URAM3HN3 [VICOR]
Output Ripple Attenuation Module; 输出纹波衰减模块
| 型号： | URAM3HN3 |
| 厂家： | 
VICOR CORPORATION |
| 描述： | Output Ripple Attenuation Module |
| 文件： | 总8页 (文件大小：1184K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PRELIMINARY
Data Sheet
TM
45
MicroRAM
Output Ripple Attenuation Module
Features
• >40dB ripple attenuation from
60Hz to 1MHz
Patents Pending
• Integrated OR’ing diode supports
N+1 redundancy
• Significantly improves load
transient response
• Efficiency up to 98%
• User selectable performance optimization
• Combined active and passive filtering
• 3-30Vdc input range
Shown actual size:
2.28 x 1.45 x 0.5 in
57,9 x 36,8 x 12,7 mm
• 20 and 30 Ampere ratings
Product Highlights
Vicor’s MicroRAM output ripple attenuation
module combines both active and passive
filtering to achieve greater than 40dB of
noise attenuation from 60Hz to 1Mhz. The
MicroRAM operates over a range of 3 to
30Vdc, is available in either 20 or 30A
models and is compatible with most
manufacturers switching converters
including Vicor’s 1st and 2nd Generation
DC-DC converters.
Absolute Maximum Ratings
Parameter
+In to –In
+In to –In
Load current
Ripple Input (Vp-p)
Ripple Input (Vp-p)
Mounting torque
Pin soldering temperature
Pin soldering temperature
Storage temperature (C, T-Grade)
Storage temperature (H-Grade)
Storage temperature (M-Grade)
Operating temperature (C-Grade)
Operating temperature (T, H-Grade)
Operating temperature (M-Grade)
Rating
30
40
40
100
500
Unit
Vdc
Vdc
Adc
mV
Notes
Continuous
100ms
Continuous
60Hzc100 kHz
100kHz–2MHz
6 each, 4-40 screw
5 sec; wave solder
7 sec; wave solder
mV
4-6 (0.45-0.68) In. lbs (Nm)
500 (260)
750 (390)
-40 to +125
-55 to +125
-65 to +125
-20 to +100
-40 to +100
-55 to +100
°F (°C)
°F (°C)
°C
°C
°C
°C
°C
°C
The MicroRAM’s closed loop architecture
greatly improves load transient response and
with dual mode control, insures precise point
of load voltage regulation, The MicroRAM
supports redundant and parallel operation
with its integrated OR’ing diode function.
Baseplate
Baseplate
Baseplate
Thermal Resistance
It is available in Vicor’s standard micro
package (quarter brick) with a variety of
terminations for through hole, socket or
surface mount applications.
Parameter
Typ
0.16
0.14
8.0
Unit
Baseplate to sink; flat, greased surface
Baseplate to sink; with thermal pad (P/N 20264)
Baseplate to ambient
°C/Watt
°C/Watt
°C/Watt
°C/Watt
Baseplate to ambient; 1000 LFM
1.9
Part Numbering
uRAM
2
C
2
1
Type
2 = 20A
3 = 30A
Product Grade
Pin Style*
1 = Short Pin
2 = Long Pin
S = Short ModuMate
N = Long ModuMate
Baseplate
1 = Slotted
2 = Threaded
Product
C = –20°C to +100°C
T = –40°C to +100°C
H = –40°C to +100°C
M = –55°C to +100°C
3 = Thru-hole
*Pin styles S & N are compatible with the ModuMate interconnect system for socketing and surface mounting.
Vicor Corp. Tel: 800-735-6200, 978-470-2900 Fax: 978-475-6715
MicroRAM
Rev. 1.1
Page 1 of 8
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PRELIMINARY
Electrical Characteristics
Electrical characteristics apply over the full operating range of input voltage, output power and baseplate temperature, unless
otherwise specified. All temperatures refer to the operating temperature at the center of the baseplate.
µRAM MODULE SPECIFICATIONS (-20°C to +100°C baseplate temperature)
Parameter
Min
Typ
Max
Unit
Notes
Operating current range
µRAM2xxx
No internal current limiting. Converter input must be
properly fused such that the µRAM output current
does not exceed the maximum operating current
rating by more than 30% under a steady state condition.
