TLP700A(TP,F) [TOSHIBA]
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| 型号： | TLP700A(TP,F) |
| 厂家： | 
TOSHIBA |
| 描述： | 暂无描述 光电 二极管 |
| 文件： | 总17页 (文件大小：322K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TLP700
TOSHIBA Photocoupler GaAℓAs IRED + Photo IC
TLP700
Industrial inverters
Unit in mm
Inverter for air conditioners
IGBT/Power MOSFET gate drive
4.58±0.25
6 5 4
TLP700 consists of a GaAℓAs light-emitting diode and an integrated
photodetector.
This unit is 6-lead SDIP package. The TLP700 is 50% smaller than the 8-pin
DIP and meets the reinforced insulation class requirements of international safety
standards. Therefore the mounting area can be reduced in equipment requiring
safety standard certification.
The TLP700 is suitable for gate driving circuits for IGBTs or power MOSFETs.
In particular, the TLP700 is capable of “direct” gate driving of low-power IGBTs.
1
2 3
7.62±0.25
•
•
•
•
•
•
•
•
•
Peak output current:
±2.0 A (max)
Guaranteed performance over temperature: −40 to 100°C
1.27±0.2
0.4±0.1
1.25±0.25
9.7±0.3
Supply current:
2 mA (max)
15 to 30 V
Power supply voltage:
Threshold input current:
Switching time (tpLH / tpHL):
Common mode transient immunity:
Isolation voltage:
IFLH = 5 mA (max)
11-5J1
500 ns (max)
TOSHIBA
11-5J1
±15 kV/μs (min)
5000 Vrms (min)
Weight: 0.26 g (typ.)
Construction mechanical rating
7.62-mm pitch
standard type
10.16-mm pitch
TLPXXXF type
Creepage Distance
Clearance
Insulation Thickness
7.0 mm (min)
7.0 mm (min)
0.4 mm (min)
8.0 mm (min)
8.0 mm (min)
0.4 mm (min)
Pin Configuration (Top View)
•
•
UL recognized:
UL1577, File No. E67349
EN60747-5-2
1: ANODE
1
2
3
6
5
4
2: N.C
Option (D4) type
TÜV approved:
3: CATHODE
4: GND
5: V ( OUTPUT )
O
6: V
CC
Maximum operating insulation voltage: 890 Vpk
Highest permissible over voltage: 8000 Vpk
SHIELD
( Note ) When a EN60747-5-2 approved type is needed,
please designate the “Option(D4)”
Schematic
ICC
VCC
(M1)
6
IF
1＋
Truth Table
IO
VF
(M2)
Input
LED
M1
M2
Output
3－
VO
5
4
H
L
ON
ON
OFF
ON
H
L
GND
OFF
OFF
SHIELD
A 0.1-μF bypass capacitor must be connected
between pins 6 and 4. (See Note 6.)
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2010-02-23
TLP700
Absolute Maximum Ratings (Ta = 25 °C)
Characteristics
Symbol
Rating
Unit
Forward current
I
20
−0.54
1
mA
mA/°C
A
F
Forward current derating (Ta ≥ 85°C)
ΔI /ΔTa
F
Peak transient forward current
Reverse voltage
(Note 1)
I
FP
V
5
V
R
Junction temperature
“H” peak output current
“L” peak output current
Output voltage
T
125
°C
j
Ta=-40 to 100 °C
(Note 2)
I
−2.0
2.0
A
OPH
I
A
OPL
V
35
V
O
Supply voltage
V
35
V
CC
Junction temperature
T
f
125
°C
j
Operating frequency
(Note 3)
(Note 4)
50
kHz
°C
Operating temperature range
Storage temperature range
T
opr
−40 to 100
−55 to 125
260
T
°C
stg
sol
Lead soldering temperature (10 s)
T
°C
Isolation voltage (AC, 1 minute, R.H. ≤ 60%)
(Note 5)
BV
5000
Vrms
S
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Pulse width PW ≤ 1 μs, 300 pps
Note 2: Exponential waveform pulse width PW ≤ 0.3 μs, f ≤15 kHz
Note 3: Exponential waveform IOPH ≥−1.5 A (≤ 0.3 μs), IOPL ≤+1.5 A (≤ 0.3 μs), Ta=100°C
Note 4: For the effective lead soldering area
Note 5: Device considered a two-terminal device: pins 1, 2 and 3 paired with pins 4, 5 and 6 respectively.
