TE0720-03-1CF_技术文档

TE0720 TRM

Revision: v.85

Exported on: 11/14/2017

TE0720 TRM

v.85

1 Table of Contents

1

2

Table of Contents................................................................................................. 2

Overview............................................................................................................... 4

2.1 Key Features............................................................................................................................... 4

2.2 Block Diagram ............................................................................................................................ 5

2.3 Main Components...................................................................................................................... 6

2.4 Initial Delivery State................................................................................................................... 7

3

4

Boot Process......................................................................................................... 8

Signals, Interfaces and Pins................................................................................. 9

4.1 Board to Board (B2B) I/Os ......................................................................................................... 9

4.2 JTAG Interface.......................................................................................................................... 10

4.3 System Controller CPLD I/O Pins............................................................................................. 10

4.4 Quad SPI Interface ................................................................................................................... 11

4.5 eMMC Interface......................................................................................................................... 11

4.6 Ethernet Interface .................................................................................................................... 12

4.7 USB Interface............................................................................................................................ 13

4.8 I2C Interface ............................................................................................................................. 14

5

On-board Peripherals ........................................................................................ 16

5.1 System Controller CPLD .......................................................................................................... 16

5.2 DDR Memory............................................................................................................................. 16

5.3 Quad SPI Flash Memory........................................................................................................... 16

5.4 eMMC Flash Memory ................................................................................................................ 16

5.5 Gigabit Ethernet PHY ............................................................................................................... 17

5.6 High-speed USB ULPI PHY ....................................................................................................... 17

5.7 RTC - Real Time Clock .............................................................................................................. 17

5.8 MAC-Address EEPROM ............................................................................................................. 18

5.9 Atmel CryptoAuthentication Chip........................................................................................... 18

5.10 eCompass module ................................................................................................................... 18

5.11 Oscillators................................................................................................................................. 18

5.12 On-board LEDs ......................................................................................................................... 19

6

Power and Power-On Sequence ....................................................................... 20

2 of 32

http://www.trenz-electronic.de

TE0720 TRM

v.85

6.1 Power Supply ........................................................................................................................... 20

6.2 Power-On Sequence ................................................................................................................ 20

6.3 Power Rails............................................................................................................................... 21

6.4 Bank Voltages........................................................................................................................... 22

7

Board to Board Connectors............................................................................... 24

7.1 Connector Mating height ......................................................................................................... 24

7.2 Connector Speed Ratings ........................................................................................................ 24

7.3 Current Rating.......................................................................................................................... 25

7.4 Connector Mechanical Ratings................................................................................................ 25

7.5 Manufacturer Documentation................................................................................................. 25

8

9

Variants Currently in Production....................................................................... 26

Technical Specifications.................................................................................... 27

9.1 Absolute Maximum Ratings..................................................................................................... 27

9.2 Recommended Operating Conditions .................................................................................... 28

9.3 Operating Temperature Ranges.............................................................................................. 28

9.4 Physical Dimensions ................................................................................................................ 28

10 Revision History ................................................................................................. 30

10.1 Hardware Revision History...................................................................................................... 30

10.2 Document Change History....................................................................................................... 30

11 Disclaimer........................................................................................................... 31

11.1 Document Warranty................................................................................................................. 31

11.2 Limitation of Liability............................................................................................................... 31

11.3 Copyright Notice ...................................................................................................................... 31

11.4 Technology Licenses................................................................................................................ 31

11.5 Environmental Protection ....................................................................................................... 31

11.6 REACH, RoHS and WEEE .......................................................................................................... 32

3 of 32

http://www.trenz-electronic.de

TE0720 TRM

v.85

2 Overview

Refer to https://wiki.trenz-electronic.de/display/PD/TE0720+TRM for online version of this

manual and additional technical documentation of the product.

The Trenz Electronic TE0720 is an industrial-grade SoM (System on Module) based on Xilinx

Zynq-7000 SoC (XC7Z020 or XC7Z014S) with up to 1 GB of DDR3/L SDRAM, 32MB of SPI flash

memory, Gigabit Ethernet PHY transceiver, a USB PHY transceiver and powerful switching-mode

power supplies for all on-board voltages. A large number of configurable I/Os is provided via

rugged high-speed stacking strips. See also Variants Currently in Production section.

2.1 Key Features

• Xilinx XC7Z SoC (XC7Z020 or XC7Z014S)

• Processing system (PS):

• XC7Z020: Dual-core ARM Cortex-A9 MPCore™ with CoreSight™

• XC7Z014S: Single-core ARM Cortex-A9 MPCore™ with CoreSight™

• L1 cache: 32 KByte instruction, 32 KByte data per processor

• L2 cache: Unified 512 KByte

• Programmable logic (PL): Artix-7 FPGA

• Programmable logic cells: 85K (XC7Z020), 65K (XC7Z014S)

• Block RAM: 4.9 MByte (XC7Z020), 3.8 MByte (XC7Z014S)

• DSP slices: 220 (XC7Z020), 170 (XC7Z014S)

• Peak DSP performance: 276 GMACs (XC7Z020), 187 GMACs (XC7Z014S)

• 2x 12 bit, MSPS ADCs with up to 17 differential inputs

• 54 multiuse I/O (MIO) pins

• 152 High-Range (HR) I/O pins (SelectIO interfaces)

• System Controller CPLD (Lattice LCMXO2-1200HC)

• Up to 1 GByte DDR3/L SDRAM memory (2 x 256 Mbit x 16, 32-bit wide data bus).

