TLN217(F) [TOSHIBA]

Infrared LED, 3.6 mm, 1 ELEMENT, INFRARED LED, 870 nm, LEAD FREE PACKAGE-2;
TLN217(F)
型号: TLN217(F)
厂家: TOSHIBA    TOSHIBA
描述:

Infrared LED, 3.6 mm, 1 ELEMENT, INFRARED LED, 870 nm, LEAD FREE PACKAGE-2

光电 半导体
文件: 总4页 (文件大小:168K)
中文:  中文翻译
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TLN217(F)  
TOSHIBA Infrared LED GaAAs Infrared Emitter  
TLN217(F)  
Lead Free Product  
Unit: mm  
Infrared Light-Emitting Diode for Still Camera  
Light Source for Auto Focus  
The TLN217(F) is a high output infrared LED employing a new  
structure of GaAAs current confining LED chip.  
Optical radiation of current confining LED chip is condensed by clear  
resin lens.  
High output and low forward voltage  
Peak emission wavelength: λp = 870 nm (typ.)  
Spectral line half width: ∆λ = 35 nm (typ.)  
Effective emission diameter: 210 ×466 µm (typ.)  
TOSHIBA  
Weight: 0.18 g (typ.)  
Maximum Ratings  
=
(Ta 25°C)  
Characteristics  
Symbol  
(Note 1)  
Rating  
Unit  
Pulse forward current  
Reverse voltage  
I
1.1  
1
A
V
FP  
V
R
Operating temperature  
Storage temperature  
T
25 to 60  
40 to 90  
°C  
°C  
opr  
T
stg  
Note 1: Total 30000 cycles (total power applied time is 7.8 h). One cycle takes 137-ms power applied time and  
800-ms pause time under the drive condition of 2.6 kHz frequency and 13.2% duty cycle.  
1
2
360  
1
Total 30000 cycles (t = 7.8 h)  
I
FP  
OFF  
50 µs  
330 µs  
One cycle = 937 ms  
1
2004-01-29  
TLN217(F)  
Optical and Electrical Characteristics (Ta = 25°C)  
Characteristics  
Pulse forward voltage  
Symbol  
Test Condition  
Min  
Typ.  
Max  
Unit  
V
I
= 300 mA, t = 10 ms  
= 1 V  
R
12  
1.6  
1.75  
100  
V
FP  
FP  
Reverse current  
I
R
V
µA  
X
Y
Half value of peak  
Half value of peak  
(Note 2)  
(Note 2)  
(Note 3)  
466  
210  
17  
Effective emission spot size  
µm  
Radiation flux  
φe  
I
I
= 300 mA, t = 10 ms  
mW  
°
FP  
1
θ
Half value angle  
= 50 mA  
±32.5  
F
2
Peak emission wavelength  
Spectral line half width  
λp  
I
I
= 50 mA  
= 50 mA  
850  
870  
35  
900  
nm  
nm  
F
F
∆λ  
Note 2: The directions of X and Y are in the following diagram.  
The shaded area represents the emitting surface.  
Y
(LED chip)  
X
Note 3: Luminous radiation output to effective angle = ±25°  
Precaution  
Soldering temperature: 260°C (max)  
Soldering time: 5 s (max)  
(Soldering must be performed 2 mm from the bottom of the package.)  
When forming the leads, bend each lead under the 2 mm from the body of the device. Soldering must be  
performed after the leads have been formed.  
The TLN217(F) is intended for a camera AF use only. Please do not use this device except for a camera.  
2
2004-01-29  
TLN217(F)  
φe – I  
(typ.)  
I
– V  
FP  
(typ.)  
FP  
FP  
60  
50  
40  
30  
20  
10  
0
800  
600  
400  
200  
0
Ta = −20°C  
25  
60  
Ta = 60°C  
25  
20  
0
200  
400  
600  
800  
0
1
2
3
Pulse forward current  
I
(mA)  
Pulse forward voltage  
V
(V)  
FP  
FP  
Wavelength characteristic  
Radiation pattern  
(typ.)  
1
0.8  
0.6  
0.4  
0.2  
0
Ta = 25°C  
I
= 50 mA  
F
Ta = 25°C  
0°  
10°  
10°  
20°  
20°  
30°  
30°  
40°  
40°  
50°  
50°  
60°  
70°  
60°  
70°  
80°  
90°  
80°  
90°  
0
0.2 0.4 0.6 0.8 1.0  
Relative intensity  
780  
800  
820  
840  
860  
880  
(nm)  
900  
920  
940  
Wavelength  
λ
3
2004-01-29  
TLN217(F)  
RESTRICTIONS ON PRODUCT USE  
030619EAC  
The information contained herein is subject to change without notice.  
The information contained herein is presented only as a guide for the applications of our products. No  
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which  
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of  
TOSHIBA or others.  
TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor  
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical  
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of  
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of  
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.  
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as  
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and  
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability  
Handbook” etc..  
The TOSHIBA products listed in this document are intended for usage in general electronics applications  
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,  
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires  
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or  
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or  
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,  
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this  
document shall be made at the customer’s own risk.  
TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced  
and sold, under any law and regulations.  
GaAs(Gallium Arsenide) is used in this product. The dust or vapor is harmful to the human body. Do not break,  
cut, crush or dissolve chemically.  
4
2004-01-29  

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