CND2047 [UMS]
10GHz Frequency Divider by 4 Fixed Modulus Prescaler; 10GHz的频率分4固定模数分频器
| 型号： | CND2047 |
| 厂家： | 
UNITED MONOLITHIC SEMICONDUCTORS |
| 描述： | 10GHz Frequency Divider by 4 Fixed Modulus Prescaler |
| 文件： | 总10页 (文件大小：151K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CND2047
10GHz Frequency Divider by 4 Fixed Modulus Prescaler
GaAs Monolithic Microwave IC
Description
The CND2047 is a low power
consumption very high speed divider by 4
GaAs prescaler manufactured with a
2047
0.7µm self aligned implanted MESFET
process.
The design is full differential input/output
that allows direct drive into 50W load.
The CND2047 is available in chip form
and in 2 packages form:
* low cost SOIC8 plastic package
* 8 lead Flat Pack ceramic surface mount
FTP8 ceramic package
package
Main Features
¦ Very broad operating frequency range
¦ Low power dissipation: 300mW
¦ Single supply operation: 3V to 5V
¦ High input sensitivity:
SOIC8 plastic package
-10dBm@8 Ghz at 25°C and
-5dBm@8Ghz at 125°C
¦ Low phase noise: -139dBc/Hz at 1KHz
Main Characteristics
Tamb= +25°C
Symbol
Vdd
Parameter
Min
3
Typ
5
Max
6
Unit
V
Drain voltage
Pdiss
Fmax
Power dissipation
120
9
300
10
9
400
mW
GHz
Maximum input frequency
FTP8
SOIC8
8
ESD Protections: Electrostatic discharge sensitive device observe handling precautions!
Ref. : DSCND20470077 -17-Mar-00
1/10
Specifications subject to change without notice
United Monolithic Semiconductors S.A.S.
Route Départementale 128 - B.P.46 - 91401 Orsay Cedex France
Tel. : +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
10GHz Frequency Divider by 4
CND2047
Electrical Characteristics in FTP8 Ceramic Package and in die form
Guaranteed electrical specifications over the temperature range of
-55°C to +125°C but tested at Tamb=25°C under configuration described in Fig.1
( Vdd=5V ; Differential inputs; Pin=0dBm ; Zo=50 W )
Symbol
Fmax
Idd
Parameter
Maximum input frequency
Supply current
Min
Typ
8.75
60
Max
Unit
GHz
mA
8.25
75
Typical design information over the temperature range of -55°C to +125°C
( Vdd=5V, Zo=50 W )
Symbol
Parameter
Min
Typ
Max
Unit
Fmax
Maximum input frequency
differential input
Pin= -5dBm
8
8.25
7.5
8
8.5
8.75
8
GHz
Ghz
Ghz
Ghz
Pin= 0dBm
Pin= -5dBm
Pin= 0dBm
one input
8.5
Pout
Idd
Output power
Supply current
-4
-1.5
60
dBm
mA
75
Typical design information over the temperature range of -55°C to +125°C.
( Vdd=3.3V, Zo=50 W )
Symbol
Parameter
Min
Typ
Max
Unit
Fmax
Maximum input frequency
differential input
Pin= -5dBm
7.5
8
8
GHz
Ghz
Ghz
Ghz
Pin= 0dBm
Pin= -5dBm
Pin= 0dBm
8.5
7.5
8
one input
7
7.5
Pout
Idd
Output power
Supply current
-7
-4.5
40
dBm
mA
55
Ref. : DSCND20470077 -17-Mar-00
2/10
Specifications subject to change without notice
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
10GHz Frequency Divider by 4
CND2047
Electrical Characteristics in SOIC8 package
Guaranteed electrical specifications over the temperature range of
-40°C to +85°C but tested at Tamb=25°C under configuration described in Fig.1
( Vdd=5V ; Differential inputs; Pin=0dBm ; Zo=50 W )
Symbol
Fmax
Idd
Parameter
Maximum input frequency
Supply current
Min
Typ
9
Max
Unit
GHz
mA
8.5
60
75
Typical design information over the temperature range of -40°C to +85°C
( Vdd=5V, Zo=50 W )
Symbol
Parameter
Min
Typ
Max
Unit
Fmax
Maximum input frequency
differential input
Pin= -5dBm
8
8.5
9
GHz
Ghz
Ghz
Ghz
Pin= 0dBm
Pin= -5dBm
Pin= 0dBm
8.5
one input
7.25
7.75
7.75
8.25
Pout
Idd
Output power
Supply current
-4
-1.5
60
dBm
mA
75
Typical design information over the temperature range of -40°C to +85°C.
