TORX196 [TOSHIBA]

FIBER OPTIC RECEIVING MODULE; 光纤接收模块
TORX196
型号: TORX196
厂家: TOSHIBA    TOSHIBA
描述:

FIBER OPTIC RECEIVING MODULE
光纤接收模块

光纤
文件: 总9页 (文件大小:163K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
TORX196  
FIBER OPTIC RECEIVING MODULE  
TORX196  
FIBER OPTIC RECEIVING MODULE  
Unit: mm  
FOR SIMPLEX DIGITAL SIGNAL  
TRANSMISSION  
l Data rate : DC to 6 Mb / s (NRZ code)  
l Transmission distance:  
Up to 40 m (APF)  
Up to 1000 m (PCF)  
l TTL Interface  
l ATC (Automatic Threshold Control)  
Circuit is used for stabilized output at a wide  
range of optical power level.  
l Wide Dynamic Range.  
1. Maximum Ratings (Ta = 25°C)  
Characteristics  
Storage Temperature  
Symbol  
Rating  
Unit  
T
40 to 85  
40 to 85  
0.5 to 7  
20  
°C  
°C  
V
stg  
opr  
CC  
OL  
Operating Temperature  
Supply Voltage  
T
V
Low Level Output Current  
High Level Output Current  
Soldering Temperature  
I
mA  
mA  
°C  
I
1  
OH  
T
sol  
260 (Note 1)  
Note 1: Soldering time 3 s (More than 1 mm apart from the package).  
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2. Recommended Operating Conditions  
Characteristics  
Supply Voltage  
Symbol  
Min  
Typ.  
Max  
Unit  
V
4.75  
5.0  
5.25  
60  
1.2  
V
CC  
High Level Output Current  
Low Level Output Current  
I
µA  
mA  
OH  
I
OL  
3. Electrical and Optical Characteristics (Ta = 25°C, V = 5 V)  
CC  
Characteristics  
Symbol  
Test Condition  
Min  
Typ.  
Max  
Unit  
Data Rate  
NRZ code  
(Note 2)  
DC  
0.2  
0.2  
6
Mb / s  
m
Using APF (Note 3), DC to 6 Mb / s  
Using PCF (Note 4), DC to 6 Mb / s  
40  
Transmission Distance  
1000  
m
Pulse width 165 ns  
Pulse cycle 330 ns  
Pulse Width Distortion  
(Note 5)  
tw  
55  
55  
ns  
C = 10 pF  
L
DC to 6 Mb / s, APF  
DC to 6 Mb / s, PCF  
DC to 6 Mb / s, APF  
DC to 6 Mb / s, PCF  
9  
14  
22  
dBm  
dBm  
dBm  
dBm  
mA  
V
Maximum Receivable Power  
P
MAX  
(Note 6)  
(Note 6)  
28  
31  
40  
Minimum Receivable Power  
P
I
MIN  
Current Consumption  
CC  
High Level Output Voltage  
Low Level Output Voltage  
V
4.6  
OH  
V
0.5  
V
OL  
Note 2: High level output when optical flux is received. Low level output when optical flux is not received.  
Note 3: All Plastic Fiber (980 / 1000 µm).  
Note 4: Plastic cladding silica fiber (200 / 300 µm)  
Note 5: Between input of a fiber optic transmitting module and output of TORX196.  
9  
Note 6: BER 10 , valued by peak.  
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4. Example of Typical Characteristics (Note 7)  
Note 7: There give characteristic examples, and its values are not guaranteed.  
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Note 7: There give characteristic examples, and its values are not guaranteed.  
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TORX196  
Note 7: There give characteristic examples, and its values are not guaranteed.  
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5. Application Circuit  
6. Applicable Optical Fiber with Fiber Optic Connectors  
(APF)  
TOCP100−□□B, TOCP155−□□B, TOCP100P−□□B, TOCP155P−□□B  
(PCF)  
TOCP100Q−□□B, TOCP150Q−□□B, TOCP100X−□□B, TOCP150X−□□B  
CF1071 series  
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7. Precaution on Use  
(1) Maximum rating  
The maximum ratings are the limit values which must not be exceeded during operation of device.  
None of these rating value must not be exceeded. If the maximum rating value is exceeded, the  
characteristics of devices may never be restored properly. In extreme cases, the device may be  
permanently damages.  
(2) Soldering  
Optical modules are comprised of internal semiconductor devices. However, in principle, optical  
modules are optical components. During soldering, ensure that flux does not contact with the emitting  
surface or the detecting surface. Also ensure that proper flux removal is conducted after soldering.  
Some optical modules come with a protective cap. The protective cap is used to avoid malfunction  
when the optical module is not in use. Note that it is not dust or waterproof.  
As mentioned before, optical modules are optical components. Thus, in principle, soldering where  
there may be flux residue and flux removal after soldering is not recommended. Toshiba recommend  
that soldering be performed without the optical module mounted on the board. Then, after the board  
has been cleaned, the optical module should be soldered on to the board manually.  
If the optical module cannot be soldered manually, use nonhalogen (chlorinefree) flux and make  
sure, without cleaning, there is no residue such as chlorine. This is one of the ways to eliminate the  
effects of flux. In such a cases, be sure to check the devices’ reliability.  
(3) Noise resistance  
It is believed that the use of optical transfer devices improve noise resistance. In theory, optical fiber  
is not affected by noise at all. However, receiving modules which handle signals whose level is  
extremely small, are susceptible to noise.  
TOSLINK improve noise resistance to use a conductive case. However, the current signal output by  
the optical receiving modules' photodiode is extremely small. Thus, in some environments, shielding  