• 32 MByte Quad SPI Flash memory

• Gigabit Ethernet transceiver PHY (Marvell 88E1512)

• MAC address serial EEPROM with EUI-48™ node identity (11AA02E48)

• Highly integrated full-featured hi-speed USB 2.0 ULPI transceiver (Microchip USB3320C-

EZK)

• 3-axis accelerometer and 3-axis magnetometer (ST Microelectronics LSM303DTR)

(Optional!)

• Real time clock with embedded crystal (Intersil ISL12020M): ±5ppm accuracy

• Atmel CryptoAuthentication element (Atmel ATSHA204A)

• Up to 32 GByte eMMC, usually 4 GByte, depends on module variant and assembly option

• User LED 1 (Green), user LED 2 (Red), user LED 3 - FPGA DONE (Green)

• On-board high-efficiency DC-DC converters for all voltages used

• Trenz 4 x 5 module socket connectors (3 x Samtec LSHM series connectors)

4 of 32

http://www.trenz-electronic.de

TE0720 TRM

v.85

• Evenly spread supply pins for good signal integrity

• Rugged for shock and high vibration

Additional assembly options are available for cost or performance optimization upon request.

2.2 Block Diagram

Figure 1: TE0720-03 block diagram.

Components and connections marked with dashed lines are optional or may be missing on

some module variants, please contact us for additional information.

5 of 32

http://www.trenz-electronic.de

TE0720 TRM

v.85

2.3 Main Components

Figure 2: Main components of the module.

1. Xilinx Zynq XC7Z SoC, U5

2. 4 Gbit DDR3/L SDRAM, U13

3. 4 Gbit DDR3/L SDRAM, U12

4. Low-power RTC with battery backed SRAM, U20

5. 32 MByte Quad SPI Flash memory, U7

6. Red LED (LED1), D5

7. Green LED (LED2), D2

8. System Controller CPLD, U19

9. eMMC NAND Flash, U15

10. 4A high-efficiency PowerSoC DC-DC step-down converter (1V), U1

11. Green LED (DONE), D4

12. B2B connector Samtec Razor Beam™ LSHM-130, JM3

13. B2B connector Samtec Razor Beam™ LSHM-150, JM1

14. B2B connector Samtec Razor Beam™ LSHM-150, JM2

15. Hi-speed USB 2.0 ULPI transceiver, U18

16. Gigabit Ethernet (GbE) transceiver, U8

17. Low-power programmable oscillator @ 52.000000 MHz (OTG-RCLK), U14

18. Low-power programmable oscillator @ 33.333333 MHz (PS-CLK), U6

19. Low-dropout regulator (VBATT), U24

20. DDR termination regulator, U4

21. 1.5A PowerSoC DC-DC step-down converter with integrated inductor (1.5V), U2

22. Atmel CryptoAuthentication chip, U10

23. 2Kbit UNI/O® serial EEPROM with EUI-48™ node identity, U17

24. Low-power programmable oscillator @ 25.000000 MHz (ETH-CLK), U9

25. 1.5A PowerSoC DC-DC step-down converter with integrated inductor (1.8V), U3

26. 3A PFET load switch with configurable slew rate (3.3V), Q1

6 of 32

http://www.trenz-electronic.de

TE0720 TRM

v.85

2.4 Initial Delivery State

Storage device name

Content

Notes

IC

Quad SPI Flash

Empty

U

7

-

eMMC NAND Flash

U

15

Empty

-

Pre-programmed globally

unique, 48-bit node address

(MAC)

11AA02E48T EEPROM

U

17

System Controller

CPLD

U

19

Standard firmware.

Download firmware

Table 1: Initial state of programmable devices on delivery of the module.

7 of 32

http://www.trenz-electronic.de

TE0720 TRM

v.85

3 Boot Process

By default the TE-0720 supports QSPI and SD Card boot modes which is controlled by the MODE

input signal from the B2B JM1 connector.

MODE Signal State

Boot Mode

High or open

QSPI

Low or connected to the ground SD Card

Table 14: Boot modes.

8 of 32

http://www.trenz-electronic.de

TE0720 TRM

v.85

4 Signals, Interfaces and Pins

4.1 Board to Board (B2B) I/Os

PL I/O signal connections between Zynq SoC's I/O banks and B2B connectors, 152 HR GPIOs

total.

