 °C
(%)
MAX ESR
at 100 kHz
(Ω)
CAPACITANCE
(µF)
CASE
CODE
PART
NUMBER
3 WVDC AT + 85 °C, 1.9 WVDC AT + 125 °C
47
P
292D476X_003P2T
1.5
12
6.0
0.21
4 WVDC AT + 85 °C, 2.7 WVDC AT + 125 °C
2.2
3.3
4.7
6.8
10
15
22
22
33
33
33
R
R
R
R
R
R
P
R
P
P
R
292D225X_004R2T
0.5
0.5
0.5
0.5
0.5
0.8
0.9
0.9
1.3
1.3
1.3
6
6
6
6
6
8
8
10
10
10
12
7.6
7.6
6.3
5.5
5.1
3.5
3.5
3.5
3.5
1.1
3.5
0.057
0.057
0.063
0.067
0.070
0.085
0.085
0.085
0.085
0.151
0.085
292D335X_004R2T
292D475X_004R2T
292D685X_004R2T
292D106X_004R2T
292D156X_004R27
292D226X_004P2T
292D226X_004R2T
292D336X_004P2T
292D336X_004P2T_035
292D336X_004R2T
6.3 WVDC AT + 85 °C, 4 WVDC AT + 125 °C
2.2
4.7
4.7
6.8
6.8
10
10
15
15
22
22
22
33
R
R
R
R
R
P
R
R
R
P
P
R
P
292D225X_6R3R2T
0.5
0.6
0.6
0.5
0.5
0.6
0.6
0.9
0.9
1.3
0.9
1.4
2.1
10
6
6
6
6
7.6
2.0
3.4
5.0
2.0
3.5
1.2
3.5
1.8
3.5
1.1
3.5
3.5
0.057
0.086
0.086
0.071
0.067
0.085
0.144
0.085
0.118
0.118
0.151
0.085
0.085
292D475X_6R3R2T_035
292D475X_6R3R2T
292D685X_6R3R2T
292D685X_6R3R2T_035
292D106X_6R3P2T
292D106X_6R3R2T
292D156X_6R3R2T_035
292D15X_6R3R2_035
292D226X_6R3P2T
292D226X_6R3P2_035
292D226X_6R3R2T
292D336X_6R3P2T
6
6
10
10
10
10
10
12
10 WVDC AT+ 85 °C, 7 WVDC AT + 125 °C
1.0
2.2
3.3
3.3
3.3
4.7
4.7
4.7
6.8
6.8
10
R
R
R
R
P
P
R
R
P
R
P
R
P
P
292D105X_010R2
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.7
0.7
1.0
1.0
1.5
1.5
4
6
8
8
8
8
8
8
8
8
8
8
8
8
9.6
6.3
2.0
1.0
2.0
5.0
5.0
2.0
2.0
2.0
2.0
2.0
3.5
1.1
0.051
0.063
0.112
0.158
0.112
0.071
0.071
0.112
0.112
0.112
0.112
0.112
0.085
0.151
292D225X_010R2T
292D335X_010R2T
292D335X_010R2_035
292D335X_010P2T
292D475X_010P2T
292D475X_010R2T
292D475X_010R2T_035
292D685X_010P2T
292D685X_010R2T
292D106X_010P2T
292D106X_010R2T
292D156X_010P2T
292D156X_010P2_035
10
15
15
16 WVDC AT + 85 °C, 10 WVDC AT + 125 °C
1.0
2.2
3.3
3.3
4.7
10
R
R
R
R
R
P
292D105X_016R2
0.5
0.35
0.53
0.53
0.75
1.6
4
9.3
6.0
6.0
3.0
6.0
6.0
0.052
0.065
0.065
0.091
0.065
0.065
292D225X_016R2T
292D335X_016R2T
292D335X_016R2_035
292D475X_016R2T
292D106X_016P2T
8
8
8
8
8
20 WVDC AT + 85 °C, 13 WVDC AT + 125 °C
1.0
2.2
R
R
292D105X_020R2T
292D225X_020R2T
0.2
0.5
8
8
5.0
6.0
0.071
0.140
www.vishay.com
36
For technical questions, contact: tantalum@vishay.com
Document Number: 40042
Revision: 22-Apr-09
Not Recommended for New Designs
292D
Solid Tantalum Chip Capacitors,
TANTAMOUNT Leadframeless Molded
Vishay Sprague
®
CAPACITORS PERFORMANCE CHARACTERISTICS
ELECTRICAL PERFORMANCE CHARACTERISTICS
ITEM
PERFORMANCE CHARACTERISTICS
Category Temperature Range
Capacitance Tolerance
Dissipation Factor (at 120 Hz)
ESR (100 kHz)
- 55 °C to + 85 °C (to + 125 °C with voltage derating)
20 %, 10 % (at 120 Hz) 2 Vrms at + 25 °C using a capacitance bridge
Limits per Standard Ratings Table. Tested via bridge method, at 25 °C, 120 Hz.
