292D106X96R3R4W [VISHAY]

CAPACITOR, TANTALUM, SOLID, POLARIZED, 6.3V, 10uF, SURFACE MOUNT, 0805, CHIP, ROHS COMPLIANT;
292D106X96R3R4W
型号: 292D106X96R3R4W
厂家: VISHAY    VISHAY
描述:

CAPACITOR, TANTALUM, SOLID, POLARIZED, 6.3V, 10uF, SURFACE MOUNT, 0805, CHIP, ROHS COMPLIANT

电容器
文件: 总8页 (文件大小:130K)
中文:  中文翻译
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Not Recommended for New Designs  
292D  
Vishay Sprague  
®
Solid Tantalum Chip Capacitors, TANTAMOUNT ,  
Leadframeless Molded  
P and R cases  
Image is not to scale  
PERFORMANCE CHARACTERISTICS  
Operating Temperature: - 55 °C to + 85 °C  
(To + 125 °C with voltage derating)  
Note  
Capacitance Range: 1.0 µF to 47 µF  
Capacitance Tolerance: 10 %, 20 % standard  
Voltage Rating: 3 WVDC to 20 WVDC  
• Refer to Doc. 40088  
ORDERING INFORMATION  
292D  
106  
X0  
010  
P
2
T
TYPE  
CAPACITANCE  
CAPACITANCE  
TOLERANCE  
DC VOLTAGE RATING  
AT + 85 °C  
CASE CODE  
TERMINATION  
REEL SIZE AND  
PACKAGING  
This is expressed in  
picofarads. The first  
two digits are the  
significant figures.  
The third is the  
number of zeros to  
follow.  
X0 = 20 %  
X9 = 10 %  
This is expressed in volts.  
To complete the three-digit  
block, zeros precede the  
voltage rating. A decimal  
point is indicated by an “R”  
(6R3 = 6.3 V).  
See ratings  
and case  
codes table  
2 = 100 % Tin  
T = Tape and reel*  
7" [178 mm] reel  
4 = Gold plated  
8 = Solder plated W = 13" [330 mm] reel  
(60/40)  
Special order  
*Cathode nearest  
sprocket hole  
Note  
• Preferred tolerance and reel sizes are in bold  
DIMENSIONS in inches [millimeters]  
P
Tantalum Wire Nib  
Identifies Anode (+)  
Terminal  
L
P
W
H
H
CASE  
EIA  
L
W
P
0805  
[2012]  
0.079 0.008  
[2.0 0.2]  
0.051 0.008  
[1.3 0.2]  
0.047 (Max.)  
[1.2 Max.]  
0.020 0.012  
[0.5 0.3]  
R
0805  
[2012]  
0.079 0.010  
[2.0 0.25]  
0.053 0.008  
[1.35 0.2]  
0.053 0.008  
[1.35 0.2]  
0.020 0.012  
[0.5 0.3]  
P
RATINGS AND CASE CODES  
µF  
1.0  
2.2  
3.3  
4.7  
6.8  
10  
3 V  
4 V  
6.3 V  
10 V  
R
R
P/R  
P/R  
P/R  
P/R  
P
16 V  
R
R
R
R
20 V  
R
R
R
R
R
R
R
R
R
R
R
P/R  
R
P
15  
22  
33  
P/R  
P/R  
P/R  
P
47  
P
* Pb containing terminations are not RoHS compliant, exemptions may apply  
Document Number: 40042  
Revision: 22-Apr-09  
For technical questions, contact: tantalum@vishay.com  
www.vishay.com  
35  
Not Recommended for New Designs  
292D  
Solid Tantalum Chip Capacitors,  
TANTAMOUNT Leadframeless Molded  
Vishay Sprague  
®
STANDARD RATINGS  
MAX RIPPLE  
100 kHz Irms  
(A)  
MAX DCL  
AT + 25 °C  
(µA)  
MAX DF  
AT + 25 °C  
(%)  
MAX ESR  
at 100 kHz  
(Ω)  
CAPACITANCE  
(µF)  
CASE  
CODE  
PART  
NUMBER  
3 WVDC AT + 85 °C, 1.9 WVDC AT + 125 °C  
47  
P
292D476X_003P2T  
1.5  
12  
6.0  
0.21  
4 WVDC AT + 85 °C, 2.7 WVDC AT + 125 °C  
2.2  
3.3  
4.7  
6.8  
10  
15  
22  
22  
33  
33  
33  
R
R
R
R
R
R
P
R
P
P
R
292D225X_004R2T  
0.5  
0.5  
0.5  
0.5  
0.5  
0.8  
0.9  