Note 6: A ceramic capacitor (0.1 μF) should be connected from pin 6 to pin 4 to stabilize the operation of the high
gain linear amplifier. Failure to provide the bypassing may impair the switching property.
The total lead length between capacitor and coupler should not exceed 1 cm.
Recommended Operating Conditions
Characteristics
Input current, ON
Symbol
Min
Typ.
Max
Unit
(Note 7)
(Note 8)
I
7.5
0
⎯
⎯
⎯
⎯
⎯
10
0.8
mA
V
F (ON)
Input voltage, OFF
Supply voltage *
V
F (OFF)
V
15
⎯
30
V
CC
/ I
Peak output current
Operating temperature
I
± 1.5
100
A
OPH OPL
T
opr
−40
°C
* This item denotes operating ranges, not meaning of recommended operating conditions.
Note : Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this
product, please confirm specified characteristics shown in this document.
Note 7: Input signal rise time (fall time) ≤ 0.5 μs.
Note 8: If the Vcc rise slope is sharp, an internal circuit might not operate with stability. Please design the Vcc rise
slope under 3.0 V/μs.
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2010-02-23
TLP700
Electrical Characteristics (Ta = −40 to 100 °C, unless otherwise specified)
Test
Circuit
Characteristics
Forward voltage
Symbol
Test Condition
= 10 mA, Ta = 25 °C
= 10 mA
Min
⎯
Typ.*
1.57
−1.8
Max
1.75
⎯
Unit
V
V
⎯
I
I
F
F
Temperature coefficient of forward
voltage
∆V /∆Ta
⎯
⎯
mV/°C
F
F
Input reverse current
Input capacitance
I
⎯
⎯
V
= 5 V, Ta = 25 °C
R
⎯
⎯
⎯
100
−1.4
⎯
10
⎯
μA
R
C
V =0 V, f = 1 MHz, Ta = 25 °C
pF
T
I
I
V
V
V
V
= 3.5 V
= 7 V
⎯
−1.0
−1.5
⎯
OPH1
OPH2
6-5
6-5
5-4
5-4
V
I
= 15 V
CC
“H” Level
1
2
= 5 mA
F
Output current
⎯
A
(Note 9)
“L” Level
I
= 2.5 V
= 7 V
1.0
1.5
1.4
⎯
OPL1
OPL2
V
CC
I
= 15 V
= 0 mA
F
I
⎯
V
=+15V, V
=-15V
EE1
CC1
“H” Level
Output voltage
V
3
4
11
13.7
⎯
OH
R
= 200Ω, I = 5 mA
F
L
V
V
=+15V, V
CC1
=-15V
EE1
“L” Level
V
⎯
-14.9
-12.5
OL
R
= 200Ω,V = 0.8 V
F
L
“H” Level
Supply current
I
5
I
I
= 10 mA
= 0 mA
⎯
⎯
1.3
1.3
1.8
⎯
2.0
2.0
5
CCH
F
F
V
= 30 V
CC
O
mA
V =Open
“L” Level
I
6
CCL
Threshold input current
Threshold input voltage
Supply voltage
L → H
H → L
I
⎯
⎯
⎯
⎯
⎯
⎯
V
V
= 15 V, V > 1 V
⎯
mA
V
FLH
CC
CC
O
V
= 15 V, V < 1 V
0.8
15
⎯
FHL
O
V
⎯
⎯
30
V
CC
V
V
V
> 2.5V, I = 5 mA
11.0
9.5
⎯
12.5
11.0
1.5
13.5
12.0
⎯
V
UVLO+
O
O
F
UVLO thresh hold
UVLO hysteresis
V
< 2.5V, I = 5 mA
F
V
UVLO-
UVLO
⎯
V
HYS
( * ): All typical values are at Ta = 25°C
Note 9: Duration of Io time ≤ 50 μs, 1 pulse
Note 10: This product is more sensitive than conventional products to electrostatic discharge (ESD) owing to its low
power consumption design.
It is therefore all the more necessary to observe general precautions regarding ESD when handling this
component.
Isolation Characteristics (Ta = 25 °C)
Characteristic
Capacitance input to output
Isolation resistance
Symbol
Test Condition
Vs = 0 V , f = 1MHz
Min
Typ.
