TIM5964-8UL [TOSHIBA]
HIGH POWER P1dB=39.5dBm at 5.9GHz to 6.4GHz; 大功率的P1dB = 39.5dBm ,在5.9GHz到6.4GHz型号: | TIM5964-8UL |
厂家: | TOSHIBA |
描述: | HIGH POWER P1dB=39.5dBm at 5.9GHz to 6.4GHz |
文件: | 总4页 (文件大小:142K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
MICROWAVE POWER GaAs FET
MICROWAVE SEMICONDUCTOR
TIM5964-8UL
TECHNICAL DATA
FEATURES
HIGH POWER
P1dB=39.5dBm at 5.9GHz to 6.4GHz
HIGH GAIN
BROAD BAND INTERNALLY MATCHED FET
HERMETICALLY SEALED PACKAGE
G1dB=10.0dB at 5.9GHz to 6.4GHz
RF PERFORMANCE SPECIFICATIONS ( Ta= 25 C )
°
CHARACTERISTICS
Output Power at 1dB Gain
Compression Point
Power Gain at 1dB Gain
Compression Point
Drain Current
SYMBOL
CONDITIONS
UNIT MIN. TYP. MAX.
P1dB
dBm 38.5 39.5
⎯
G1dB
VDS= 10V
IDSset=1.8A
dB
9.0
10.0
⎯
f = 5.9 to 6.4GHz
IDS1
ΔG
A
dB
%
2.2
⎯
2.6
±0.6
⎯
⎯
⎯
Gain Flatness
Power Added Efficiency
3rd Order Intermodulation
Distortion
ηadd
IM3
36
⎯
Two-Tone Test
Po= 28.5dBm
dBc
-44
-47
⎯
(Single Carrier Level)
Drain Current
IDS2
A
2.2
2.6
80
⎯
⎯
(VDS X IDS + Pin – P1dB)
X Rth(c-c)
C
°
Channel Temperature Rise
ΔTch
⎯
Recommended gate resistance(Rg) : Rg= 150 Ω(MAX.)
ELECTRICAL CHARACTERISTICS ( Ta= 25 C )
°
CHARACTERISTICS
SYMBOL
CONDITIONS
VDS= 3V
IDS= 3.0A
UNIT MIN. TYP. MAX.
Transconductance
gm
mS
1800
-2.5
5.2
⎯
-1.0
⎯
⎯
-4.0
⎯
Pinch-off Voltage
VGSoff VDS= 3V
IDS= 30mA
V
Saturated Drain Current
IDSS
VDS= 3V
VGS= 0V
A
IGS= -100 A
Gate-Source Breakdown
Voltage
VGSO
V
-5
μ
⎯
⎯
C/W
°
Thermal Resistance
Rth(c-c) Channel to Case
2.5
3.5
⎯
The information contained herein is presented only as a guide for the applications of our products. No responsibility is
assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may results from its use,
No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others.
The information contained herein is subject to change without prior notice. It is therefor advisable to contact TOSHIBA
before proceeding with design of equipment incorporating this product.
Rev. Jun. 2009
TIM5964-8UL
ABSOLUTE MAXIMUM RATINGS ( Ta= 25 C )
°
CHARACTERISTICS
Drain-Source Voltage
SYMBOL
VDS
VGS
IDS
UNIT
V
RATING
15
-5
Gate-Source Voltage
Drain Current
V
A
7.0
Total Power Dissipation (Tc= 25 C)
PT
W
42.9
°
C
Channel Temperature
Storage
Tch
175
°
C
°
Tstg
-65 to +175
PACKAGE OUTLINE (2-11D1B)
Unit in mm
c Gate
d Source
e Drain
HANDLING PRECAUTIONS FOR PACKAGE MODEL
Soldering iron should be grounded and the operating time should not exceed 10 seconds
at 260°C.
2
TIM5964-8UL
RF PERFORMANCE
Output Power vs. Frequency
42
VDS= 10V
IDS≅ 2.2A
41 Pin= 29.5dBm
40
39
38
37
5.7
5.8
5.9
6
6.1
6.2
6.3
6.4
6.5
6.6
Frequency (GHz)
Output Power vs. Input Power
42
41
40
39
38
37
36
35
34
33
90
80
70
60
50
40
30
20
10
0
f= 6.15GHz
VDS= 10V
IDS≅ 2.2A
Po
ηadd
23
25
27
29
31
33
Pin (dBm)
3
TIM5964-8UL
Power Dissipation vs. Case Temperature
50
40
30
20
10
0
0
40
80
120
160
200
Tc (℃)
IM3 vs. Output Power Characteristics
-20
-30
-40
-50
-60
VDS= 10V
IDS≅ 2.2A
f= 6.15GHz
Δf= 5MHz
24
26
28
30
32
34
Po(dBm), Single Carrier Level
4
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