VIV015MHJ [VICOR]
DC-DC Regulated Power Supply Module, 1 Output, Hybrid, ROHS COMPLIANT PACKAGE-28;型号: | VIV015MHJ |
厂家: | VICOR CORPORATION |
描述: | DC-DC Regulated Power Supply Module, 1 Output, Hybrid, ROHS COMPLIANT PACKAGE-28 |
文件: | 总16页 (文件大小:1736K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
®
VIV0105THJ
C
US
S
C
NRTL US
TM
VTM
Transformer
FEATURES
DESCRIPTION
• 40 Vdc to 5 Vdc 20 A transformer
The V I ChipTM transformer is a high efficiency (>94%) Sine
•
TM
- Operating from standard 48 V or 24 V PRM regulators
Amplitude ConverterTM (SACTM) operating from a 26 to 48 Vdc
primary bus to deliver an isolated output. The Sine Amplitude
Converter offers a low AC impedance beyond the bandwidth of
most downstream regulators, which means that capacitance
normally at the load can be located at the input to the Sine
Amplitude Converter. Since the K factor of the VIV0105THJ is
1/8, that capacitance value can be reduced by a factor of 64,
resulting in savings of board area, materials and total system
cost.
• High efficiency (>94%) reduces system power
consumption
• High density (133 A/in3)
•
• “Half Chip” V I Chip package enables surface mount,
low impedance interconnect to system board
• Contains built-in protection features:
- Overvoltage Lockout
- Overcurrent
•
The VIV0105THJ is provided in a V I Chip package compatible
with standard pick-and-place and surface mount assembly
- Short Circuit
- Over Temperature
•
processes. The co-molded V I Chip package provides enhanced
thermal management due to large thermal interface area and
superior thermal conductivity. With high conversion efficiency
the VIV0105THJ increases overall system efficiency and lowers
operating costs compared to conventional approaches.
The VIV0105THJ enables the utilization of Factorized Power
ArchitectureTM providing efficiency and size benefits by lowering
conversion and distribution losses and promoting high density
point of load conversion.
• Provides enable / disable control, internal temperature
monitoring, current monitoring
• ZVS / ZCS resonant Sine Amplitude Converter topology
• Less than 50ºC temperature rise at full load
in typical applications
TYPICAL APPLICATIONS
• High End Computing Systems
• Automated Test Equipment
• High Density Power Supplies
• Communications Systems
• 0
(NOM)
VIN = 26 to 48 V
OUT = 3.3 to 6.0 V
IOUT = 20 A
K= 1/8
(NO LOAD)
V
PART NUMBER
VIV0105THJ
DESCRIPTION
-40°C to 125°C TJ
TJ
VIV015MHJ
-55°C TO 125°C
Regulator
Voltage Transformer
VC
IM
TM
PC
VC
PR
SG
OS
CD
PC
TM
IL
L
O
A
D
VTM
PRM
+Out
+Out
+In
+In
VIN
-Out
-Out
-In
-In
Factorized Power Architecture
(See Application Note AN:024)
Rev. 2.0
2/10
V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
Page 1 of 16
vicorpower.com
VIV0105THJ
PRELIMINARY DATASHEET
1.0 ABSOLUTE MAXIMUM VOLTAGE RATINGS
The absolute maximum ratings below are stress ratings only. Operation at or beyond these maximum ratings can cause permanent
damage to the device.
MIN
+ IN to - IN . . . . . . . . . . . . . . . . . . . . . . . -1.0
PC to - IN . . . . . . . . . . . . . . . . . . . . . . . . -0.3
TM to -IN . . . . . . . . . . . . . . . . . . . . . . . . -0.3
VC to - IN . . . . . . . . . . . . . . . . . . . . . . . . -0.3
MAX
53
UNIT
VDC
VDC
VDC
VDC
MIN
MAX
3.15
2250
60
UNIT
VDC
VDC
VDC
VDC
IM to - IN.................................................
+ IN / - IN to + OUT / - OUT (hipot)........
+ IN / - IN to + OUT / - OUT (working)...
0
20
7
20
+ OUT to - OUT....................................... -1.0
10
2.0 ELECTRICAL CHARACTERISTICS
Specifications apply over all line and load conditions unless otherwise noted; Boldface specifications apply over the temperature
range of -40°C < TJ < 125°C (T-Grade); All other specifications are at TJ = 25ºC unless otherwise noted.