1.0
Max
⎯
Unit
pF
Ω
C
R
(Note 5)
(Note 5)
⎯
S
S
12
14
R.H. ≤ 60 %, V = 500 V
S
1×10
10
⎯
AC, 1 minute
5000
⎯
⎯
⎯
⎯
⎯
Vrms
Vdc
Isolation voltage
BV
S
AC, 1 second, in oil
DC, 1 minute, in oil
10000
10000
⎯
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2010-02-23
TLP700
Switching Characteristics (Ta = −40 to 100 °C, unless otherwise specified)
Test
Circuit
Characteristics
Symbol
Test Condition
Min
Typ.*
Max
Unit
ns
L → H
H → L
t
t
I
I
I
= 0 → 5 mA
= 5 → 0 mA
= 0 → 5 mA
= 5 → 0 mA
50
50
⎯
⎯
⎯
⎯
50
50
500
500
⎯
pLH
F
F
F
Propagation delay time
pHL
V
= 30 V
CC
R = 20 Ω
Output rise time (10−90 %)
Output fall time (90−10 %)
t
r
g
7
C = 10 nF
g
t
I
⎯
f
F
Switching time dispersion
between ON and OFF
| t
-t
|
⎯
−15
15
⎯
⎯
⎯
250
⎯
I
I
= 0 ↔ 5 mA
= 5 mA
pHL pLH
F
Common mode transient immunity
at HIGH level output
F
CM
H
V
=1000 Vp-p
CM
Ta = 25 °C
= 30 V
V
= 26 V
O (min)
8
kV/μs
Common mode transient immunity
at LOW level output
I
= 0 mA
F
V
CM
L
⎯
CC
V
= 1 V
O (max)
( * ): All typical values are at Ta = 25 °C.
Test Circuit 1: I
Test Circuit 2: I
OPH
OPL
1
1
6
6
0.1μF
V
6-5
I
A
OPL
I
OPH
I
A
F
0.1μF
V
V
CC
CC
V
5-4
3
3
4
4
Test Circuit 3: V
Test Circuit 4: V
OH
OL
1
1
6
6
V
V
CC1
0.1μF
CC1
0.1μF
V
F
R
L
R
L
I
F
V
V
V
V
V
EE1
V
EE1
OH
OL
3
4
3
4
Test Circuit 5: I
Test Circuit 6: I
CCH
CCL
I
CCL
A
I
1
CCH
1
6
6
A
0.1μF
0.1μF
V
I
CC
F
V
CC
3
3
4
4
4
2010-02-23
TLP700
Test Circuit 7: t
, t
, t , t , | tpHL-tpLH
r f
|
pLH pHL
(f=25kHz, duty=50%, less than tr=tf=5ns)
6
1
I
F
I
V
F
O
V
t
t
OH
r
f
Cg = 10nF
V
CC
90%
50%
10%
Rg = 20 Ω
V
O
3
4
t
pHL
t
pLH
V
OL
Test Circuit 8: CM , CM
H
L
1000 V
6
1
90%
10%
I
F
V
CM
0.1μF
SW
A
V
t
t
f
O
r
B
V
CC
• SW A: I = 5 mA
F
CM
CM
H
L
4
3
26V
V
O
V
1V
• SW B: I = 0 mA
CM
+
−
F
800 V
CM = −
H
t (μs)
f
800 V
CM
=
L
t (μs)
r
CM (CM ) is the maximum rate of rise (fall) of the common mode voltage that can be sustained with the output
L
H
voltage in the LOW (HIGH) state.
