TLP666J(D4,S,F) [TOSHIBA]

TRIAC-OUTPUT OPTOCOUPLER,1-CHANNEL,5KV ISOLATION,DIP;
TLP666J(D4,S,F)
型号: TLP666J(D4,S,F)
厂家: TOSHIBA    TOSHIBA
描述:

TRIAC-OUTPUT OPTOCOUPLER,1-CHANNEL,5KV ISOLATION,DIP

三端双向交流开关 分离技术 隔离技术 输出元件 光电
文件: 总6页 (文件大小:160K)
中文:  中文翻译
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TLP666J(S)  
TOSHIBA PHOTOCOUPLER GaAs IRED & PHOTO-TRIAC  
TLP666J(S)  
Unit: mm  
Office Equipment  
Household Appliances  
Triac Drivers  
Solid State Relays  
The TOSHIBA TLP666J(S) consists of a gallium arsenide infrared  
emitting diode optically coupled to a triac-output photocoupler featuring  
a zero-cross voltage and is housed in a 6-pin DIP package.  
Peak Off-State Voltage: 600 V (min)  
Trigger LED Current: 10 mA (max)  
On-State Current: 100 mA (max)  
Isolation Voltage: 5000 Vrms (min)  
UL Recognized: UL1577, File No. E67349  
SEMKO Approved: SS EN60065  
JEDEC  
JEITA  
SS EN60950, File No.9841102  
TOSHIBA  
11-7A9  
BSI Approved: BS EN60065, File No.8385  
BS EN60950, File No.8386  
Weight: 0.39 g (typ.)  
Option (D4) type  
Pin Configuration  
(top view)  
VDE approved: DIN EN60747-5-2  
Approved No. 40009302  
1
2
3
6
Maximum operating insulation voltage: 890 VPK  
Maximum permissible overvoltage: 8000 VPK  
Note: When ordering an EN60747-5-2 approved device,  
"Option (D4)" should be designated.  
ZC  
4
Construction mechanical rating  
1: Anode  
2: Cathode  
3: N.C.  
4:Terminal 1  
6:Terminal 2  
7.62 mm pitch  
Standard Type  
10.16 mm pitch  
TLPxxxxF type  
Creepage Distance  
Clearance  
Insulation Thickness  
7.0 mm (Min)  
7.0 mm (Min)  
0.5 mm (Min)  
8.0 mm (Min)  
8.0 mm (Min)  
0.5 mm (Min)  
ZC:Zero-cross Circuit  
1
2010-10-01  
TLP666J(S)  
Absolute Maximum Ratings (Ta = 25°C)  
Characteristic  
Symbol  
Rating  
Unit  
Forward current  
I
50  
mA  
F
Forward current derating (Ta 53°C)  
ΔI / °C  
F
0.7  
mA / °C  
Peak forward current  
(100 μs pulse, 100 pps)  
I
1
A
FP  
Power dissipation  
P
100  
1.0  
5
mW  
D
Power dissipation derating (Ta 25°C)  
Reverse voltage  
ΔP / °C  
mW / °C  
D
V
V
°C  
V
R
Junction temperature  
T
125  
600  
100  
50  
j
Offstate output terminal voltage  
V
DRM  
Ta = 25°C  
Onstate RMS current  
I
mA  
T(RMS)  
Ta = 70°C  
Onstate current derating (Ta 25°C)  
ΔI / °C  
1.1  
mA / °C  
A
T
Peak onstate current  
(100 μs pulse, 120 pps)  
I
2
TP  
Peak nonrepetitive surge  
I
1.2  
A
TSM  
current (P = 10 ms)  
w
Power dissipation  
P
300  
4.0  
mW  
mW / °C  
°C  
D
Power dissipation derating (Ta 25°C)  
Junction temperature  
ΔP / °C  
D
T
115  
j
Storage temperature range  
T
55 to 150  
40 to 100  
260  
°C  
stg  
opr  
Operating temperature range  
Lead soldering temperature (10 s)  
Total package power dissipation  
T
°C  
T
°C  
sol  
P
330  
mW  
T
Total package power dissipation derating  
(Ta 25°C)  
ΔP / °C  
4.4  
mW / °C  
Vrms  
T
Isolation voltage  
(AC, 1 min., R.H.60%)  
BV  
5000  
S
(Note 1)  
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the  
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even  
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum  
ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
(Note 1) Device considered a two terminal device: Pins 1, 2 and 3 shorted together and pins 4 and 6 shorted  
together.  
Recommended Operating Conditions  
Characteristic  
Symbol  
Min  
Typ.  
Max  
Unit  
Supply voltage  
Forward current  
V
15  
20  
240  
25  
1
Vac  
mA  
A
AC  
I
F
Peak onstate current  
I
TP  
Operating temperature  
T
opr  
25  
85  
°C  
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the  
device. Additionally, each item is an independent guideline respectively. In developing designs using this  
product, please confirm specified characteristics shown in this document.  
2
2010-10-01  
TLP666J(S)  
Individual Electrical Characteristics (Ta = 25°C)  
Characteristic  
Forward voltage  
Symbol  
Test Condition  
= 10 mA  
F
Min  
Typ.  
Max  
Unit  
V
I
1.0  
1.15  
1.3  
10  
V
μA  
pF  
nA  
V
F
Reverse current  
I
V = 5 V  
R
R
Capacitance  
C
V = 0 V, f = 1 MHz  
= 600 V  
30  
T
Peak offstate current  
Peak onstate voltage  
Holding current  
I
V
10  
1000  
3.0  
DRM  
DRM  
= 100 mA  
TM  
V
I
1.7  
0.6  
TM  
I
mA  
H
Critical rate of rise of  
offstate voltage  
V
V
= 240 Vrms, Ta = 85°C  
in  
in  
dv / dt  
200  
500  
0.2  
V / μs  
V / μs  
(Fig.1)  
(Fig.1)  
Critical rate of rise of  
commutating voltage  
= 60 Vrms, I = 15 mA  
T
dv / dt (c)  
Coupled Electrical Characteristics (Ta = 25°C)  
Characteristic  
Trigger LED current  
Symbol  
Test Condition  
Min  
Typ.  
Max  
Unit  
I
V
= 6 V  
T
5
10  
50  
mA  
V
FT  
Inhibit voltage  
V
I
I
= rated I  
= rated I  
IH  
F
FT  
FT  
F
Leakage in inhibited state  
I
100  
300  
μA  
IH  
V
V
V
= rated V  
T
S
S
DRM  
Capacitance input to output  
Isolation resistance  
C
R
= 0 V, f = 1 MHz  
5×1010  
5000  
0.8  
1014  
pF  
S
S
= 500 V (R.H.60%)  
Ω
AC, 1 minute  
Vrms  
Isolation voltage  
BV  
S
AC, 1 second, in oil  
DC, 1 minute, in oil  
