TGP2615 [TRIQUINT]
15- to 19-GHz 6-Bit Digital Phase Shifter;
| 型号： | TGP2615 |
| 厂家： | 
TRIQUINT SEMICONDUCTOR |
| 描述： | 15- to 19-GHz 6-Bit Digital Phase Shifter |
| 文件： | 总9页 (文件大小：382K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TGP2615
15- to 19-GHz 6-Bit Digital Phase Shifter
Applications
Phased-Array Radar
Satellite Communications
Product Features
6-Bit Digital Phase Shifter
Frequency Range: 15 to 19 GHz
360° Coverage, LSB = 5.625°
RMS Phase Error: 4°
RMS Amplitude Error: 1 dB
Insertion Loss: 7 dB
Input Return Loss: >10 dB
Output Return Loss: >9 dB
Input IP3: >34 dBm
Functional Block Diagram
10
11
12
REF
REF
REF
+90
REF
REF
REF
+5
9
1
+22
8
+45
7
+180
4
+11
3
Input P1dB: >24 dBm
6
5
2
Positive Control Logic: 0/+3.3 V
Chip Dimensions: 2.11 x 1.47 x 0.10 mm
General Description
Pad Configuration
TriQuint’s TGP2615 is a 6-bit digital phase shifter
fabricated on TriQuint’s high-performance 0.15-μm GaAs
pHEMT process. It operates over 15 to 19 GHz, and
provides 360° of phase coverage with a LSB of
5.625°. It also achieves a low RMS phase error of 4°,
with 7-dB average insertion loss over all states.
Pad No.
1
Symbol
RF IN
5°
2
3
11°
4
180°
45°
5
The TGP2615 uses positive single-control-line switch
logic, eliminating the need for a negative voltage rail or
complimentary logic. This, combined with low insertion
loss and a high degree of resolution makes the
TGP2615 ideally suited for applications in phased-array
radar and satellite communications.
6
90°
7
22°
8
VREF
RF OUT
180°
11°
9
10
11
12
5°
The device is lead-free and RoHS compliant.
Ordering Information
Part
ECCN Description
6-Bit Digital Phase Shifter
(+Vc)
TGP2615
EAR99
Preliminary Datasheet: Rev - 07-11-14
Disclaimer: Subject to change without notice
- 1 of 9 -
© 2014 TriQuint
www.triquint.com
TGP2615
15- to 19-GHz 6-Bit Digital Phase Shifter
Absolute Maximum Ratings
Recommended Operating Conditions
Parameter
Control and Reference Voltage
Value
6 V
Parameter
Value
0/+3.3 V
+3.3 V
Control Voltage (5°, 11°, 22°, 45°, 90°, 180°)
Reference Voltage (VREF
)
Power Dissipation
0.8 W
30 dBm
200°C
Electrical specifications are measured at specified test
conditions. Specifications are not guaranteed over all
recommended operating conditions.
Input Power, CW, 50 Ω, 85°C
Channel Temperature
Mounting Temperature
(30 Seconds)
320°C
Storage Temperature
−55 to 150°C
Operation of this device outside the parameter ranges
given above may cause permanent damage. These are
stress ratings only, and functional operation of the device at
these conditions is not implied.
Electrical Specifications
Test conditions unless otherwise noted: 25°C. Control Voltage (REF, 5°, 11°, 22°, 45°, 90°, 180°) = 0/+3.3 V; See Bias Truth Table.
Parameter
Operational Frequency Range
Conditions
Min
15
Typ
Max
19
Units
GHz
dB
Insertion Loss
Average across all phase states
Average across all phase states
Average across all phase states
6 - 8
>10
>9
Input Return Loss
Output Return Loss
RMS Phase Error
RMS Amplitude Error
Input P1dB
dB
dB
4
deg
dB
1
>24
dBm
Tone spacing = 10 MHz
Pin/Tone = 15 dBm
Input IP3
>34
dBm
Insertion Loss Temperature Coefficient
Control Current
Average all phase states, 19 GHz
0.002
+/- 20
dB/°C
uA
Bias Truth Table
Logic “0” = 0 V, Logic “1” = VREF = +3.3 V
5°
0
1
0
0
0
0
0
1
180°
REF
Phase Shifter
0° (Reference)
11°
0
22°
0
45°
0
90°
0
0
0
0
0
1
0
1
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
5°
0
0
0
11°
22°
45°
90°
180°
355°
1
0
0
0
1
0
0
0
1
0
0
0
0
0
0
1
1
1
Preliminary Datasheet: Rev - 07-11-14
Disclaimer: Subject to change without notice
- 2 of 9 -
© 2014 TriQuint
www.triquint.com
TGP2615
15- to 19-GHz 6-Bit Digital Phase Shifter
Thermal and Reliability Information
Parameter
Test Conditions
Value
85
Units
°C
Channel Temperature (TCH)
Median Lifetime (TM)
Notes:
