LSM1208472V [VCC]
Single Color LED,;
| 型号： | LSM1208472V |
| 厂家： | 
Visual Communications Company |
| 描述： | Single Color LED, 光电 |
| 文件： | 总7页 (文件大小：1931K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LSM1208472V Series
1208 SMD LED Package
3.0x2.0x1.3 mm SMD Chip LED
LSM1208472V Yellow SMD LED. Low Profile Surface Mount LED
Application
•ꢀ Automotive Dashboards
•ꢀ Backlighting
•ꢀ Tail Lights
•ꢀ Medical Devices
•ꢀ Status Indicators
•ꢀ NavigationꢀSystems
•ꢀ Home and Smart Appliance
•ꢀ Status Indicator
•ꢀ Wearable and Portable Devices
Key Features
•ꢀ 3.0 x 2.0 mm (1208 package/3020 metric) Chip SMD LED
•ꢀ 1.3 mm in thickness
•ꢀ Wide viewing angle (120°)
•ꢀ Cost-efficientꢀsolutionꢀforꢀlow-powerꢀandꢀcompactꢀelectronicꢀequipmentꢀdesignsꢀ
•ꢀ IdealꢀforꢀspecialꢀconfigurationsꢀforꢀautomatedꢀPCꢀboardꢀassemblyꢀandꢀspace-sensitiveꢀapplicationsꢀ
•ꢀ Water clear lens
•ꢀ Compatibleꢀwithꢀinfraredꢀandꢀvaporꢀphaseꢀreflowꢀsolderꢀprocess
•ꢀ Compatibleꢀwithꢀautomaticꢀplacementꢀequipment
•ꢀ Moistureꢀsensitivityꢀlevel:ꢀMSLꢀ5A
•ꢀ Package 2,000 pieces per reel
•ꢀ Compliant with RoHS
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Product Dimensions
Notes:
1. All dimensions are in millimeters (inches)
2. Tolerance is ±0.1 mm [.004 in] unless otherwise noted
3.ꢀTheꢀspecifications,ꢀcharacteristicsꢀandꢀtechnicalꢀdataꢀdescribedꢀinꢀtheꢀdatasheetꢀareꢀsubjectꢀtoꢀchangeꢀwithoutꢀpriorꢀnotice.
Product Specifications
Absolute Maximum Ratings (Ta=25˚C)
5
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Product Specifications
Electrical and optical characteristics(Ta=25°C)
Typical Electro-Optical Characteristics Curves
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Reliability Data
Reliability Test
Judgment criteria of failure for the reliability
Notes:
1.ꢀUꢀmeansꢀtheꢀupperꢀlimitꢀspecifiedꢀcharacteristics.ꢀSꢀmeansꢀinitialꢀvalue.
2. Measurement shall be taken between 2 hours and after the test pieces have been returned to normal ambient conditions after
completion of each test.
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Recommended Reflow Soldering Profile
IR-Reflow
1. AvoidꢀanyꢀexternalꢀstressꢀappliedꢀtoꢀtheꢀresinꢀwhileꢀtheꢀLEDsꢀareꢀatꢀhighꢀtemperature,ꢀespeciallyꢀ
during soldering.
2. Avoidꢀrapidꢀcoolingꢀorꢀanyꢀexcessꢀvibrationꢀduringꢀtemperatureꢀramp-downꢀprocessꢀ
3. Although the soldering condition is recommended above, soldering at the lowest possible
temperature is feasible for the LEDs
Iron Soldering
350˚Cꢀwithinꢀ3ꢀSec,ꢀoneꢀtimeꢀonly
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LSM1208472Vꢀꢀ|ꢀꢀ12/19ꢀꢀ|ꢀꢀPageꢀ5ꢀofꢀ7
Precautions
Handling Precautions
Compareꢀtoꢀepoxyꢀencapsulantꢀthatꢀisꢀhardꢀandꢀbrittle,ꢀsiliconeꢀisꢀsofterꢀandꢀflexible.ꢀAlthoughꢀitsꢀcharacteristicꢀ
significantlyꢀreducesꢀthermalꢀstress,ꢀitꢀisꢀmoreꢀsusceptibleꢀtoꢀdamageꢀbyꢀexternalꢀmechanicalꢀforce.ꢀAsꢀaꢀresult,ꢀ
specialꢀhandlingꢀprecautionsꢀneedꢀtoꢀbeꢀobservedꢀduringꢀassemblyꢀusingꢀsiliconeꢀencapsulatedꢀLEDꢀproducts.ꢀ
FailureꢀtoꢀcomplyꢀmightꢀleadꢀtoꢀdamageꢀandꢀprematureꢀfailureꢀofꢀtheꢀLED.
