TD62004APG(O,N) [TOSHIBA]
暂无描述;型号: | TD62004APG(O,N) |
厂家: | TOSHIBA |
描述: | 暂无描述 晶体 驱动器 小信号双极晶体管 开关 光电二极管 |
文件: | 总13页 (文件大小:340K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TD62001~004P/AP/F/AF
TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC
TD62001P,TD62001AP,TD62001F,TD62001AF,TD62002P
TD62002AP,TD62002F,TD62002AF,TD62003P,TD62003AP,TD62003F
TD62003AF,TD62004P,TD62004AP,TD62004F,TD62004AF
7CH DARLINGTON SINK DRIVER
The TD62001P / AP / F / AF Series are high−voltage, high−current
darlington drivers comprised of seven NPN darlington pairs.
All units feature integral clamp diodes for switching inductive
loads.
Applications include relay, hammer, lamp and display (LED)
drivers.
FEATURES
l Output current (single output) 500 mA MAX.
l High sustaining voltage output
35 V MIN. (TD62001P / F Series)
50 V MIN. (TD62001AP / AF Series)
l Output clamp diodes
l Inputs compatible with various types of logic
l Package Type−P, AP: DIP−16 pin
l Package Type−F, AF: SOP−16 pin
INPUT BASE
TYPE
DESIGNATION
General Purpose
14~25 V PMOS
RESISTOR
External
TD62001P / AP / F / AF
TD62002P / AP / F / AF
Weight
10.5−kΩ + 7 V
DIP16−P−300−2.54A : 1.11 g (Typ.)
SOP16−P−225−1.27 : 0.16 g (Typ.)
Zenner diode
TD62003P / AP / F / AF
TD62004P / AP / F / AF
2.7 kΩ
TTL, 5 V CMOS
10.5 kΩ
6~15 V PMOS, CMOS
PIN CONNECTION (TOP VIEW)
1
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TD62001~004P/AP/F/AF
SCHEMATICS (EACH DRIVER)
TD62001P / AP / F / AF
TD62002P / AP / F / AF
TD62003P / AP / F / AF
TD62004P / AP / F / AF
Note: The input and output parasitic diodes cannot be used as clamp diodes.
MAXIMUM RATINGS (Ta = 25°C)
CHARACTERISTIC
SYMBOL
RATING
UNIT
V
P, F
−0.5~35
−0.5~50
500
Output Sustaining
V
CE (SUS)
Voltage
AP, AF
Output Current
Input Voltage
Input Current
I
mA / ch
V
OUT
V
I
(Note 1)
−0.5~30
25
IN
IN
(Note 2)
mA
P, F
35
Clamp Diode
V
V
R
D
Reverse Voltage
AP, AF
50
Clamp Diode Forward Current
Power Dissipation
I
500
mA
F
P
1.0
AP
1.47
P
W
0.54 / 0.625
(Note 3)
F, AF
P
−30~75
−40~85
−55~150
Operating
T
°C
°C
opr
Temperature
AP, F, AF
Storage Temperature
T
stg
Note 1: Except TD62001P / AP / F / AF
Note 2: Only TD62001P / AP / F / AF
Note 3: On glass epoxy PCB (30 × 30 × 1.6 mm Cu 50%)
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TD62001~004P/AP/F/AF
RECOMMENDED OPERATING CONDITIONS
(Ta = −40~85°C and Ta = −30~75°C for only Type−P)
CHARACTERISTIC
SYMBOL
CONDITION
MIN
TYP.
MAX
UNIT
V
P, F
0
0
0
0
0
0
0
0
―
―
―
―
―
―
―
―
35
50
Output Sustaining
V
CE (SUS)
Voltage
AP, AF
Duty = 10%
370
130
295
95
AP
P
Duty = 50%
Duty = 10%
Duty = 50%
Duty = 10%
Duty = 50%
T
= 25 ms
pw
7 Circuits
Ta = 85°C
mA /
ch
Output Current
I
OUT
T = 120°C
j
233
70
F, AF
Except
Input Voltage
TD62001P /
AP / F / AF
V
0
―
24
V
V
IN
TD62002
TD62003
TD62004
TD62001
TD62002
TD62003
TD62004
Only TD62001
P, F
14.5
2.8
6.2
0
―
―
―
―
―
―
―
―
―
―
―
―
―
―
24
24
Input Voltage
(Output On)
I
= 400 mA
= 800
OUT
V
IN (ON)
h
FE
24
0.6
7.4
0.7
1.0
10
0
Input Voltage
(Output Off)
V
V
IN (OFF)
0
0
Input Current
Clamp Diode Reverse
Voltage
I
0
mA
V
IN
―
―
―
―
―
―
35
V
R
AP, AF
50
Clamp Diode Forward Current
I
350
0.6
0.76
0.325
mA
F
P
Ta = 85°C
Ta = 85°C
Power Dissipation
P
W
AP
D
AF, F
(Note)
Note:
On glass epoxy PCB (30 × 30 × 1.6 mm Cu 50%)
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TD62001~004P/AP/F/AF
ELECTRICAL CHARACTERISTICS (Ta = 25°C unless otherwise noted)
TEST
CIR−
CUIT
CHARACTERISTIC
SYMBOL
TEST CONDITION
MIN
TYP.