ATTRIBUTE
Input Voltage Range
SYMBOL
CONDITIONS / NOTES
No external VC applied
MIN
TYP
MAX
UNIT
26
0
48
48
1
VIN
VDC
V/µs
V
VC applied
VIN Slew Rate
dVIN /dt
VIN_UV
Module latched shutdown,
No external VC applied, IOUT = 20A
VIN = 42.4 V
VIN = 26 V to 48 V
VIN = 42.4 V, TC = 25ºC
VIN = 26 V to 48 V, TC = 25ºC
VIN UV Turn Off
22
26.0
1.5
3.0
3.6
2.7
3
No Load Power Dissipation
Inrush Current Peak
PNL
W
A
2.1
4.8
1/8
VC enable, VIN = 42.4 V COUT = 2000 µF,
RLOAD = 252 mΩ
IINRP
12
DC Input Current
Transfer Ratio
Output Voltage
IIN_DC
K
VOUT
2.7
A
V/V
V
K = VOUT/VIN, IOUT = 0 A
VOUT = VIN • K - IOUT • ROUT, Section 11
Output Current (Average)
Output Current (Peak)
Output Power (Average)
IOUT_AVG
IOUT_PK
POUT_AVG
20
30
132
A
A
W
TPEAK < 10 ms, IOUT_AVG ≤ 20 A
IOUT_AVG ≤ 20 A
VIN = 42.4 V, IOUT = 20 A
VIN = 26 V to 48 V, IOUT = 20 A
VIN = 42.4 V, IOUT = 10 A
92.0
88.5
92.6
91.0
93.0
Efficiency (Ambient)
Efficiency (Hot)
ηAMB
%
%
93.7
92.3
ηHOT
η20%
ROUT_COLD
ROUT_AMB
ROUT_HOT
FSW
VIN = 42.4 V, TC = 100°C, IOUT = 20 A
Efficiency (Over Load Range)
Output Resistance (Cold)
Output Resistance (Ambient)
Output Resistance (Hot)
Switching Frequency
4 A < IOUT < 20 A
85.0
8.0
10.5
12.5
1.60
3.20
%
TC = -40°C, IOUT = 20 A
TC = 25°C, IOUT = 20 A
TC = 100°C, IOUT = 20 A
10.5
12.6
14.8
1.75
3.50
13.5
15.5
17.5
1.90
3.80
mΩ
mΩ
mΩ
MHz
MHz
Output Ripple Frequency
FSW_RP
COUT = 0 F, IOUT = 20 A, VIN = 42.4 V,
20 MHz BW, Section 12
Frequency up to 30 MHz,
Simulated J-lead model
VOUT = 5 V
Output Voltage Ripple
VOUT_PP
135
350
mV
Output Inductance (Parasitic)
Output Capacitance (Internal)
Output Capacitance (External)
LOUT_PAR
COUT_INT
COUT_EXT
600
68
pH
µF
µF
VTM Standalone Operation
VIN pre-applied, VC enable
2000
PROTECTION
OVLO
Overvoltage Lockout
Response Time
Output Overcurrent Trip
Short Circuit Protection Trip Current
Output Overcurrent Response
Time Constant
VIN_OVLO+
TOVLO
IOCP
ISCP
Module latched shutdown
Effective internal RC filter
48.6
50.8
2.7
42
53
60
V
µs
20.2
30
A
A
TOCP
Effective internal RC filter (Integrative).
5.7
ms
From detection to cessation
of switching (Instantaneous)
Short Circuit Protection Response Time
Thermal Shutdown Setpoint
TSCP
1
µs
ºC
TJ_OTP
125
130
135
Rev. 2.0
2/10
Page 2 of 16
V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
vicorpower.com
VIV0105THJ
PRELIMINARY DATASHEET
3.0 SIGNAL CHARACTERISTICS
Specifications apply over all line and load conditions unless otherwise noted; Boldface specifications apply over the temperature
range of -40°C < TJ < 125°C (T-Grade); All other specifications are at TJ = 25°C unless otherwise noted.
VTM CONTROL : VC
•
•
Used to wake up powertrain circuit.
A minimum of 12 V must be applied indefinitely for VIN < 26 V
to ensure normal operation.
•
•
PRM VC can be used as valid wake-up signal source.
VC voltage may be continuously applied;
there will be minimal VC current drawn when VIN > 26 V and VC < 13.
Internal resistance used in adaptive loop compensation
•
VC slew rate must be within range for a succesful start.
•
SIGNAL TYPE
STATE
ATTRIBUTE
SYMBOL
CONDITIONS / NOTES
MIN TYP MAX UNIT
Required for startup, and operation
below 26 V. See Section 7.
Low VC current draw for VIN >26 V
VC = 13 V, VIN = 0 V
External VC Voltage
VVC_EXT
VVC_TH
12
16.5
150
V
V
VC Current Draw Threshold
13
90
6
Steady
VC Current Draw
IVC
VC = 13 V, VIN > 26 V
mA
VC = 16.5 V, VIN > 26 V
70
VC Internal Resistor
VC Slew Rate
RVC-INT
dVC/dt
IINR_VC
TON
4.64
kΩ
0.25 V/µs
Required for proper startup;
0.02
ANALOG
INPUT
Start Up
VC Inrush Current
VC Output Turn-On Delay
VC = 16.5 V, dVC/dt = 0.25 V/µs
VIN pre-applied, PC floating, VC enable
CPC = 0 µF, COUT = 2000 µF
750
500
mA
µs
Transitional
VC = 12 V to PC high, VIN = 0 V,
dVC/dt = 0.25 V/µs
VC to PC Delay
TVC_PC
10
25
µs
µF
Internal VC Capacitance
CVC_INT
VC = 0 V
2.2
PRIMARY CONTROL : PC
•
•
•
The PC pin enables and disables the VTM.
When held below 2 V, the VTM will be disabled.
PC pin outputs 5 V during normal operation. PC pin is equal to 2.5 V
during fault mode given VIN > 26 V and VC > 12 V.
After successful start-up and under no fault condition, PC can be used as
a 5 V regulated voltage source with a 2 mA maximum current.
•
Module will shutdown when pulled low with an impedance
less than 400 Ω.
•
•
In an array of VTMs, connect PC pin to synchronize startup.
PC pin cannot sink current and will not disable other module
during fault mode.