Bank Type

Voltage

HR GPIO VCCIO13 JM2 48

HR GPIO VCCIO13 JM2

B2B I/O Count Notes

13

33

34

35

24 LVDS pairs

2

B13_IO0 and B13_IO25

9 LVDS pairs

HR GPIO VCCIO33 JM2 18

HR GPIO VCCIO34 JM3 36

HR GPIO VCCIO35 JM1 48

18 LVDS pairs

24 LVDS pairs

Table 2: General PL I/O to B2B connectors information.

PS MIO bank 500 and 501 signal connections to B2B JM1 connector, 14 PS MIOs total.

MIO

0

B2B Pin

JM1-87

JM1-91

JM1-95

JM1-93

JM1-99

JM1-97

JM1-92

JM1-85

JM1-27

JM1-25

JM1-23

JM1-21

Bank

500

501

Voltage

3.3V

1.8V

Notes

9

10

11

12

13

14

15

40

41

42

43

Also wired to U19-M4

Also wired to U19-N4

Zynq SoC SD0

9 of 32

http://www.trenz-electronic.de

TE0720 TRM

v.85

44

45

JM1-19

JM1-17

501

1.8V

Zynq SoC SD0

Table 3: General PS MIO connections information.

For detailed information about the pin-out, please refer to the Pin-out tables.

4.2 JTAG Interface

JTAG access to the Zynq SoC and System Controller CPLD is provided through B2B connector

JM2.

JTAG Signal B2B Connector Pin

TMS

TDI

JM2-93

JM2-95

JM2-97

JM2-99

TDO

TCK

Table 4: JTAG pins connection.

JTAGMODE pin 89 in B2B connector JM1 is used to switch access between devices, low

selects Zynq SoC, high selects System Controller CPLD.



4.3 System Controller CPLD I/O Pins

Special purpose pins are connected to System Controller CPLD and have following default

configuration:

Mode

Function

Default Configuration

Name

RESIN

Input

Reset input Active low reset input, default mapping forces POR_B

reset to Zynq PS.

PGOO

D

Output Power

good

Active high when all on-module power supplies are

working properly.

MODE

Input

Boot mode

Force low for boot from the SD card. Latched at power-on

only, not during soft reset!

10 of 32

http://www.trenz-electronic.de

TE0720 TRM

v.85

EN1

Input

Power

enable

High enables the DC-DC converters and on-board

supplies. Not used if NOSEQ is high.

NOSE

Q

Power

Forces the 1.0V and 1.8V DC-DC converters always ON

sequencing when high.

JTAG

JTAG select Keep low for FPGA JTAG access.

MODE

MIO7

Input/

Output

GPIO

Connected to System Controller CPLD pin P11, function

depends on firmware

Table 5: System Controller CPLD special purpose pins description.

4.4 Quad SPI Interface

Quad SPI Flash (U7) is connected to the Zynq PS QSPI0 interface via PS MIO bank 500, pins

MIO1..6.

MIO Signal Name U7 Pin

1

2

3

4

5

6

SPI-CS

C2

D3

D2

C4

D4

B2

SPI-DQ0/M0

SPI-DQ1/M1

SPI-DQ2/M2

SPI-DQ3/M3

SPI-SCK/M4

Table 6: Quad SPI interface MIOs and pins.

4.5 eMMC Interface

The TE0720 has on-board eMMC memory device (U15) except TE0720-03-1CR variant. At least

three different eMMC devices have been used, please contact Trenz Electronic for more specific

information.

MIO Signal Name U15 Pin

46

47

MMC-D0

H3

MMC-CMD

W5

11 of 32

http://www.trenz-electronic.de

TE0720 TRM

v.85

48

49

50

51

MMC-CLK

MMC-D1

MMC-D2

MMC-D3

W6

H4

H5

J2

Table 7: eMMC interface MIOs and pins.

4.6 Ethernet Interface

The Marvell Alaska 88E1512 (U8) is a physical layer device containing a single Gigabit Ethernet

transceiver and three separate major electrical interfaces: MDI interface to copper cable,

SERDES/SGMII interface and RGMII interface. RGMII interface is connected to the Zynq SoC PS

bank 501 MIO pins, see tables below.

SGMII (SFP copper or fiber) pins are routed to the B2B connector JM3 and MDI pins are routed to

the B2B connector JM1 (see table below).

Ethernet PHY to B2B connections

PHY Signal

SOUT_N

SOUT_P

SIN_N

B2B Pin

JM3-1

JM3-3

JM3-2

JM3-4

PHY Signal

B2B Pin

PHY_MDI1_P JM1-10

PHY_MDI1_N JM1-12

PHY_MDI2_P JM1-16

PHY_MDI2_N JM1-18

PHY_MDI3_P JM1-22

PHY_MDI3_N JM1-24

SIN_P

PHY_MDI0_P JM1-4

PHY_MDI0_N JM1-6

Table 8: Ethernet PHY to B2B connections.