0.02
0.02
20
30
A
A
µRAM3xxx
Operating input voltage
3.0
30
50
Vdc
Continuous
Transient output response
Load current step <1A/µsec
Step load change;
mVp-p
see Figures 9, 12, & 15, pp. 6-7
Transient output response
Load current step <1A/µsec
(CTRAN = 820µF)
Optional capacitance CTRAN can be used
50
mVp-p
mV
to increase transient current capability; See Figures
1 & 2 on p. 3 and Figures 10, 13, & 16 on pp. 6-7
VHR headroom voltage range(1)
@ 1A load
See Figures 5, 6 & 7
325
425
See Table 1 for headroom setting resistor values
Output ripple
10
5
mVp-p
mVrms
Ripple frequency 60Hz to 100kHz; optional capacitor
Input Vp-p = 100mV
CHR = 100µF required to increase low frequency
attenuation as shown in Figures 3a and 3b
see Figures 8, 11, & 14, pp. 6-7
Output ripple
10
5
mVp-p
mVrms
Ripple frequency 100kHz to 2MHz;
see Figures 8, 11, & 14, pp. 6-7
Input Vp-p = 500mV
SC output voltage(2)
OR’ing threshold
µRAM bias current
1.23
Vdc
mV
mA
See Table 1 RSC value
Vin – Vout
10
60
Power Dissipation
µRAM2xxx VHR = 380mV@1A
7.5
W
W
Vin = 28V; Iout = 20A
Vin = 28V; Iout = 30A
µRAM3xxx VHR = 380mV@1A
11.5
(1) Headroom is the voltage difference between the +Input and +Output pins.
RHR = (µRAM +Out/VHR) x 2.3k (see Table 1 for example values)
(2) SC resistor is required to trim the converter output up to accommodate the headroom of the µRAM module when remote sense
is not used. This feature can only be used when the trim reference of the converter is in the 1.21 to 1.25 Volt range.
(see Table 1 with calculated RSC resistor values)
RSC = ((µRAM +Out)/1.23V x 1k) – 2k
µRAM Out
3.0V
V
HR @ 1A
375mV
375mV
375mV
375mV
375mV
375mV
R
HR Value (ohms)
R
SC Value (ohms)
18.4k
0.439k
5.0V
30.6k
2.07k
12.0V
15.0V
24.0V
28.0V
73.6k
7.76k
92.0k
10.20k
147.2k
17.50k
171.7k
20.76k
Table 1—RHR and RSC are computed values for a 375mV case. To compute different headroom voltages, or for standard resistor
values and tolerances, use Notes 1 and 2.
Vicor Corp. Tel: 800-735-6200, 978-470-2900 Fax: 978-475-6715
MicroRAM Data Sheet
Rev. 1.1
Page 2 of 8
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PRELIMINARY
Electrical Characteristics (continued)
APPLICATION SCHEMATIC DRAWINGS USING VICOR CONVERTERS AND THE µRAM
RSENSE
(2)
5.1
+In
PC
+Out
22µF
+In
+Out
+S
RHR
SC
DC-DC
Converter
SC
µRAM
VREF
–Out
CTRAN
CHR*
PR
–In
–S
–In
CTRAN*
–Out
*Optional Component
Figure 1—Typical Configuration using Remote Sensing
+In
+Out
+In
+Out
RSC
RHR
PC
PR
SC
DC-DC
Converter
SC
µRAM
VREF
–Out
CTRAN
CHR*
–In
–Out
–In
CTRAN*
*Optional Component
Figure 2—Typical Configuration using SC Control (Oppional CHR 25µF maximum in SC configuration.)
Functional Description
The MicroRAM has an internal passive filter that
Transient load current is supplied by the internal CTRAN
capacitance, plus optional external capacitance, during the
time it takes the converter loop to respond to the increase
in load. The MicroRAM’s active loop responds in roughly
one microsecond to output voltage perturbations. There
are limitations to the magnitude and the rate of change of
the transient current that the MicroRAM can sustain while
the converter responds. See Figures 8-16, on pp. 6 and 7,
for examples of dynamic performance. A larger headroom
voltage setting will provide increased transient performance,
ripple attenuation and power dissipation while reducing
overall efficiency (see Figures 4a, 4b, 4c and 4d on p. 5).
effectively attenuates ripple in the 50kHz to 1MHz range.
An active filter provides attenuation from low frequency
up to the 1MHz range. The user must set the headroom
voltage of the active block with the external RHR resistor
to optimize performance. The MicroRAM must be connected
as shown in Figures 1 or 2 depending on the load sensing
method. The transient load current performance can be
increased by the addition of optional CTRAN capacitance
to the CTRAN pin. The low frequency ripple attenuation
can be increased by addition of optional CHR capacitance
to the VREF pin as shown in Figures 3a and 3b, on p. 5.