SIGNAL TYPE
STATE
ATTRIBUTE
PC Voltage
PC Source Current
PC Resistance (Internal)
PC Source Current
PC Capacitance (Internal)
PC Resistance (External)
PC Voltage (Enable)
PC Voltage (Disable)
PC Pull Down Current
PC Disable Time
SYMBOL
CONDITIONS / NOTES
MIN TYP MAX UNIT
VPC
IPC_OP
RPC_INT
IPC_EN
CPC_INT
RPC_EXT
VPC_EN
VPC_DIS
IPC_PD
4.7
5.0
5.3
2
400
300
50
V
mA
kΩ
µA
pF
kΩ
V
Steady
ANALOG
OUTPUT
Internal pull down resistor
50
50
150
100
Start Up
Section 7
60
2
Enable
Disable
2.5
3
2
V
DIGITAL
INPUT / OUPUT
5.1
mA
µs
TPC_DIS_T
TFR_PC
4
Transitional
PC Fault Response Time
From fault to PC = 2 V
100
µs
TEMPERATURE MONITOR : TM
•
•
The TM pin monitors the internal temperature of the VTM controller IC
within an accuracy of 5°C.
Can be used as a "Power Good" flag to verify that the VTM is operating.
•
The TM pin has a room temperature setpoint of 3 V (@27°C)
and approximate gain of 10 mV/°C.
SIGNAL TYPE
STATE
ATTRIBUTE
TM Voltage
SYMBOL
CONDITIONS / NOTES
MIN TYP MAX UNIT
VTM_AMB TJ controller = 27°C
2.95 3.00 3.05
V
TM Source Current
TM Gain
ITM
ATM
100
µA
mV/°C
ANALOG
OUTPUT
Steady
10
CTM = 0 F, VIN = 42.4 V,
IOUT = 20 A
TM Voltage Ripple
VTM_PP
120
200
mV
Disable
TM Voltage
VTM_DIS
0
40
V
kΩ
pF
µs
TM Resistance (Internal)
TM Capacitance (External)
TM Fault Response Time
RTM_INT
CTM_EXT
TFR_TM
Internal pull down resistor
From fault to TM = 1.5 V
25
50
50
DIGITAL OUTPUT
(FAULT FLAG)
Transitional
10
Rev. 2.0
2/10
V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
Page 3 of 16
vicorpower.com
VIV0105THJ
PRELIMINARY DATASHEET
3.0 SIGNAL CHARACTERISTICS (CONT.)
Specifications apply over all line and load conditions unless otherwise noted; Boldface specifications apply over the temperature
range of -40°C < TJ < 125°C (T-Grade); All other specifications are at TJ = 25°C unless otherwise noted.
CURRENT MONITOR : IM
•
The nominal IM pin voltage varies between 0.11 V and 1.47 V
representing the output current within 25% under all operating line
temperature conditions between 50% and 100%.
•
The IM pin provides a DC analog voltage proportional to
the output current of the VTM.
SIGNAL TYPE
STATE
ATTRIBUTE
SYMBOL
CONDITIONS / NOTES
TC = 25ºC, VIN = 42.4 V, IOUT = 0 A
MIN TYP MAX UNIT
IM Voltage (No Load)
IM Voltage (50%)
IM Voltage (Full Load)
IM Gain
VIM_NL
0.04 0.11 0.25
V
V
V
VIM_50% TC = 25ºC, VIN = 42.4 V, IOUT = 10 A
VIM_FL
AIM
0.68
1.47
ANALOG
OUTPUT
Steady
TC = 25ºC, VIN = 42.4 V, IOUT = 20 A
TC = 25ºC, VIN = 42.4 V, IOUT > 10 A
80
mV/A
MΩ
IM Resistance (External)
RIM_EXT
2.5
4.0 TIMING DIAGRAM
6
7
IOUT
ISSP
IOCP
8
d
1
2
3
4
5
VC
b
VVC-EXT
a
VOVLO
VIN
NL
≥ 26 V
c
e
f
VOUT
TM
VTM-AMB
PC
g
5 V
3 V
a: VC slew rate (dVC/dt)
b: Minimum VC pulse rate
c: TOVLO
1. Initiated VC pulse
2. Controller start
3. VIN ramp up
Notes:
– Timing and voltage is not to scale
– Error pulse width is load dependent
d: TOCP
4. VIN = VOVLO
5. VIN ramp down no VC pulse
e: Output turn on delay (TON
)
f: PC disable time (TPC-DIS
)
6. Overcurrent
g: VC to PC delay (TVC-PC
)
7. Start up on short circuit
8. PC driven low
Rev. 2.0
2/10
V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
Page 4 of 16
vicorpower.com
VIV0105THJ
5.0 APPLICATION CHARACTERISTICS
The following values, typical of an application environment, are collected at TC = 25ºC unless otherwise noted. See associated figures
for general trend data.
