AP2301BGN-HF [TYSEMI]

Surface Mount Device; 表面安装器件
AP2301BGN-HF
型号: AP2301BGN-HF
厂家: TY Semiconductor Co., Ltd    TY Semiconductor Co., Ltd
描述:

Surface Mount Device
表面安装器件

晶体 晶体管 开关 脉冲 光电二极管
文件: 总2页 (文件大小:145K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Product specification  
AP2301BGN-HF  
Simple Drive Requirement  
Small Package Outline  
BVDSS  
RDS(ON)  
ID  
-20V  
130mΩ  
- 2.8A  
D
Surface Mount Device  
RoHS Compliant & Halogen-Free  
S
SOT-23  
G
Description  
D
S
Advanced Power MOSFETs from APEC provide the  
designer with the best combination of fast switching,  
low on-resistance and cost-effectiveness.  
G
The SOT-23 package is widely preferred for commercial-industrial  
surface mount applications and suited for low voltage applications  
such as DC/DC converters.  
Absolute Maximum Ratings  
Symbol  
Parameter  
Rating  
- 20  
Units  
V
VDS  
VGS  
Drain-Source Voltage  
Gate-Source Voltage  
+8  
V
ID@TA=25℃  
ID@TA=70℃  
IDM  
Continuous Drain Current3  
Continuous Drain Current3  
Pulsed Drain Current1  
-2.8  
A
-2.1  
A
-12  
A
PD@TA=25℃  
TSTG  
Total Power Dissipation  
1.38  
W
Storage Temperature Range  
Operating Junction Temperature Range  
-55 to 150  
-55 to 150  
TJ  
Thermal Data  
Symbol  
Parameter  
Value  
Unit  
Rthj-amb  
Maximum Thermal Resistance, Junction-ambient3  
90  
/W  
http://www.twtysemi.com  
sales@twtysemi.com  
4008-318-123  
1 of 2  
Product specification  
AP2301BGN-HF  
Electrical Characteristics@Tj=25oC(unless otherwise specified)  
Symbol  
BVDSS  
RDS(ON)  
Parameter  
Test Conditions  
Min. Typ. Max. Units  
Drain-Source Breakdown Voltage  
Static Drain-Source On-Resistance2 VGS=-4.5V, ID=-2.8A  
VGS=0V, ID=-250uA  
-20  
-
-
-
-
V
-
-
130  
190  
m  
mΩ  
VGS=-2.5V, ID=-2A  
VGS(th)  
Gate Threshold Voltage  
VDS=VGS, ID=-250uA  
VDS=-5V, ID=-2A  
VDS=-16V, VGS=0V  
VGS=+8V, VDS=0V  
ID=-2A  
-0.5  
-
7.6  
-
-1.25  
V
gfs  
Forward Transconductance  
Drain-Source Leakage Current  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
S
IDSS  
uA  
nA  
nC  
nC  
nC  
ns  
ns  
ns  
ns  
pF  
pF  
pF  
-1  
IGSS  
Gate-Source Leakage  
Total Gate Charge2  
Gate-Source Charge  
Gate-Drain ("Miller") Charge  
Turn-on Delay Time2  
Rise Time  
-
+100  
Qg  
7.5  
1
12  
-
Qgs  
Qgd  
td(on)  
tr  
VDS=-16V  
VGS=-4.5V  
3
-
VDS=-10V  
8.5  
18  
22  
10  
-
ID=-1A  
-
td(off)  
tf  
Turn-off Delay Time  
Fall Time  
RG=3.3Ω,VGS=-5V  
RD=10Ω  
-
-
Ciss  
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
Gate Resistance  
VGS=0V  
550 1470  
Coss  
Crss  
Rg  
VDS=-20V  
60  
55  
6
-
-
f=1.0MHz  
f=1.0MHz  
9
Source-Drain Diode  
Symbol  
Parameter  
Forward On Voltage2  
Reverse Recovery Time2  
Test Conditions  
IS=-1.2A, VGS=0V  
IS=-2A, VGS=0V,  
dI/dt=100A/µs  
Min. Typ. Max. Units  
VSD  
trr  
-
-
-
-
-1.2  
V
ns  
nC  
16  
9
-
-
Qrr  
Reverse Recovery Charge  
http://www.twtysemi.com  
sales@twtysemi.com  
4008-318-123  
2 of 2  

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