Vicor Corp. Tel: 800-735-6200, 978-470-2900 Fax: 978-475-6715
MicroRAM
Rev. 1.1
Page 3 of 8
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PRELIMINARY
Functional Description (continued)
The active loop senses the output current and reduces the
headroom voltage in a linear fashion to approximate
constant power dissipation of MicroRAM with increasing
loads (see Figures 5, 6 & 7, p. 6). The headroom setting
can be reduced to decrease power dissipation where the
transient requirement is low and efficient ripple
output current and the resistance of the load path from the
output of the MicroRAM to the load.
The OR’ing feature prevents current flowing from the
output of the MicroRAM back through it’s input terminal
in a redundant system configuration in the event that a
converter output fails. When the converter output
attenuation is the primary performance concern.
supplying the MicroRAM droops below the OR’ed output
voltage potential of the redundant system, the input of the
MicroRAM is isolated from it’s output. Less than 50mA
will flow out of the input terminal of the MicroRAM over
the full range of input voltage under this condition.
The active dynamic headroom range is limited on the low
end by the initial headroom setting and the maximum
expected load. If the maximum load in the application is
10 Amps, for example, the 1 Amp headroom can be set
75mV lower to conserve power and still have active
headroom at the maximum load current of 10 Amps. The
high end or maximum headroom range is limited by the
internal OR’ing diode function.
Passive
Block
Active
Block
+In
+Out
SC
The SC or trim-up function can be used when remote
sensing is not available on the source converter or is not
desirable. It is specifically designed for converters with a
1.23 Volt reference and a 1k ohm input impedance like
Vicor 2nd Generation converters. In comparison to remote
sensing, the SC configuration will have an error in the load
voltage versus load current. It will be proportional to the
VREF
–Out
SC
Control
CTRAN
–In
µRAM Block Diagram
Application Notes
Load capacitance can affect the overall phase margin of
the MicroRAM active loop as well as the phase margin of
the converter loop. The distributed variables such as
inductance of the load path, the capacitor type and value as
well as its ESR and ESL also affect transient capability at
the load. The following guidelines should be considered
when point of load capacitance is used with the MicroRAM
in order to maintain a minimum of 30 degrees of phase margin.
2) For the case where load capacitance is connected
directly to the output of the MicroRAM, i.e. no
trace inductance, and the ESR is >1 milliohm:
(a) 20µF to 200µF load capacitance needs an ESL
of >50nH
(b)200µF to 1,000µF load capacitance needs an
ESL of >5nH
3) Adding low ESR capacitance directly at the output
terminals of MicroRAM is not recommended and
may cause stability problems.
1) Using ceramic load capacitance with <1milliohm
ESR and <1nH ESL:
(a) 20µF to 200µF requires 20nH of trace/wire
load path inductance
4) In practice the distributed board or wire inductance at a
load or on a load board will be sufficient to isolate the
output of the MicroRAM from any load capacitance
and minimize any appreciable effect on phase margin.
(b)200µF to 1,000µF requires 60nH of trace/wire
load path inductance
Vicor Corp. Tel: 800-735-6200, 978-470-2900 Fax: 978-475-6715
MicroRAM Data Sheet
Rev. 1.1
Page 4 of 8
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PRELIMINARY
µRAM2xxx
Ripple Attenuation @ 28V (Room Temp.)
Ripple Attenuation @ 5V (Room Temp.)
20.00
0.00
20.00
0.00
-20.00
-40.00
-60.00
-20.00
-40.00
-60.00
-80.00
-80.00
10
100
1,000
10,000
100,000
1,000,000
10,000,000
10
100
1,000
10,000
100,000
1,000,000
10,000,000
Freq. (Hz)
Freq. (Hz)
10A, 100uF Vref
10A, No Vref Cap
10A, 100uF Vref
10A, No Vref Cap
Figure 3a, 3b—Curves demonstrating the small signal attenuation performance as measured on a network analyzer with a typical
module at (a) 28V and 10A output and (b) 5V and 10A. The low frequency attenuation can be enhanced by connecting a 100µF
capacitor, CHR, to the VREF pin as shown in Figures 1 and 2.