( Vdd=3.3V, Zo=50 W )
Symbol
Parameter
Min
Typ
Max
Unit
Fmax
Maximum input frequency
differential input
Pin= -5dBm
7
7.5
8
GHz
Ghz
Ghz
Ghz
Pin= 0dBm
Pin= -5dBm
Pin= 0dBm
7.5
6.5
6.75
one input
7
7.25
Pout
Idd
Output power
Supply current
-7
-4.5
40
dBm
mA
55
Ref. : DSCND20470077 -17-Mar-00
3/10
Specifications subject to change without notice
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
10GHz Frequency Divider by 4
CND2047
Absolute Maximum Ratings (1)
Tamb= 25°C
Symbol
Vdd
Parameter
Values
7
Units
V
Drain voltage
Pin
Maximum input power
15
dBm
°C
Top
Operating temperature range
SOIC8
-40 to +85
-55 to +125
-65 to +175
Die form / FTP8
Storage temperature range
Tstg
°C
(1) Operation of this device above anyone of these parameters may cause permanent damage
Ref. : DSCND20470077 -17-Mar-00
4/10
Specifications subject to change without notice
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
10GHz Frequency Divider by 4
CND2047
Typical Characteristics
Tamb= 25°C, Zo=50W, Vdd=5V
Output power level vs Input frequency and Vdd
2
0
-2
Vdd=5V
-4
Vdd=3.3V
-6
-8
-10
1
3
5
7
9
11
Frequency (GHz)
Device current vs Voltage and Temperature
80
70
60
50
40
30
20
10
0
25°C
-55°C
125°C
2,5
3
3,5
4
4,5
5
5,5
6
Vdd (V)
SSB phase noise vs. Offset frequency (Fin=3.9 Ghz)
0
-20
-40
-60
-80
-100
-120
-140
-160
10
100
1000
10000
100000
Offset frequency (Hz)
Ref. : DSCND20470077 -17-Mar-00
5/10
Specifications subject to change without notice
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
10GHz Frequency Divider by 4
CND2047
Fmax vs Vdd (Pin=0dBm; differential inputs)
12
10
8
SOIC8
FTP8
6
4
2
0
2
2,5
3
3,5
4
4,5
5
5,5
6
Vdd (Volts)
FTP8 package / Die form
Input sensitivity vs. Input frequency and temperature (Vdd=5V; differential
inputs)
15
5
-5
+25°C
+125°C
-55°C
-15
-25
-35
-45
-55
1,00
3,00
5,00
7,00
9,00
11,00
Frequency (GHz)
SOIC8 package
Input sensitivity vs. Input frequency and temperature (Vdd=5V; differential
inputs)
15,00
5,00
-5,00
+80
+25
-40
-15,00
-25,00
-35,00
-45,00
-55,00
1,00
3,00
5,00
7,00
9,00
11,00
Frequency (GHz)
Ref. : DSCND20470077 -17-Mar-00
6/10
Specifications subject to change without notice
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
10GHz Frequency Divider by 4
CND2047
Typical bias tuning
Tamb=25°C
Vdd
1 nF
1 nF
1 nF
0°
Signal generator
50 Ohms load
Tansmission lines
are 50 Ohms
Spectrum
analyzer
50 Ohms load
1 nF
180°
Fig.1 : Typical measurement and RF biasing configuration
(differential inputs)
Vdd
1 nF
Signal generator
50 Ohms load
Tansmission lines
are 50 Ohms
1 nF
Q
F/4 RF output (50 Ohms)
QB
F/4 RF output (50 Ohms)
1 nF
Fig.2 : RF biasing configuration with single input
Fig.3 : Chip block diagram
Ref. : DSCND20470077 -17-Mar-00
7/10
Specifications subject to change without notice
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
10GHz Frequency Divider by 4
CND2047
SOIC8 Mechanical Data
5+/ -0.15
[20+/ -0.006]
3.81
[.15]
1.27
[0.05]
0.2
[0.006]
8
5
0.1+/ -0.15
[.004+/ -.006]
3,7
(1,45)
6+/-0,15
(,236+/-,006)
1.4
[0.055]
1
4
0.4
[.015]
8° m a x
1.7 m a x
unité : m m
Unit: [In]
To lé ra nc e g é né ra le : +/ -0.05
[g e ne ra l to le ra nc e : +/ -.002]
Pin out
Signal
Vdd
CK
CKB
Ground
Ground
QB
1
2
3
4
5
6
7
8
Q
Vdd
Ref. : DSCND20470077 -17-Mar-00
8/10
Specifications subject to change without notice
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
10GHz Frequency Divider by 4
CND2047
FTP8 Mechanical Data
3,81
1,27 typ.
8
5
0,127 max
2047
9,56 - 10,16
4,6 max
Date code
1,00 - 1,77
1
4
2,00 max
±0,02
0,127
0,38
4,6 max
Unite : mm
Pin out
Signal
Vdd
CK
CKB
Ground
Ground
QB
1
2
3
4
5
6
7
8
Q
Vdd
Ref. : DSCND20470077 -17-Mar-00
9/10
Specifications subject to change without notice
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
10GHz Frequency Divider by 4
CND2047
Chip Mechanical Data
Recommended die attach
Epoxy die attach is recommended.
Minimum quantity of electrically conductive
epoxy must be used, with a narrow fillet
around the die after contact
Vdd
CKB
CK
Vdd
Recommended bonding
Bonding pads of the product are covered
with aluminium metallic layer.
GND
GND
Wedge or ball bonding can be used.
Aluminium wire has be used if the
assembly process is up to 250°C.
Otherwise the use of gold wire is possible.
The ground bounding length should be as
short as possible to optimize the use of the
product.
GND
QB
Q
Vdd1
The bonder should be properly grounded.
Note 1: Vdd1 is used to connect the output
buffers (on Q/QB) and can be applied
separately from Vdd.
dimensions in µm :
1050 (+10 /-100) * 900 (+10 /-100)
Thickness= 300µm ± 20µm
Pads area: 100*100µm
Ordering Information
Chip form
FTP8 Package
:CND2047-99F/00
:CND2047-SNF/23
SOIC8 Package :CND2047-DAF/20
Information furnished is believed to be accurate and reliable. However United Monolithic Semiconductors
S.A.S. assumes no responsibility for the consequences of use of such information nor for any infringement of
patents or other rights of third parties which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of United Monolithic Semiconductors S.A.S.. Specifications
mentioned in this publication are subject to change without notice. This publication supersedes and replaces all
information previously supplied. United Monolithic Semiconductors S.A.S. products are not authorised for
use as critical components in life support devices or systems without express written approval from United
Monolithic Semiconductors S.A.S.
Ref. : DSCND20470077 -17-Mar-00
10/10
Specifications subject to change without notice
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
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