TLEGF1108(XA2-T11) [TOSHIBA]
Visible LED, SINGLE COLOR LED, GREEN, ROHS COMPLIANT, PLASTIC, 4-3W1, 4 PIN;
| 型号： | TLEGF1108(XA2-T11) |
| 厂家： | 
TOSHIBA |
| 描述： | Visible LED, SINGLE COLOR LED, GREEN, ROHS COMPLIANT, PLASTIC, 4-3W1, 4 PIN |
| 文件： | 总11页 (文件大小：242K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TL(BF,EGF)1108(T11)
TOSHIBA LED Lamp
TLBF1108(T11), TLEGF1108(T11)
Unit: mm
Panel Circuit Indicators
3.5 (L) mm × 2.9 (W) mm × 1.9 (H) mm
TL□F1108(T11) series
•
Luminous intensity:
Blue: Iv = 560 mcd (typ.)@ I = 40 mA
F
Green: Iv = 2000 mcd (typ.)@ I = 40 mA
F
•
•
•
Topr / Tstg = -40 to 100°C
High current driving : I = 50 mA (max)
F
Standard embossed tape packing:
4 mm pitch : T11 type (2000 pcs/reel)
8-mm tape/ reel
•
Applications: automotive use, backlighting, pilot lamp etc.
Color and Material
Part Number
Color
Material
InGaN
JEDEC
―
―
TLBF1108
Blue
JEITA
TLEGF1108
Green
TOSHIBA
4-3W1
Weight: 0.035 g (typ.)
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Forward Current
Symbol
Rating
Unit
(Note 1)
I
50
5
mA
V
F
Reverse Voltage
V
P
R
D
Power Dissipation
200
mW
°C
Operating Temperature
Storage Temperature
T
opr
−40 to 100
−40 to 100
T
stg
°C
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Forward current derating
I
– Ta
F
80
60
40
20
0
0
20
40
60
80
100
120
Ambient temperature Ta (°C)
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TL(BF,EGF)1108(T11)
Electrical Characteristics (Ta = 25°C)
Characteristics
Symbol
Test condition
= 40 mA
Min
Typ.
Max
Unit
Forward Voltage
Reverse Current
V
I
3.0
3.5
4.0
10
V
F
F
I
V
= 5 V
R
⎯
⎯
μA
R
Optical Characteristics-1 (Ta = 25°C)
Luminous Intensity I
Available Iv rank
V
Part Number
Please see Note 2
Min
400
Typ.
560
Max
1250
3200
I
F
TLBF1108
TLEGF1108
Unit
UA1 / UA2 / VA1/ VA2
WA1 / WA2 / XA1 / XA2
⎯
40
1000
2000
mcd
mA
Note 2: The specification as following table is used for Iv classification of LEDs in Toshiba facility.
Each reel includes the same rank LEDs. Let the delivery ratio of each rank be unquestioned.
Iv rank
Rank symbol
UA1
Min
400
Max
630
UA2
500
800
VA1
630
1000
1250
1600
2000
2500
3200
mcd
VA2
800
WA1
WA2
XA1
1000
1250
1600
2000
mcd
XA2
Unit
Optical Characteristics–2 (Ta = 25°C)
Emission Spectrum
Peak Emission
Part Number
Δλ
Dominant Wavelength λ
d
Wavelength λ
p
I
F
Min
Typ.
Max
Typ.
Min
Typ.
Max
TLBF1108
TLEGF1108
Unit
⎯
⎯
468
518
nm
⎯
⎯
25
35
463
518
470
528
nm
477
538
40
nm
mA
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2010-09-29
TL(BF,EGF)1108(T11)
The cautions
ESD withstand voltage according to MIL STD 883D, Method 3015.7: ≥1000V
When handling this LED, take the following measures to prevent the LED from being damaged or otherwise
adversely affected.
1) Use a conductive tablemat and conductive floor mat, and ground the workbench and floor.
2) Operators handling laser diodes must be grounded via a high resistance (about 1 MΩ). A conductive strap is
good for this purpose.
3) Ground all tools including soldering irons.
This product is designed as a general display light source usage, and it has applied the measurement standard
that matched with the sensitivity of human's eyes. Therefore, it is not intended for usage of functional application
(ex. Light source for sensor, optical communication and etc) except general display light source.