10000  
10000  
V
dc  
Fig. 1  
dv / dt test circuit  
+
+5 V,V  
R
CC  
0 V  
dv / dt  
in  
V
in  
6
4
1
2
3
V
CC  
120 Ω  
R
L
dv / dt(c)  
4 kΩ  
3
2010-10-01  
TLP666J(S)  
I
– T  
I
– T  
a
F
a
T(RMS)  
60  
50  
120  
100  
40  
30  
20  
80  
60  
40  
10  
0
20  
0
20  
0
20  
40  
60  
80  
100  
120  
20  
0
20  
40  
60  
80  
100  
120  
1.8  
3.0  
Ambient temperature Ta ()  
– D  
Ambient temperature Ta ()  
I
I
– V  
FP  
R
F
F
100  
3000  
1000  
Pulse width 100 μs  
Ta=25℃  
Ta=25℃  
50  
30  
500  
300  
10  
5
3
100  
1
50  
30  
0.5  
0.3  
10  
0.1  
4
3
3
2
2
1
1
3 ×1010-  
3×1010-  
3×10-  
10-  
3×10-  
1.0  
1.2  
1.4  
1.6  
0.6  
0.8  
1
Forward voltage V (V)  
Duty cycle ration D  
F
R
ΔV / ΔTa – I  
I
– V  
F
F
FP FP  
1000  
3.2  
500  
300  
2.8  
2.4  
2.0  
1.6  
1.2  
100  
50  
30  
10  
Pulse width 10 μs  
Repetitive frequency  
=100 Hz  
5
3
0.8  
0.4  
Ta=25℃  
1
0.6  
0.1  
0.3 0.5  
1
3
5
10  
30 50  
1.0  
1.4  
2.2  
2.6  
1.8  
Pulse forward voltage  
V
(V)  
Forward current I (mA)  
FP  
F
4
2010-10-01  
TLP666J(S)  
Normalized  
I
Ta  
Normalized  
I
Ta  
FT  
H
3
2
3
2
V
=3 V  
T
1.2  
1.2  
1
1
0.5  
0.3  
0.5  
0.3  
0.1  
40  
0.1  
40  
100  
60  
20  
0
20  
40  
80  
100  
20  
0
20  
40  
80  
60  
Ambient temperature Ta ()  
Ambient temperature Ta ()  
Normalized  
I
Ta  
Normalized  
V
Ta  
DRM  
DRM  
103  
102  
1.4  
V
=Rated  
DRM  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
101  
100  
0
100  
40  
60  
100  
20  
40  
60  
80  
20  
0
20  
40  
80  
Ambient temperature Ta ()  
Ambient temperature Ta ()  
Normalized  
V
Ta  
Normalized  
I
Ta  
IH  
IH  
3
2
3
2
1.2  
1
1.2  
1
0.5  
0.3  
0.5  
0.3  
I
= Rated I  
F
FT  
V
= Rated V  
I
= Rated I  
60  
T
DRM  
F
FT  
0.1  
40  
0.1  
40  
100  
100  
60  
20  
0
20  
40  
80  
20  
0
20  
40  
80  
Ambient temperature Ta ()  
Ambient temperature Ta ()  
5
2010-10-01  
TLP666J(S)  
RESTRICTIONS ON PRODUCT USE  
Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information  
in this document, and related hardware, software and systems (collectively “Product”) without notice.  
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with  
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.  
Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are  
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and  
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily  
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the  
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of  
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes  
for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the  
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their  
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such  
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,  
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating  
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR  
APPLICATIONS.  
Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring  
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.  
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or  
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious  
public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used  
in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling  
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric  
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this  
document.  
Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.  
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any  
applicable laws or regulations.  
The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any  
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to  
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.  
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE  
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY  
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR  
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND  
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO  
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS  
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.  
GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or  
vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.  
Do not use or otherwise make available Product or related software or technology for any military purposes, including without  
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile  
technology products (mass destruction weapons). Product and related software and technology may be controlled under the  
Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product  
or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.  
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.  
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,  
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of  
noncompliance with applicable laws and regulations.  
6
2010-10-01  

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