TBASEPLATE = 85°C
5.2E+9
Hrs
1. Under normal (lifetime) operating conditions, self-heating is not a significant contributor to channel temperature.
Median Lifetime
Median Lifetime vs. Channel Temperature
1E+15
1E+14
1E+13
1E+12
1E+11
1E+10
1E+09
1E+08
1E+07
1E+06
1E+05
1E+04
FET5
1E+03
25
50
75
100
125
150
175
200
Channel Temperature, TCH (°C)
Preliminary Datasheet: Rev - 07-11-14
Disclaimer: Subject to change without notice
- 3 of 9 -
© 2014 TriQuint
www.triquint.com
TGP2615
15- to 19-GHz 6-Bit Digital Phase Shifter
Typical Performance
RMS Phase Error vs Frequency
RMS Amplitude Error vs Frequency
All Phase States, VREF = 3.3 V
All Phase States, VREF = 3.3 V
5
4
3
2
1
0
2.5
-50 C
+25 C
2.0
+85 C
1.5
1.0
0.5
0.0
-50 C
+25 C
+85 C
15
16
17
18
19
15
15
15
16
17
18
19
Frequency (GHz)
Frequency (GHz)
Average Insertion Loss vs Temperature
Peak Insertion Loss vs Frequency
All Phase States, VREF = 3.3 V
All Phase States, 25 oC, VREF = 3.3 V
0
-2
0
-2
-50 C
+25 C
+85 C
Min
Avg
Max
-4
-4
-6
-6
-8
-8
-10
-10
15
16
17
18
19
16
17
18
19
Frequency (GHz)
Frequency (GHz)
Input Return Loss vs Temperature
Input Return Loss vs Frequency
All Phase States, VREF = 3.3 V
All Phase States, 25 oC, VREF = 3.3 V
0
-5
0
-5
Peak
Avg
-10
-15
-20
-25
-10
-15
-20
-25
-50 C
+25 C
+85 C
15
16
17
18
19
16
17
18
19
Frequency (GHz)
Frequency (GHz)
Preliminary Datasheet: Rev - 07-11-14
Disclaimer: Subject to change without notice
- 4 of 9 -
© 2014 TriQuint
www.triquint.com
TGP2615
15- to 19-GHz 6-Bit Digital Phase Shifter
Typical Performance
Output Return Loss vs Temperature
Output Return Loss vs Frequency
All Phase States, VREF = 3.3 V
All Phase States, 25 oC, VREF = 3.3 V
0
-5
0
Peak
-5
Avg
-10
-15
-20
-25
-10
-15
-20
-25
-50 C
+25 C
+85 C
15
15
15
16
17
18
19
19
19
15
16
17
18
19
Frequency (GHz)
Frequency (GHz)
Input TOI vs Frequency
Input TOI vs Frequency
Major Phase States, 25 oC, VREF = 3.3 V
Major Phase States, 85 oC, VREF = 3.3 V
43
40
37
34
31
28
43
40
37
34
31
28
0 deg
5 deg
22 deg
0 deg
5 deg
11 deg
45 deg
180 deg
11 deg
45 deg
180 deg
22 deg
90 deg
355 deg
90 deg
355 deg
16
17
Frequency (GHz)
18
15
16
17
Frequency (GHz)
18
19
Input P1dB vs Frequency
Loss Temperature Coefficient vs Frequency
Major Phase States, 25 oC, VREF = 3.3 V
All Phase States, -50 to +85 oC, VREF = 3.3 V
30
28
26
24
22
20
0.00
-0.05
-0.10
-0.15
-0.20
-0.25
0 deg
5 deg
Test Limit 28 dBm
11 deg
45 deg
180 deg
22 deg
90 deg
355 deg
16
17
Frequency (GHz)
18
15
16
17
18
19
Frequency (GHz)
Preliminary Datasheet: Rev - 07-11-14
Disclaimer: Subject to change without notice
- 5 of 9 -
© 2014 TriQuint
www.triquint.com
TGP2615
15- to 19-GHz 6-Bit Digital Phase Shifter
Mechanical Information and Bond Pad Description
Unit: millimeters
Thickness: 0.10
Die x,y size tolerance: ± 0.050
Chip edge to bond pad dimensions are shown to center of pad
Ground is backside of die
Bond Pad
1
Symbol
RF IN
Description
RF Input; 50 Ω; DC-Blocked
Pad Size
0.100 x 0.200
0.100 x 0.100
0.100 x 0.100
0.100 x 0.100
0.100 x 0.100
0.100 x 0.100
0.100 x 0.100
0.100 x 0.100
0.100 x 0.200
0.100 x 0.100
0.100 x 0.100
0.100 x 0.100
2
5°
5° Bit Control
3
11°
11° Bit Control
4
180°
45°
180° Bit Control
5
45° Bit Control
6
90°
90° Bit Control
7
22°
22° Bit Control
8
VREF
RF OUT
180°
11°
Reference voltage for logic “1”
RF Output; 50 Ω; DC-Blocked
180° Bit Alternate Control
11° Bit Alternate Control
5° Bit Alternate Control
9
10
11
12
5°
Preliminary Datasheet: Rev - 07-11-14
Disclaimer: Subject to change without notice
- 6 of 9 -
© 2014 TriQuint
www.triquint.com
TGP2615
15- to 19-GHz 6-Bit Digital Phase Shifter
Assembly Drawing
5O
180O
90O
V
22O
11O
45O
RF IN
RF OUT
-
-
The spacing between MMIC and TFN (at RF In or RF Out) is < 5 mils typical.