-0
-25
-50
-75
-0
Rhr=260k (Vheadroom=90mV)
250k (100mV)
Rhr=28k (Vheadroom=90mV)
Vout=3V Iload=20A
100 degrees baseplate temperature
Vout=28V Iload=20A
100 degrees baseplate temperature
27k (100mV)
26k (110mV)
25k (122mV)
24k (135mV)
23k (150mV)
240k (110mV)
230k (122mV)
220k (135mV)
210k (150mV)
200k (160mV)
-25
-50
-75
22k (160mV)
150k (260mV)
160k (240mV)
170k (217mV)
17k (260mV)
18k (240mV)
19k (217mV)
180k (197mV)
190k (180mV)
20k (197mV)
21k (180mV)
10Hz
100Hz
... DB(V(VOUT))
1.0KHz
10KHz
100KHz
1.0MHz
10Hz
100Hz
... DB(V(VOUT))
1.0KHz
10KHz
100KHz
1.0MHz
Frequency
Frequency
Figure 4a-4b—Simulated graphs demonstrating the tradeoff of attenuation versus headroom setting at 20 Amps and an equivalent
100°C baseplate temperature at 3V and 28V.
28V 20A
-10
-20
-30
-40
-50
-60
-70
-10
-20
-30
-40
-50
-60
-70
Rhr=260k
250k
100khz 28V
500khz 28V
1Mhz 28V
100khz 3V
500khz 3V
1Mhz 3V
Rhr=28k
27k
240k
230k
26k
25k
220k
210k
24k
200k
23k
190k
22k
180k
21k
170k
20k
160k
19k
150k
18k
17k
3.0
3.5
4.0
4.5
5.0
5.5
6.0
3.0
3.5
4.0
4.5
5.0
5.5
6.0
Watts
Watts
Figure 4c-4d—MicroRam attenuation vs. power dissipation at 3V 20A, and 28V 20A.
Notes:The measurements in Figures 8-16 were taken with a µRAM2C21 and standard scope probes with a 20MHz bandwidth scope setting. The criteria for transient current
capability was as follows: The transient load current step was incremented from 10A to the peak value indicated, then stepped back to 10A until the resulting output peak to
peak was around 40mV.
Vicor Corp. Tel: 800-735-6200, 978-470-2900 Fax: 978-475-6715
MicroRAM
Rev. 1.1
Page 5 of 8
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PRELIMINARY
µRAM2xxx (µRAM3xxx data not included in this rev.)
450mV
450mV
400mV
VOUT=3V
VOUT=15V
400mV
Rhr=16k
Rhr=80k
300mV
300mV
17k
85k
90k
18k
19k
20k
95k
100k
105k
21k
200mV
200mV
1A
2A
4A
6A
8A
10A
12A
14A
16A
18A
20A
1A
2A
4A
6A
8A
10A
12A
14A
16A
18A
20A
V(VSOURCE) –V(VOut)
V(VSOURCE) –V(VOut)
I_Iload
I_Iload
Figure 6—Headroom vs. load current at 15V output.
Figure 5—Headroom vs. load current at 3V output.
450mV
VOUT=28V
400mV
Rhr=150k
300mV
160k
170k
180k
190k
200k
200mV
1A
2A
4A
6A
8A
10A
12A
14A
16A
18A
20A
V(VSOURCE) –V(VOut)
I_Iload
Figure 7—Headroom vs. load current at 28V output.