ATTRIBUTE
SYMBOL
CONDITIONS / NOTES
TYP
UNIT
No Load Power Dissipation
Efficiency (Ambient)
Efficiency (Hot)
Output Resistance (Ambient)
Output Resistance (Hot)
Output Resistance (Cold)
PNL
ηAMB
VIN = 40 V
VIN = 40 V, IOUT = 20 A
2.0
W
%
%
92.7
91.5
13.1
15.7
10.7
ηHOT
VIN = 40 V, IOUT = 20 A, TC = 100ºC
VIN = 40 V, IOUT = 20 A
VIN = 40 V, IOUT = 20 A, TC = 100ºC
VIN = 40 V, IOUT = 20 A, TC = -40ºC
COUT = 0 F, IOUT = 20 A, VIN = 42.4 V,
20 MHz BW, Section 12
IOUT_STEP = 0 A TO 20A, VIN = 42.4 V,
ISLEW > 10 A/us
IOUT_STEP = 20 A to 0 A, VIN = 42.4 V
ISLEW > 10 A/us
ROUT_AMB
ROUT_HOT
ROUT_COLD
mΩ
mΩ
mΩ
mV
mV
mV
Output Voltage Ripple
VOUT Transient (Positive)
VOUT Transient (Negative)
VOUT_PP
253
200
200
VOUT_TRAN+
VOUT_TRAN-
Full Load Efficiency vs. Case Temperature
No Load Power Dissipation vs. Line
3.5
3
96
94
92
90
88
86
2.5
2
1.5
1
26
28
31
33
Input Voltage (V)
-40°C 25°C
36
38
41
43
46
48
-40
-20
0
20
40
60
80
100
Case Temperature (°C)
26 V
V
:
40 V
48 V
TCASE
:
100°C
IN
Figure 1 – No load power dissipation vs. VIN
Figure 2 – Full load efficiency vs. temperature
Efficiency & Power Dissipation -40°C Case
Efficiency & Power Dissipation 25°C Case
96
92
88
84
80
76
72
68
14
12
10
8
96
92
88
84
80
76
72
68
14
12
10
8
η
η
6
6
PD
PD
4
4
2
2
0
0
0
2
4
6
8
10
12
14
16
18
20
0
2
4
6
8
10
12
14
16
18
20
Output Current (A)
Output Current (A)
26 V
40 V
48 V
26 V
40 V
48 V
VIN:
26 V
40 V
48 V
26 V
40 V
48 V
VIN:
Figure 3 – Efficiency and power dissipation at –40°C
Figure 4 – Efficiency and power dissipation at 25°C
Rev. 2.0
2/10
V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
Page 5 of 16
vicorpower.com
VIV0105THJ
PRELIMINARY DATASHEET
Efficiency & Power Dissipation 100°C Case
ROUT vs. TCASE at VIN = 40 V
96
14
16
15
14
92
88
84
80
76
72
68
12
10
η
13
12
11
10
9
8
6
4
2
0
PD
8
0
2
4
6
8
10
12
14
16
18
20
-40
-20
0
20
Case Temperature (°C)
IOUT
40
60
80
100
Output Current (A)
26 V
40 V
48 V
26 V
40 V
48 V
VIN
:
:
10 A
20 A
Figure 5 – Efficiency and power dissipation at 100°C
Figure 6 – ROUT vs. temperature
Ripple vs. Load
IM Voltage vs. Load 40 VIN
275
2
1.75
1.5
1.25
1
250
225
200
175
150
125
100
0.75
0.5
0.25
0
0
2
4
6
8
10
12
14
16
18
20
0
2
4
6
8
10
12
14
16
18
20
Load Current (A)
Load Current (A)
TCASE
:
-40°C
25°C
100°C
Vpk-pk (mV)
Figure 7 – VRIPPLE vs. IOUT ; No external COUT.
Board mounted module, scope setting : 20 MHz analog BW
Figure 8 – IM voltage vs. load
Full Load IM Voltage vs. TCASE & Line
IM Voltage vs. Load 25°C Case
1.75
2
1.75
1.5
1.5
1.25
1
0.75
0.5
0.25
0
1.25
1
0
2
4
6
8
10
Load Current (A)
26 V 40 V
12
14
16
18
20
-40
-20
:
0
20
Case Temperature (°C)
26 V 40 V
40
60
80
100
V
IN
:
48 V
V
IN
48 V
Figure 9 – IM voltage vs. load
Figure 10 – Full load IM voltage vs. TCASE
Rev. 2.0
2/10
Page 6 of 16
V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
vicorpower.com
VIV0105THJ
PRELIMINARY DATASHEET
Safe Operating Area
40
35
30
25
20
15
10
5
10 ms Max
Continuous
0
0
1
2
3
4
5
6
Output Voltage (V)
Figure 12 – Full load ripple, 100 µF CIN; No external COUT.
Board mounted module, scope setting : 20 MHz analog BW
Figure 11 – Safe operating area
Figure 13 –Start up from application of VIN; VC pre-applied
Figure 14 – Start up from application of VC; VIN pre-applied
COUT = 2000 µF
COUT = 2000 µF
Figure 15 – 0 A– 20 A transient response:
Figure 16 – 20 A – 0 A transient response:
CIN = 100 µF, no external COUT
CIN = 100 µF, no external COUT
Rev. 2.0
2/10
V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
Page 7 of 16
vicorpower.com
VIV0105THJ
PRELIMINARY DATASHEET
6.0 GENERAL CHARACTERISTICS
Specifications apply over all line and load conditions unless otherwise noted; Boldface specifications apply over the temperature
range of -40ºC < TJ < 125ºC (T-Grade); All Other specifications are at TJ = 25°C unless otherwise noted.
