TD62388APG [TOSHIBA]
8 Ch Low Input Active Darlington Sink Driver; 8通道低输入有效达林顿下沉式驱动器
| 型号： | TD62388APG |
| 厂家： | 
TOSHIBA |
| 描述： | 8 Ch Low Input Active Darlington Sink Driver |
| 文件： | 总11页 (文件大小：609K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TD62386,387,388APG/AFG
TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC
TD62386APG,TD62386AFG,TD62387APG
TD62387AFG,TD62388APG,TD62388AFG
8 Ch Low Input Active Darlington Sink Driver
The TD62386APG, TD62386AFG, TD62387APG, TD62387AFG
and TD62388APG, TD62388AFG are non−inverting transistor
arrays, which are comprised of eight NPN darlington output
stages and PNP input stages.
TD62386APG
TD62387APG
TD62388APG
All units feature integral clamp diodes for switching inductive
loads.
These devices are Low Level input active drivers and are suitable
for operations with TTL, 5 V CMOS and 5 V Microprocessor
which have sink current output drivers.
Applications include relay, hammer, lamp and LED driver.
TD62386AFG
TD62387AFG
TD62388AFG
Features
•
•
•
•
•
•
•
•
Output current (single output) 500 mA (Max)
High sustaining voltage 50 V (Min)
Output clamp diodes
Low level active input
Standard supply voltage
Inputs compatible with TTL and 5 V CMOS
Package type−APG:
Package type−AFG:
DIP−20 pin
SOP−20 pin
Weight
DIP20−P−300−2.54A : 2.25 g (Typ.)
SOP20−P−300−1.27 : 0.25 g (Typ.)
TYPE
V
IN (ON)
TD62386APG, TD62386AFG
TD62387APG, TD62387AFG
TD62388APG, TD62388AFG
−20 V to V
− 2.8 V
CC
0 V to V
− 3.7 V
CC
Pin Connection (top view)
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Schematics (each driver)
TD62386APG, TD62386AFG
TD62387APG, TD62387AFG
TD62388APG, TD62388AFG
Note: The output parasitic diode cannot be used as clamp diodes.
Absolute Maximum Ratings
Characteristic
Supply Voltage
Symbol
Rating
Unit
V
−0.5 to 7.0
−0.5 to 50
500
V
V
CC
V
CE (SUS)
Output Sustaining Voltage
Output Current
I
mA/ch
OUT
−22 to V
+ 0.5
CC
V
(Note 1)
(Note 2)
IN
Input Voltage
V
V
−0.5 to 7
−10
IN
Input Current
I
mA
V
IN
Clamp Diode Reverse Voltage
Clamp Diode Forward Current
V
50
R
I
500
mA
F
APG
AFG
1.38
Power Dissipation
P
(Note 3)
W
D
1.0 (Note 4)
−40 to 85
−55 to 150
Operating Temperature
Storage Temperature
T
opr
°C
°C
T
stg
Note 1: TD62386APG, TD62386AFG only
Note 2: TD62387APG, TD62387AFG, TD62388APG, TD62388AFGonly
Note 3: Delated above 25°C in the proportion of 11.7 mW/°C (APG−Type), 7.7 mW/°C (AFG−Type).
Note 4: On PCB (50 × 50 × 1.6 mm Cu 40% Glass Epoxy)
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Operating Conditions (Ta = −40~85°C)
Characteristic
Supply Voltage
Symbol
Condition
Min
Typ.
Max
Unit
V
⎯
⎯
4.5
0
5.0
5.5
50
V
V
CC
Output Sustaining Voltage
Output Current
V
⎯
CE (SUS)
Tpw = 25 ms, Duty = 10%
mA/
ch
I
0
−20
0
⎯
⎯
⎯
270
OUT
8 Circuits
TD62386
⎯
⎯
V
CC
Input Voltage
V
V
IN
TD62387
TD62388
5.5
Clamp Diode Reverse Voltage
Clamp Diode Forward Current
V
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
50
400
0.52
0.4
V
R
D
I
F
mA
APG
AFG
Power Dissipation
P
W
(Note 1)
Note 1: On Glass Epoxy PCB (50 × 50 × 1.6 mm Cu 40%)
Electrical Characteristics (Ta = 25°C)
Test
Cir−
cuit
Characteristic
Symbol
Test Condition
= 5.5 V, I = 0
Min
Typ.
Max
100
Unit
V
V
CC
IN
Output Leakage Current
I
1
2
⎯
⎯
µA
CEX
= 50 V, Ta = 85°C
OUT
V
V
= 4.5 V,
CC
IN
Output Saturation Voltage
V
= V
⎯
1.4
2.0
V
CE (sat)
IN (ON)
IN (ON) MAX.