0.9  
1.3  
1.3  
1.3  
6
6
6
6
6
8
8
10  
10  
10  
12  
7.6  
7.6  
6.3  
5.5  
5.1  
3.5  
3.5  
3.5  
3.5  
1.1  
3.5  
0.057  
0.057  
0.063  
0.067  
0.070  
0.085  
0.085  
0.085  
0.085  
0.151  
0.085  
292D335X_004R2T  
292D475X_004R2T  
292D685X_004R2T  
292D106X_004R2T  
292D156X_004R27  
292D226X_004P2T  
292D226X_004R2T  
292D336X_004P2T  
292D336X_004P2T_035  
292D336X_004R2T  
6.3 WVDC AT + 85 °C, 4 WVDC AT + 125 °C  
2.2  
4.7  
4.7  
6.8  
6.8  
10  
10  
15  
15  
22  
22  
22  
33  
R
R
R
R
R
P
R
R
R
P
P
R
P
292D225X_6R3R2T  
0.5  
0.6  
0.6  
0.5  
0.5  
0.6  
0.6  
0.9  
0.9  
1.3  
0.9  
1.4  
2.1  
10  
6
6
6
6
7.6  
2.0  
3.4  
5.0  
2.0  
3.5  
1.2  
3.5  
1.8  
3.5  
1.1  
3.5  
3.5  
0.057  
0.086  
0.086  
0.071  
0.067  
0.085  
0.144  
0.085  
0.118  
0.118  
0.151  
0.085  
0.085  
292D475X_6R3R2T_035  
292D475X_6R3R2T  
292D685X_6R3R2T  
292D685X_6R3R2T_035  
292D106X_6R3P2T  
292D106X_6R3R2T  
292D156X_6R3R2T_035  
292D15X_6R3R2_035  
292D226X_6R3P2T  
292D226X_6R3P2_035  
292D226X_6R3R2T  
292D336X_6R3P2T  
6
6
10  
10  
10  
10  
10  
12  
10 WVDC AT+ 85 °C, 7 WVDC AT + 125 °C  
1.0  
2.2  
3.3  
3.3  
3.3  
4.7  
4.7  
4.7  
6.8  
6.8  
10  
R
R
R
R
P
P
R
R
P
R
P
R
P
P
292D105X_010R2  
0.5  
0.5  
0.5  
0.5  
0.5  
0.5  
0.5  
0.5  
0.7  
0.7  
1.0  
1.0  
1.5  
1.5  
4
6
8
8
8
8
8
8
8
8
8
8
8
8
9.6  
6.3  
2.0  
1.0  
2.0  
5.0  
5.0  
2.0  
2.0  
2.0  
2.0  
2.0  
3.5  
1.1  
0.051  
0.063  
0.112  
0.158  
0.112  
0.071  
0.071  
0.112  
0.112  
0.112  
0.112  
0.112  
0.085  
0.151  
292D225X_010R2T  
292D335X_010R2T  
292D335X_010R2_035  
292D335X_010P2T  
292D475X_010P2T  
292D475X_010R2T  
292D475X_010R2T_035  
292D685X_010P2T  
292D685X_010R2T  
292D106X_010P2T  
292D106X_010R2T  
292D156X_010P2T  
292D156X_010P2_035  
10  
15  
15  
16 WVDC AT + 85 °C, 10 WVDC AT + 125 °C  
1.0  
2.2  
3.3  
3.3  
4.7  
10  
R
R
R
R
R
P
292D105X_016R2  
0.5  
0.35  
0.53  
0.53  
0.75  
1.6  
4
9.3  
6.0  
6.0  
3.0  
6.0  
6.0  
0.052  
0.065  
0.065  
0.091  
0.065  
0.065  
292D225X_016R2T  
292D335X_016R2T  
292D335X_016R2_035  
292D475X_016R2T  
292D106X_016P2T  
8
8
8
8
8
20 WVDC AT + 85 °C, 13 WVDC AT + 125 °C  
1.0  
2.2  
R
R
292D105X_020R2T  
292D225X_020R2T  
0.2  
0.5  
8
8
5.0  
6.0  
0.071  
0.140  
www.vishay.com  
36  
For technical questions, contact: tantalum@vishay.com  
Document Number: 40042  
Revision: 22-Apr-09  
Not Recommended for New Designs  
292D  
Solid Tantalum Chip Capacitors,  
TANTAMOUNT Leadframeless Molded  
Vishay Sprague  
®
CAPACITORS PERFORMANCE CHARACTERISTICS  
ELECTRICAL PERFORMANCE CHARACTERISTICS  
ITEM  
PERFORMANCE CHARACTERISTICS  
Category Temperature Range  
Capacitance Tolerance  
Dissipation Factor (at 120 Hz)  
ESR (100 kHz)  
- 55 °C to + 85 °C (to + 125 °C with voltage derating)  
20 %, 10 % (at 120 Hz) 2 Vrms at + 25 °C using a capacitance bridge  
Limits per Standard Ratings Table. Tested via bridge method, at 25 °C, 120 Hz.  