Limits per Standard Ratings Table. Tested via bridge method, at 25 °C, 100 kHz.
After application of rated voltage applied to capacitors for 5 minutes using a steady source of power with
1 kΩ resistor in series with the capacitor under test, leakage current at 25 °C is not more than described in.
See graph below for the appropriate adjustment factor.
Leakage Current
Reverse Voltage
Capacitors are capable of withstanding peak voltages in the reverse direction equal to: 10 % of the DC
5 % of the DC rating at + 85 °C
Vishay does not recommended intentional or repetitive application of reverse voltage
If capacitors are to be used at temperatures above + 25 °C, the permissible rms ripple current or voltage
Temperature Derating
1.0 at + 25 °C
0.9 at + 85 °C
0.4 at + 125 °C
Maximum Permissible Power
Dissipation at 25 °C
(W) in free air
P- + R-case: 0.025
Operating Temperature
+ 85 °C RATING
+ 125 °C RATING
WORKING VOLTAGE
SURGE VOLTAGE
WORKING VOLTAGE
SURGE VOLTAGE
4
5.2
8
2.7
4
7
10
13
17
23
33
3.4
5
8
12
16
20
28
40
6.3
10
16
20
25
35
50
13
20
26
32
46
65
TYPICAL LEAKAGE CURRENT FACTOR RANGE
100
+ 125 °C
+ 85 °C
10
1.0
+ 55 °C
+ 25 °C
0 °C
0.1
- 55 °C
0.01
0.001
0
10
20
30
40
50
60
70
80
90
100
PERCENT OF RATED VOLTAGE
Notes
• At + 25 °C, the leakage current shall not exceed the value listed in the Standard Ratings Table
• At + 85 °C, the leakage current shall not exceed 10 times the value listed in the Standard Ratings Table
• At + 125 °C, the leakage current shall not exceed 12 times the value listed in the Standard Ratings Table
Document Number: 40042
Revision: 22-Apr-09
For technical questions, contact: tantalum@vishay.com
www.vishay.com
37
Not Recommended for New Designs
292D
Solid Tantalum Chip Capacitors,
TANTAMOUNT Leadframeless Molded
Vishay Sprague
®
ENVIRONMENTAL PERFORMANCE CHARACTERISTICS
ITEM
CONDITION
POST TEST PERFORMANCE
Life Test at + 85 °C
1000 h application of rated voltage at
85 °C with a 3 Ω series resistance,
MIL-STD 202G Method 108A
Capacitance Change
Dissipation Factor
Leakage Current
Refer to Standard Ratings Table
Not to exceed 150 % of initial
Not to exceed 200 % of initial
Humidity Tests
Thermal Shock
At 40 °C/90 % RH 500 h, no voltage
applied. MIL-STD 202G Method 103B
Capacitance Change
Dissipation Factor
Leakage Current
Refer to Standard Ratings Table
Not to exceed 150 % of initial
Not to exceed 200 % of initial
At - 55 °C/+ 125 °C, 30 min. each,
for 5 cycles. MIL-STD 202G Method 107G
Capacitance Change
Dissipation Factor
Leakage Current
Refer to Standard Ratings Table
Not to exceed 150 % of initial
Not to exceed 200 % of initial
MECHANICAL PERFORMANCE CHARACTERISTICS
TEST CONDITION
CONDITION
POST TEST PERFORMANCE
Terminal Strength
Apply a pressure load of 5 N for 10 1 s
horizontally to the center of capacitor side body.