ATTRIBUTE
MECHANICAL
SYMBOL
CONDITIONS / NOTES
MIN
TYP
MAX
UNIT
Length
Width
Height
Volume
Weight
Lead Finish
L
W
H
Vol
W
21.7 / [0.85]
16.4 / [0.64]
6.48 / [0.255]
22.0 / [0.87]
16.5 / [0.65]
6.73 / [0.265]
2.44 / [0.150]
8.0 / 0.28
22.3 / [0.88]
16.6 / [0.66]
6.98 / [0.275] mm/[in]
mm/[in]
mm/[in]
No heat sink
cm3/[in3]
g/[oz]
2.03
0.15
Nickel
Palladium
Gold
0.51
0.02
0.003
µm
0.051
THERMAL
VIV0105THJ (T-Grade)
VIV015MHJ (M-Grade)
-40
-55
125
125
°C
°C
Ws/°C
Operating Temperature
Thermal Capacity
TJ
5
ASSEMBLY
Peak Compressive Force
Applied to Case (Z-axis)
Supported by J-lead only
2.5
3
lbs
VIV0105THJ (T-Grade)
VIV015MHJ (M-Grade)
Human Body Model,
-40
-65
125
125
°C
°C
Storage Temperature
TST
ESDHBM
ESDMM
1500
400
"JEDEC JESD 22-A114C.01"
ESD Withstand
VDC
Machine Model,
"JEDEC JESD 22-A115-A"
SOLDERING
MSL 5
MSL 6, TOB = 4hrs
225
245
150
3
°C
°C
s
°C/s
°C/s
Peak Temperature During Reflow
Peak Time Above 183°C
Peak Heating Rate During Reflow
Peak Cooling Rate Post Reflow
1.5
1.5
6
SAFETY
Working Voltage (IN – OUT)
Isolation Voltage (hipot)
Isolation Capacitance
Isolation Resistance
VIN_OUT
VHIPOT
CIN_OUT
RIN_OUT
60
VDC
VDC
pF
2250
1350
10
Unpowered Unit
1750
4.5
2150
MΩ
MHrs
MIL HDBK 217, 25ºC,
Ground Benign
cTUVus
MTBF
cURus
CE Mark
Agency Approvals / Standards
RoHS 6 of 6
Rev. 2.0
2/10
Page 8 of 16
V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
vicorpower.com
VIV0105THJ
PRELIMINARY DATASHEET
7.0 USING THE CONTROL SIGNALS VC, PC, TM, IM
Current Monitor (IM) pin provides a voltage proportional to
the output current of the VTM. The nominal voltage will vary
between 0.11 V and 1.47 V over the output current range of
the VTM (See Figures 8–10). The accuracy of the IM pin will be
within 25% under all line and temperature conditions between
50% and 100% load.
The VTM Control (VC) pin is an input pin which powers the
internal VCC circuitry when within the specified voltage range
of 12 V to 16.5 V. This voltage is required in order for the VTM
to start, and must be applied as long as the input is below
26 V. In order to ensure a proper start, the slew rate of the
applied voltage must be within the specified range.
8.0 STARTUP BEHAVIOR
Some additional notes on the using the VC pin:
Depending on the sequencing of the VC with respect to the
input voltage, the behavior during startup will vary as follows:
• In most applications, the VTM will be powered by an
upstream PRM which provides a 10 ms VC pulse during
startup. In these applications the VC pins of the PRM and
VTM should be tied together.
• Normal Operation (VC applied prior to VIN): In this case the
controller is active prior to ramping the input. When the
input voltage is applied, the VTM output voltage will track
the input (See Figure 13). The inrush current is determined by
the input voltage rate of rise and output capacitance. If the
VC voltage is removed prior to the input reaching 26 V, the
VTM may shut down.
• The VC voltage can be applied indefinitely allowing for
continuous operation down to 0 VIN.
• The fault response of the VTM is latching. A positive edge on
VC is required in order to restart the unit. If VC is
continuously applied the PC pin may be toggled to restart
the VTM.
• Stand Alone Operation (VC applied after VIN): In this case the
VTM output will begin to rise upon the application of the VC
voltage (See Figure 14). The Adaptive Soft Start circuit
(See Section 10) may vary the ouput rate of rise in order to
limit the inrush current to it’s maximum level. When starting
into high capacitance, or a short, the output current will be
limited for a maximum of 900 µsec. After this period, the
adaptive soft start circuit will time out and the VTM
may shut down. No restart will be attempted until VC is
re-applied, or PC is toggled. The maximum output
capacitance is limited to 2000 µF in this mode of operation
to ensure a sucessful start.
Primary Control (PC) pin can be used to accomplish the
following functions:
• Delayed start: Upon the application of VC, the PC pin will
source a constant 100 µA current to the internal RC
network. Adding an external capacitor will allow further
delay in reaching the 2.5 V threshold for module start.
• Auxiliary voltage source: Once enabled in regular
operational conditions (no fault), each VTM PC provides a
regulated 5 V, 2 mA voltage source.
• Output disable: PC pin can be actively pulled down in order
to disable the module. Pull down impedance shall be lower
than 400 Ω.
9.0 THERMAL CONSIDERATIONS
• Fault detection flag: The PC 5 V voltage source is internally
turned off as soon as a fault is detected. It is important to
notice that PC doesn’t have current sink capability. Therefore,
in an array, PC line will not be capable of disabling
neighboring modules if a fault is detected.
•
V I Chip products are multi-chip modules whose temperature
distribution varies greatly for each part number as well as with
the input / output conditions, thermal management and
environmental conditions. Maintaining the top of the
VIV0105THJ case to less than 100ºC will keep all junctions
•
within the V I Chip below 125ºC for most applications.
• Fault reset: PC may be toggled to restart the unit if VC
is continuously applied.
The percent of total heat dissipated through the top surface
versus through the J-lead is entirely dependent on the
particular mechanical and thermal environment. The heat
dissipated through the top surface is typically 60%. The heat
dissipated through the J-lead onto the PCB board surface is
typically 40%. Use 100% top surface dissipation when
designing for a conservative cooling solution.
Temperature Monitor (TM) pin provides a voltage
proportional to the absolute temperature of the converter
control IC.