Limits per Standard Ratings Table. Tested via bridge method, at 25 °C, 100 kHz.  
After application of rated voltage applied to capacitors for 5 minutes using a steady source of power with  
1 kΩ resistor in series with the capacitor under test, leakage current at 25 °C is not more than described in.  
See graph below for the appropriate adjustment factor.  
Leakage Current  
Reverse Voltage  
Capacitors are capable of withstanding peak voltages in the reverse direction equal to: 10 % of the DC  
5 % of the DC rating at + 85 °C  
Vishay does not recommended intentional or repetitive application of reverse voltage  
If capacitors are to be used at temperatures above + 25 °C, the permissible rms ripple current or voltage  
Temperature Derating  
1.0 at + 25 °C  
0.9 at + 85 °C  
0.4 at + 125 °C  
Maximum Permissible Power  
Dissipation at 25 °C  
(W) in free air  
P- + R-case: 0.025  
Operating Temperature  
+ 85 °C RATING  
+ 125 °C RATING  
WORKING VOLTAGE  
SURGE VOLTAGE  
WORKING VOLTAGE  
SURGE VOLTAGE  
4
5.2  
8
2.7  
4
7
10  
13  
17  
23  
33  
3.4  
5
8
12  
16  
20  
28  
40  
6.3  
10  
16  
20  
25  
35  
50  
13  
20  
26  
32  
46  
65  
TYPICAL LEAKAGE CURRENT FACTOR RANGE  
100  
+ 125 °C  
+ 85 °C  
10  
1.0  
+ 55 °C  
+ 25 °C  
0 °C  
0.1  
- 55 °C  
0.01  
0.001  
0
10  
20  
30  
40  
50  
60  
70  
80  
90  
100  
PERCENT OF RATED VOLTAGE  
Notes  
At + 25 °C, the leakage current shall not exceed the value listed in the Standard Ratings Table  
At + 85 °C, the leakage current shall not exceed 10 times the value listed in the Standard Ratings Table  
At + 125 °C, the leakage current shall not exceed 12 times the value listed in the Standard Ratings Table  
Document Number: 40042  
Revision: 22-Apr-09  
For technical questions, contact: tantalum@vishay.com  
www.vishay.com  
37  
Not Recommended for New Designs  
292D  
Solid Tantalum Chip Capacitors,  
TANTAMOUNT Leadframeless Molded  
Vishay Sprague  
®
ENVIRONMENTAL PERFORMANCE CHARACTERISTICS  
ITEM  
CONDITION  
POST TEST PERFORMANCE  
Life Test at + 85 °C  
1000 h application of rated voltage at  
85 °C with a 3 Ω series resistance,  
MIL-STD 202G Method 108A  
Capacitance Change  
Dissipation Factor  
Leakage Current  
Refer to Standard Ratings Table  
Not to exceed 150 % of initial  
Not to exceed 200 % of initial  
Humidity Tests  
Thermal Shock  
At 40 °C/90 % RH 500 h, no voltage  
applied. MIL-STD 202G Method 103B  
Capacitance Change  
Dissipation Factor  
Leakage Current  
Refer to Standard Ratings Table  
Not to exceed 150 % of initial  
Not to exceed 200 % of initial  
At - 55 °C/+ 125 °C, 30 min. each,  
for 5 cycles. MIL-STD 202G Method 107G  
Capacitance Change  
Dissipation Factor  
Leakage Current  
Refer to Standard Ratings Table  
Not to exceed 150 % of initial  
Not to exceed 200 % of initial  
MECHANICAL PERFORMANCE CHARACTERISTICS  
TEST CONDITION  
CONDITION  
POST TEST PERFORMANCE  
Terminal Strength  
Apply a pressure load of 5 N for 10 1 s  
horizontally to the center of capacitor side body.  
