10-FY12B2A040MR02-L387L63 [VINCOTECH]
Easy paralleling;Low on-resistance;Fast switching speed;Fast recovery body diode;
| 型号： | 10-FY12B2A040MR02-L387L63 |
| 厂家： | 
VINCOTECH |
| 描述： | Easy paralleling;Low on-resistance;Fast switching speed;Fast recovery body diode |
| 文件： | 总7页 (文件大小：374K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
10-FY12B2A040MR02-L387L63
target datasheet
flowBOOST 1 dual SiC
Features
1200 V / 40 mΩ
flow 1 12mm housing
● High frequency SiC MOSFET
● Compact and low inductive design
Schematic
Target applications
● Solar
Types
● 10-FY12B2A040MR02-L387L63
Maximum Ratings
T
j
= 25 °C, unless otherwise specified
Parameter
Symbol
Condition
Value
Unit
Boost Switch
VDSS
ID
Drain-source voltage
1200
32
V
A
Drain current
Tj = Tjmax
Ts = 80 °C
Ts = 80 °C
IDM
Peak drain current
tp limited by Tjmax
Tj = Tjmax
137
73
A
Ptot
VGSS
Tjmax
Total power dissipation
Gate-source voltage
Maximum Junction Temperature
W
V
-4/22
175
°C
Copyright Vincotech
1
25 Apr. 2016 / Revision 1
10-FY12B2A040MR02-L387L63
target datasheet
Maximum Ratings
Tj = 25 °C, unless otherwise specified
Parameter
Symbol
Condition
Value
Unit
Boost Diode
VRRM
IF
Ptot
Tjmax
Peak Repetitive Reverse Voltage
1200
48
V
A
Continuous (direct) forward current
Total power dissipation
Tj = Tjmax
Tj = Tjmax
Ts = 80 °C
Ts = 80 °C
125
175
W
°C
Maximum Junction Temperature
Rectifier Diode
VRRM
IF
IFSM
I2t
Ptot
Tjmax
Peak Repetitive Reverse Voltage
1600
53
V
A
Continuous (direct) forward current
Surge (non-repetitive) forward current
Surge current capability
Tj = Tjmax
Ts = 80 °C
Tj = 150 °C
Ts = 80 °C
490
1200
86
A
50 Hz Single Half Sine Wave
tp = 10 ms
A2s
W
°C
Total power dissipation
Tj = Tjmax
Maximum Junction Temperature
150
DC Link Capacitance
VMAX
Top
Maximum DC voltage
1500
V
Operation Temperature
-55…+125
°C
Module Properties
Thermal Properties
Tstg
Tjop
Storage temperature
-40…+125
°C
°C
Operation temperature under switching condition
Isolation Properties
Isolation voltage
-40…(Tjmax - 25)
Visol
DC Test Voltage
tp = 2 s
4000
min. 12,7
9,43
V
Creepage distance
mm
mm
Clearance
Comparative Tracking Index
CTI
> 200
Copyright Vincotech
2
25 Apr. 2016 / Revision 1
10-FY12B2A040MR02-L387L63
target datasheet
Characteristic Values
Parameter
Symbol
Conditions
Value
Typ
Unit
VGE [V] VCE [V] IC [A]
VGS [V] VDS [V] ID [A]
Tj [°C]
Min
Max
Boost Switch
Static
25
39
52
60
50
rDS(on)
125
150
Drain-source on-state resistance
18
20
mΩ
VGS(th)
IGSS
IDSS
rg
Gate-source threshold voltage
Gate to Source Leakage Current
Zero Gate Voltage Drain Current
Internal gate resistance
VGS = VDS
0,01
25
25
25
2,7
5,6
V
22
-4
100
0
nA
µA
ꢀ
-100
0
1200
10
7
107
22
Qg
Gate charge
QGS
QGD
Ciss
Coss
Crss
Gate to source charge
18
600
800
20
25
25
nC
pF
Gate to drain charge
41
Short-circuit input capacitance
Short-circuit output capacitance
Reverse transfer capacitance
1337
76
f = 1 MHz
0
27
Reverse Diode Static
Forward voltage
0
20
25
3,20
1,31
V
Vsd
Thermal
phase-change
material
λ = 3,4 W/mK
Rth(j-s)
Thermal resistance junction to sink
K/W
Boost Diode
Static
25
1,4
1,8
1,9
1,6
Forward voltage
VF
Ir
30
125
150
V
Reverse leakage current
1200
25
600
µA
Thermal
phase-change
material
λ = 3,4 W/mK
Rth(j-s)
Thermal resistance junction to sink
0,76
K/W
Copyright Vincotech
3
25 Apr. 2016 / Revision 1
10-FY12B2A040MR02-L387L63
target datasheet
Characteristic Values
Parameter
Symbol
Conditions
Value
Typ
Unit
VGE [V] VCE [V] IC [A]
VGS [V] VDS [V] ID [A]
Tj [°C]
Min
Max
Rectifier Diode
Static
25
1,22
1,48
1,8
VF
Ir
Forward voltage
50
V
125
25
50
Reverse leakage current
1600
µA
150
1100
Thermal
phase-change
material
λ = 3,4 W/mK
Rth(j-s)
Thermal resistance junction to sink
0,82
K/W
DC Link Capacitance
Capacitance
C
78
nF
%
Tolerance
-10
+10
Climatic category
55/125/56
Thermistor
R
ΔR/R
P
Rated resistance
25
100
25
25
25
25
22
kΩ
%
Deviation of R100
Power dissipation
Power dissipation constant
B-value
R100 = 1484 Ω
-5