AECQ-200 rev. C Method 006
Capacitance Change
Dissipation Factor
Leakage Current
Refer to Standard Ratings Table
Initial specified value or less
Initial specified value or less
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Substrate Bending
(Board flex)
With parts soldered onto substrate test board,
apply force to the test board for a deflection
of 1 mm. AECQ-200 rev. C Method 005
Capacitance Change
Dissipation Factor
Leakage Current
Refer to Standard Ratings Table
Initial specified value or less
Initial specified value or less
Vibration
MIL-STD-202G, Method 204D,
10 Hz to 2000 Hz, 20 G Peak
Capacitance Change
Dissipation Factor
Leakage Current
Refer to Standard Ratings Table
Initial specified value or less
Initial specified value or less
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Shock
Mil-Std-202G, Method 213B, Condition I,
100G Peak
Capacitance Change
Dissipation Factor
Leakage Current
Refer to Standard Ratings Table
Initial specified value or less
Initial specified value or less
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Resistance to Solder
Heat
At 260 °C, for 10 s, reflow
Capacitance Change
Dissipation Factor
Leakage Current
Refer to Standard Ratings Table
Not to exceed 150 % of initial
Not to exceed 200 % of initial
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Solderability
MIL-STD-202G, Method 208H, ANSI/J-Std-002,
Test B. Applies only to Solder and tin plated
terminations. Does not apply to gold terminations.
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Resistance to
Solvents
MIL-STD-202, Method 215D
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Flammability
Encapsulation materials meet UL94 VO with an
oxygen index of 32 %.
www.vishay.com
38
For technical questions, contact: tantalum@vishay.com
Document Number: 40042
Revision: 22-Apr-09
Not Recommended for New Designs
292D
Solid Tantalum Chip Capacitors,
TANTAMOUNT Leadframeless Molded
Vishay Sprague
®
PLASTIC TAPE AND REEL PACKAGING in inches [millimeters]
0.157 0.004
[4.0 0.10]
10 pitches cumulative
tolerance on tape
0.008 [0.200]
Tape Thickness
0.014
[0.35]
MAX.
Deformation
Between
Embossments
0.059 + 0.004 - 0.0
[1.5 + 0.10 - 0.0]
Embossment
0.069 0.004
[1.75 0.10]
0.079 0.002
[2.0 0.05]
Top
Cover
Tape
A0
20°
0.030 [0.75]
MIN.(Note 3)
F
W
Maximum
Component
Rotation
B
1 MAX.
K0
(Note 6)
B0
Top
Cover
Tape
0.030 [0.75]
MIN.(Note 4)
(Side or Front Sectional View)
0.004 [0.1]
MAX.
Center Lines
of Cavity
P1
For Tape Feeder
Reference only
including draft.
Concentric around B
(Note 5)
D
1 MIN. For Components
0.079 x 0.047 [2.0 x 1.2] and Large.r
Maximum (Note 5)
Cavity Size
USER DIRECTION OF FEED
0
(Note 1)
Cathode (-)
Anode (+)
Direction of Feet
Tape and Reel Specifications: All case sizes are available on
plastic embossed tape per EIA-481-1. Tape reeling per IEC 286-3
is also available. Standard reel diameter is 7" [178 mm],
13" [330 mm] reels are available and recommended as the most
cost effective packaging method.
3.937 [100.0]
0.039 [1.0]
MAX.
20° Maximum
Component Rotation
Typical
Component
Cavity
Tape
B0
0.039 [1.0]
MAX.
Center Line
The most efficient packaging quantities are full reel increments on
a given reel diameter. The quantities shown allow for the sealed
empty pockets required to be in conformance with EIA-481-1. Reel
size and packaging orientation must be specified in the Vishay
Sprague part number.
