TD62004APG(O,N) [TOSHIBA]

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TD62004APG(O,N)
型号: TD62004APG(O,N)
厂家: TOSHIBA    TOSHIBA
描述:

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晶体 驱动器 小信号双极晶体管 开关 光电二极管
文件: 总13页 (文件大小:340K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
TD62001~004P/AP/F/AF  
TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC  
TD62001P,TD62001AP,TD62001F,TD62001AF,TD62002P  
TD62002AP,TD62002F,TD62002AF,TD62003P,TD62003AP,TD62003F  
TD62003AF,TD62004P,TD62004AP,TD62004F,TD62004AF  
7CH DARLINGTON SINK DRIVER  
The TD62001P / AP / F / AF Series are highvoltage, highcurrent  
darlington drivers comprised of seven NPN darlington pairs.  
All units feature integral clamp diodes for switching inductive  
loads.  
Applications include relay, hammer, lamp and display (LED)  
drivers.  
FEATURES  
l Output current (single output) 500 mA MAX.  
l High sustaining voltage output  
35 V MIN. (TD62001P / F Series)  
50 V MIN. (TD62001AP / AF Series)  
l Output clamp diodes  
l Inputs compatible with various types of logic  
l Package TypeP, AP: DIP16 pin  
l Package TypeF, AF: SOP16 pin  
INPUT BASE  
TYPE  
DESIGNATION  
General Purpose  
14~25 V PMOS  
RESISTOR  
External  
TD62001P / AP / F / AF  
TD62002P / AP / F / AF  
Weight  
10.5k+ 7 V  
DIP16P3002.54A : 1.11 g (Typ.)  
SOP16P2251.27 : 0.16 g (Typ.)  
Zenner diode  
TD62003P / AP / F / AF  
TD62004P / AP / F / AF  
2.7 kΩ  
TTL, 5 V CMOS  
10.5 kΩ  
6~15 V PMOS, CMOS  
PIN CONNECTION (TOP VIEW)  
1
2001-06-27  
TD62001~004P/AP/F/AF  
SCHEMATICS (EACH DRIVER)  
TD62001P / AP / F / AF  
TD62002P / AP / F / AF  
TD62003P / AP / F / AF  
TD62004P / AP / F / AF  
Note: The input and output parasitic diodes cannot be used as clamp diodes.  
MAXIMUM RATINGS (Ta = 25°C)  
CHARACTERISTIC  
SYMBOL  
RATING  
UNIT  
V
P, F  
0.5~35  
0.5~50  
500  
Output Sustaining  
V
CE (SUS)  
Voltage  
AP, AF  
Output Current  
Input Voltage  
Input Current  
I
mA / ch  
V
OUT  
V
I
(Note 1)  
0.5~30  
25  
IN  
IN  
(Note 2)  
mA  
P, F  
35  
Clamp Diode  
V
V
R
D
Reverse Voltage  
AP, AF  
50  
Clamp Diode Forward Current  
Power Dissipation  
I
500  
mA  
F
P
1.0  
AP  
1.47  
P
W
0.54 / 0.625  
(Note 3)  
F, AF  
P
30~75  
40~85  
55~150  
Operating  
T
°C  
°C  
opr  
Temperature  
AP, F, AF  
Storage Temperature  
T
stg  
Note 1: Except TD62001P / AP / F / AF  
Note 2: Only TD62001P / AP / F / AF  
Note 3: On glass epoxy PCB (30 × 30 × 1.6 mm Cu 50%)  
2
2001-06-27  
TD62001~004P/AP/F/AF  
RECOMMENDED OPERATING CONDITIONS  
(Ta = 40~85°C and Ta = 30~75°C for only TypeP)  
CHARACTERISTIC  
SYMBOL  
CONDITION  
MIN  
TYP.  