= 350 mA
I
OUT
TD62387
TD62388
V
V
= 5.5 V, V = 0.4 V
⎯
⎯
⎯
−0.32
⎯
−0.45
−2.6
−4.0
CC
CC
IN
Output
On
I
3
4
mA
Input
Current
TD62386
= 5.5 V, V = −20 V
IN
Output Common to all
I
⎯
⎯
⎯
⎯
µA
IN (OFF)
Off
devices
V
CC
TD62386
⎯
⎯
⎯
⎯
− 2.8
Input Voltage
(Output on)
V
5
V
IN (ON)
TD62387
TD62388
V
CC
− 3.7
V
V
= 50 V, Ta = 25°C
= 50 V, Ta = 85°C
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
17
⎯
0.1
3
50
R
R
Clamp Diode Reverse Current
Clamp Diode Forward Voltage
Supply Current
I
6
7
8
9
µA
R
100
2.0
1.8
22
I
I
= 350 mA
= 280 mA
F
F
V
V
F
I
V
V
= 5.5 V, V = 0
mA
CC (ON)
CC
CC
IN
I
= 5.5 V, V = V
CC
100
⎯
µA
CC (OFF)
IN
Turn−On Delay
Turn−Off Delay
t
ON
V
R
= 5 V, V
= 50 V
CC
OUT
L
µs
= 125 Ω, C = 15 pF
L
t
⎯
OFF
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Test Circuit
1. I
2. V
CE (sat)
CEX
3. I
4. I
IN (OFF)
IN (ON)
5. V
6. I
R
IN (ON)
7. V
8. I
F
CC
9. t
t
ON, OFF
Note 1: Pulse Width 50 µs, Duty Cycle 10%
Output Impedance 50 Ω, t ≤ 5 ns, t ≤ 10 ns
r
f
Note 2: C includes probe and jig capacitance.
L
Precautions for Using
This IC does not integrate protection circuits such as overcurrent and overvoltage protectors.
Thus, if excess current or voltage is applied to the IC, the IC may be damaged. Please design the IC so that
excess current or voltage will not be applied to the IC.
Utmost care is necessary in the design of the output line, V , COMMON and GND line since IC may be
CC
destroyed due to short−circuit between outputs, air contamination fault, or fault by improper grounding.
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Package Dimensions
DIP20−P−300−2.54A
Unit: mm
Weight: 2.25 g (Typ.)
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Package Dimensions
SOP20−P−300−1.27
Unit: mm
Weight: 0.25 g (Typ.)
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Notes on Contents
1. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory
purposes.
2. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the
application equipment.
IC Usage Considerations
Notes on Handling of ICs
(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be
exceeded, even for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
(2) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in
case of over current and/or IC failure. The IC will fully break down when used under conditions that
exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal
pulse noise occurs from the wiring or load, causing a large current to continuously flow and the
breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of
breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are
required.
(3) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the
design to prevent device malfunction or breakdown caused by the current resulting from the inrush
current at power ON or the negative current resulting from the back electromotive force at power OFF.
IC breakdown may cause injury, smoke or ignition.
Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable,
the protection function may not operate, causing IC breakdown. IC breakdown may cause injury,
smoke or ignition.
(4) Do not insert devices in the wrong orientation or incorrectly.
Make sure that the positive and negative terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and
exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
In addition, do not use any device that is applied the current with inserting in the wrong orientation
or incorrectly even just one time.
(5) Carefully select external components (such as inputs and negative feedback capacitors) and load
components (such as speakers), for example, power amp and regulator.
If there is a large amount of leakage current such as input or negative feedback condenser, the IC
output DC voltage will increase. If this output voltage is connected to a speaker with low input
withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause
smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied
Load (BTL) connection type IC that inputs output DC voltage to a speaker directly.
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Points to Remember on Handling of ICs
(1) Heat Radiation Design
In using an IC with large current flow such as power amp, regulator or driver, please design the
device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at
any time and condition. These ICs generate heat even during normal use. An inadequate IC heat
radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In
addition, please design the device taking into considerate the effect of IC heat radiation with
peripheral components.
(2) Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to
the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power
supply is small, the device’s motor power supply and output pins might be exposed to conditions
beyond absolute maximum ratings. To avoid this problem, take the effect of back-EMF into
consideration in system design.
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About solderability, following conditions were confirmed
• Solderability
(1) Use of Sn-37Pb solder Bath
· solder bath temperature = 230°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
(2) Use of Sn-3.0Ag-0.5Cu solder Bath
· solder bath temperature = 245°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
RESTRICTIONS ON PRODUCT USE
070122EBA_R6
• The information contained herein is subject to change without notice. 021023_D
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc. 021023_A
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk. 021023_B
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patents or other rights of
TOSHIBA or the third parties. 070122_C
• Please use this product in compliance with all applicable laws and regulations that regulate the inclusion or use of
controlled substances.
Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws
and regulations. 060819_AF
• The products described in this document are subject to foreign exchange and foreign trade control laws. 060925_E
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