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2010-09-29
TL(BF,EGF)1108(T11)
TLBF1108
I
– V (typ.)
F
F
I /I (40 mA) – I (typ.)
V V
F
3
1
100
Ta = 25°C
Ta = 25°C
30
10
0.3
0.1
3
1
0.03
0.01
2.2
2.6
3.0
3.4
3.8
4.2
4.6
5.0
1
3
5
10
30 50 100
300 500
Forward Voltage
V
(V)
Forward Current
I
(mA)
F
F
Relative I – Tc (typ.)
V
Wavelength characteristic (typ.)
10
1.0
0.8
0.6
0.4
0.2
0
1
0.1
-40
-20
0
20
40
60
80
100
300
400
500
600
700
800
Case Temperature Tc (°C)
Wavelength
λ (nm)
Radiation pattern (typ.)
Ta = 25°C
0°
10°
10°
20°
20°
30°
30°
40°
40°
50°
50°
60°
70°
60°
70°
80°
90°
80°
90°
0.2 0.4 0.6 0.8 1.0
0
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2010-09-29
TL(BF,EGF)1108(T11)
TLEGF1108
I
– V (typ.)
F
F
I /I (40 mA) – I (typ.)
V V
F
3
1
100
Ta = 25°C
Ta = 25°C
30
10
0.3
0.1
3
1
0.03
0.01
2.2
2.6
3.0
3.4
3.8
4.2
4.6
5.0
1
3
5
10
30 50 100
300 500
Forward Voltage
V
(V)
F
Forward Current
I
(mA)
F
Relative I – Tc (typ.)
V
Wavelength characteristic (typ.)
10
1.0
0.8
0.6
0.4
0.2
0
1
0.1
-40
-20
0
20
40
80
100
60
300
400
500
600
700
800
Case Temperature Tc (°C)
Wavelength
λ
(nm)
Radiation pattern (typ.)
Ta = 25°C
0°
10°
10°
20°
20°
30°
30°
40°
40°
50°
50°
60°
70°
60°
70°
80°
90°
80°
90°
0.2 0.4 0.6 0.8 1.0
0
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2010-09-29
TL(BF,EGF)1108(T11)
Packaging
This LED device is packed in an aluminum envelope with a silica gel and a moisture indicator to avoid moisture
absorption. The optical characteristics of the device may be affected by exposure to moisture in the air before
soldering and the device should therefore be stored under the following conditions:
1. This moisture proof bag may be stored unopened within 12 months at the following conditions.
Temperature: 5°C to 30°C
Humidity: 90% (max)
2. After opening the moisture proof bag, the device should be assembled within 4weeks in an environment of 5°C
to 30°C/60% RH or below.
3. If upon opening, the moisture indicator card shows humidity 30% or above (Color of indication changes to
pink) or the expiration date has passed, the device should be baked in taping with reel.
After baking, use the baked device within 72 hours, but perform baking only once.
Baking conditions: 60±5°C, for 24 to 48 hours.
Expiration date: 12 months from sealing date, which is imprinted on the label affixed.
4. Repeated baking can cause the peeling strength of the taping to change, then leads to trouble in mounting.
5. If the packing material of laminate would be broken, the hermeticity would deteriorate. Therefore, do not
throw or drop the packed devices.
Mounting Method
Soldering
•
Reflow soldering (example)
Temperature profile for Pb soldering (example)
Temperature profile for Pb-free soldering (example)
(*)
(*)
10 s max
5 s max
(*)
(*)
240°C max
260°C max
(*)
4°C/s max
max(*)
max(*)
140 to 160°C
230°C
150 to 180°C
(*)
(*)
4°C/s max
4°C/s max
(*)
4°C/s max
max(*)
60 to 120 s
max(*)
60 to 120 s
30 to 50s max(*)
Time (s)
Time (s)
•
The product is evaluated using above reflow soldering conditions. No additional test is performed exceed the
condition (i.e. the condition more than max(*) values) as a evaluation. Please perform reflow soldering under
the above conditions.
•
•
Please perform the first reflow soldering with reference to the above temperature profile and within 4weeks of
opening the package.
Second reflow soldering
In case of second reflow soldering should be performed within 168 h of the first reflow under the above
conditions.