5
5
mW
mW/K
K
1,5
B(25/50)
Tol. ±1 %
Tol. ±1 %
3962
4000
B(25/100)
B-value
K
Vincotech NTC Reference
I
Copyright Vincotech
4
25 Apr. 2016 / Revision 1
10-FY12B2A040MR02-L387L63
target datasheet
Ordering Code & Marking
Version
Ordering Code
without thermal paste with solder pins 12mm housing
10-FY12B2A040MR02-L387L63
Name
Date code
WWYY
UL & VIN
UL VIN
Lot
Serial
NN-NNNNNNNNNNNNNN
TTTTTTVV WWYY UL
VIN LLLLL SSSS
Text
NN-NNNNNNNNNNNNNN-TTTTTTVV
LLLLL
SSSS
Type&Ver
Lot number
Serial
Date code
WWYY
Datamatrix
TTTTTTTVV
LLLLL
SSSS
Outline
Pin table [mm]
Pin table [mm]
Pin
1
X
Y
0
0
Function
Boost2
Boost2
Pin
28
29
30
31
32
X
Y
23,5
20,5
9
Function
DC-
52,2
49,2
52,2
52,2
52,2
52,2
2
DC-
3
not assembled
DC+
4
34,7
0
DC+In2
6
DC+
5
not assembled
not assembled
6
31,7
20,5
17,5
0
0
0
DC+In2
7
DC+In1
DC+In1
8
9
not assembled
not assembled
10
11
12
13
14
15
16
17
18
19
3
0
0
0
Boost1
Boost1
not assembled
0
0
0
0
6
DC+
9
DC+
DC-
DC-
20,5
23,5
not assembled
8,1
28,2
28,2
G1
E1
20
21
22
23
24
25
26
27
11,1
not assembled
23,55
28,65
28,2
28,2
NTC1
NTC2
not assembled
41,1
44,1
28,2
28,2
E2
G2
not assembled
Copyright Vincotech
5
25 Apr. 2016 / Revision 1
10-FY12B2A040MR02-L387L63
target datasheet
Pinout
Identification
ID
Component
MOSFET
FWD
Voltage
1200 V
1200 V
1600 V
1500 V
Current
Function
Comment
T1, T2
D1, D2
D3, D4
C1, C2
NTC
40 mΩ
30 A
Boost Switch
Boost Diode
FWD
50 A
Rectifier Diode
DC Link Capacitance
Thermistor
Capacitor
Thermistor
Copyright Vincotech
6
25 Apr. 2016 / Revision 1
10-FY12B2A040MR02-L387L63
target datasheet
Packaging instruction
Handling instruction
Standard packaging quantity (SPQ) 100
>SPQ
Standard
<SPQ
Sample
Handling instructions for flow 1 packages see vincotech.com website.
Package data
Package data for flow 1 packages see vincotech.com website.
UL recognition and file number
This device is certified according to UL 1557 standard, UL file number E192116. For more information see vincotech.com website.
Document No.:
Date:
Modification:
Pages
10-FY12B2A040MR02-L387L63-T1-14
25 Apr. 2016
Product status definition
Datasheet Status
Product Status
Definition
This datasheet contains the design specifications for product development.
Specifications may change in any manner without notice. The data contained is
exclusively intended for technically trained staff.
Target
Formative or In Design
DISCLAIMER
The information, specifications, procedures, methods and recommendations herein (together “information”) are presented by Vincotech to
reader in good faith, are believed to be accurate and reliable, but may well be incomplete and/or not applicable to all conditions or situations
that may exist or occur. Vincotech reserves the right to make any changes without further notice to any products to improve reliability,
function or design. No representation, guarantee or warranty is made to reader as to the accuracy, reliability or completeness of said
information or that the application or use of any of the same will avoid hazards, accidents, losses, damages or injury of any kind to persons
or property or that the same will not infringe third parties rights or give desired results. It is reader’s sole responsibility to test and determine
the suitability of the information and the product for reader’s intended use.
LIFE SUPPORT POLICY
Vincotech products are not authorised for use as critical components in life support devices or systems without the express written approval
of Vincotech.
As used herein:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or
sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in labelling can be
reasonably expected to result in significant injury to the user.
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause
the failure of the life support device or system, or to affect its safety or effectiveness.
Copyright Vincotech
7
25 Apr. 2016 / Revision 1
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