143 [TTELEC]

Custom Commercial Modules; 自定义的商业模块


型号：	143
厂家：	TT Electronics
描述：	Custom Commercial Modules 自定义的商业模块
文件：	总3页 (文件大小：122K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

MODEL 143

Custom Commercial

Modules

FEATURES

IMPLEMENTATION

BI has an experienced design team that provides

customer assistance on new programs from the

proposal/estimate phase through development and

into production.

• Low cost surface mount assembly

• Chip on board capability

• Reduced board size

• Ceramic board

During the proposal phase, a customer interface will

be set up to develop and price alternate design

approaches. During the development phase, a close

working arrangement will be maintained through

prototype samples and into production.

• Integral thick ﬁlm resistors

• U.S. design & management

• U.S. or offshore Assembly

• Versatile lead conﬁguration

• Low proﬁle outline

Simply submit a circuit schematic, dimensional

constraints, critical components and any special

requirements to BI Marketing. BI will produce a sizing

estimate and costing workup to meet your design

goals.

DESCRIPTION

Whether you are upgrading your “through-hole” circuit

board to surface mount or developing a new design, BI

Technologies has the solution for you. BI commercial

hybrids can be used as subassemblies on a

motherboard, or they can encompass your entire

circuit.

Hybrid assemblies are being used in an increasing

number of applications. BI commercial assemblies are

circuit boards based on ceramic material rather than

conventional polymer materials. In small to mid-sized

assemblies, ceramic substrates offer price competitive

solutions and many quality and design advantages.

Resistors are directly screened onto the substrate and

other components are typically surface mounted. Chip

and wire attachment is available for components

where required. A variety of lead frame conﬁgurations

are available to create SIP’s, DIP’s, through hole, and

surface mountable assemblies. Polymer encapsulation

can be used to protect components and proprietary

designs.

COMMITMENT

BI is committed to servicing your needs. BI has been a

dominant force in the commercial and military hybrid

microelectronics industry since its conception. Our

reputation is built on over 25 years of proven reliability

and quality. Program Management, engineering, and

quality departments are located in Fullerton, California

for ease of contact and interface. BI’s domestic

location is your window to global facilities. BI

Fullerton can draw on multiple factory locations,

including Mexico, Scotland, Asia and Fullerton, to

select the optimum resources for your assembly

needs.

Speciﬁcations subject to change without notice.

Model 143

7-5

ADVANTAGES OF SURFACE MOUNT

Low Cost, High Quality

(A)

(D)

(E)

(B)

(F)

(C)

Model 143

7-6

CERAMIC BOARD (A)

SURFACE MOUNT SEMICONDUCTORS (D)

Our hybrids use ceramic (alumina) substrates to

achieve optimum size reduction and reliability.

Ceramic substrates produce an environmentally

superior product. The advantages of ceramic over

polymer board construction include: better heat

dissipation, elimination of blistering, minimal moisture

absorption, reduced size and improved performance.

For small-sized assemblies (up to approx. 2” x 2”),

ceramic board construction is usually the low cost

choice. Thick film conductors, typically Palladium

silver or gold, as small as 5 mil wide, are screened

onto the substrate. Multilayer construction of up to

ﬁve metal layers is standard.

BI has experience with a wide range of surface

mountable

semiconductors

packaged

configurations, including SOT, SO, SOL and PLCC.

Our commercial hybrids will also accommodate

semiconductor die attached and wire bonded directly

to the substrate. This allows us to utilize ASICs and

other semiconductors not currently offered in a

surface mountable package.

SURFACE MOUNT PASSIVE COMPONENTS (E)

Ceramic and tantalum capacitors, chip inductors and

resistor chips all lend themselves to surface mount

assembly. Axial leaded components can be formed

and mounted as well.

PRECISION SCREENED RESISTORS (B)

Thick film resistors are screened directly onto the

substrate utilizing a wide range of resistor inks,

yielding high precision at low cost. Our thick film

resistors can be ratio matched to 0.1% with absolute

tolerances of 0.5%. Thick ﬁlm resistors can be located

underneath surface mount devices, or screened onto

the back of the substrate for increased circuit

densities.

ENCAPSULATION (F)

Surface mount hybrids do not normally require

encapsulation. However, encapsulation may be

applied if desired for rigidity or for protection of

proprietary circuit design. When chip and wire

elements are used, these are generally individually

“glob-topped” to provide protection for the device; the

entire module may then be fully encapsulated.

INTERCONNECT FLEXIBILITY (C)

Lead frames can be attached to accommodate a variety

of interconnection requirements. Leads can be afﬁxed

to any or all edges of the substrate and can be

conﬁgured for various mounting styles. Additionally, a

wide variety of standard sockets can be attached to

allow plug-in capability to your next level of assembly.

Model 143

7-7

143 [TTELEC]

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