Storage conditions before the second reflow soldering: 30°C, 60% RH (max)
•
•
Make any necessary soldering corrections manually.
(only once at each soldering point)
Soldering iron: 25 W
Temperature : 300°C or less
Time
: within 3 s
Do not perform wave soldering.
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TL(BF,EGF)1108(T11)
Recommended soldering pattern
Cu area > 16 mm2
Unit: mm
1.5
4.0
4.0
Do not use this area for
electrical contact.
Anode
4.0
2.3
0.7
0.8
Do not use this area for
electrical contact.
1.1
Cathode
: Resist area
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TL(BF,EGF)1108(T11)
Cleaning
When cleaning is required after soldering, Toshiba recommends the following cleaning solvents.
It is confirmed that these solvents have no effect on semiconductor devices in our dipping test (under the
recommended conditions). In selecting the one for your actual usage, please perform sufficient review
on washing condition, using condition and etc.
ASAHI CLEAN AK-225AES
KAO CLEAN THROUGH 750HS
PINE ALPHA ST-100S
: (made by ASAHI GLASS)
: (made by KAO)
: (made by ARAKAWA CHEMICAL)
Precautions when Mounting
(1) Do not apply force to the plastic part of the LED under high-temperature conditions.
(2) To avoid damaging the LED plastic, do not apply friction using a hard material.
(3) When installing the PCB in a product, ensure that the device does not come into contact with other components.
(4) For this product, silicone is used as the encapsulated material. Therefore the top surface of this product is soft.
Please do not stress on the encapsulated part of LEDs to avoid affecting the reliability of the product. When
using the mounting devices, please use the picking up nozzle that does not affect the silicone resin.
Tape Specifications
1. Product number format
The type of package used for shipment is denoted by a symbol suffix after the product number. The
method of classification is as below. (this method, however does not apply to products whose electrical
characteristics differ from standard Toshiba specifications)
(1) Tape Type: T11 (4-mm pitch)
(2) Example
TLBF1108 (T11)
Tape type
Toshiba product No.
2. Tape dimensions
Unit: mm
Symbol
Dimension
Tolerance
Symbol
Dimension
Tolerance
D
E
1.5
1.75
4.0
+0.1/−0
±0.1
P
2.0
8.0
4.0
2.9
3.7
2.3
±0.05
±0.3
±0.1
±0.1
±0.1
±0.1
2
W
P
P
±0.1
0
t
0.3
±0.05
±0.05
±0.1
A
B
K
0
0
0
F
3.5
D
1
1.5
K
P
0
0
D
t
P
2
E
F
W
B
0
Polarity
P
D
1
A
0
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2010-09-29
TL(BF,EGF)1108(T11)
3. Reel dimensions
Unit: mm
9 +1/−0
11.4 ± 1.0
φ44
2 ± 0.5
4. Leader and trailer sections of tape
40 mm or more
(Note 1)
40 mm or more
(Note 2)
Leading part: 190 mm (min)
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2010-09-29
TL(BF,EGF)1108(T11)
5. Packing form
(1) Packing quantity
Reel
2,000 pcs
Carton
10,000 pcs
(2) Packing form: Each reel is sealed in an aluminum pack with silica gel.
6. Label format
(1) Label contents
Shipped products are mentioned the following contents.
P/N:
TOSHIBA
TYPE
TLBF1108
ADDC
(T11)
Q’TY
32C
2,000 pcs
2000
Lot Number
Key code for TSB
(RANK SYMBOL)
Use under 5-30degC/60%RH within 4weeks
SEALED:
DIFFUSED IN *****
ASSEMBLED IN *****
[[G]]/RoHS COMPATIBLE
*Y380xxxxxxxxxxxxxxxxxx*
(2) Label location
•
Reel
• Carton
Tape feel direction
Label position
Label position
•
The aluminum package in which the reel is supplied also has the label attached to
center of one side.
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2010-09-29
TL(BF,EGF)1108(T11)
RESTRICTIONS ON PRODUCT USE
•
•
•
Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR
APPLICATIONS.
•
Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious
public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used
in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this
document.
•
•
Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
•
•
The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
•
•
Do not use or otherwise make available Product or related software or technology for any military purposes, including without
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product
or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
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2010-09-29
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