AECQ-200 rev. C Method 006  
Capacitance Change  
Dissipation Factor  
Leakage Current  
Refer to Standard Ratings Table  
Initial specified value or less  
Initial specified value or less  
There shall be no mechanical or visual damage to capacitors  
post-conditioning.  
Substrate Bending  
(Board flex)  
With parts soldered onto substrate test board,  
apply force to the test board for a deflection  
of 1 mm. AECQ-200 rev. C Method 005  
Capacitance Change  
Dissipation Factor  
Leakage Current  
Refer to Standard Ratings Table  
Initial specified value or less  
Initial specified value or less  
Vibration  
MIL-STD-202G, Method 204D,  
10 Hz to 2000 Hz, 20 G Peak  
Capacitance Change  
Dissipation Factor  
Leakage Current  
Refer to Standard Ratings Table  
Initial specified value or less  
Initial specified value or less  
There shall be no mechanical or visual damage to capacitors  
post-conditioning.  
Shock  
Mil-Std-202G, Method 213B, Condition I,  
100G Peak  
Capacitance Change  
Dissipation Factor  
Leakage Current  
Refer to Standard Ratings Table  
Initial specified value or less  
Initial specified value or less  
There shall be no mechanical or visual damage to capacitors  
post-conditioning.  
Resistance to Solder  
Heat  
At 260 °C, for 10 s, reflow  
Capacitance Change  
Dissipation Factor  
Leakage Current  
Refer to Standard Ratings Table  
Not to exceed 150 % of initial  
Not to exceed 200 % of initial  
There shall be no mechanical or visual damage to capacitors  
post-conditioning.  
Solderability  
MIL-STD-202G, Method 208H, ANSI/J-Std-002,  
Test B. Applies only to Solder and tin plated  
terminations. Does not apply to gold terminations.  
There shall be no mechanical or visual damage to capacitors  
post-conditioning.  
Resistance to  
Solvents  
MIL-STD-202, Method 215D  
There shall be no mechanical or visual damage to capacitors  
post-conditioning.  
Flammability  
Encapsulation materials meet UL94 VO with an  
oxygen index of 32 %.  
www.vishay.com  
38  
For technical questions, contact: tantalum@vishay.com  
Document Number: 40042  
Revision: 22-Apr-09  
Not Recommended for New Designs  
292D  
Solid Tantalum Chip Capacitors,  
TANTAMOUNT Leadframeless Molded  
Vishay Sprague  
®
PLASTIC TAPE AND REEL PACKAGING in inches [millimeters]  
0.157 0.004  
[4.0 0.10]  
10 pitches cumulative  
tolerance on tape  
0.008 [0.200]  
Tape Thickness  
0.014  
[0.35]  
MAX.  
Deformation  
Between  
Embossments  
0.059 + 0.004 - 0.0  
[1.5 + 0.10 - 0.0]  
Embossment  
0.069 0.004  
[1.75 0.10]  
0.079 0.002  
[2.0 0.05]  
Top  
Cover  
Tape  
A0  
20°  
0.030 [0.75]  
MIN.(Note 3)  
F
W
Maximum  
Component  
Rotation  
B
1 MAX.  
K0  
(Note 6)  
B0  
Top  
Cover  
Tape  
0.030 [0.75]  
MIN.(Note 4)  
(Side or Front Sectional View)  
0.004 [0.1]  
MAX.  
Center Lines  
of Cavity  
P1  
For Tape Feeder  
Reference only  
including draft.  
Concentric around B  
(Note 5)  
D
1 MIN. For Components  
0.079 x 0.047 [2.0 x 1.2] and Large.r  
Maximum (Note 5)  
Cavity Size  
USER DIRECTION OF FEED  
0
(Note 1)  
Cathode (-)  
Anode (+)  
Direction of Feet  
Tape and Reel Specifications: All case sizes are available on  
plastic embossed tape per EIA-481-1. Tape reeling per IEC 286-3  
is also available. Standard reel diameter is 7" [178 mm],  
13" [330 mm] reels are available and recommended as the most  
cost effective packaging method.  
3.937 [100.0]  
0.039 [1.0]  
MAX.  
20° Maximum  
Component Rotation  
Typical  
Component  
Cavity  
Tape  
B0  
0.039 [1.0]  
MAX.  
Center Line  
The most efficient packaging quantities are full reel increments on  
a given reel diameter. The quantities shown allow for the sealed  
empty pockets required to be in conformance with EIA-481-1. Reel  
size and packaging orientation must be specified in the Vishay  
Sprague part number.  