Ethernet PHY to Zynq SoC PS MIO ETH0 connections

PHY Signal SoC MIO

ETH-TXCK

ETH-TXD0

ETH-TXD1

16

17

ETH-RXCK

ETH-RXD0

ETH-RXD1

22

23

24

18

ETH-TXD2

19

ETH-RXD2

25

12 of 32

http://www.trenz-electronic.de

TE0720 TRM

ETH-RXD3 26

v.85

ETH-TXD3

ETH-TXCTL

ETH-MDC

20

21

52

ETH-RXCTL

ETH-MDIO

27

53

Table 9: Ethernet PHY to Zynq SoC connections.

4.7 USB Interface

Hi-speed USB ULPI PHY is provided by USB3320 from Microchip (U18). The ULPI interface is

connected to the Zynq SoC PS USB0 via MIO28..39, bank 501.

USB PHY Signal Wired to SoC MIO

OTG-DATA4

OTG-DIR

U18-7

28

29

U18-31

OTG-STP

U18-29

U18-2

U18-3

U18-4

U18-5

U18-6

U18-1

U18-9

U18-10

U18-13

30

31

32

33

34

35

36

37

38

39

OTG-NXT

OTG-DATA0

OTG-DATA1

OTG-DATA2

OTG-DATA3

OTG-CLK

OTG-DATA5

OTG-DATA6

OTG-DATA7

Table 10: USB ULPI PHY to Zynq SoC connections.

USB PHY connection

13 of 32

http://www.trenz-electronic.de

TE0720 TRM

v.85

USB PHY

SC CPLD

B2B

Name

Notes

REFSEL0..

2

-

Reference clock frequency select, all set to GND =

52.000000 MHz.

RESETB

B14, bank

1

Active low reset.

CLKOUT

DP, DM

-

ULPI output clock connected to Zynq PS MIO36.

USB data lines.

OTG-

D_P,

OTG-D_N

CPEN

VBUS

ID

VBUS_V_

EN

External USB power switch active high enable

signal.

-

USB-

VBUS

Connect to USB VBUS via a series of resistors, see

reference schematic.

OTG-ID

For A-device connect to the ground, for B-device

leave floating.

SPK_L

SPK_R

M5, bank

2

-

In USB audio mode a switch connects the DM pin to

the SPK_L.

M8, bank

2

In USB audio mode a switch connects the DP pin to

the SPK_R.

Table 11: USB ULPI PHY connections.

4.8 I2C Interface

2

On-board I C devices are connected to the System Controller CPLD which acts as a I C bus

repeater for the Zynq SoC. System Controller CPLD signals X1, X3 and X7 are routed to Zynq SoC

bank 34. Exact functionality depends on the System Controller CPLD firmware.

Signal Name SC CPLD Pin SoC Pin Notes

X1

X5

X7

F1

J1

M1

L16

P22

N22

SCL, I2C clock.

SDA, I2C data out.

SDA, I2C data in.

2

Table 12: Zynq SoC to System Controller CPLD I C bus.

14 of 32

http://www.trenz-electronic.de

TE0720 TRM

v.85

2

IC

Notes

I C Device

I C Address

ISL12020M RTC

ISL12020M SRAM

LSM303D

0x6F

0x57

0x1D

U20 RTC registers.

U20 Battery backed RAM in RTC IC.

U22 Optional, not soldered on current production

variants.

2

Table 13: I C slave device addresses.

15 of 32

http://www.trenz-electronic.de

TE0720 TRM

v.85

5 On-board Peripherals

5.1 System Controller CPLD

The System Controller CPLD (U19) is provided by Lattice Semiconductor LCMXO2-1200HC

(MachXO2 product family). The System Controller CPLD is the central system management unit

where essential control signals are logically linked by the implemented logic in System

Controller CPLD firmware, which generates output signals to control the system, the on-board

2

peripherals and the interfaces. Also interfaces like JTAG and I C between the on-board

peripherals and to the Zynq SoC are by-passed, forwarded and controlled.

Other tasks of the System Controller CPLD are monitoring of the power-on sequence and to

indicate the programming state of the Zynq SoC FPGA.

For more detailed information, refer to the TE0720 System Controller CPLD firmware page.

5.2 DDR Memory

By default TE0720 module has two DDR3/L SDRAM chips arranged into 32-bit wide memory bus

providing total on-board memory size up to 1 GBytes. Size of memory depends on the module

variant, refer to the variants table.

5.3 Quad SPI Flash Memory

On-board 32-MByte QSPI flash memory S25FL256S (U7) is used to store initial FPGA

configuration. Besides FPGA configuration, remaining free flash memory can be used for user

application and data storage. All four SPI data lines are connected to the FPGA allowing x1, x2 or

x4 data bus widths. Maximum data rate depends on the selected bus width and clock frequency

used.

SPI Flash QE (Quad Enable) bit must be set to high or FPGA is unable to load its

configuration from flash during power-on. By default this bit is set to high at the

manufacturing plant.