MAX
UNIT
µA
V
V
V
V
V
V
= 50 V, Ta = 25°C
= 50 V, Ta = 85°C
= 35 V, Ta = 25°C
= 35 V, Ta = 85°C
= 35 V, Ta = 25°C
= 35 V, Ta = 75°C
―
―
―
―
―
―
―
―
―
1000
―
―
―
50
50
―
―
―
―
―
―
―
―
―
―
―
―
―
―
―
―
―
―
―
―
1.3
1.1
0.9
―
1.1
0.4
0.8
65
65
―
―
―
―
―
―
―
―
―
―
―
―
―
15
50
100
50
CE
CE
AP, AF
CE
Output Leakage
Current
I
1
F
P
CEX
100
50
CE
CE
100
1.6
1.3
1.1
―
CE
I
I
I
= 350 mA, I = 500 µA
IN
OUT
OUT
OUT
Collector−Emitter Saturation Voltage
V
2
2
3
V
= 200 mA, I = 350 µA
IN
CE (sat)
= 100 mA, I = 250 µA
IN
DC Current Transfer Ratio
TD62002
h
FE
V
V
V
V
= 2 V, I
OUT
= 350 mA
= 350 mA
= 350 mA
CE
= 20 V, I
1.7
0.7
1.2
―
IN
IN
OUT
Input Current
I
mA
µA
TD62003
= 2.4 V, I
= 9.5 V, I
IN (ON)
OUT
(Output On)
TD62004
= 350 mA
OUT
IN
P
I
I
= 500 µA, Ta = 75°C
= 500 µA, Ta = 85°C
OUT
OUT
Input Current
I
4
5
IN (OFF)
(Output Off)
AP, F, AF
―
I
I
I
I
I
I
= 350 mA
= 200 mA
= 350 mA
= 200 mA
= 350 mA
= 200 mA
13.7
11.4
2.6
2.0
4.7
4.4
50
OUT
OUT
OUT
OUT
OUT
OUT
TD62002
Input Voltage
TD62003
V
= 2 V
= 800
CE
FE
V
V
IN (ON)
(Output On)
h
TD62004
AP, AF
V
V
V
V
V
V
= 50 V, Ta = 25°C
= 50 V, Ta = 85°C
= 35 V, Ta = 25°C
= 35 V, Ta = 85°C
= 35 V, Ta = 25°C
= 35 V, Ta = 75°C
R
R
R
R
R
R
100
50
Clamp Diode
F
I
6
µA
R
Reverse Current
100
50
P
100
2.0
―
Clamp Diode Forward Voltage
Input Capacitance
V
7
I
= 350 mA
F
V
F
C
IN
―
pF
V
= 35 V, R = 87.5 Ω
L
OUT
P, F
Turn−On Delay
―
―
―
―
0.1
0.1
0.2
0.2
―
―
―
―
C = 15 pF
L
t
8
8
ON
V
= 50 V, R = 125 Ω
L
OUT
L
AP, AF
C = 15 pF
µs
V
= 35 V, R = 87.5 Ω
L
OUT
L
P, F
Turn−Off Delay
C = 15 pF
t
OFF
V
= 50 V, R = 125 Ω
L
OUT
L
AP, AF
C = 15 pF
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TD62001~004P/AP/F/AF
TEST CIRCUIT
1. I
2. V
, h
3.
CEX
CE (sat) FE
IIN (ON)
4. I
5. V
6. I
R
IN (OFF)
IN (ON)
7. V
F
5
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TD62001~004P/AP/F/AF
8. t , t
ON OFF
Note 1: Pulse width 50 µs, duty cycle 10%
Output impedance 50 Ω, t ≤ 5 ns, t ≤ 10 ns
r
f
Note 2: See below
INPUT CONDITION
TYPE NUMBER
R1
V
IH
TD62001P / AP / F / AF
TD62002P / AP / F / AF
TD62003P / AP / F / AF
TD62004P / AP / F / AF
2.7 kΩ
3 V
13 V
3 V
0
0
0
8 V
Note 3: C includes probe and jig capacitance.
L
PRECAUTIONS for USING
This IC does not include built-in protection circuits for excess current or overvoltage.
If this IC is subjected to excess current or overvoltage, it may be destroyed.
Hence, the utmost care must be taken when systems which incorporate this IC are designed.
Utmost care is necessary in the design of the output line, COMMON and GND line since IC may be destroyed
due to short−circuit between outputs, air contamination fault, or fault by improper grounding.
6
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TD62001~004P/AP/F/AF
7
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TD62001~004P/AP/F/AF
8
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TD62001~004P/AP/F/AF
9
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TD62001~004P/AP/F/AF
10
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TD62001~004P/AP/F/AF
PACKAGE DIMENSIONS
DIP16−P−300−2.54A
Unit : mm
Weight: 1.11 g (Typ.)
11
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TD62001~004P/AP/F/AF
PACKAGE DIMENSIONS
SOP16−P−225−1.27
Unit : mm
Weight: 0.16 g (Typ.)
12
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TD62001~004P/AP/F/AF
RESTRICTIONS ON PRODUCT USE
000707EBA
· TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc..
· The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk.
· The products described in this document are subject to the foreign exchange and foreign trade laws.
· The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other
rights of the third parties which may result from its use. No license is granted by implication or otherwise under
any intellectual property or other rights of TOSHIBA CORPORATION or others.
· The information contained herein is subject to change without notice.
13
2001-06-27
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