MAX  
UNIT  
V
P, F  
0
0
0
0
0
0
0
0
35  
50  
Output Sustaining  
V
CE (SUS)  
Voltage  
AP, AF  
Duty = 10%  
370  
130  
295  
95  
AP  
P
Duty = 50%  
Duty = 10%  
Duty = 50%  
Duty = 10%  
Duty = 50%  
T
= 25 ms  
pw  
7 Circuits  
Ta = 85°C  
mA /  
ch  
Output Current  
I
OUT  
T = 120°C  
j
233  
70  
F, AF  
Except  
Input Voltage  
TD62001P /  
AP / F / AF  
V
0
24  
V
V
IN  
TD62002  
TD62003  
TD62004  
TD62001  
TD62002  
TD62003  
TD62004  
Only TD62001  
P, F  
14.5  
2.8  
6.2  
0
24  
24  
Input Voltage  
(Output On)  
I
= 400 mA  
= 800  
OUT  
V
IN (ON)  
h
FE  
24  
0.6  
7.4  
0.7  
1.0  
10  
0
Input Voltage  
(Output Off)  
V
V
IN (OFF)  
0
0
Input Current  
Clamp Diode Reverse  
Voltage  
I
0
mA  
V
IN  
35  
V
R
AP, AF  
50  
Clamp Diode Forward Current  
I
350  
0.6  
0.76  
0.325  
mA  
F
P
Ta = 85°C  
Ta = 85°C  
Power Dissipation  
P
W
AP  
D
AF, F  
(Note)  
Note:  
On glass epoxy PCB (30 × 30 × 1.6 mm Cu 50%)  
3
2001-06-27  
TD62001~004P/AP/F/AF  
ELECTRICAL CHARACTERISTICS (Ta = 25°C unless otherwise noted)  
TEST  
CIR−  
CUIT  
CHARACTERISTIC  
SYMBOL  
TEST CONDITION  
MIN  
TYP.  
MAX  
UNIT  
µA  
V
V
V
V
V
V
= 50 V, Ta = 25°C  
= 50 V, Ta = 85°C  
= 35 V, Ta = 25°C  
= 35 V, Ta = 85°C  
= 35 V, Ta = 25°C  
= 35 V, Ta = 75°C  
1000  
50  
50  
1.3  
1.1  
0.9  
1.1  
0.4  
0.8  
65  
65  
15  
50  
100  
50  
CE  
CE  
AP, AF  
CE  
Output Leakage  
Current  
I
1
F
P
CEX  
100  
50  
CE  
CE  
100  
1.6  
1.3  
1.1  
CE  
I
I
I
= 350 mA, I = 500 µA  
IN  
OUT  
OUT  
OUT  
CollectorEmitter Saturation Voltage  
V
2
2
3
V
= 200 mA, I = 350 µA  
IN  
CE (sat)  
= 100 mA, I = 250 µA  
IN  
DC Current Transfer Ratio  
TD62002  
h
FE  
V
V
V
V
= 2 V, I  
OUT  
= 350 mA  
= 350 mA  
= 350 mA  
CE  
= 20 V, I  
1.7  
0.7  
1.2  
IN  
IN  
OUT  
Input Current  
I
mA  
µA  
TD62003  
= 2.4 V, I  
= 9.5 V, I  
IN (ON)  
OUT  
(Output On)  
TD62004  
= 350 mA  
OUT  
IN  
P
I
I
= 500 µA, Ta = 75°C  
= 500 µA, Ta = 85°C  
OUT  
OUT  
Input Current  
I
4
5
IN (OFF)  
(Output Off)  
AP, F, AF  
I
I
I
I
I
I
= 350 mA  
= 200 mA  
= 350 mA  
= 200 mA  
= 350 mA  
= 200 mA  
13.7  
11.4  
2.6  
2.0  
4.7  
4.4  
50  
OUT  
OUT  
OUT  
OUT  
OUT  
OUT  
TD62002  
Input Voltage  
TD62003  
V
= 2 V  
= 800  
CE  
FE  
V
V
IN (ON)  
(Output On)  
h
TD62004  
AP, AF  
V
V
V
V
V
V
= 50 V, Ta = 25°C  
= 50 V, Ta = 85°C  
= 35 V, Ta = 25°C  
= 35 V, Ta = 85°C  
= 35 V, Ta = 25°C  
= 35 V, Ta = 75°C  
R
R
R
R
R
R
100  
50  
Clamp Diode  
F
I
6
µA  
R
Reverse Current  
100  
50  
P
100  
2.0  
Clamp Diode Forward Voltage  
Input Capacitance  
V
7
I
= 350 mA  
F
V
F
C
IN  
pF  
V
= 35 V, R = 87.5 Ω  
L
OUT  
P, F  
TurnOn Delay  
0.1  
0.1  
0.2  
0.2  
C = 15 pF  
L
t
8
8
ON  
V
= 50 V, R = 125 Ω  
L
OUT  
L
AP, AF  
C = 15 pF  
µs  
V
= 35 V, R = 87.5 Ω  
L
OUT  
L
P, F  
TurnOff Delay  
C = 15 pF  
t
OFF  
V
= 50 V, R = 125 Ω  
L
OUT  
L
AP, AF  
C = 15 pF  
4
2001-06-27  
TD62001~004P/AP/F/AF  
TEST CIRCUIT  
1. I  
2. V  
, h  
3.  
CEX  
CE (sat) FE  
IIN (ON)  