5.4 eMMC Flash Memory

eMMC Flash memory device(U15) is connected to the Zynq PS MIO bank 501 pins MIO46..MIO51

(see also Variants Currently in Production for options). Depending on the module variant,

different make and model of eMMC chips are available.

16 of 32

http://www.trenz-electronic.de

TE0720 TRM

v.85

5.5 Gigabit Ethernet PHY

On-board Gigabit Ethernet PHY is provided with Marvell Alaska 88E1512 IC (U8). The Ethernet

PHY RGMII interface is connected to the Zynq Ethernet0 PS GEM0. I/O voltage is fixed at 1.8V for

HSTL signalling. The reference clock input of the PHY is supplied from an on-board 25.000000

MHz oscillator (U9), the 125MHz output clock signal CLK_125MHZ is connected to the pin G13 of

the System Controller CPLD chip (U19).

PHY Signal

ETH-MDC

SC CPLD Pin

L14

ETH-MDIO

PHY_LED0

PHY_LED1

PHY_LED2

PHY_CONFIG

ETH-RST

K14

F14

D12

C13

C14

E14

CLK_125MHZ

G13

Table 15: Ethernet PHY to SC CPLD connections.

5.6 High-speed USB ULPI PHY

Hi-speed USB ULPI PHY is provided with USB3320 from Microchip. The ULPI interface is

connected to the Zynq PS USB0 via MIO28..39, bank 501 (see also section. The I/O voltage is

fixed at 1.8V and PHY reference clock input is supplied from the on-board 52.000000 MHz

oscillator (U14).

5.7 RTC - Real Time Clock

Temperature compensated Intersil ISL12020M IC is used for Real Time Clock (U20). Battery

voltage must be supplied to the module VBAT_IN pin from the carrier board to use battery

2

backed functionality. Battery backed registers can be accessed over I C bus at slave address of

2

0x6F. General purpose RAM is at I C slave address 0x57. RTC IC is supported by Linux so it can be

used as hwclock device.

17 of 32

http://www.trenz-electronic.de

TE0720 TRM

v.85

5.8 MAC-Address EEPROM

A Microchip 2Kbit 11AA02E48 serial EEPROM (U17) is connected to the System Controller CPLD

pin M14 via single-I/O UNI/O serial interface and contains pre-programmed globally unique 48-

TM

bit node address compatible with EUI-48 specification. Chip is programmed at the factory

with a globally unique node address stored in the upper 1/4 of the memory array and write-

protected through the STATUS register. The remaining 1,536 bits are available for application

use.

5.9 Atmel CryptoAuthentication Chip

TM

The ATSHA204A Atmel CryptoAuthentication chip (U10) is connected to the System Controller

CPLD pin N14 via single-wire interface providing various security functions and features such as

anti-counterfeiting, firmware/media protection, password validation, secure session key

exchanging, secure data storage and more. Refer to the product datasheet for more

information.

5.10 eCompass module

Optionally TE0720 module can be fitted with ultra-compact high-performance eCompass device

(LSM303D, U22) featuring 3D accelerometer and 3D magnetometer.

5.11 Oscillators

Sourc

e

Signal

Frequency

Destinatio Pin Name

n

Notes

PS-CLK

33.333333

MHz

U5

PS_CLK_50 Zynq SoC PS subsystem

U6

0

main clock.

OTG-

RCLK

52.000000

MHz

REFCLK

USB3320C PHY reference

clock.

U14

U9

U18

U8

ETH-

CLK

25.000000

MHz

XTAL_IN

88E1512 PHY reference

clock.

Table 16: Oscillators.

18 of 32

http://www.trenz-electronic.de

TE0720 TRM

v.85

5.12 On-board LEDs

LED Color Connected to Description and Notes

D2

D4

D5

Green LED1

Green DONE

Controlled by System Controller CPLD firmware.

Red

LED2

Controlled by System Controller CPLD firmware.

Table 17: On-board LEDs.

19 of 32

http://www.trenz-electronic.de

TE0720 TRM

v.85

6 Power and Power-On Sequence

6.1 Power Supply

Power supply with minimum current capability of 3A for system startup is recommended.

Power Consumption

Power Input Pin Typical Current

VIN

TBD*

3.3VIN

Table 18: Power Consumption.

* TBD - To Be Determined.

Power Distribution Diagram

Figure 3: Power distribution diagram.

Current rating of Samtec Razor Beam™ LSHM B2B connectors is 2.0A per pin (2 adjacent



pins powered).

6.2 Power-On Sequence

For highest efficiency of the on-board DC-DC regulators, it is recommended to use single 3.3V

power source for both VIN and 3.3VIN power rails. Although VIN and 3.3VIN can be powered up in

any order, it is recommended to power them up simultaneously.

20 of 32

http://www.trenz-electronic.de

TE0720 TRM

v.85

It is important that all carrier board I/Os are 3-stated at power-on until System Controller CPLD

sets PGOOD signal high (B2B connector JM1, pin 30), or 3.3V is present on B2B connector JM2

pins 10 and 12, meaning that all on-module voltages have become stable and module is

properly powered up.