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2010-02-23
TLP700
I － V
⊿V /⊿Ta － I
F
F
F
F
-3.2
-2.8
-2.4
-2
100
10
1
Ta=-40°C
Ta=25°C
Ta=100°C
-1.6
-1.2
0.1
0.1
1
10
1
1.2
1.4
1.6
1.8
2
Forward Voltage V [V]
Forward Current I [mA]
F
F
V
－ Ta
V
－ Ta
OL
OH
30
25
20
15
10
5
-30
-25
-20
-15
-10
-5
V =0.8V, R =200Ω
I =5mA, R =200Ω
F L
F
L
V
=15V, V
=-15V
V
=15V, V
=-15V
CC1
EE1
CC1
EE1
V
=7.5V, V
=-7.5V
V
=7.5V, V
CC1
=-7.5V
CC1
EE1
EE1
0
0
-40 -20
0
20 40 60 80 100
-40 -20
0
20 40 60 80 100
Ambient Temperature Ta [°C]
Ambient Temperature Ta [°C]
I
－ Ta
I
－ Ta
CCL
CCH
5
5
4
3
2
1
0
I =0mA
I =10mA
F
F
V
=30V
V
=30V
CC
CC
4
3
2
1
0
-40 -20
0
20 40 60 80 100
-40 -20
0
20 40 60 80 100
Ambient Temperature Ta [°C]
Ambient Temperature Ta [°C]
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2010-02-23
TLP700
t
, t
－ Ta
t
, t
－ V
PLH PHL
PLH PHL
CC
500
400
300
200
100
0
500
400
300
200
100
0
I =5mA
I =5mA, V =30V
CC
I =5mA, R =20Ω
F
F
g
R =20Ω, C =10nF
C =10nF
g
g
g
tpHL
tpLH
tpHL
tpLH
15
20
25
30
-40 -20
0
20 40 60 80 100
Ambient Temperature Ta [°C]
Supply Voltage V
[V]
CC
t
, t
－ I
I
－ Ta
PLH PHL
F
FLH
5
4
3
2
1
0
500
400
300
200
100
0
V
=30V
CC
V
I
=15V, V >1V
CC
O
=0mA
R =20Ω, C =10nF
O
g
g
tpLH
tpHL
-40 -20
0
20 40 60 80 100
4
6
8
10 12 14 16 18 20
Forward current I [mA]
Ambient Temperature Ta [°C]
F
I
－ Ta
I
－ Ta
OPL
OPH
5
4
3
2
1
0
0
-1
-2
-3
-4
-5
I =0mA, V =15V
I =5mA, V =15V
F
CC
F
CC
（Note 9）
（Note 9）
V
=-3.5V
6-5
V
=7.0V
5-4
I
I
OPH
MAX
OPL
MAX
V
=2.5V
5-4
V
=-7.0V
6-5
-40 -20
0
20 40 60 80 100
-40 -20
0
20 40 60 80 100
Ambient Temperature Ta [°C]
Ambient Temperature Ta [°C]
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2010-02-23
TLP700
V
－ I
OPL
V
－ I
5-4
6-5 OPH
7
6
5
4
3
2
1
0
-1
-2
-3
-4
-5
-6
-7
I =0mA, V =15V
CC
I =5mA, V =15V
F CC
F
（Note9）
（Note9）
Ta=100°C
Ta=25°C
Ta=-40°C
Ta=-40°C
Ta=100°C
Ta=25°C
0
-0.5
-1
-1.5
-2
0
0.5
1
1.5
2
Low Level Output Peak Current I
[A]
High Level Output Peak Current I
[A]
OPH
OPL
V (V
O UVLO
)** - V
CC
14
12
10
8
I =5mA, V >2.5V
F
O
**Test Circuit : V (V
O
) - V
CC
UVLO
UVLO
HYS
6
1
V
O
+V
UVLO
I
F
V
6
CC
-V
UVLO
4
3
4
2
0
5
10
15
[V]
20
Supply Voltage V
CC
*: The above graphs show typical characteristics.
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2010-02-23
TLP700
Soldering and Storage
(1) Precautions for Soldering
1) When Using Soldering Reflow
z
An example of a temperature profile when Sn-Pb eutectic solder is used:
z
An example of a temperature profile when lead(Pb)-free solder is used:
z Reflow soldering must be performed once or twice.
z The mounting should be completed with the interval from the first to the last mountings being 2 weeks.
2) When using soldering Flow (Applicable to both eutectic solder and Lead(Pb)-Free solder)
z
z
z
Apply preheating of 150 deg.C for 60 to 120 seconds.
Mounting condition of 260 deg.C or less within 10 seconds is recommended.
Flow soldering must be performed once
3) When using soldering Iron (Applicable to both eutectic solder and Lead(Pb)-Free solder)
z
Complete soldering within 10 seconds for lead temperature not exceeding 260 deg.C or within 3 seconds
not exceeding 350 deg.C.
z
Heating by soldering iron must be only once per 1 lead
9
2010-02-23
TLP700
(2) Precautions for General Storage
1) Do not store devices at any place where they will be exposed to moisture or direct sunlight.