0.9843 [250.0]  
Typical  
Component  
Center Line  
Camber  
(Top View)  
A0  
(Top View)  
Allowable Camber to be 0.039/3.937 [1/100]  
Non-Cumulative Over 9.843 [250.0]  
B1  
(MAX.)  
D1  
(MIN.)  
K0  
(MAX.)  
CASE  
CODE  
TAPE  
SIZE  
P1  
F
W
292D  
P
R
0.092 0.0039 0.0394 + 0.0098 0.1378 0.0098 0.053 0.0039 0.157 0.0039 0.315 + 0.0118/- 0.0039  
8 mm  
[2.34 0.100]  
[1.5 + 0.100]  
[3.5 0.05]  
[1.35 0.100]  
[4.0 0.2]  
[8.0 + 0.30/- 0.10]  
Note: Metric dimensions will govern. Dimensions in inches are rounded and for reference only  
STANDARD PACKAGING QUANTITY  
QTY (PCS/REEL)  
SERIES  
CASE CODE  
7" REEL  
13" REEL  
292D  
P, R  
2500  
10 000  
Document Number: 40042  
Revision: 22-Apr-09  
For technical questions, contact: tantalum@vishay.com  
www.vishay.com  
39  
Not Recommended for New Designs  
292D  
Solid Tantalum Chip Capacitors,  
TANTAMOUNT Leadframeless Molded  
Vishay Sprague  
®
RECOMMENDED VOLTAGE DERATING GUIDELINES  
STANDARD CONDITIONS: FOR EXAMPLE: OUTPUT FILTERS  
Capacitor Voltage Rating  
Operating Voltage  
4.0  
2.5  
3.6  
6.0  
10  
12  
15  
24  
28  
6.3  
10  
16  
20  
25  
35  
50  
SEVERE CONDITIONS: FOR EXAMPLE: INPUT FILTERS  
Capacitor Voltage Rating  
Operating Voltage  
4.0  
6.3  
10  
16  
20  
25  
35  
50  
2.5  
3.3  
5.0  
8.0  
10  
12  
15  
24  
RECOMMENDED REFLOW PROFILES  
Tp °C  
(tp)  
TL °C  
Ts MAX. °C  
(tL)  
Ts MAX. °C  
Preheat (ts)  
25 °C  
All Case Codes  
TP  
TL  
TS MIN.  
lead  
TS  
TS MAX.  
TS  
tS  
TP  
TL  
tS  
tP  
tL  
TYPE  
292D  
lead  
lead  
MIN.  
lead  
MAX.  
lead  
Sn/Pb  
Sn/Pb  
Sn/Pb  
(Pb)-free  
(Pb)-free  
(Pb)-free  
Sn/Pb  
(Pb)-free  
Sn/Pb  
(Pb)-free  
260 °C  
225 °C 10  
217 °C  
183 °C  
150 °C  
100 °C  
200 °C  
150 °C  
60 - 150  
60 - 90 70  
PAD DIMENSIONS in inches [millimeters]  
B
C
A
A
B
C
D
CASE CODE  
292D  
P, R  
0.059 [1.50]  
0.031 [0.80]  
0.039 [1.00]  
0.102 [2.60]  
www.vishay.com  
40  
For technical questions, contact: tantalum@vishay.com  
Document Number: 40042  
Revision: 22-Apr-09  
Not Recommended for New Designs  
292D  
Solid Tantalum Chip Capacitors,  
TANTAMOUNT Leadframeless Molded  
Vishay Sprague  
®
6.  
Printed Circuit Board Materials: Molded capacitors  
are compatible with commonly used printed circuit  
board materials (alumina substrates, FR4, FR5, G10,  
PTFE-fluorocarbon and porcelanized steel).  
GUIDE TO APPLICATION  
1.  
A-C Ripple Current: The maximum allowable ripple  
current shall be determined from the formula:  
P
7.  
Attachment:  
I
=
---------------  
rms  
R
ESR  
7.1  
Solder Paste: The recommended thickness of the  
solder paste after application is 0.007" 0.001"  
[0.178 mm 0.025 mm]. Care should be exercised in  
selecting the solder paste. The metal purity should be  
as high as practical. The flux (in the paste) must be  
active enough to remove the oxides formed on the  
metallization prior to the exposure to soldering heat.  
In practice this can be aided by extending the solder  
preheat time at temperatures below the liquidous  
state of the solder.  
where,  
P =  
Power Dissipation in Watts at + 25 °C as  
given in the table in Paragraph Number 5  
(Power Dissipation).  