It can be used to accomplish the following functions:
• Monitor the control IC temperature: The temperature in
Kelvin is equal to the voltage on the TM pin scaled
by 100. (i.e. 3.0 V = 300 K = 27ºC). If a heat sink is applied,
TM can be used to thermally protect the system.
•
It is not recommended to use a V I Chip for an extended
period of time at full load without proper heatsinking.
• Fault detection flag: The TM voltage source is internally
turned off as soon as a fault is detected. For system
monitoring purposes (microcontroller interface) faults are
detected on falling edges of TM signal.
Rev. 2.0
2/10
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VIV0105THJ
PRELIMINARY DATASHEET
10.0 VIV0105THJ VTM BLOCK DIAGRAM
Rev. 2.0
2/10
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11.0 SINE AMPLITUDE CONVERTER POINT OF LOAD CONVERSION
The Sine Amplitude Converter (SAC) uses a high frequency
resonant tank to move energy from input to output. (The
resonant tank is formed by Cr and leakage inductance Lr in the
power transformer windings as shown in the VTM Block
Diagram. See Section 10). The resonant LC tank, operated at
high frequency, is amplitude modulated as function of input
voltage and output current. A small amount of capacitance
embedded in the input and output stages of the module is
sufficient for full functionality and is key to achieving power
density.
The VIV0105THJ SAC can be simplified into the following
model:
305 pH
IOUT
ROUT
LIN = 3.7 nH
LOUT = 600 pH
R
L
12.6 mΩ
+
+
R
COUT
R
R
CIN
781 mΩ
1/8 • VIN
20 µΩ
V•I
K
6.36 mΩ
0.9 nF
1/8 • IOUT
+
–
C
+
–
C
68 µF
C
C
IN
OUT
V
V
IN
IQ
OUT
I
0.050 A
–
–
•
Figure 17 – V I Chip AC model
At no load:
ROUT = 0 Ω and IQ = 0 A, Eq. (3) now becomes Eq. (1) and is
essentially load independent. A resistor R is now placed in
series with VIN as shown in Figure 18.
•
VOUT = VIN
K
(1)
(2)
K represents the “turns ratio” of the SAC.
Rearranging Eq (1):
R
SAC
VOUT
+
–
VOUT
K =
K = 1/32
VIN
VIN
In the presence of load, VOUT is represented by:
Figure 18 – K = 1/32 Sine Amplitude Converter with series
input resistor
•
•
VOUT = VIN K – IOUT ROUT
(3)
(4)
The relationship between VIN and VOUT becomes:
and IOUT is represented by:
IIN – IQ
•
•
VOUT = (VIN – IIN R) K
(5)
IOUT
=
K
Substituting the simplified version of Eq. (4)
(IQ is assumed = 0 A) into Eq. (5) yields:
ROUT represents the impedance of the SAC, and is a function of
the RDSON of the input and output MOSFETs and the winding
resistance of the power transformer. IQ represents the
2
quiescent current of the SAC control and gate drive circuitry.
•
•
•
VOUT = VIN K – IOUT R K
(6)
The use of DC voltage transformation provides additional
interesting attributes. Assuming for the moment that
Rev. 2.0
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This is similar in form to Eq. (3), where ROUT is used to
represent the characteristic impedance of the SAC. However, in
this case a real R on the input side of the SAC is effectively
scaled by K2 with respect to the output.
Low impedance is a key requirement for powering a high
current, low voltage load efficiently. A switching regulation
stage should have minimal impedance, while simultaneously
providing appropriate filtering for any switched current. The
use of a SAC between the regulation stage and the point of
load provides a dual benefit, scaling down series impedance
leading back to the source and scaling up shunt capacitance
(or energy storage) as a function of its K factor squared.
However, these benefits are not useful if the series impedance
of the SAC is too high. The impedance of the SAC must be low
well beyond the crossover frequency of the system.
Assuming that R = 1 Ω, the effective R as seen from the secondary
side is 0.98 mΩ, with K = 1/32 as shown in Figure 18.
A similar exercise should be performed with the additon of a
capacitor, or shunt impedance, at the input to the SAC. A
switch in series with VIN is added to the circuit. This is depicted
in Figure 19.
A solution for keeping the impedance of the SAC low involves
switching at a high frequency. This enables magnetic
components to be small since magnetizing currents remain
low. Small magnetics mean small path lengths for turns. Use of
low loss core material at high frequencies reduces core losses
as well.
S
SAC
V
K = 1/32
+
–
OUT
C
VIN
The two main terms of power loss in the VTM module are:
- No load power dissipation (PNL): defined as the power
used to power up the module with an enabled power
train at no load.
Figure 19 – Sine Amplitude Converter with input capacitor
- Resistive loss (ROUT): refers to the power loss across
the VTM modeled as pure resistive impedance.
A change in VIN with the switch closed would result in a
change in capacitor current according to the following
equation:
PDISSIPATED = PNL + PROUT
Therefore,
(10)
dVIN
(7)
IC(t) = C
dt
POUT = PIN – PDISSIPATED = PIN – PNL – PROUT
(11)
Assume that with the capacitor charged to VIN, the switch is
opened and the capacitor is discharged through the idealized
SAC. In this case,
The above relations can be combined to calculate the overall
module efficiency:
POUT
PIN
PIN – PNL – PROUT
•
=
(12)
IC= IOUT
K
(8)
η =
PIN
Substituting Eq. (1) and (8) into Eq. (7) reveals:
2
•
•
VIN IIN – PNL – (IOUT
VIN • IIN
)
ROUT
•
C
K2
dVOUT
dt
=
(9)
IOUT
=
Writing the equation in terms of the output has yielded a K2
scaling factor for C, this time in the denominator of the
equation. For a K factor less than unity, this results in an
effectively larger capacitance on the output when expressed in
terms of the input. With a K=1/32 as shown in Figure 19,
C=1 µF would effectively appear as C=1024 µF when viewed
from the output.