2) When transportation or storage of devices, follow the cautions indicated on the carton box.
3) The storage area temperature should be kept within a temperature range of 5 degree C
to 35 degree C, and relative humidity should be maintained at between 45% and 75%.
4) Do not store devices in the presence of harmful (especially corrosive)gases, or in dusty conditions.
5) Use storage areas where there is minimal temperature fluctuation. Because rapid temperature
changes can cause condensation to occur on stored devices, resulting in lead oxidation or corrosion,
as a result, the solderability of the leads will be degraded.
6) When repacking devices, use anti-static containers.
7) Do not apply any external force or load directly to devices while they are in storage.
8) If devices have been stored for more than two years, even though the above conditions have been
followed, it is recommended that solderability of them should be tested before they are used.
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2010-02-23
TLP700
Specifications for Embossed-Tape Packing
(TP) for SDIP6 Type Photocoupler
1. Applicable Package
Package Name
SDIP6
Product Type
Photocouplers
2. Product Naming System
Type of package used for shipment is denoted by a symbol suffix after a product number. The method of
classification is as below.
(Example) TLP700 (TP, F)
[[G]]/RoHS COMPATIBLE (Note11)
Tape type
Device name
3. Tape Dimensions
3.1 Orientation of Devices in Relation to Direction of Tape Movement
Device orientation in the recesses is as shown in Figure 1.
Tape feed
Figure 1 Device Orientation
3.2 Tape Packing Quantity: 1500 devices per reel
3.3 Empty Device Recesses Are as Shown in Table 1.
Table 1 Empty Device Recesses
Standard
0
Remarks
Occurrences of 2 or more
successive empty device
recesses
Within any given 40-mm section of
tape, not including leader and trailer
Single empty device
recesses
6 devices (max) per reel Not including leader and trailer
3.4 Start and End of Tape:
The start of the tape has 30 or more empty holes. The end of the tape has 30 or more empty holes
and two empty turns only for a cover tape.
11
2010-02-23
TLP700
3.5 Tape Specification
(1) Tape material: Plastic (protection against electrostatics)
(2) Dimensions: The tape dimensions are as shown in Figure 2 and Table 2.
2.0 ± 0.1
+0.1
φ1.5
0.4 ± 0.05
−0
F
G
φ1.6 ± 0.1
K
0
A
4.55 ± 0.2
Figure 2 Tape Forms
Table 2 Tape Dimension
Unit: mm
Unless otherwise specified: ±0.1
Symbol
Dimension
Remark
A
B
D
E
F
10.4
5.1
⎯
⎯
7.5
Center line of indented square hole and sprocket hole
1.75
12.0
4.0
Distance between tape edge and hole center
+0.1
Cumulative error
Cumulative error
Internal space
(max) per 10 feed holes
(max) per 10 feed holes
−0.3
+0.1
−0.3
G
K
4.1
0
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2010-02-23
TLP700
3.6 Reel
(1) Material: Plastic
(2) Dimensions: The reel dimensions are as shown in Figure 3 and Table 3.
Table 3 Reel Dimension
Unit: mm
記
号
寸
法
A
B
C
E
U
φ380 ± 2
φ80 ± 1
U
φ13 ± 0.5
2.0 ± 0.5
4.0 ± 0.5
17.5 ± 0.5
21.5 ± 1.0
E
W1
W2
W1
W2
Figure 3 Reel Forms
4. Packing
Either one reel or five reels of photocouplers are packed in a shipping carton.
5. Label Indication
The carton bears a label indicating the product number, the symbol representing classification of
standard, the quantity, the lot number and the Toshiba company name.
6. Ordering Method
When placing an order, please specify the product number, the CTR rank, the tape type and the quantity
as shown in the following example.
(Example) TLP700 (TP, F) 1500 pcs
Quantity (must be a multiple of 1500)
[[G]]/RoHS COMPATIBLE (Note 11)
Tape type
Device name
Note 11 :Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS
compatibility of Product.
RoHS is the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the
restriction of the use of certain hazardous substances in electrical and electronics equipment.
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2010-02-23
TLP700
EN60747-5-2 Option:(D4)
Attachment
Types
: Specifications for EN60747-5-2 option: (D4)
: TLP700, TLP700F
Type designations for “option: (D4)”, which are tested under EN60747 requirements.