The capacitor Equivalent Series  
Resistance at the specified frequency.  
RESR  
=
2.  
A-C Ripple Voltage: The maximum allowable ripple  
voltage shall be determined from the formula:  
P
7.2  
Soldering: Capacitors can be attached by  
conventional soldering techniques; vapor phase,  
convection reflow, infrared reflow, wave soldering  
and hot plate methods. The Soldering Profile charts  
show recommended time/temperature conditions for  
soldering. Preheating is recommended. The  
recommended maximum ramp rate is 2 °C per  
second. Attachment with a soldering iron is not  
recommended due to the difficulty of controlling  
temperature and time at temperature. The soldering  
iron must never come in contact with the capacitor.  
V
= Z ---------------  
rms  
R
ESR  
or, from the formula:  
= I  
V
× Z  
rms  
rms  
where,  
P =  
Power Dissipation in Watts at + 25 °C as  
given in the table in Paragraph Number 5  
(Power Dissipation).  
The capacitor Equivalent Series  
Resistance at the specified frequency.  
The capacitor impedance at the specified  
frequency.  
RESR  
Z =  
=
7.2.1 Backward and Forward Compatibility: Capacitors  
with SnPb or 100 % tin termination finishes can be  
soldered using SnPb or lead (Pb)-free soldering  
processes.  
2.1  
2.2  
3.  
The sum of the peak AC voltage plus the applied DC  
voltage shall not exceed the DC voltage rating of the  
capacitor.  
8.  
Cleaning (Flux Removal) After Soldering: Molded  
capacitors are compatible with all commonly used  
solvents such as TES, TMS, Prelete, Chlorethane,  
Terpene and aqueous cleaning media. However,  
CFC/ODS products are not used in the production of  
these devices and are not recommended. Solvents  
containing methylene chloride or other epoxy  
solvents should be avoided since these will attack the  
epoxy encapsulation material.  
The sum of the negative peak AC voltage plus the  
applied DC voltage shall not allow a voltage reversal  
exceeding 10 % of the DC working voltage at + 25 °C.  
Reverse Voltage: These capacitors are capable of  
withstanding peak voltages in the reverse direction  
equal to 10 % of the DC rating at + 25 °C, 5 % of the DC  
rating at + 85 °C and 1 % of the DC rating at + 125 °C.  
8.1  
9.  
When using ultrasonic cleaning, the board may  
resonate if the output power is too high. This vibration  
can cause cracking or a decrease in the adherence of  
the termination. DO NOT EXCEED 9W/l at 40 kHz for  
2 minutes.  
4.  
Temperature Derating: If these capacitors are to be  
operated at temperatures above + 25 °C, the  
permissible rms ripple current or voltage shall be  
calculated using the derating factors as shown:  
TEMPERATURE  
+ 25 °C  
DERATING FACTOR  
Recommended Mounting Pad Geometries: Proper  
mounting pad geometries are essential for successful  
solder connections. These dimensions are highly  
process sensitive and should be designed to  
minimize component rework due to unacceptable  
solder joints. The dimensional configurations shown  
are the recommended pad geometries for both wave  
and reflow soldering techniques. These dimensions  
are intended to be a starting point for circuit board  
designers and may be fine tuned if necessary based  
upon the peculiarities of the soldering process and/or  
circuit board design.  
1.0  
0.9  
0.4  
+ 85 °C  
+ 125 °C  
5.  
Power Dissipation: Power dissipation will be  
affected by the heat sinking capability of the mounting  
surface. Non-sinusoidal ripple current may produce  
heating effects which differ from those shown. It is  
important that the equivalent Irms value be established  
when calculating permissible operating levels. (Power  
Dissipation calculated using + 25 °C temperature  
rise.)  
Document Number: 40042  
Revision: 22-Apr-09  
For technical questions, contact: tantalum@vishay.com  
www.vishay.com  
41  
Legal Disclaimer Notice  
Vishay  
Disclaimer  
All product specifications and data are subject to change without notice.  
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf  
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein  
or in any other disclosure relating to any product.  
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any  
information provided herein to the maximum extent permitted by law. The product specifications do not expand or  
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed  
therein, which apply to these products.  
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this  
document or by any conduct of Vishay.  
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless  
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such  
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting  
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding  
products designed for such applications.  
Product names and markings noted herein may be trademarks of their respective owners.  
Document Number: 91000  
Revision: 18-Jul-08  
www.vishay.com  
1

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