See also Xilinx datasheet DS187 for additional information. User should also check related

carrier board documentation when choosing carrier board design for TE0720 module.

NOSEQ input signal

NOSEQ input signal from the carrier board can be used to control output of the two DC-DC

converters U1 and U3. It works in conjunction with the System Controller CPLD firmware

controlled ON_1V0 and ON_1V8 input signals of the U21 and U25 gate ICs.

If NOSEQ input signal from the carrier board

is low (logical 0), signals ON_1V0 and

ON_1V8 can be driven by System Controller

CPLD to control outputs of the U1 and U3

DC-DC converters.

If NOSEQ input signal from the carrier board

is high (logical 1), state of the ON_1V0 and

ON_1V8 signals is irrelevant and DC-DC

converters U1 and U3 outputs are always

enabled.

Figure 4: Power sequencing.

Initial state of the ON_1V0 and ON_1V8 signals and therefore also functionality of the

NOSEQ signal depend on the System Controller CPLD firmware.



6.3 Power Rails

B2B

Name

B2B JM1

Pins

B2B JM2

Pins

Direct

ion

Note

VIN

1, 3, 5

2, 4, 6, 8

Input

Supply voltage from carrier board.

21 of 32

http://www.trenz-electronic.de

TE0720 TRM

v.85

3.3VIN

13, 15

91

Input

Supply voltage from carrier board. JM2-91

is VREF_JTAG.

VCCIO3

5

9, 11

-

High range bank voltage from carrier

board.

VCCIO3

3

-

5

High range bank voltage from carrier

board.

VCCIO1

3

-

7, 9

1, 3

-

High range bank voltage from carrier

board.

VCCIO3

4

-

High range bank voltage from carrier

board.

VBAT_I

N

79

-

RTC battery-buffer supply voltage.

Internal 3.3V voltage level.

Internal 1.8V voltage level.

Internal 1.5V voltage level.

3.3V

10, 12

-

Outpu

t

1.8V

39

-

Outpu

t

1)

19

Outpu

t

1.5V

Table 19: Module power rails.

1)

In case of module variant of TE0720-03-L1IF which uses Xilinx Zynq XC7Z020-L1CLG484I chip

with lower power consumption, power rails named 1.5V and VCCO_DDR_502 voltage is actually

1.35V. To achieve this, a resistor with different value is used for R4 (see schematic of the

TE0720-03-L1IF for more information).

6.4 Bank Voltages

Bank

Voltage

Schematic Name

Notes

500

3.3V, VCCO_MIO0_500

1.8V, VCCO_MIO1_501

1.5V, VCCO_DDR_502

3.3V

1.8V

1.5V

3.3V

501

502

0 Config

22 of 32

http://www.trenz-electronic.de

TE0720 TRM

v.85

Bank

Voltage

Schematic Name

Notes

13 HR

33 HR

34 HR

35 HR

VCCO13

VCCIO33

VCCIO34

VCCIO35

1.2V to 3.3V

Supplied by the carrier board.

1.2V to 3.3V

Table 20: Zynq SoC bank voltages.

23 of 32

http://www.trenz-electronic.de

TE0720 TRM

v.85

7 Board to Board Connectors

These connectors are hermaphroditic. Odd pin numbers on the module are connected to

even pin numbers on the baseboard and vice versa.



4 x 5 modules use two or three Samtec Razor Beam LSHM connectors on the bottom side.

• 2 x REF-189016-02 (compatible to LSHM-150-04.0-L-DV-A-S-K-TR), (100 pins, "50" per row)

• 1 x REF-189017-02 (compatible to LSHM-130-04.0-L-DV-A-S-K-TR), (60 pins, "30" per row)

(depending on module)

7.1 Connector Mating height

When using the same type on baseboard, the mating height is 8mm. Other mating heights are

possible by using connectors with a different height

Connector on baseboard

compatible to

Mating height

6.5 mm

REF-189016-01

LSHM-150-02.5-L-DV-A-S-K-TR

LSHM-150-03.0-L-DV-A-S-K-TR LSHM-150-03.0-L-DV-A-S-K-TR

REF-189016-02 LSHM-150-04.0-L-DV-A-S-K-TR

LSHM-150-06.0-L-DV-A-S-K-TR LSHM-150-06.0-L-DV-A-S-K-TR

REF-189017-01 LSHM-130-02.5-L-DV-A-S-K-TR

LSHM-130-03.0-L-DV-A-S-K-TR LSHM-130-03.0-L-DV-A-S-K-TR

REF-189017-02 LSHM-130-04.0-L-DV-A-S-K-TR

LSHM-130-06.0-L-DV-A-S-K-TR LSHM-130-06.0-L-DV-A-S-K-TR

7.0 mm

8.0 mm

10.0mm

6.5 mm

7.0 mm

8.0 mm

10.0mm

The module can be manufactured using other connectors upon request.