Ex.: TLP700 (D4-TP,F)
D4 : EN60747 option
TP : Standard tape & reel type
F
: [[G]]/RoHS COMPATIBLE (Note 11)
Note: Use TOSHIBA standard type number for safety standard application.
Ex.: TLP700 (D4-TP,F) TLP700
→
EN60747 Isolation Characteristics
Description
Symbol
Rating
Unit
—
Application classification
for rated mains voltage≤300Vrms
for rated mains voltage≤600Vrms
I-IV
I-III
Climatic classification
40/ 100 / 21
—
—
Pollution degree
2
TLPxxx type
TLPxxxFtype
TLPxxx type
890
Maximum operating insulation voltage
VIORM
Vpk
Vpk
1140
1335
Input to output test voltage, method A
Vpr=1.5×VIORM, type and sample test
tp=10s, partial discharge<5pC
Vpr
TLPxxxFtype
TLPxxx type
TLPxxxFtype
1710
1670
2140
Input to output test voltage, method B
Vpr=1.875×VIORM, 100% production test
tp=1s, partial discharge<5pC
Vpr
VTR
Vpk
Vpk
Highest permissible overvoltage
(transient overvoltage, tpr = 60s)
8000
Safety limiting values (max. permissible ratings in case of
fault, also refer to thermal derating curve)
current (input current IF, Psi = 0)
power (output or total power dissipation)
temperature
Isi
Psi
Tsi
300
700
150
mA
mW
℃
≥ 1012
≥ 1011
≥ 109
Insulation resistance,
V
V
V
IO =500V, Ta=25°C
IO =500V, Ta=100°C
IO =500V, Ta=Tsi
Rsi
Ω
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2010-02-23
TLP700
Insulation Related Specifications
7.62mm pitch
TLPxxx type
10.16mm pitch
TLPxxxF type
Minimum creepage distance
Minimum clearance
Cr
Cl
ti
7.0mm
7.0mm
8.0mm
8.0mm
Minimum insulation thickness
0.4mm
175
Comperative tracking index
CTI
1．If a printed circuit is incorporated, the creepage distance and clearance may be reduced below this
value. (e.g.at a standard distance between soldering eye centres of 7.5mm). If this is not permissible,
the user shall take suitable measures.
2．This photocoupler is suitable for ‘safe electrical isolation’ only within the safety limit data.
Maintenance of the safety data shall be ensured by means of protective circuits.
Marking on product for EN60747 ：
4
Marking Example：
6
4
Lot.Code
P700
4
Type name without “TL”
Mark for option(D4)
3
1
1pin indication
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2010-02-23
TLP700
1
Partial discharge measurement procedure according to EN60747
Destructive test for qualification and sampling tests.
Figure
Method A
V
(8kV)
INITIAL
V
(for type and sampling tests,
destructive tests)
V
(1335V for TLPxxx)
(1710V for TLPxxxF)
pr
t , t
1
t , t
3
= 1 to 10 s
= 1 s
2
4
V
(890V for TLPxxx)
IORM
(1140V for TLPxxxF)
t
t (Measuring time for
p
partial discharge)
= 10 s
= 12 s
= 60 s
0
t
t
t
3
P
4
t
t
b
t
t
t
b
t
1
ini
2
ini
Figure
2
Partial discharge measurement procedure according to EN60747
Non-destructive test for100% inspection.
Method B
V
(1670V for TLPxxx)
pr
V
(2140V for TLPxxxF)
(for sample test,non-
destructive test)
V
(890V for TLPxxx)
IORM
(1140V for TLPxxxF)
= 0.1 s
t , t
3
4
t (Measuring time for
p
= 1 s
= 1.2 s
partial discharge)
t
t
b
t
P
t
t
3
b
t
4
Figure
3 Dependency of maximum safety ratings on ambient temperature
500
1000
800
Psi
(mW)
Isi
(mA)
400
300
600
400
200
0
200
100
Psi
→
←
Isi
0
0
25
50
75
100
Ta (°C)
125
150
175
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2010-02-23
TLP700
RESTRICTIONS ON PRODUCT USE
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all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
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APPLICATIONS.
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Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
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noncompliance with applicable laws and regulations.
17
2010-02-23
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