0.9843 [250.0]
Typical
Component
Center Line
Camber
(Top View)
A0
(Top View)
Allowable Camber to be 0.039/3.937 [1/100]
Non-Cumulative Over 9.843 [250.0]
B1
(MAX.)
D1
(MIN.)
K0
(MAX.)
CASE
CODE
TAPE
SIZE
P1
F
W
292D
P
R
0.092 0.0039 0.0394 + 0.0098 0.1378 0.0098 0.053 0.0039 0.157 0.0039 0.315 + 0.0118/- 0.0039
8 mm
[2.34 0.100]
[1.5 + 0.100]
[3.5 0.05]
[1.35 0.100]
[4.0 0.2]
[8.0 + 0.30/- 0.10]
Note: Metric dimensions will govern. Dimensions in inches are rounded and for reference only
STANDARD PACKAGING QUANTITY
QTY (PCS/REEL)
SERIES
CASE CODE
7" REEL
13" REEL
292D
P, R
2500
10 000
Document Number: 40042
Revision: 22-Apr-09
For technical questions, contact: tantalum@vishay.com
www.vishay.com
39
Not Recommended for New Designs
292D
Solid Tantalum Chip Capacitors,
TANTAMOUNT Leadframeless Molded
Vishay Sprague
®
RECOMMENDED VOLTAGE DERATING GUIDELINES
STANDARD CONDITIONS: FOR EXAMPLE: OUTPUT FILTERS
Capacitor Voltage Rating
Operating Voltage
4.0
2.5
3.6
6.0
10
12
15
24
28
6.3
10
16
20
25
35
50
SEVERE CONDITIONS: FOR EXAMPLE: INPUT FILTERS
Capacitor Voltage Rating
Operating Voltage
4.0
6.3
10
16
20
25
35
50
2.5
3.3
5.0
8.0
10
12
15
24
RECOMMENDED REFLOW PROFILES
Tp °C
(tp)
TL °C
Ts MAX. °C
(tL)
Ts MAX. °C
Preheat (ts)
25 °C
All Case Codes
TP
TL
TS MIN.
lead
TS
TS MAX.
TS
tS
TP
TL
tS
tP
tL
TYPE
292D
lead
lead
MIN.
lead
MAX.
lead
Sn/Pb
Sn/Pb
Sn/Pb
(Pb)-free
(Pb)-free
(Pb)-free
Sn/Pb
(Pb)-free
Sn/Pb
(Pb)-free
260 °C
225 °C 10
217 °C
183 °C
150 °C
100 °C
200 °C
150 °C
60 - 150
60 - 90 70
PAD DIMENSIONS in inches [millimeters]
B
C
A
A
B
C
D
CASE CODE
292D
P, R
0.059 [1.50]
0.031 [0.80]
0.039 [1.00]
0.102 [2.60]
www.vishay.com
40
For technical questions, contact: tantalum@vishay.com
Document Number: 40042
Revision: 22-Apr-09
Not Recommended for New Designs
292D
Solid Tantalum Chip Capacitors,
TANTAMOUNT Leadframeless Molded
Vishay Sprague
®
6.
Printed Circuit Board Materials: Molded capacitors
are compatible with commonly used printed circuit
board materials (alumina substrates, FR4, FR5, G10,
PTFE-fluorocarbon and porcelanized steel).
GUIDE TO APPLICATION
1.
A-C Ripple Current: The maximum allowable ripple
current shall be determined from the formula:
P
7.
Attachment:
I
=
---------------
rms
R
ESR
7.1
Solder Paste: The recommended thickness of the
solder paste after application is 0.007" 0.001"
[0.178 mm 0.025 mm]. Care should be exercised in
selecting the solder paste. The metal purity should be
as high as practical. The flux (in the paste) must be
active enough to remove the oxides formed on the
metallization prior to the exposure to soldering heat.