7.2 Connector Speed Ratings

The LSHM connector speed rating depends on the stacking height; please see the following

table:

Stacking height

Speed rating

12 mm, Single-Ended 7.5 GHz / 15 Gbps

24 of 32

http://www.trenz-electronic.de

TE0720 TRM

v.85

6.5 GHz / 13 Gbps

12 mm, Differential

5 mm, Single-Ended

5 mm, Differential

11.5 GHz / 23 Gbps

7.0 GHz / 14 Gbps

7.3 Current Rating

Current rating of Samtec Razor Beam™ LSHM B2B connectors is 2.0A per pin (2 adjacent pins

powered).

7.4 Connector Mechanical Ratings

• Shock: 100G, 6 ms Sine

• Vibration: 7.5G random, 2 hours per axis, 3 axes total

7.5 Manufacturer Documentation

Geändert

07 04, 2016 by Thorsten Trenz

25 of 32

http://www.trenz-electronic.de

TE0720 TRM

v.85

8 Variants Currently in Production

RAM

eMMC

Size

Temperatur B2B

Module Variant

Zynq SoC

e

Connector

Range

Height

TE0720-03-2IF

XC7Z020-2CLG4

84I

1 GByte

4 GByte Industrial

4.0 mm

TE0720-03-2IF

C3

XC7Z020-2CLG4

84I

2.5 mm

4.0 mm

TE0720-03-2IF

C8

XC7Z020-2CLG4

84I

32

Industrial

GByte

TE0720-03-

L1IF

XC7Z020-

L1CLG484I

512

MByte

4 GByte Industrial

TE0720-03-1CF XC7Z020-1CLG4

1 GByte

4 GByte Commercial

84C

TE0720-03-1CR XC7Z020-1CLG4

256

MByte

-

Commercial

84C

TE0720-03-14S

-1C

XC7Z014S-1CLG

484C

1 GByte

4 GByte Commercial

4 GByte Automotive

TE0720-03-1QF XA7Z020-1CLG4

84Q

Table 21: Module variants currently in production.

26 of 32

http://www.trenz-electronic.de

TE0720 TRM

v.85

9 Technical Specifications

9.1 Absolute Maximum Ratings

Parameter

U

ni

ts

Reference Document

Mi

n

Max

VIN supply voltage

V

-0.

3

6.5

3.75

3.6

EP53F8QI datasheet.

TPS27082L and

3.3VIN supply voltage

-0.

1

LCMXO2-1200HC datasheets.

Supply voltage for PS MIO

banks

-0.

5

See Xilinx DS187 datasheet.

I/O input voltage for MIO

banks

-0.

4

VCCO_MIO +

0.55

(VCCO_MIO0_500,

VCCO_MIO1_501)

See Xilinx DS187 datasheet.

Supply voltage for HR I/Os

banks

-0.

5

3.6

V

(VCCIO13, VCCIO33, VCCIO34,

VCCIO35)

I/O input voltage for HR I/O

banks

-0.

4

VCCIO + 0.55

V

See Xilinx DS187 datasheet.

-

Storage temperature

-40 +85

-55

°C

Storage temperature without

the ISL12020MIRZ, eMMC Flash

and 88E1512 PHY installed

+100

°C NB! Module variants using

Nanya SDRAM chips, max

temperature limit is +125 °C.

Table 22: Module absolute maximum ratings.

Assembly variants for higher storage temperature range are available on request.



Please check Xilinx datasheet DS187 for complete list of absolute maximum and

recommended operating ratings.

27 of 32

http://www.trenz-electronic.de

TE0720 TRM

v.85

9.2 Recommended Operating Conditions

Parameter

Min

Max

Un Reference Document

its

VIN supply voltage

3.3VIN supply voltage

2.5

5.5

V

EN6347QI and EP53F8QI

datasheets.

3.13

5

3.465

3.3V +/- 5%.

Supply voltage for PS

MIO banks

1.71

See Xilinx DS187 datasheet.

I/O input voltage for PS

MIO banks

-0.2

0

VCCO_MIO +

0.20

Supply voltage for HR I/

Os banks

1.14

3.465

I/O input voltage for HR

I/O banks

-0.2

0

VCCIO + 0.20

Table 23: Recommended operating conditions.

9.3 Operating Temperature Ranges

Commercial grade: 0°C to +70°C.

Industrial and automotive grade: -40°C to +85°C.

Operating temperature range depends also on customer design and cooling solution. Please

contact us for options.

9.4 Physical Dimensions

• Module size: 50 mm × 40 mm. Please download the assembly diagram for exact numbers.

• Mating height with standard connectors: 8 mm.

• PCB thickness: 1.6 mm.

• Highest part on PCB: approx. 2.5 mm. Please download the step model for exact numbers.

All dimensions are given in millimeters.

28 of 32

http://www.trenz-electronic.de

TE0720 TRM

v.85

Figure 5: TE0720 module physical dimensions.