4. I  
5. V  
6. I  
R
IN (OFF)  
IN (ON)  
7. V  
F
5
2001-06-27  
TD62001~004P/AP/F/AF  
8. t , t  
ON OFF  
Note 1: Pulse width 50 µs, duty cycle 10%  
Output impedance 50 , t 5 ns, t 10 ns  
r
f
Note 2: See below  
INPUT CONDITION  
TYPE NUMBER  
R1  
V
IH  
TD62001P / AP / F / AF  
TD62002P / AP / F / AF  
TD62003P / AP / F / AF  
TD62004P / AP / F / AF  
2.7 kΩ  
3 V  
13 V  
3 V  
0
0
0
8 V  
Note 3: C includes probe and jig capacitance.  
L
PRECAUTIONS for USING  
This IC does not include built-in protection circuits for excess current or overvoltage.  
If this IC is subjected to excess current or overvoltage, it may be destroyed.  
Hence, the utmost care must be taken when systems which incorporate this IC are designed.  
Utmost care is necessary in the design of the output line, COMMON and GND line since IC may be destroyed  
due to shortcircuit between outputs, air contamination fault, or fault by improper grounding.  
6
2001-06-27  
TD62001~004P/AP/F/AF  
7
2001-06-27  
TD62001~004P/AP/F/AF  
8
2001-06-27  
TD62001~004P/AP/F/AF  
9
2001-06-27  
TD62001~004P/AP/F/AF  
10  
2001-06-27  
TD62001~004P/AP/F/AF  
PACKAGE DIMENSIONS  
DIP16P3002.54A  
Unit : mm  
Weight: 1.11 g (Typ.)  
11  
2001-06-27  
TD62001~004P/AP/F/AF  
PACKAGE DIMENSIONS  
SOP16P2251.27  
Unit : mm  
Weight: 0.16 g (Typ.)  
12  
2001-06-27  
TD62001~004P/AP/F/AF  
RESTRICTIONS ON PRODUCT USE  
000707EBA  
· TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor  
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical  
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of  
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of  
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.  
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as  
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and  
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability  
Handbook” etc..  
· The TOSHIBA products listed in this document are intended for usage in general electronics applications  
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,  
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires  
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or  
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or  
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,  
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this  
document shall be made at the customer’s own risk.  
· The products described in this document are subject to the foreign exchange and foreign trade laws.  
· The information contained herein is presented only as a guide for the applications of our products. No  
responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other  
rights of the third parties which may result from its use. No license is granted by implication or otherwise under  
any intellectual property or other rights of TOSHIBA CORPORATION or others.  
· The information contained herein is subject to change without notice.  
13  
2001-06-27  

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