TD62502FNG [TOSHIBA]
7ch Single Driver: Common Emitter; 7CH单驱动器：共发射极
| 型号： | TD62502FNG |
| 厂家： | 
TOSHIBA |
| 描述： | 7ch Single Driver: Common Emitter |
| 文件： | 总8页 (文件大小：144K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TD62502,503,504FNG
Toshiba Bipolar Digital Integrated Circuit Silicon Monolithic
TD62502FNG,TD62503FNG,TD62504FNG
7ch Single Driver: Common Emitter
TD62502, 503, 504FN: Common Emitter
The TD62502FNG, TD62503FNG and TD62504FNG are
comprised of seven or five NPN Transistor Arrays.
Applications include relay, hammer, Lamp and display (LED)
drivers.
The suffix (G) appended to the part number represents a Lead
(Pb)-Free product.
Features
•
•
•
•
Output current (single output) 200 mA max
High sustaining voltage output 35 V min
Inputs compatible with various types of logic.
Weight: 0.07 g (typ.)
TD62502FNG: RIN = 10.5 kΩ + 7 V
Zener diode··· 14 V to 25 V P-MOS
•
•
•
TD62503FNG: RIN = 2.7 kΩ··· TTL, 5 V C-MOS
TD62504FNG: RIN = 10.5 kΩ··· 6 V to 15 V P-MOS, C-MOS
Package type: SSOP-16 pin (0.65 mm pitch)
Pin Connection
(top view)
O1 O2 O3 O4 O5 O6 O7 NC
16 15 14 13 12 11 10
9
1
2
3
4
5
6
7
8
I1
I2
I3
I4
I5
I6
I7 COM-E
Schematics (each driver)
TD62502FNG
Output
7 V
10.5 kΩ
Input
(*)
(*)
(*)
(*)
(*)
(*)
Common
emitter
TD62503FNG
TD62504FNG
Output
R1
Input
(*)
(*)
(*)
(*)
(*)
(*)
Common
emitter
TD62503FNG R1 = 2.7 kΩ
TD62504FNG R1 = 10.5 kΩ
*: The input and output parasitic diodes cannot be used us clamp diodes.
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Absolute Maximum Ratings (Ta = 25°C unless otherwise noted)
Characteristics
Collector-emitter voltage
Symbol
Rating
Unit
V
V
35
50
V
V
CEO
CBO
Collector-base voltage
Collector current
I
200
mA/ch
V
C
Input voltage
V
−0.5 to 30
0.78
IN
Power dissipation
Operating temperature
Storage temperature
P
(Note 1)
W
D
T
opr
−40 to 85
−55 to 150
°C
T
stg
°C
Note 1: On glass epoxy PCB (50 × 50 × 1.6 mm, Cu 40%)
Recommended Operating Conditions
= −
40 to 85°C)
(Ta
Characteristics
Collector-emitter voltage
Symbol
Test Condition
Min
Typ.
Max
Unit
V
V
0
0
⎯
⎯
⎯
⎯
⎯
35
50
V
V
CEO
CBO
Collector-base voltage
Collector current
Input voltage
I
0
150
25
mA/ch
V
C
V
0
IN
Power dissipation
P
(Note 1) On PCB
⎯
0.325
W
D
Note 1: On glass epoxy PCB (50 × 50 × 1.6 mm, Cu 40%)
Electrical Characteristics
=
(Ta 25°C unless otherwise noted)
Test
Circuit
Characteristics
Symbol
Test Condition
= 35V, V = 0 V
Min
Typ.
Max
Unit
µA
Output leakage current
I
1
V
⎯
⎯
⎯
⎯
10
CEX
CE
IN
I
I
= 1 mA, I = 10 mA
0.2
IN
IN
C
Collector-emitter saturation voltage
V
2
2
V
CE (sat)
= 3 mA, I = 150 mA
C
⎯
⎯
0.8
(Note 1)
DC current transfer ration
TD62502FNG
Input voltage
TD62503FNG
(Output on)
h
FE
V
CE
= 10 V, I = 10 mA
50
14.0
2.4
7.0
0
⎯
⎯
⎯
25
25
25
7.0
0.4
0.8
⎯
C
V
V
3
I
= 1 mA, I = 10 mA
V
⎯
IN (ON)
IN
C
TD62504FNG
⎯
TD62502FNG
Input voltage
TD62503FNG
(Output off)
⎯
3
4
I
≤ 10 µA
C
V
0
⎯
IN (OFF)
TD62504FNG
0
⎯
Turn-on delay
t
⎯
⎯
50
200
ON
V
C
= 35 V, R = 220 Ω
L
OUT
ns
= 15 pF
L
Turn-off delay
t
⎯
OFF
Note 1: Except TD62502FNG
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TD62502,503,504FNG
Test Circuit
1. I
2. h , V
3. V
IN (ON)
CEX
FE
CE (sat)
I
C
I
I
I
IN
IN
C
V
CE
Open
V
IN
V
IN (ON)
V
, V
I
CE CE (sat)
CEX
I
C
h
FE
=
I
IN
4. t , t
ON OFF
t
t
f
r
V
OUT
= 35 V
Input
V
IH
90%
50%
90%
50%
R
= 3.3 kΩ
L
Input
R
Pulse
generator
L
C
B
Output
10%
10%
t
0
(Note 2)
E
50 µs
C
= 15 pF
L
(Note 1)
t
OFF
(Note 3)
ON
V
OH
50%
50%
Output
V
OL
Note 1: Pulse width 50 µs, duty cycle 10%
Output impedance 50 Ω, tr ≤ 5 ns, tf ≤ 10 ns
Note 2: See below
Input Condition
Type Number
R
V
I
IH
TD62502FN
TD62503FN
TD62504FN
0 Ω
0 Ω
0 Ω
15 V
3 V
10 V
Note 3: CL includes probe and jig capacitance
Precautions for Using
This IC does not integrate protection circuits such as overcurrent and overvoltage protectors.