1. Handleꢀtheꢀcomponentꢀalongꢀtheꢀsideꢀsurfacesꢀbyꢀusingꢀforcepsꢀorꢀappropriateꢀtools.ꢀ(pic.1)
2. Doꢀnotꢀdirectlyꢀtouchꢀorꢀhandleꢀtheꢀsiliconeꢀlensꢀsurface.ꢀItꢀmayꢀdamageꢀtheꢀinternalꢀcircuitry.ꢀ(pic.2,ꢀpic.3)
3. DoꢀnotꢀstackꢀtogetherꢀassembledꢀPCBs,ꢀcontainingꢀexposedꢀLEDs.ꢀTheꢀimpactꢀmayꢀscratchꢀtheꢀsiliconeꢀ
lensꢀorꢀdamageꢀtheꢀinternalꢀcircuitry.ꢀ(pic.4)
4. The outer diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks.
Theꢀinnerꢀdiameterꢀofꢀtheꢀnozzleꢀshouldꢀbeꢀasꢀlargeꢀasꢀpossible.ꢀ(pic.5)
5.ꢀ A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during
pickup.ꢀ(pic.5)
6. Theꢀdimensionsꢀofꢀtheꢀcomponentꢀmustꢀbeꢀaccuratelyꢀprogrammedꢀinꢀtheꢀpick-and-placeꢀmachineꢀtoꢀinsureꢀ
preciseꢀpickupꢀandꢀavoidꢀdamageꢀduringꢀproduction.ꢀ(pic.5)
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Precautions
Notes for designing:
CareꢀmustꢀbeꢀtakenꢀtoꢀprovideꢀtheꢀcurrentꢀlimitingꢀresistorꢀinꢀtheꢀcircuitꢀtoꢀdriveꢀtheꢀLEDsꢀwithinꢀtheꢀratedꢀfig-
ures. Also, caution should be taken not to overload LEDs with the instantaneous voltage at the turning ON and
OFF of the circuit.
Whenꢀusingꢀtheꢀpulseꢀdriveꢀcareꢀmustꢀbeꢀtakenꢀtoꢀkeepꢀtheꢀaverageꢀcurrentꢀwithinꢀtheꢀratedꢀfigures.ꢀAlso,ꢀtheꢀ
circuitꢀshouldꢀbeꢀdesignedꢀtoꢀbeꢀsubjectedꢀtoꢀreverseꢀvoltageꢀwhenꢀturningꢀoffꢀtheꢀLEDs.
Storage:
To avoid the absorption of moisture, it is recommended to solder LEDs as soon as possible after unpacking the
sealedꢀenvelope.ꢀIfꢀtheꢀenvelopeꢀisꢀstillꢀpacked,ꢀtoꢀstoreꢀitꢀinꢀtheꢀenvironmentꢀasꢀfollows:
(1)ꢀTemperature:ꢀ5℃-30℃(41℉)ꢀHumidity:ꢀRHꢀ60﹪ꢀMax.
(2)ꢀAfterꢀthisꢀbagꢀisꢀopened,ꢀdevicesꢀthatꢀwillꢀbeꢀappliedꢀtoꢀinfraredꢀreflow,ꢀvapor-phaseꢀreflowꢀorꢀequivalentꢀ
solderingꢀprocessꢀmustꢀbe:
a. Completed within 24 hours.
b.ꢀStoredꢀatꢀlessꢀthanꢀ20﹪ꢀRH.
(3)ꢀDevicesꢀrequireꢀbakingꢀbeforeꢀmounting,ꢀif:ꢀ2aꢀorꢀ2bꢀisꢀnotꢀmet.
(4)ꢀIfꢀbakingꢀisꢀrequired,ꢀdevicesꢀmustꢀbeꢀbakedꢀunderꢀbelowꢀconditions:ꢀ48ꢀhoursꢀatꢀ60℃±5℃.
Tape and Reel Specifications
Package:ꢀProductsꢀareꢀpackedꢀinꢀoneꢀbagꢀofꢀ2000pcsꢀ(oneꢀtapingꢀreel)ꢀandꢀaꢀlabelꢀisꢀattachedꢀonꢀeachꢀbag.
Tapping and packaging specifications (Units: mm)
Compliances and Approvals
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