2
•
PNL + (IOUT
)
ROUT
= 1 –
(
)
•
VIN IIN
Rev. 2.0
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PRELIMINARY DATASHEET
12.0 INPUT AND OUTPUT FILTER DESIGN
13.0 CAPACITIVE FILTERING CONSIDERATIONS
FOR A SINE AMPLITUDE CONVERTER
A major advantage of a SAC system versus a conventional
PWM converter is that the former does not require large
functional filters. The resonant LC tank, operated at extreme
high frequency, is amplitude modulated as a function of input
voltage and output current and efficiently transfers charge
through the isolation transformer. A small amount of
capacitance embedded in the input and output stages of the
module is sufficient for full functionality and is key to achieving
high power density.
It is important to consider the impact of adding input and
output capacitance to a Sine Amplitude Converter on the
system as a whole. Both the capacitance value, and the
effective impedance of the capacitor must be considered.
A Sine Amplitude Converter has a DC ROUT value which has
already been discussed in section 11. The AC ROUT of the SAC
contains several terms:
• Resonant tank impedance
This paradigm shift requires system design to carefully evaluate
external filters in order to:
• Input lead inductance and internal capacitance
• Output lead inductance and internal capacitance
1.Guarantee low source impedance.
To take full advantage of the VTM dynamic response, the
impedance presented to its input terminals must be low
from DC to approximately 5 MHz. Input capacitance may
be added to improve transient performance or compensate
for high source impedance.
The values of these terms are shown in the behavioral model in
section 11. It is important to note on which side of the
transformer these impedances appear and how they reflect
across the transformer given the K factor.
The overall AC impedance varies from model to model but for
most models it is dominated by DC ROUT value from DC to
beyond 500 KHz. The behavioral model in section 11 should be
used to approximate the AC impedance of the specific model.
2.Further reduce input and/or output voltage ripple without
sacrificing dynamic response.
Given the wide bandwidth of the VTM, the source
response is generally the limiting factor in the overall
system response. Anomalies in the response of the source
will appear at the output of the VTM multiplied by its
K factor.
Any capacitors placed at the output of the VTM reflect back to
the input of the VTM by the square of the K factor (Eq. 9) with
the impedance of the VTM appearing in series. It is very
important to keep this in mind when using a PRM to power
the VTM. Most PRMs have a limit on the maximum amount of
capacitance that can be applied to the output. This capacitance
includes both the PRM output capacitance and the VTM
output capacitance reflected back to the input. In PRM remote
sense applications, it is important to consider the reflected
value of VTM output capacitance when designing and
compensating the PRM control loop.
3.Protect the module from overvoltage transients imposed
by the system that would exceed maximum ratings and
cause failures.
•
The V I Chip input/output voltage ranges must not be
exceeded. An internal overvoltage lockout function
prevents operation outside of the normal operating input
range. Even during this condition, the powertrain is
exposed to the applied voltage and power MOSFETs must
withstand it.
Capacitance placed at the input of the VTM appear to the load
reflected by the K factor, with the impedance of the VTM in
series. In step-down VTM ratios, the effective capacitance is
increased by the K factor. The effective ESR of the capacitor is
decreased by the square of the K factor, but the impedance of
the VTM appears in series. Still, in most step-down VTMs an
electrolytic capacitor placed at the input of the VTM will have a
lower effective impedance compared to an electrolytic
capacitor placed at the output. This is important to consider
when placing capacitors at the output of the VTM. Even
though the capacitor may be placed at the output, the majority
of the AC current will be sourced from the lower impedance,
which in most cases will be the VTM. This should be studied
carefully in any system design using a VTM. In most cases, it
should be clear that electrolytic output capacitors are not
necessary to design a stable, well-bypassed system.
Rev. 2.0
2/10
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14.0 CURRENT SHARING
16.0 REVERSE OPERATION
The SAC topology bases its performance on efficient transfer
of energy through a transformer without the need of closed
loop control. For this reason, the transfer characteristic can be
approximated by an ideal transformer with some resistive drop
and positive temperature coefficient.
The VIV0105THJ is capable of reverse operation. If a voltage is
present at the output which satisfies the condition
VOUT > VIN • K at the time the VC voltage is applied, or after the
unit has started, then energy will be transferred from
secondary to primary. The input to output ratio will be
maintained. The VIV0105THJ will continue to operate in
reverse as long as the input and output are within the specified
limits. The VIV0105THJ has not been qualified for continuous
operation (>10 ms) in the reverse direction.
This type of characteristic is close to the impedance
characteristic of a DC power distribution system, both in
behavior (AC dynamic) and absolute value (DC dynamic).
When connected in an array with the same K factor, the VTM
module will inherently share the load current with parallel
units, according to the equivalent impedance divider that the
system implements from the power source to the point of load.
Some general recommendations to achieve matched array
impedances:
• Dedicate common copper planes within the PCB
to deliver and return the current to the modules.
• Provide the PCB layout as symmetric as possible.
• Apply same input / output filters (if present) to each unit.
For further details see AN:016 Using BCM™ Bus Converters
in High Power Arrays.