In practice this can be aided by extending the solder
preheat time at temperatures below the liquidous
state of the solder.
where,
P =
Power Dissipation in Watts at + 25 °C as
given in the table in Paragraph Number 5
(Power Dissipation).
The capacitor Equivalent Series
Resistance at the specified frequency.
RESR
=
2.
A-C Ripple Voltage: The maximum allowable ripple
voltage shall be determined from the formula:
P
7.2
Soldering: Capacitors can be attached by
conventional soldering techniques; vapor phase,
convection reflow, infrared reflow, wave soldering
and hot plate methods. The Soldering Profile charts
show recommended time/temperature conditions for
soldering. Preheating is recommended. The
recommended maximum ramp rate is 2 °C per
second. Attachment with a soldering iron is not
recommended due to the difficulty of controlling
temperature and time at temperature. The soldering
iron must never come in contact with the capacitor.
V
= Z ---------------
rms
R
ESR
or, from the formula:
= I
V
× Z
rms
rms
where,
P =
Power Dissipation in Watts at + 25 °C as
given in the table in Paragraph Number 5
(Power Dissipation).
The capacitor Equivalent Series
Resistance at the specified frequency.
The capacitor impedance at the specified
frequency.
RESR
Z =
=
7.2.1 Backward and Forward Compatibility: Capacitors
with SnPb or 100 % tin termination finishes can be
soldered using SnPb or lead (Pb)-free soldering
processes.
2.1
2.2
3.
The sum of the peak AC voltage plus the applied DC
voltage shall not exceed the DC voltage rating of the
capacitor.
8.
Cleaning (Flux Removal) After Soldering: Molded
capacitors are compatible with all commonly used
solvents such as TES, TMS, Prelete, Chlorethane,
Terpene and aqueous cleaning media. However,
CFC/ODS products are not used in the production of
these devices and are not recommended. Solvents
containing methylene chloride or other epoxy
solvents should be avoided since these will attack the
epoxy encapsulation material.
The sum of the negative peak AC voltage plus the
applied DC voltage shall not allow a voltage reversal
exceeding 10 % of the DC working voltage at + 25 °C.
Reverse Voltage: These capacitors are capable of
withstanding peak voltages in the reverse direction
equal to 10 % of the DC rating at + 25 °C, 5 % of the DC
rating at + 85 °C and 1 % of the DC rating at + 125 °C.
8.1
9.
When using ultrasonic cleaning, the board may
resonate if the output power is too high. This vibration
can cause cracking or a decrease in the adherence of
the termination. DO NOT EXCEED 9W/l at 40 kHz for
2 minutes.
4.
Temperature Derating: If these capacitors are to be
operated at temperatures above + 25 °C, the
permissible rms ripple current or voltage shall be
calculated using the derating factors as shown:
TEMPERATURE
+ 25 °C
DERATING FACTOR
Recommended Mounting Pad Geometries: Proper
mounting pad geometries are essential for successful
solder connections. These dimensions are highly
process sensitive and should be designed to
minimize component rework due to unacceptable
solder joints. The dimensional configurations shown
are the recommended pad geometries for both wave
and reflow soldering techniques. These dimensions
are intended to be a starting point for circuit board
designers and may be fine tuned if necessary based
upon the peculiarities of the soldering process and/or
circuit board design.
1.0
0.9
0.4
+ 85 °C
+ 125 °C
5.
Power Dissipation: Power dissipation will be
affected by the heat sinking capability of the mounting
surface. Non-sinusoidal ripple current may produce
heating effects which differ from those shown. It is
important that the equivalent Irms value be established
when calculating permissible operating levels. (Power
Dissipation calculated using + 25 °C temperature
rise.)
Document Number: 40042
Revision: 22-Apr-09
For technical questions, contact: tantalum@vishay.com
www.vishay.com
41
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding
products designed for such applications.
Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000
Revision: 18-Jul-08
www.vishay.com
1
相关型号:
292D15X06R3R8W35
CAPACITOR, TANTALUM, SOLID, POLARIZED, 6.3V, 15uF, SURFACE MOUNT, 0805, CHIP, 0805
VISHAY
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