Thus, if excess current or voltage is applied to the IC, the IC may be damaged. Please design the IC so that
excess current or voltage will not be applied to the IC.
Utmost care is necessary in the design of the output line, V
CC
and GND line since IC may be destroyed due to
short-circuit between outputs, air contamination fault, or fault by improper grounding.
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TD62502FNG
I
– V
TD62503FNG
I
– V
IN IN
IN
IN
4
3
2
1
0
4
3
2
1
0
Ta = 25°C
I
= 25 to 100 mA
OUT
Ta = 25°C
I
= 25 to 100 mA
OUT
0
10
20
30
40
50
0
4
8
12
16
20
Input voltage
V
(V)
Input voltage
V
(V)
IN
IN
TD62504FNG
I
– V
I – V
C
IN
IN
CE (sat)
120
100
80
60
40
20
0
4
3
2
1
0
Ta = 25°C
Ta = 25°C
2 mA
1 mA
I
= 25 to 100 mA
OUT
700 µA
I
IN
= 500 µA
0
0.2
0.4
0.6
0.8
1.0
1.2
(V)
1.4
0
10
20
Input voltage
30
40
50
V
(V)
Output saturation voltage
V
CE (sat)
IN
P
D
– Ta
1.0
0.8
0.6
0.4
0.2
0
On PCB
(50 × 50 × 1.6 mm Cu 40%
On glass epoxy PCB
0
25
50
75
100
125
150
Ambient temperature Ta (°C)
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Package Dimensions
Weight: 0.07 g (typ.)
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Notes on Contents
1. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory
purposes.
2. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the
application equipment.
IC Usage Considerations
Notes on Handling of ICs
(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be
exceeded, even for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
(2) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in
case of over current and/or IC failure. The IC will fully break down when used under conditions that
exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal
pulse noise occurs from the wiring or load, causing a large current to continuously flow and the
breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of
breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are
required.
(3) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the
design to prevent device malfunction or breakdown caused by the current resulting from the inrush
current at power ON or the negative current resulting from the back electromotive force at power OFF.
IC breakdown may cause injury, smoke or ignition.
Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable,
the protection function may not operate, causing IC breakdown. IC breakdown may cause injury,
smoke or ignition.
(4) Do not insert devices in the wrong orientation or incorrectly.
Make sure that the positive and negative terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and
exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
In addition, do not use any device that is applied the current with inserting in the wrong orientation
or incorrectly even just one time.
(5) Carefully select external components (such as inputs and negative feedback capacitors) and load
components (such as speakers), for example, power amp and regulator.
If there is a large amount of leakage current such as input or negative feedback condenser, the IC
output DC voltage will increase. If this output voltage is connected to a speaker with low input
withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause
smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied
Load (BTL) connection type IC that inputs output DC voltage to a speaker directly.
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Points to Remember on Handling of ICs
(1) Heat Radiation Design
In using an IC with large current flow such as power amp, regulator or driver, please design the
device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at
any time and condition. These ICs generate heat even during normal use. An inadequate IC heat
radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In
addition, please design the device taking into considerate the effect of IC heat radiation with
peripheral components.
(2) Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to
the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power
supply is small, the device’s motor power supply and output pins might be exposed to conditions
beyond absolute maximum ratings. To avoid this problem, take the effect of back-EMF into
consideration in system design.
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About solderability, following conditions were confirmed
• Solderability
(1) Use of Sn-37Pb solder Bath
· solder bath temperature = 230°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
(2) Use of Sn-3.0Ag-0.5Cu solder Bath
· solder bath temperature = 245°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
RESTRICTIONS ON PRODUCT USE
060116EBA
• The information contained herein is subject to change without notice. 021023_D
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc. 021023_A
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk. 021023_B
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of
TOSHIBA or others. 021023_C
• The products described in this document are subject to the foreign exchange and foreign trade laws. 021023_E
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