the case may not achieve sufficient noise resistance.  
First systems which incorporate TOSLINK, Toshiba recommend testing using the actual device to  
check its noise resistance.  
Use a simple noise filter on TOSLINK fiber optic transceiving module's power line. If the ripple in the  
power supply used is significant, reinforce the filter.  
The optical module is to be used in an area which is susceptible to radiated noise, increase the  
shielding by covering the optical module and the power line filter with a metallic cover.  
(4) Vibration and shock  
This module is plastic sealed and has its wire fixed by resin. This structure is relatively resistant to  
vibration and shock. In actual equipment, there are sometime cases in which vibration, shock, or  
stress is applied to soldered parts or connected parts, resulting in lines cut. A care must be taken in  
the design of equipment which will be subject to high levels of vibration.  
(5) Attaching the fiber optic receiving module  
Solder the fixed pins (pins 4 and 5) of the fiber optic receiving module TORX196 to the printed circuit  
board in order to fix it to the board.  
(6) Shielding and wiring pattern of fiber optic receiving modules  
To shield, connect the fixed pins (pins 5 and 6) of fiber optic transceiving module TORX196 to the  
GND.  
Where the fiber optic receiving module uses conductive resin, be careful that the case does not touch  
wiring (including land).  
To improve noise resistance, shield the optical module and the power line filter using a metallic cover.  
(7) Solvent  
When using solvent for flux removal, do not use a high acid or high alkali solvent. Be careful not to  
pour solvent in to the optical connector ports. If solvent is inadvertently poured in to them, clean it off  
using cotton tips.  
(8) Protective cap  
When the TORX196 is not in use, attach the protective cap.  
(9) Supply voltage  
Use the supply voltage within the recommended operating condition (V  
= 5 ± 0.25 V). Make sure  
CC  
that supply voltage does not exceed the maximum rating value of 7 V, even for an instant.  
(10) Output  
If the receiver output is at low and is connected to the power supply, or if the output is high and is  
connected to GND, the internal IC may be destroyed.  
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(11) Soldering condition  
Solder at 260°C or less for no more than three seconds.  
(12) Precautions when disposing of devices and packing materials.  
When disposing devices and packing materials, follow the procedures stipulated by local regulations  
in order to protect the environment against contamination.  
When devices are disposed of, worker safety and protection of the environment must be taken into  
account.  
(13) Precautions during use  
Toshiba is continually working to improve the quality and the reliability of their products.  
Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical  
sensitivity and their vulnerability to physical stress. It is the responsibility of the buyer, when  
utilizing Toshiba products, to observe standards of safety, and to avoid situations in which the  
malfunction or failure of a Toshiba product could cause loss of human life, bodily injury or damage to  
property.  
When developing equipment, please ensure that Toshiba products are used within the specified  
operating ranges set forth in the most recent product specifications. Also, please keep in mind the  
precautions and conditions set forth in the Toshiba Semiconductor Reliability Handbook.  
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RESTRICTIONS ON PRODUCT USE  
000707EAA  
· TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor  
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical  
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of  
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of  
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.  
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as  
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and  
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability  
Handbook” etc..  
· The TOSHIBA products listed in this document are intended for usage in general electronics applications  
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,  
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires  
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or  
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or  
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,  
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this  
document shall be made at the customer’s own risk.  
· The information contained herein is presented only as a guide for the applications of our products. No  
responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other  
rights of the third parties which may result from its use. No license is granted by implication or otherwise under  
any intellectual property or other rights of TOSHIBA CORPORATION or others.  
· The information contained herein is subject to change without notice.  
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