29 of 32

http://www.trenz-electronic.de

TE0720 TRM

v.85

10 Revision History

10.1 Hardware Revision History

Notes

Date

Revision

PCN Documentation Link

2015-10-12

03

02

TE0720-03

TE0720-02

-

01

Prototypes

Table 24: Hardware revision history table.

There is no hardware revision number marking on the module PCB.

10.2 Document Change History

Date

2017-11-10

Revision Contributors Description

• Replace B2B connector section

• Correction of Boot Mode section

• Initial document.

v.85

John Hartfiel

Jan Kumann

v.84

v.83

2017-09-07

2017-08-31

Table 25: Document change history table.

30 of 32

http://www.trenz-electronic.de

TE0720 TRM

v.85

11 Disclaimer

11.1 Document Warranty

The material contained in this document is provided “as is” and is subject to being changed at

any time without notice. Trenz Electronic does not warrant the accuracy and completeness of

the materials in this document. Further, to the maximum extent permitted by applicable law,

Trenz Electronic disclaims all warranties, either express or implied, with regard to this

document and any information contained herein, including but not limited to the implied

warranties of merchantability, fitness for a particular purpose or non infringement of

intellectual property. Trenz Electronic shall not be liable for errors or for incidental or

consequential damages in connection with the furnishing, use, or performance of this document

or of any information contained herein.

11.2 Limitation of Liability

In no event will Trenz Electronic, its suppliers, or other third parties mentioned in this document

be liable for any damages whatsoever (including, without limitation, those resulting from lost

profits, lost data or business interruption) arising out of the use, inability to use, or the results of

use of this document, any documents linked to this document, or the materials or information

contained at any or all such documents. If your use of the materials or information from this

document results in the need for servicing, repair or correction of equipment or data, you

assume all costs thereof.

11.3 Copyright Notice

No part of this manual may be reproduced in any form or by any means (including electronic

storage and retrieval or translation into a foreign language) without prior agreement and

written consent from Trenz Electronic.

11.4 Technology Licenses

The hardware / firmware / software described in this document are furnished under a license

and may be used /modified / copied only in accordance with the terms of such license.

11.5 Environmental Protection

To confront directly with the responsibility toward the environment, the global community and

eventually also oneself. Such a resolution should be integral part not only of everybody's life.

Also enterprises shall be conscious of their social responsibility and contribute to the

preservation of our common living space. That is why Trenz Electronic invests in the protection

of our Environment.

31 of 32

http://www.trenz-electronic.de

TE0720 TRM

v.85

11.6 REACH, RoHS and WEEE

REACH

Trenz Electronic is a manufacturer and a distributor of electronic products. It is therefore a so

called downstream user in the sense of REACH. The products we supply to you are solely non-

chemical products (goods). Moreover and under normal and reasonably foreseeable

circumstances of application, the goods supplied to you shall not release any substance. For

that, Trenz Electronic is obliged to neither register nor to provide safety data sheet. According to

present knowledge and to best of our knowledge, no SVHC (Substances of Very High Concern)

on the Candidate List are contained in our products. Furthermore, we will immediately and

unsolicited inform our customers in compliance with REACH - Article 33 if any substance present

in our goods (above a concentration of 0,1 % weight by weight) will be classified as SVHC by the

European Chemicals Agency (ECHA).

RoHS

Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and

distributed RoHS compliant.

WEEE

Information for users within the European Union in accordance with Directive 2002/96/EC of the

European Parliament and of the Council of 27 January 2003 on waste electrical and electronic

equipment (WEEE).

Users of electrical and electronic equipment in private households are required not to dispose

of waste electrical and electronic equipment as unsorted municipal waste and to collect such

waste electrical and electronic equipment separately. By the 13 August 2005, Member States

shall have ensured that systems are set up allowing final holders and distributors to return

waste electrical and electronic equipment at least free of charge. Member States shall ensure

the availability and accessibility of the necessary collection facilities. Separate collection is the

precondition to ensure specific treatment and recycling of waste electrical and electronic

equipment and is necessary to achieve the chosen level of protection of human health and the

environment in the European Union. Consumers have to actively contribute to the success of

such collection and the return of waste electrical and electronic equipment. Presence of

hazardous substances in electrical and electronic equipment results in potential effects on the

environment and human health. The symbol consisting of the crossed-out wheeled bin

indicates separate collection for waste electrical and electronic equipment.

Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676.

32 of 32

http://www.trenz-electronic.de


型号：	TE0720-03-1CF
厂家：	Trenz Electronic
描述：	Evenly spread supply pins for good signal integrity
文件：	总32页 (文件大小：2304K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

TE0720-03-1CF [TRENZ]

相关型号：

TE0720-03-1CR

TE0720-03-1QF

TE0720-03-2IF

TE0720-03-2IFC3

TE0720-03-2IFC8

TE0720-03-L1IF

TE09019100J0G

TE100-DFXM

TE100-DM24

TE100-DS24

TE100-DSM

TE100-DTXM