ZIN_EQ1
ZOUT_EQ1
VIN
VOUT
VTM1
RO_1
ZIN_EQ2
ZOUT_EQ2
VTM2
RO_2
+
–
Load
DC
ZIN_EQn
ZOUT_EQn
VTMn
RO_n
Figure 20 – VTM array
15.0 FUSE SELECTION
In order to provide flexibility in configuring power systems
V•I Chip products are not internally fused. Input line fusing of
V•I Chip products is recommended at system level to provide
thermal protection in case of catastrophic failure.
The fuse shall be selected by closely matching system
requirements with the following characteristics:
• Current rating (usually greater than maximum VTM current)
• Maximum voltage rating (usually greater than the maximum
possible input voltage)
• Ambient temperature
• Nominal melting I2t
Rev. 2.0
2/10
Page 14 of 16
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VIV0105THJ
PRELIMINARY DATASHEET
17.1 MECHANICAL DRAWING
mm
(inch)
17.2 RECOMMENDED LAND PATTERN
4
3
2
1
A
B
C
D
+In
+Out
-Out
IM
E
F
TM
VC
PC
-In
J
K
L
G
H
M
Bottom View
Signal
Name
+In
–In
Designation
A1-B1, A2-B2
L1-M1, L2-M2
E1
IM
TM
F2
VC
G1
PC
H2
+Out
–Out
A3-D3, A4-D4
J3-M3, J4-M4
17.3 RECOMMENDED LAND PATTERN FOR PUSH PIN HEATSINK
Notes:
1. Maintain 3.50 (0.138) Dia. keep-out zone
free of copper, all PCB layers.
2. (A) minimum recommended pitch is 24.00 (0.945)
this provides 7.50 (0.295) component
edge–to–edge spacing, and 0.50 (0.020)
clearance between Vicor heat sinks.
(B) Minimum recommended pith is 25.50 (1.004).
This provides 9.00 (0.354) component
edge–to–edge spacing, and 2.00 (0.079)
clearence between Vicor heat sinks.
3. V•I Chip land pattern shown for reference
only, actual land pattern may differ.
Dimensions from edges of land pattern
to push–pin holes will be the same for
all half size V•I Chip Products.
4. RoHS complient per CST–0001 latest revision.
5. Unless otherwise specified:
Dimensions are mm (inches)
tolerances are:
x.x (x.xx) = 0.13 (0.01)
x.xx (x.xxx) = 0.13 (0.005)
6. Plated through holes for grounding clips (33855)
shown for reference, Heatsink orientation and
device pitch will dictate final grounding solution.
(NO GROUNDING CLIPS)
(WITH GROUNDING CLIPS)
Rev. 2.0
2/10
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PRELIMINARY DATASHEET
Warranty
Vicor products are guaranteed for two years from date of shipment against defects in material or workmanship when in
normal use and service. This warranty does not extend to products subjected to misuse, accident, or improper
application or maintenance. Vicor shall not be liable for collateral or consequential damage. This warranty is extended to
the original purchaser only.
EXCEPT FOR THE FOREGOING EXPRESS WARRANTY, VICOR MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING,
BUT NOT LIMITED TO, THE WARRANTY OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE.
Vicor will repair or replace defective products in accordance with its own best judgement. For service under this
warranty, the buyer must contact Vicor to obtain a Return Material Authorization (RMA) number and shipping
instructions. Products returned without prior authorization will be returned to the buyer. The buyer will pay all charges
incurred in returning the product to the factory. Vicor will pay all reshipment charges if the product was defective within
the terms of this warranty.
Information published by Vicor has been carefully checked and is believed to be accurate; however, no responsibility is
assumed for inaccuracies. Vicor reserves the right to make changes to any products without further notice to improve
reliability, function, or design. Vicor does not assume any liability arising out of the application or use of any product or
circuit; neither does it convey any license under its patent rights nor the rights of others. Vicor general policy does not
recommend the use of its components in life support applications wherein a failure or malfunction may directly threaten
life or injury. Per Vicor Terms and Conditions of Sale, the user of Vicor components in life support applications assumes
all risks of such use and indemnifies Vicor against all damages.
Vicor’s comprehensive line of power solutions includes high density AC-DC
and DC-DC modules and accessory components, fully configurable AC-DC
and DC-DC power supplies, and complete custom power systems.
Information furnished by Vicor is believed to be accurate and reliable. However, no responsibility is assumed by Vicor for
its use. Vicor components are not designed to be used in applications, such as life support systems, wherein a failure or
malfunction could result in injury or death. All sales are subject to Vicor’s Terms and Conditions of Sale, which are
available upon request.
Specifications are subject to change without notice.
Intellectual Property Notice
Vicor and its subsidiaries own Intellectual Property (including issued U.S. and Foreign Patents and pending patent
applications) relating to the products described in this data sheet. Interested parties should contact Vicor's
Intellectual Property Department.
The products described on this data sheet are protected by the following U.S. Patents Numbers:
5,945,130; 6,403,009; 6,710,257; 6,911,848; 6,930,893; 6,934,166; 6,940,013; 6,969,909; 7,038,917;
7,145,186; 7,166,898; 7,187,263; 7,202,646; 7,361,844; D496,906; D505,114; D506,438; D509,472; and for
use under 6,975,098 and 6,984,965.
Vicor Corporation
25 Frontage Road
Andover, MA, USA 01810
Tel: 800-735-6200
Fax: 978-475-6715
email
Customer Service: custserv@vicorpower.com
Technical Support: apps@vicorpower.com
Rev. 2.0
2/10
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