Figure 8—V375A28C600A and µRAM; Input and output ripple
@50% (10A) load CH1=Vi; CH2=Vo; Vi-Vo=332mV; RHR=178k
Figure 9—V375A28C600A and µRAM; Input and output
dynamic response no added CTRAN; 20% of 20A rating load
step of 4A (10A➟14A);RHR=178k (Configured as in Figs. 1 & 2)
Figure 10—V375A28C600A and µRAM; Input and output
dynamic response CTRAN=820µF Electrolytic; 32.5% of load step
of 6.5A (10A➟16.5A);RHR=178k (Configured as in Figs. 1 & 2)
Vicor Corp. Tel: 800-735-6200, 978-470-2900 Fax: 978-475-6715
MicroRAM Data Sheet
Rev. 1.1
Page 6 of 8
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PRELIMINARY
µRAM2xxx
Figure 11—V375B12C250A and µRAM; Input and output ripple
@50% (10A) load CH1=Vi; CH2=Vo; Vi-Vo=305mV; RHR=80k
(Configured as in Figs. 1 & 2)
Figure 12—V300B12C250A and µRAM; Input and output
dynamic response no added CTRAN; 17.5% of 20A rating load
step of 3.5A (10A➟13.5A);RHR=80k (Configured as in Figs. 1 & 2)
Figure 13—V300B12C250A and µRAM; Input and output
dynamic response CTRAN=820µF Electrolytic; 30% of load
step of 6A (10A➟16A);RHR=80k (Configured as in Figs. 1 & 2)
Figure 14—V48C5C100A and µRAM; Input and output ripple
@50% (10A) load CH1=Vi; CH2=Vo; Vi-Vo=327mV; RHR=31k
(Configured as in Figs. 1 & 2)
Figure 15—V48C5C100A and µRAM; Input and output dynamic
response no added CTRAN; 22.5% of 20A rating load step of 4.5A
(10A➟14.5A);RHR=31k (Configured as in Figs. 1 & 2)
Figure 16—V48C5C100A and µRAM; Input and output dynamic
response CTRAN=820µF Electrolytic; 35% of load step of 7A
(10A➟17A);RHR=31k (Configured as in Figs. 1 & 2)
Vicor Corp. Tel: 800-735-6200, 978-470-2900 Fax: 978-475-6715
MicroRAM
Rev. 1.1
Page 7 of 8
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PRELIMINARY
Mechanical Drawings
MODULE OUTLINE
0.50 ±0.02
12,7 ±0,5
uRAM Pins
No. Function Label
0.800
20,32
0.01
1
2
3
4
5
6
7
+In
Control
C ext.
–In
+
0.525
13,34
SC
0.235±.015
5,97±0,38
(REF)
0.49
12,4
style 2 & 3
0.12* 0.20**
CTRAN
1.27
32,3
0.09
2,3
baseplates only
(4X)***
.275
6,99
3,1 5,08
–
–
0.10
X 45˚
–Out
0.490 ±.015
12,45 ±0,38
2,5
(REF)
CHAMFER
1
2
3
4
Reference Vref
+Out
0.27
6,9
(2X)
0.350±.015
8,89±0,38
0.65
16,5
+
FULL R (6X)
0.13
ALUMINUM
BASEPLATE
2.28
57,9
(REF)
2.000
50,80
1.30
33,0
(6X)
3,3
7
6
5
0.080
2,03
Use a
DIA. (7X)
0.43
10,9
0.06
4-40 Screw (6x)
Torque to:
5 in-lbs
R
(3X)
1.45
0.400
10,16
1,5
0.54
(7X)
36,8
(REF.)
Pin Style 1&S
(Short Pin)
13,7
0.21
1.04
26,4
1.45
36,8
Slotted (Style 1)
or
0.57 N-m
5,2
(REF)
0.62
15,7
(7X)
Pin Style 2&N
(Long Pin)
Threaded (Style 2)
4-40 UNC-2B (6X)
or
Thru Hole (Style 3)
#30 Drill Thru (6X)
(0.1285)
*
Style 1 baseplate only
** Style 2 & 3 baseplates
*** Reserved for Vicor accessories
Not for mounting
PCB MOUNTING SPECIFICATIONS
0.062 ±0.010
PCB THICKNESS
1,57 ±0,25
0.800*
20,32
INBOARD
ONBOARD
SOLDER
MOUNT
SOLDER
MOUNT
0.525*
13,34
ALL MARKINGS
THIS SURFACE
PLATED
THRU HOLE
DIA
0.275*
6,99
PIN STYLE 1&S
PIN STYLE 2&N
0.094 ±0.003
2,39 ±0,08
0.094 ±0.003
2,39 ±0,08
(7X)
0.170*
4,32
0.133
3,38
1
2
3
4
ALUMINUM
1.734**
44,04
BASEPLATE
2.000*
50,80
PINS STYLES
STYLE 1 & 2: TIN/LEAD
HOT SOLDER DIPPED
7
6
5
STYLE S & N: GOLD PLATED COPPER
0.06
R
(4X)
1,5
0.53
13,5
0.43
10,9
Unless otherwise specified,
dimensions are in inches
mm
.400*
10,16
1.140**
*DENOTES TOL = ±0.003
±0,08
Decimals
Tol.
Angles
**PCB WINDOW
28,96
0.XX
±0.01
±0,25
±0.005
±0,127
±1°
0.XXX
Vicor Corp. Tel: 800-735-6200, 978-470-2900 Fax: 978-475-6715
MicroRAM Data Sheet
P/N 25774
Rev.1.1 11/02/10M
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