RF connections: Bond two 1 mil diameter, < 20 mils length, gold bond wires at RF In and RF Out for
optimum RF performance.
-
For fixtured testing, device was rotated 180 degrees from orientation in the page-1 chip photograph.
Preliminary Datasheet: Rev - 07-11-14
Disclaimer: Subject to change without notice
- 7 of 9 -
© 2014 TriQuint
www.triquint.com
TGP2615
15- to 19-GHz 6-Bit Digital Phase Shifter
Assembly Notes
Component placement and adhesive attachment assembly notes:
•
•
•
•
•
Vacuum pencils and/or vacuum collets are the preferred method of pick up.
Contact with air bridges must be avoided during placement.
The force impact is critical during auto placement.
Solder or Organic Adhesive attachment may be used for this part.
Devices must be stored in a dry nitrogen atmosphere.
Solder attachment reflow process assembly notes:
•
•
•
•
Use AuSn (80/20) solder and limit exposure to temperatures above 300°C to 3 to 4 minutes, maximum.
An alloy station or conveyor furnace with reducing atmosphere should be used.
Do not use any kind of flux.
Coefficient of thermal expansion matching is critical for long-term reliability.
Organic adhesive attachment assembly notes:
•
•
•
The organics such as epoxy or polyimide can be used.
Epoxies cure at temperatures of 100 to 200°C.
Curing should be done in a convection oven; proper exhaust is a safety concern.
Interconnect process assembly notes:
•
•
•
•
Thermosonic ball bonding is the preferred interconnect technique.
Force, time, and ultrasonics are critical parameters.
Aluminum wire should not be used.
Devices with small pad sizes should be bonded with 0.0007-inch wire.
Preliminary Datasheet: Rev - 07-11-14
Disclaimer: Subject to change without notice
- 8 of 9 -
© 2014 TriQuint
www.triquint.com
TGP2615
15- to 19-GHz 6-Bit Digital Phase Shifter
Product Compliance Information
ESD Sensitivity Ratings
Solderability
This part is compliant with EU 2002/95/EC RoHS
directive (Restrictions on the Use of Certain Hazardous
Substances in Electrical and Electronic Equipment).
Caution! ESD-Sensitive Device
This product also has the following attributes:
ESD Rating: TBD
Lead Free
Halogen Free (Chlorine, Bromine)
Antimony Free
TBBP-A (C15H12Br402) Free
PFOS Free
SVHC Free
Value:
Test:
TBD
Human Body Model (HBM)
Standard: JEDEC Standard JESD22-A114
ECCN
US Department of Commerce: EAR99
Contact Information
For the latest specifications, additional product information, worldwide sales and distribution locations, and
information about TriQuint:
Web: www.triquint.com
Email: info-sales@triquint.com
Tel:
Fax:
+1.972.994.8465
+1.972.994.8504
For technical questions and application information:
Email: info-products@triquint.com
Important Notice
The information contained herein is believed to be reliable. TriQuint makes no warranties regarding the information
contained herein. TriQuint assumes no responsibility or liability whatsoever for any of the information contained
herein. TriQuint assumes no responsibility or liability whatsoever for the use of the information contained herein. The
information contained herein is provided "AS IS, WHERE IS" and with all faults, and the entire risk associated with
such information is entirely with the user. All information contained herein is subject to change without notice.
Customers should obtain and verify the latest relevant information before placing orders for TriQuint products. The
information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any
patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or
anything described by such information.
TriQuint products are not warranted or authorized for use as critical components in medical, life-saving, or life-
sustaining applications, or other applications where a failure would reasonably be expected to cause severe personal
injury or death.
Preliminary Datasheet: Rev - 07-11-14
Disclaimer: Subject to change without notice
- 9 of 9 -
© 2014 TriQuint
www.triquint.com
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